CN215496672U - Metal contaminant removing device for wafer polishing - Google Patents
Metal contaminant removing device for wafer polishing Download PDFInfo
- Publication number
- CN215496672U CN215496672U CN202121738402.3U CN202121738402U CN215496672U CN 215496672 U CN215496672 U CN 215496672U CN 202121738402 U CN202121738402 U CN 202121738402U CN 215496672 U CN215496672 U CN 215496672U
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- shaped
- ejecting
- ejector
- wafer
- blocks
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- 239000002184 metal Substances 0.000 title claims abstract description 15
- 238000005498 polishing Methods 0.000 title claims abstract description 14
- 239000000356 contaminant Substances 0.000 title claims description 8
- 239000000463 material Substances 0.000 claims abstract description 49
- 229920001971 elastomer Polymers 0.000 claims abstract description 23
- 239000005060 rubber Substances 0.000 claims abstract description 23
- 239000003344 environmental pollutant Substances 0.000 claims abstract description 7
- 231100000719 pollutant Toxicity 0.000 claims abstract description 7
- 235000012431 wafers Nutrition 0.000 claims 8
- 238000000034 method Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 206010063659 Aversion Diseases 0.000 abstract description 2
- 238000010521 absorption reaction Methods 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000004140 cleaning Methods 0.000 description 3
- 230000000670 limiting effect Effects 0.000 description 2
- 239000004484 Briquette Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The utility model discloses a metal pollutant removing device for wafer polishing, which comprises a material pressing mechanism, wherein a material ejecting mechanism is arranged below the material pressing mechanism, and a wafer body is placed at the top of the material ejecting mechanism, so that the device has the beneficial effects that: two anti-skidding rubbers are because of the both sides of the torsion centre gripping wafer body of torsional spring, avoid the carousel frame to appear the condition of aversion at the pivoted in-process, press the material pole to descend to withstand the one end that anti-skidding rubber was kept away from to L type briquetting when one, wafer body is kept away from to two anti-skidding rubbers, wafer body has lost the spacing nature, the top of ejector pad is withstood to the bottom of two No. two material poles of pressing simultaneously, two ejector pads pass through the axis of rotation, the activity of loose axle is slightly ejecting with L type ejector pin at L type top inslot portion, make and be withstood the gap between wafer body and the carousel frame, make things convenient for the absorption of sucking disc to get the material work.
Description
Technical Field
The utility model relates to a metal pollutant removing device for wafer polishing, and belongs to the technical field of wafer reinforcement.
Background
In the prior art, when a wafer is polished and metal pollutants on the surface are cleaned, the wafer is poor in limiting performance and easy to shift when being cleaned, after cleaning is completed, the wafer is adsorbed by an upper sucking disc and is far away from a rotating disc rack, and due to the reason of a cleaning agent, the bottom of the wafer is easy to adsorb on a cleaning rack, so that the sucking disc cannot conveniently adsorb the wafer, and therefore the utility model provides the device for removing the metal pollutants for polishing the wafer.
SUMMERY OF THE UTILITY MODEL
The utility model provides a device for removing metal pollutants for polishing a wafer, which is used for solving the problems.
In order to solve the technical problems, the utility model provides the following technical scheme:
the utility model relates to a metal pollutant removing device for wafer polishing, which comprises a material pressing mechanism, wherein a material ejecting mechanism is arranged below the material pressing mechanism, and a wafer body is placed at the top of the material ejecting mechanism;
the material pressing mechanism comprises a ring frame, bolts are inserted into four corners of the ring frame, and a first material pressing rod and a second material pressing rod are fixed at two ends of the bottom of the ring frame respectively;
the ejecting mechanism comprises a rotary plate frame, two L-shaped ejecting grooves are formed in the rotary plate frame in a chiseling mode, two ejecting blocks are inserted into the bottom end of the inner portion of each L-shaped ejecting groove, two L-shaped ejector rods are inserted into the top end of each L-shaped ejecting groove, one ends, close to the ejecting blocks and the L-shaped ejector rods, of the ejecting blocks are located inside the L-shaped ejecting grooves and are connected with one ends of the movable shafts in a rotating mode, one ends, far away from the movable shafts, of the ejecting blocks are located inside the L-shaped ejecting grooves and are movably connected with the rotary plate frame through rotating shafts, the hangers on two sides of the top of the rotary plate frame are connected with one ends of the bottom of the L-shaped pressing blocks through torsion springs, and anti-skid rubber is fixed on one side, close to each other, of the L-shaped pressing blocks.
Preferably, the two first pressing rods are perpendicular to the end positions, far away from the anti-skid rubber, of the two L-shaped pressing blocks respectively.
Preferably, the two second material pressing rods are respectively perpendicular to the top positions of the two material ejecting blocks at the ends far away from each other.
Preferably, the distance between the bottoms of the two second pressing rods and the top of the ejection block matched in position is equal to the distance between the bottom of the two first pressing rods and the top of the L-shaped pressing block on the side far away from the anti-skid rubber.
Preferably, the distance between the two anti-slip rubber adjacent side walls is equal to the distance between the two ends of the wafer body.
Preferably, the outer diameter of each of the two ejector blocks and the L-shaped ejector rod is smaller than the inner diameter of the L-shaped ejector groove at the corresponding position of the L-shaped ejector groove.
The utility model has the following beneficial effects: two anti-skidding rubbers are because of the both sides of the torsion centre gripping wafer body of torsional spring, avoid the carousel frame to appear the condition of aversion at the pivoted in-process, press the material pole to descend to withstand the one end that anti-skidding rubber was kept away from to L type briquetting when one, wafer body is kept away from to two anti-skidding rubbers, wafer body has lost the spacing nature, the top of ejector pad is withstood to the bottom of two No. two material poles of pressing simultaneously, two ejector pads pass through the axis of rotation, the activity of loose axle is slightly ejecting with L type ejector pin at L type top inslot portion, make and be withstood the gap between wafer body and the carousel frame, make things convenient for the absorption of sucking disc to get the material work.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model and not to limit the utility model. In the drawings:
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic side view of the present invention without a take-off;
fig. 3 is a schematic side view of the present invention during material removal.
In the figure: 1. a material pressing mechanism; 11. a ring frame; 12. a bolt; 13. a first material pressing rod; 14. a second material pressing rod; 2. a material ejecting mechanism; 21. a rotary plate rack; 22. a torsion spring; 23. an L-shaped briquette; 24. anti-skid rubber; 25. an L-shaped top groove; 26. a rotating shaft; 27. a movable shaft; 28. an L-shaped ejector rod; 29. a material ejection block; 3. a wafer body.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example (b): as shown in fig. 1-3, a metal contaminant removing device for wafer polishing comprises a material pressing mechanism 1, a material ejecting mechanism 2 is arranged below the material pressing mechanism 1, and a wafer body 3 is arranged on the top of the material ejecting mechanism 2;
the material pressing mechanism 1 comprises a ring frame 11, bolts 12 are inserted into four corners of the ring frame 11, and a first material pressing rod 13 and a second material pressing rod 14 are fixed at two ends of the bottom of the ring frame 11 respectively;
The positions of the two first pressing rods 13 are respectively vertical to the positions of one ends of the two L-shaped pressing blocks 23 far away from the anti-skid rubber 24; the two second material pressing rods 14 are respectively perpendicular to the top positions of the ends, far away from each other, of the two material ejecting blocks 29; the distance between the bottoms of the two second pressing rods 14 and the top of the ejection block 29 which is matched in position is equal to the distance between the bottom of the two first pressing rods 13 and the top of the L-shaped pressing block 23 far away from the anti-skid rubber 24; the outer diameter of the two ejector blocks 29 and the L-shaped ejector rod 28 are smaller than the inner diameter of the L-shaped ejector groove 25 at the corresponding position; through the decline of two first pressure pin 13, conveniently support L type briquetting 23 and keep away from the one end of non-slip rubber 24, make wafer body 3 lose the spacing nature, rethread two No. two pressure pin 14 support ejection of compact piece 29 tops, conveniently make L type ejector pin 28 slightly rise to with wafer body 3 slight jack-up, make things convenient for the sucking disc to adsorb.
The distance between two anti-slip rubbers 24 close to the side wall is equal to the distance between two ends of the wafer body 3, so that the wafer body 3 is conveniently and well limited at the top of the rotary disc frame 21, and the situation of displacement is avoided in the process of cleaning and rotating.
Specifically, the material pressing mechanism 1 of the device is connected to the suction cup frame through four bolts 12, when the ring frame 11 descends, the two first material pressing rods 13 are driven to descend together, the two anti-skid rubbers 24 clamp the two sides of the wafer body 3 due to the torsion of the torsion spring 22, the situation that the rotating disc frame 21 is displaced in the rotating process is avoided, when the first material pressing rods 13 descend to abut against one end, away from the anti-skid rubbers 24, of the L-shaped pressing block 23, the two anti-skid rubbers 24 are away from the wafer body 3, the wafer body 3 loses the limiting property, meanwhile, the bottoms of the two second material pressing rods 14 abut against the top of the material pressing blocks 29, the two material pressing blocks 29 slightly eject the L-shaped ejecting rod 28 inside the L-shaped ejecting groove 25 through the rotation shaft 26 and the activity of the movable shaft 27, so that a gap is abutted between the wafer body 3 and the rotating disc frame 21, and the material sucking work of the suction cup is facilitated.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The device for removing the metal pollutants for polishing the wafers is characterized by comprising a material pressing mechanism (1), wherein a material ejecting mechanism (2) is arranged below the material pressing mechanism (1), and a wafer body (3) is placed at the top of the material ejecting mechanism (2);
the material pressing mechanism (1) comprises a ring frame (11), bolts (12) are inserted into four corners of the ring frame (11), and a first material pressing rod (13) and a second material pressing rod (14) are fixed at two ends of the bottom of the ring frame (11) respectively;
the material ejecting mechanism (2) comprises a rotary disc frame (21), two L-shaped ejecting grooves (25) are drilled in the rotary disc frame (21), ejecting blocks (29) are inserted into the bottom ends of the two L-shaped ejecting grooves (25), L-shaped ejector rods (28) are inserted into the top ends of the two L-shaped ejecting grooves (25), one ends, close to each other, of the two ejecting blocks (29) and the L-shaped ejector rods (28) are respectively positioned inside the L-shaped ejecting grooves (25) and rotatably connected with one end of a movable shaft (27), one ends, far away from the movable shaft (27), of the two ejecting blocks (29) are both positioned inside the L-shaped ejecting grooves (25) and movably connected with the rotary disc frame (21) through rotating shafts (26), the hangers on two sides of the top of the rotary plate frame (21) are connected with one end of the bottom of the L-shaped pressing block (23) through torsion springs (22), and anti-skid rubber (24) is fixed on one side, close to each other, of the two L-shaped pressing blocks (23).
2. The device for removing metal contaminants from wafer polishing as recited in claim 1, wherein the two first pressing rods (13) are respectively positioned perpendicular to the two L-shaped pressing blocks (23) at an end thereof remote from the anti-slip rubber (24).
3. The apparatus for removing metal contaminants for wafer polishing as set forth in claim 1, wherein two said second swage rods (14) are respectively positioned perpendicular to the top positions of the two ejector blocks (29) at ends thereof distant from each other.
4. The device for removing metal contaminants from wafer polishing as claimed in claim 1, wherein the distance from the bottom of each of the two second swage rods (14) to the top of the matching ejector block (29) is equal to the distance from the bottom of each of the two first swage rods (13) to the top of the L-shaped block (23) on the side away from the anti-slip rubber (24).
5. The apparatus for removing metal contaminants for wafer polishing as set forth in claim 1, wherein the distance between the two adjacent side walls of said non-slip rubber (24) is equal to the distance between the two ends of the wafer body (3).
6. The apparatus for removing metal contaminants for wafer polishing as set forth in claim 1, wherein the outer diameter of both of said ejector block (29) and said L-shaped ejector pins (28) is smaller than the inner diameter of the L-shaped ejector groove (25) at the corresponding position thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121738402.3U CN215496672U (en) | 2021-07-28 | 2021-07-28 | Metal contaminant removing device for wafer polishing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121738402.3U CN215496672U (en) | 2021-07-28 | 2021-07-28 | Metal contaminant removing device for wafer polishing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215496672U true CN215496672U (en) | 2022-01-11 |
Family
ID=79752861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121738402.3U Active CN215496672U (en) | 2021-07-28 | 2021-07-28 | Metal contaminant removing device for wafer polishing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215496672U (en) |
-
2021
- 2021-07-28 CN CN202121738402.3U patent/CN215496672U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 201900 No. 181, Shanlian Road, Baoshan City Industrial Park, Baoshan District, Shanghai Patentee after: Shanghai Shenhe Investment Co.,Ltd. Address before: 201900 No. 181, Shanlian Road, Baoshan City Industrial Park, Baoshan District, Shanghai Patentee before: SHANGHAI SHENHE THERMO-MAGNETICS ELECTRONICS Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230706 Address after: No. 21, Nanhai Road, Yi'an District, Tongling City, Anhui Province 244151 Patentee after: Anhui fulede Changjiang semiconductor material Co.,Ltd. Address before: 201900 No. 181, Shanlian Road, Baoshan City Industrial Park, Baoshan District, Shanghai Patentee before: Shanghai Shenhe Investment Co.,Ltd. |
|
| TR01 | Transfer of patent right |