CN215494938U - Sensor module, touch module and electronic equipment - Google Patents
Sensor module, touch module and electronic equipment Download PDFInfo
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- CN215494938U CN215494938U CN202121710202.7U CN202121710202U CN215494938U CN 215494938 U CN215494938 U CN 215494938U CN 202121710202 U CN202121710202 U CN 202121710202U CN 215494938 U CN215494938 U CN 215494938U
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Abstract
Disclosed herein are a sensor module, a touch module and an electronic device. The touch module includes: touch-control base plate, support, circuit board and first cushion, the touch-control base plate the circuit board with the support sets gradually, being close to of circuit board one side of support is installed and is used for detecting the sensor of the touch-control dynamics on the touch-control base plate, first cushion compresses tightly to be fixed the sensor with between the support. Due to the arrangement of the first elastic cushion, the sensor is in a positive pressure state, deformation and stable output of detection signals are facilitated, the number of the sensors can be reduced, a subsequent processing algorithm for the detection signals of the sensor can be simplified, the product performance is improved, and the product cost is reduced.
Description
Technical Field
The present disclosure relates to, but is not limited to, a sensor module, a touch module, and an electronic device.
Background
Some touch-control modules install the sensor that detects the touch-control dynamics on the circuit board, and there is not any part contact sensor below. When a user presses the touch substrate, the sensor is bent and deformed (micro-deformed) along with the touch substrate, so that the subsequent processing of detection data of the sensor is complex, the number of required sensors is large, the overall cost of the touch module is high, and the performance is unstable.
SUMMERY OF THE UTILITY MODEL
The following is a summary of the subject matter described in detail herein.
The embodiment of the application provides a sensor module, touch module and electronic equipment, and the sensor is in positive pressure state, is favorable to warping and the stable output of detected signal to reducible sensor's use quantity can simplify the processing algorithm to the detected signal of sensor simultaneously, has promoted product property ability, and has reduced the cost of product.
The embodiment of the application provides a touch module, include: touch-control base plate, support, circuit board and first cushion, the touch-control base plate the circuit board with the support sets gradually, being close to of circuit board one side of support is installed and is used for detecting the sensor of the touch-control dynamics on the touch-control base plate, first cushion compresses tightly to be fixed the sensor with between the support.
In some exemplary embodiments, at least one sensor is arranged on each of the sensors and the first elastic pads, and the number of the sensors is equal to that of the first elastic pads in one-to-one correspondence;
a first end face of the first elastic pad, which is close to the circuit board, is provided with a mounting groove, the sensor is mounted to the mounting groove corresponding to the first elastic pad and is in extrusion fit with the bottom wall of the mounting groove, and a gap is formed between the first end face of the first elastic pad and the circuit board, or the first end face of the first elastic pad is in contact with the circuit board; or the sensor is in press fit with the first end face of the corresponding first elastic pad close to the circuit board.
In some exemplary embodiments, the touch module further includes a limiting pad, the limiting pad is disposed between the circuit board and the bracket, and an avoiding hole for avoiding the first elastic pad and the sensor is disposed on the limiting pad.
In some exemplary embodiments, the sensor is disposed at an edge of the circuit board, the position limiting pad is in a ring-shaped structure and disposed along the edge of the circuit board, and the hardness of the position limiting pad is less than that of the first elastic pad, wherein:
the limiting pad is fixedly connected with one of the circuit board and the bracket, and a gap is reserved between the limiting pad and the other of the circuit board and the bracket; or the circuit board and the bracket are fixedly connected with the limiting pad.
In some exemplary embodiments, the first elastic pad is provided with one and is of an annular structure, at least one mounting groove is arranged on a first end surface of the first elastic pad close to one side of the circuit board, the sensor is provided with at least one mounting groove, the number of the mounting grooves is equal to that of the sensors, the mounting grooves correspond to the sensors in a one-to-one correspondence manner, and the sensors are mounted to the corresponding mounting grooves and are in press fit with the bottom walls of the corresponding mounting grooves.
In some exemplary embodiments, the sensor has a positive electrode and a negative electrode, the positive electrode and the negative electrode are respectively located at a side close to the bracket and a side close to the circuit board, the touch module further includes a second elastic pad and an electrical connector, the second elastic pad is disposed between the sensor and the circuit board, the first elastic pad and the second elastic pad are conductive pads and are respectively electrically connected with the positive electrode and the negative electrode of the sensor, and the first elastic pad and the second elastic pad are electrically connected to the circuit board through the electrical connector;
or the sensor is provided with a positive pole and a negative pole, the positive pole and the negative pole are positioned on one side close to the circuit board, the touch module further comprises an electric connector, and the positive pole and the negative pole of the sensor are electrically connected to the circuit board through the electric connector.
In some exemplary embodiments, the sensor has a positive electrode and a negative electrode, the positive electrode and the negative electrode are respectively located at a side close to the bracket and a side close to the circuit board, the touch module further includes a second elastic pad, an electrical connector, and a fixing member, the second elastic pad is disposed between the sensor and the circuit board, the first elastic pad and the second elastic pad are conductive pads and are respectively electrically connected to the positive electrode and the negative electrode of the sensor, the fixing member includes a connecting portion and a limiting portion, one end of the connecting portion is connected to the limiting portion, the other end of the connecting portion passes through the bracket, the first elastic pad, the sensor and the second elastic pad and is fixed to the circuit board, the limiting portion is located at a side of the bracket away from the first elastic pad, and a gap is provided between the limiting portion and the bracket, the fixing piece is provided with a first conductive part and a second conductive part, the first elastic pad and the second elastic pad are electrically connected to the electric connecting piece through the first conductive part and the second conductive part respectively, and the electric connecting piece is electrically connected with the circuit board;
or, the sensor has positive pole and negative pole, positive pole and negative pole are located and are close to one side of circuit board, the touch module still includes electric connector and mounting, the positive pole and the negative pole of sensor pass through the electric connector electricity is connected to the circuit board, the mounting includes connecting portion and spacing portion, the one end of connecting portion with spacing portion connects, the other end of connecting portion passes the support, first cushion with the sensor, and fix to the circuit board, spacing position in one side of keeping away from of support first cushion, just spacing portion with be equipped with the clearance between the support.
In some exemplary embodiments, the edge of the bracket is provided with a plurality of fixing parts arranged along the circumferential direction, and the plurality of fixing parts are fixedly connected with a shell of the electronic device;
or, the support is in a cantilever beam form, one end of the support is provided with a fixing part which is fixedly connected with a shell of the electronic equipment, the other end of the support is a free end, and the free end is in press fit with the first elastic cushion;
or the bracket is arranged to be in an integrated structure with the shell of the electronic equipment.
An embodiment of the present application further provides an electronic device, including the touch module according to any one of the above embodiments.
In some exemplary embodiments, the electronic device is a notebook computer, and the bracket of the touch module is fixed to or integrally formed with a C shell of the notebook computer;
two ends of a touch substrate of the touch module extend to the edge of the C shell along the length direction of the C shell, or the length of the touch substrate is smaller than that of the C shell;
the surface of the touch substrate is provided with a touch area and a non-touch area, or the whole surface of the touch substrate is the touch area;
the length of the circuit board of the touch module is smaller than or equal to the length of the touch substrate.
The embodiment of the application provides a sensor module, includes: the touch control module comprises a sensor and a first elastic pad, wherein the sensor is fixed to the first elastic pad, the sensor module is arranged to be fixed between a circuit board of the touch control module and a support, the sensor is arranged to be installed on the circuit board, and the first elastic pad is arranged to be compressed and fixed between the sensor and the support.
The touch module that this application embodiment provided, touch-control base plate, circuit board and support set gradually, and the support is used for supporting touch-control base plate and circuit board, and when pressing the touch-control base plate, pressing force accessible touch-control base plate transmits to the circuit board, makes the circuit board take place deformation, and the deformation of sensor detectable circuit board on the circuit board, and then can learn the touch-control dynamics information (including touch-control dynamics size and/or touch-control position etc.) on the touch-control base plate according to the detected signal of sensor.
Be equipped with first cushion between sensor and the support, because the sensor is withstood, is supported by first cushion all the time, therefore the user is when pressing the touch-control base plate, and the sensor bears the normal pressure, and the touch-control module is close the deformation state of normal pressure, is favorable to warping and the stable output of detected signal to reducible sensor's use quantity provides convenience for the realization of follow-up algorithm simultaneously, has promoted product property ability to a great extent, and has reduced the cost of product.
Other features and advantages of the present application will be set forth in the description that follows.
Drawings
Fig. 1 is an exploded view of a touch module according to a first embodiment of the present disclosure;
fig. 2 is an exploded schematic view of a partial structure of the touch module shown in fig. 1;
fig. 3 is a schematic partial cross-sectional structure view of the touch module shown in fig. 1;
fig. 4 is a schematic layout diagram of sensors of a touch module according to an embodiment of the present disclosure;
fig. 5 is a schematic partial cross-sectional view illustrating a touch module according to a second embodiment of the present disclosure;
fig. 6a is a schematic view illustrating a first structure of a bracket of a touch module according to an embodiment of the present disclosure;
fig. 6b is a schematic view illustrating a second structure of a bracket of a touch module according to an embodiment of the present disclosure;
fig. 6c is a schematic structural diagram of a bracket of a touch module according to an embodiment of the present disclosure;
fig. 6d is a schematic diagram illustrating a fourth structure of a bracket of a touch module according to an embodiment of the disclosure;
fig. 6e is a schematic structural diagram of a bracket of a touch module according to an embodiment of the present disclosure;
fig. 7 is an exploded view of a touch module according to a third embodiment of the present disclosure;
FIG. 8a is a schematic partial cross-sectional view illustrating a structure of the touch module shown in FIG. 7;
FIG. 8b is a schematic partial cross-sectional view illustrating another structure of the touch module shown in FIG. 7;
FIG. 8c is a schematic structural diagram of a first elastic pad of the touch module shown in FIG. 7;
fig. 9 is an exploded view of a touch module according to a fourth embodiment of the present disclosure;
fig. 10 is an exploded view of a touch module according to a fifth embodiment of the present disclosure;
fig. 11 is an exploded view of a touch module according to a sixth embodiment of the present disclosure;
fig. 12 is a schematic partial cross-sectional structure view of the touch module shown in fig. 11;
fig. 13 is a schematic structural diagram of a sensor module of the touch module shown in fig. 11;
FIG. 14 is a schematic cross-sectional view of the sensor module shown in FIG. 13;
fig. 15 is a schematic partial cross-sectional structure view of a touch module according to a seventh embodiment of the present application.
Reference numerals:
1: a touch substrate; 11: a touch area; 12: a non-touch area; 2: a circuit board; 3: a sensor; 4: a first elastic pad; 41: mounting grooves; 5: a limiting pad; 51: avoiding holes; 6: a support; 61: a fixed part; 62: mounting holes; 7: a housing; 71: a second through hole; 8: a sensor module; 81: a second elastic pad; 82: a reinforcing sheet; 84: an electrical connection; 85: a first through hole; 9: a fixing member; 91: a connecting portion; 92: a limiting part; S1-S16: a sensor.
Detailed Description
Hereinafter, embodiments of the present application will be described in detail with reference to the accompanying drawings. It should be noted that the embodiments and features of the embodiments in the present application may be arbitrarily combined with each other without conflict.
As shown in fig. 1-3, an embodiment of the present application provides a touch module, which includes a touch substrate 1, a support 6, a circuit board 2, and a first elastic pad 4, where the touch substrate 1, the circuit board 2, and the support 6 are sequentially disposed, a sensor 3 for detecting a touch force on the touch substrate 1 is installed on one side of the circuit board 2 close to the support 6, and the first elastic pad 4 is compressed and fixed between the sensor 3 and the support 6.
The touch substrate 1, the circuit board 2 and the support 6 can be sequentially arranged from top to bottom (i.e., from bottom to top in fig. 1), the sensor 3 is installed on the lower plate surface of the circuit board 2, and the circuit board 2 is a main body part for realizing functions of force, touch and the like. The touch substrate may be glass or mylar, etc.
The bracket 6 may be fixedly connected to a housing 7 of the electronic device and provide structural support for other components of the touch module, such as supporting the touch substrate 1 and the circuit board 2. When the touch substrate 1 is pressed, the pressing force can be transmitted to the circuit board 2 through the touch substrate 1, so that the circuit board 2 deforms and extrudes the sensor 3, the sensor 3 generates an electric signal, and touch force information (including touch force and/or touch position) on the touch substrate 1 can be obtained according to a detection signal of the sensor 3.
As shown in fig. 3, the first elastic pad 4 is sandwiched between the sensor 3 and the bracket 6, and is in a compressed state, that is, after the touch module is assembled, the first elastic pad 4 generates a pre-deformation (the deformation amount can be set as required) for pressing, so that the first elastic pad 4 is in contact with the sensor 3 at any time and can generate a positive pressure during pressing. The sensor 3 is supported and supported by the first elastic cushion 4, so that when a user presses the touch substrate 1, the sensor 3 bears positive pressure, the touch module is close to the deformation state of the positive pressure, and the deformation and the stable output of detection signals are facilitated, the number of the sensors 3 can be reduced, meanwhile, the follow-up processing algorithm for the detection signals of the sensor 3 can be simplified, convenience is provided for the implementation of the follow-up algorithm, the product performance is greatly improved, and the product cost is reduced.
The way in which the positive pressure of the sensor 3 is stressed allows the use of a smaller number of sensors 3 to achieve a design of equivalent semaphore, such as: in the scheme of sensor bending deformation atress, 6-8 sensors are required to detect touch-control dynamics information, and the scheme of this application can only need 4 sensors 3 to detect touch-control dynamics information, the cost is reduced.
In one scheme, as shown in fig. 4, the 4 sensors may be sensors S1-S4 disposed at the edge of the circuit board 2, the sensors S1-S4 are disposed at four corners of the rectangular circuit board 2 and are symmetrically distributed, the sensors S1-S4 may be rectangular, and the length direction of the sensors S1-S4 may be parallel to the width direction of the circuit board 2. In one solution, the 4 sensors may be sensors S5-S8 disposed at the edge of the circuit board 2, the sensors S5-S8 are disposed at four corners of the rectangular circuit board 2 and are symmetrically distributed, the sensors S5-S8 may be rectangular, and the length direction of the sensors S5-S8 may be parallel to the length direction of the circuit board 2. In one solution, the 4 sensors may be sensors S9-S12 disposed at the edge of the circuit board 2, the sensors S9-S12 are disposed at the middle of the four board edges of the rectangular circuit board 2 and are symmetrically distributed, the sensors S9-S12 may be rectangular, and the length directions of the sensors S9-S12 may be parallel to the board edges of the circuit board 2 adjacent to the sensors. In one scheme, the 4 sensors may be sensors S13-S16 disposed at the edge of the circuit board 2, two sensors S13-S14 are disposed at two quarters of one long side of the rectangular circuit board 2, the other two sensors S15-S16 are disposed at two quarters of the other long side of the rectangular circuit board 2, and the sensors S13-S16 are symmetrically distributed, the sensors S13-S16 may be rectangular, and the length directions of the sensors S13-S16 may be parallel to the length direction of the circuit board 2.
Of course, the number of the sensors is not limited to 4, and may be set according to the need, for example, the number of the sensors may be 6, 8, and so on, and different solutions of the sensors may be combined with each other.
In some exemplary embodiments, the area of the end surface of the sensor 3 adjacent to the side of the first elastic pad 4 is not larger than the area of the end surface of the first elastic pad 4 adjacent to the side of the sensor 3, so that the entire end surface of the sensor 3 adjacent to the side of the first elastic pad 4 can be in contact with the first elastic pad 4 and is subjected to the pressing force of the first elastic pad 4.
In some exemplary embodiments, as shown in fig. 1-3 and 7-10, at least one sensor 3 and at least one first elastic pad 4 are provided, the number of the sensors 3 and the number of the first elastic pads 4 are equal and correspond to each other, and the sensors 3 are in press fit with the corresponding first elastic pads 4. As shown in fig. 7 and fig. 8a to 8c, a first end surface of the first elastic pad 4 near the circuit board 2 may be provided with a mounting groove 41, and the sensor 3 is mounted to the mounting groove 41 corresponding to the first elastic pad 4 and is in press fit with a bottom wall of the mounting groove 41; alternatively, as shown in fig. 1 to 3 and 9 to 10, the first end surface of the first elastic pad 4 close to the circuit board 2 may not be provided with the mounting groove 41, and the sensor 3 is directly press-fitted with the first end surface of the corresponding first elastic pad 4 close to the circuit board 2.
The number of the sensors 3 is equal to the number of the first elastic pads 4, and the sensors 3 correspond to the first elastic pads 4 one to one, so that each sensor 3 can be pressed by the corresponding first elastic pad 4 to ensure that the sensor 3 bears positive pressure when the touch substrate 1 is pressed.
One end of the first elastic pad 4 is fixedly connected with the sensor 3, and the other end of the first elastic pad 4 is abutted against the bracket 6 (the first elastic pad 4 and the bracket 6 can be in contact or not in contact); alternatively, one end of the first elastic pad 4 is fixedly connected with the bracket 6, and the other end of the first elastic pad 4 abuts against the sensor 3 (the first elastic pad 4 may contact or may not contact the bracket 6).
The first elastic pad 4 can be single-sided back glued and is fixedly adhered to one of the sensor 3 and the bracket 6, and the other side of the first elastic pad 4 can be abutted to the other of the sensor 3 and the bracket 6, so that the first elastic pad 4 can be pressed on the sensor 3 and the bracket 6 and can generate a pressing force on the sensor 3. Of course, both ends of the first elastic pad 4 can be fixed to the sensor 3 and the bracket 6, respectively, and the first elastic pad 4 needs to be double-sided back adhesive.
It will be appreciated that the first resilient pad 4 may also be secured by other means than gluing.
As shown in fig. 8a, the first end surface of the first elastic pad 4 can contact the circuit board 2 without a gap therebetween; alternatively, as shown in fig. 8b, the first end surface of the first elastic pad 4 has a gap S1 with the circuit board 2, and the two are not in contact. As shown in fig. 8c, the mounting groove 41 of the first elastic pad 4 is a counter bore (non-through hole), so that the first elastic pad 4 is a clip-shaped frame as a whole, and the sensor 3 is embedded in the middle of the clip-shaped frame. The mounting groove 41 may be a rectangular groove or other shape, and the first elastic pad 4 may be a rectangular pad or a circular pad or other shape.
The sensor 3 and the first elastic pad 4 can be made into a sensor module by using an integral forming process, and a positive electrode and a negative electrode are led out from one side of the sensor 3, which is far away from the circuit board 2, and are connected to the circuit board 2. The sensor 3 can be assembled with the circuit board 2 in an adhesive manner, or a second elastic pad can be additionally arranged between the sensor 3 and the circuit board 2, or the second elastic pad is not arranged, and at the moment, the sensor 3 can be directly adhered to the circuit board 2 by using high-performance adhesive, such as curing adhesive, ultraviolet adhesive and the like, so as to ensure the adhesion stability.
In some exemplary embodiments, as shown in fig. 1-3 and 9-10, the touch module further includes a position limiting pad 5, and the position limiting pad 5 is disposed between the circuit board 2 and the bracket 6.
The limiting pad 5 is arranged between the circuit board 2 and the support 6, and can limit the deformation of the circuit board 2 and the touch substrate 1, so that the circuit board 2 and the touch substrate 1 are prevented from being deformed too much when the touch substrate 1 is pressed by a pressing force, and further from interfering or colliding with other components of the electronic device.
As shown in fig. 2 and 3, the spacing pad 5 is provided with an avoiding hole 51 for avoiding the first elastic pad 4 and the sensor 3.
In some exemplary embodiments, the position limiting pad 5 is configured to be fixedly connected with one of the circuit board 2 and the bracket 6, and has a gap with the other of the circuit board 2 and the bracket 6.
The limiting pad 5 can be fixedly connected with the circuit board 2, a gap is formed between the limiting pad 5 and the support 6, and the circuit board 2 and the touch substrate 1 can deform to a certain extent due to the existence of the gap. Or, the limiting pad 5 may be fixedly connected to the bracket 6, and a gap is formed between the limiting pad 5 and the circuit board 2, and the existence of the gap enables the circuit board 2 and the touch substrate 1 to deform to a certain extent.
In other exemplary embodiments, the circuit board 2 and the bracket 6 are fixedly connected with the limiting pad 5. At this time, the limiting pad 5 has a certain compressive deformation capability, so that the circuit board 2 and the touch substrate 1 can deform to a certain extent.
Wherein, spacing pad 5 accessible bonding is fixed, for example: the limiting pad 5 can be glued on one side to be fixedly adhered to the circuit board 2 or the bracket 6; alternatively, the position limiting pad 5 can be double-sided adhesive backed for adhering and fixing the circuit board 2 and the bracket 6 together. Of course, the limiting pad 5 can also be fixed to the circuit board 2 and/or the bracket 6 in other ways.
In some exemplary embodiments, the double-sided adhesive of the position limiting pad 5, the single-sided adhesive of the first elastic pad 4, and whether the one-sided adhesive of the first elastic pad 4 close to the sensor 3 or the one-sided adhesive of the bracket 6 need to be determined according to the bonding process of the position limiting pad 5. Such as: spacing pad 5 bonds with circuit board 2 earlier, then first cushion 4 needs the gum near the one side of sensor 3, treats that spacing pad 5 and circuit board 2 bonding are fixed, first cushion 4 and sensor 3 bonding are fixed after finishing, tears the gum of spacing pad 5 another side again, pastes spacing pad 5 and support 6 firmly, accomplishes the assembly promptly. On the contrary, if the limiting pad 5 is firstly adhered to the support 6, one surface of the first elastic pad 4 close to the support 6 needs to be coated with gum, after the first elastic pad 4 is fixedly adhered to the support 6 and the limiting pad 5 is fixedly adhered to the support 6, the gum on the other surface of the limiting pad 5 is torn off, and the limiting pad 5 is firmly adhered to the circuit board 2, so that the assembly is completed.
In some exemplary embodiments, the hardness of the spacing pad 5 is less than the hardness of the first elastic pad 4. When 5 two-sided gum of spacing pad and bond to circuit board 2 and support 6 on, the hardness of spacing pad 5 is less than the hardness of first cushion 4 for 5 materials of spacing pad are softer, easily compression deformation, so that do not influence the dynamics of the sensor 3 that supports through first cushion 4 and detect. When the limiting pad 5 is single-sided back glued and is fixedly bonded with one of the circuit board 2 and the bracket 6 and has a gap with the other of the circuit board 2 and the bracket 6, the hardness of the limiting pad 5 and the hardness of the first elastic pad 4 can be unlimited, and the hardness of the limiting pad 5 can be greater than, equal to or less than the hardness of the first elastic pad 4.
In some exemplary embodiments, as shown in fig. 1, 9 and 10, the sensor 3 is disposed at the edge of the circuit board 2, and the position limiting pad 5 is in a ring-shaped structure and disposed along the edge of the circuit board 2.
Because the sensor 3 is supported by the first elastic pad 4 and is in a positive pressure deformation state when being stressed, the sensor 3 can be arranged at the edge of the circuit board 2, and other parts of the electronic equipment can be conveniently arranged. The limiting pad 5 is an annular structure arranged along the edge of the circuit board 2 and can limit the edge of the circuit board 2. Of course, the position limiting pad 5 can be arranged at other positions of the circuit board 2.
In the embodiments shown in fig. 1-3 and 9-10, the touch module includes a first elastic pad 4 and a limiting pad 5, the sensor 3 is supported by the first elastic pad 4, and the deformation of the circuit board 2 and the touch substrate 1 is limited by the limiting pad 5. In other exemplary embodiments, as shown in fig. 5, one first elastic pad 4 is provided, at least one mounting groove 41 is provided on a first end surface of the first elastic pad 4 close to the circuit board 2, at least one sensor 3 is provided, the number of the mounting grooves 41 is equal to that of the sensors 3, the mounting grooves 41 correspond to the sensors 3 one by one, and the sensors 3 are mounted to the corresponding mounting grooves 41 and press-fit with the bottom walls of the corresponding mounting grooves 41.
The number of the sensors 3 is equal to the number of the mounting grooves 41 formed in the first elastic pad 4, and the sensors 3 are in one-to-one correspondence with the mounting grooves 41, so that each sensor 3 can be mounted in the corresponding mounting groove 41 and is pressed by the bottom wall of the corresponding mounting groove 41, and the sensor 3 is ensured to bear positive pressure when the touch substrate 1 is pressed.
The first elastic pad 4 is fixedly connected with the bracket 6, and a gap is formed between the first end surface of the first elastic pad 4 and the circuit board 2; or, the first elastic pad 4 is fixedly connected with the circuit board 2, and a gap is formed between the second end surface of the first elastic pad 4 close to the side of the bracket 6 and the bracket 6 (it is required to ensure that the bottom wall of the mounting groove 41 is pressed by the sensor 3 and the bracket 6, for example, the bottom wall of the mounting groove 41 can protrude out of the second end surface of the first elastic pad 4); alternatively, the first elastic pad 4 is fixedly connected to the circuit board 2 and the bracket 6. The first resilient pad 4 may be single-or double-sided adhesive backed for adhesive fixation to the circuit board 2 and/or the bracket 6.
The first end surface of the first elastic pad 4 is provided with mounting grooves 41 with the number corresponding to that of the sensors 3, so that the sensors 3 are mounted on the corresponding mounting grooves 41 and then are in press fit with the bottom walls of the corresponding mounting grooves 41. The part of the first end surface of the first elastic pad 4, which is not provided with the mounting groove 41, can limit the circuit board 2 and the touch substrate 1, so as to prevent the circuit board 2 and the touch substrate 1 from deforming too much when the touch substrate 1 is pressed by a pressing force, and further interfering or colliding with other components of the electronic device.
In the embodiment shown in fig. 5, the sensor 3 may be disposed at the edge of the circuit board 2, and the first elastic pad 4 has a ring-shaped structure.
Arranging the sensor 3 at the edge of the outermost periphery of the circuit board 2 has the advantage of saving space, facilitating the arrangement of other components of the electronic device.
In the embodiment shown in fig. 5, the first elastic pad 4 can be in press fit with the sensor 3, so that the sensor 3 is in a positive pressure state, and can limit deformation of the touch substrate 1 and the circuit board 2, and the first elastic pad 4 has dual functions, which is helpful to simplify the structure of the touch module.
In some exemplary embodiments, as shown in fig. 12-14, the touch module further includes a second elastic pad 81, and the second elastic pad 81 is disposed between the sensor 3 and the circuit board 2. The second resilient pad 81 may provide a soft-connection support for the sensor 3.
As shown in fig. 13 and 14, the touch module may further include a reinforcing sheet 82. Wherein, the reinforcing sheet 82 is arranged between the first elastic cushion 4 and the bracket 6, the reinforcing sheet 82 is fixed with the bracket 6, and the first elastic cushion 4 is fixed to the reinforcing sheet 82.
In the embodiment shown in fig. 12 and 13, the housing 7 and the bracket 6 of the electronic device are of an integral structure, the reinforcing sheet 82 is disposed between the first elastic pad 4 and the housing 7, and the reinforcing sheet 82 is fixed to the housing 7.
The reinforcing plate 82 may be a steel plate or other material. The reinforcing sheet 82 may be provided with a back adhesive to be bonded and fixed to the bracket 6 or the housing 7, or the reinforcing sheet 82 may be fixed by welding or the like.
The reinforcing plate 82 can reinforce the support of the sensor 3 and protect the sensor 3.
In some exemplary embodiments, as shown in fig. 12-14, the sensor 3 has a positive electrode and a negative electrode, the positive electrode and the negative electrode of the sensor 3 are respectively located at a side close to the bracket 6 (or a side close to the housing 7 when the bracket 6 is integrated with the housing 7 of the electronic device) and a side close to the circuit board 2, the touch module further includes an electrical connector 84, the first elastic pad 4 and the second elastic pad 81 are both conductive pads and are respectively connected with the positive electrode and the negative electrode of the sensor 3, the first elastic pad 4 and the second elastic pad 81 can be electrically connected to the electrical connector 84, and the electrical connector 84 is electrically connected with the circuit board 2. The electrical connector 84 may be an FPC (Flexible Printed Circuit) or other electrical connector. The electrical connection member 84 may be disposed between the first elastic pad 4 and the bracket 6, or when the bracket 6 and the housing 7 of the electronic device are of an integrated structure, the electrical connection member 84 may be disposed between the first elastic pad 4 and the housing 7, and specifically, the electrical connection member 84 is disposed between the first elastic pad 4 and the reinforcing sheet 82.
The first elastic pad 4 and the second elastic pad 81 can not only function as elastic supports, but also function as electrical connections, so that the positive electrode and the negative electrode of the sensor 3 are electrically connected to the electrical connector 84, and then connected to the circuit board 2 through the electrical connector 84, so as to realize signal transmission between the sensor 3 and the circuit board 2.
The reinforcing sheet 82, the electrical connector 84, the first elastic pad 4, the sensor 3 and the second elastic pad 81 are sequentially arranged and can be connected through gluing to form the sensor module 8.
As shown in fig. 11-14, the touch module further includes a fixing member 9, the fixing member 9 includes a connecting portion 91 and a limiting portion 92, one end of the connecting portion 91 is connected to the limiting portion 92, and the other end of the connecting portion passes through the bracket 6 (or the bracket 6 and the housing 7 of the electronic device are in an integrated structure, and passes through the housing 7), the reinforcing sheet 82, the electrical connector 84, the first elastic pad 4, the sensor 3, and the second elastic pad 81, and is fixed to the circuit board 2, the limiting portion 92 is located on one side of the bracket 6 (or the housing 7 of the bracket 6 in an integrated structure), which is far away from the first elastic pad 4, and a gap S is provided between the limiting portion 92 and the bracket 6 (or the housing 7 of the bracket 6 in an integrated structure). Wherein the gap S may be 0.5mm or may be adjusted as required.
The center of the sensor module 8 may be provided with a first through hole 85, the bracket 6 is provided with a second through hole (or the housing 7 integrated with the bracket 6 is provided with a second through hole 71), and the connecting portion 91 of the fixing member 9 may pass through the second through hole on the bracket 6 (or the second through hole 71 on the housing 7 integrated with the bracket 6) and the first through hole 85 on the sensor module 8, and is fixed to the circuit board 2. The sectional area of the limiting portion 92 of the fixing member 9 is larger than that of the second through hole, so that the limiting portion 92 performs a limiting function, and a gap S is provided between the limiting portion 92 and the bracket 6 (or the housing 7 integrated with the bracket 6).
The whole accessible of sensor module 8 bonds or other modes are fixed to circuit board 2 on, and the fixed effect of rethread mounting 9 reinforcing sensor module 8 and circuit board 2 for the two is fixed firm, can not drop. A gap S is provided between the limiting portion 92 of the fixing member 9 and the bracket 6 (or the housing 7 integrated with the bracket 6) to ensure that the limiting portion 92 does not contact the bracket 6 (or the housing 7 integrated with the bracket 6) to affect the usability of the touch module when the touch substrate 1 is normally pressed, and to protect the sensor module 8 and the circuit board 2 from falling.
The fixing member 9 is a screw or a rivet, and may be fixed to the circuit board 2 by screwing, riveting, or the like. The fixing member 9 may have a first conductive portion and a second conductive portion thereon, the first elastic pad 4 and the second elastic pad 81 are electrically connected to the electrical connector 84 through the first conductive portion and the second conductive portion, respectively, and the electrical connector 84 is electrically connected to the circuit board 2.
The fixing member 9 may be formed with a first conductive portion on one side and a second conductive portion on the other side, the first conductive portion and the second conductive portion being insulated from each other and electrically connected to the electric connecting member 84.
In other exemplary embodiments, as shown in fig. 15, the positive electrode and the negative electrode of the sensor 3 are both located at a side close to the circuit board 2, that is, the sensor 3 has a flanged electrode (one of the positive electrode and the negative electrode is bent so as to be located at the same side as the other of the positive electrode and the negative electrode), and in this case, the touch module may further include an electrical connector 84, and the positive electrode and the negative electrode of the sensor 3 are electrically connected to the circuit board 2 through the electrical connector 84. The electrical connector 84 may be an FPC (Flexible Printed Circuit) or other electrical connector. An electrical connection 84 may be provided between the sensor 3 and the circuit board 2.
As shown in fig. 15, the touch module may further include a fixing member 9, the fixing member 9 includes a connecting portion 91 and a limiting portion 92, one end of the connecting portion 91 is connected to the limiting portion 92, the other end of the connecting portion 91 passes through the bracket 6 (or the housing 7 integrated with the bracket 6), the first elastic pad 4, the sensor 3 and the electrical connector 84, and is fixed to the circuit board 2, the limiting portion 92 is located on one side of the bracket 6 (or the housing 7 integrated with the bracket 6) away from the first elastic pad 4, and a gap S is provided between the limiting portion 92 and the bracket 6 (or the housing 7 integrated with the bracket 6).
In the exemplary embodiment shown in fig. 15, the sensor 3 has a flanged electrode and can be electrically connected to the circuit board 2 by an electrical connection 84, and therefore, the first elastic pad 4 and the fixing member 9 may not have a conductive function. A gap S is provided between the limiting portion 92 of the fixing member 9 and the bracket 6 (or the housing 7 integrated with the bracket 6) to ensure that the limiting portion 92 does not contact the bracket 6 (or the housing 7 integrated with the bracket 6) to affect the usability of the touch module when the touch substrate 1 is normally pressed, and to protect the sensor module 8 and the circuit board 2 from falling. The fixing member 9 is a screw or a rivet.
As shown in fig. 15, the touch module may further include a reinforcing sheet 82. The reinforcing sheet 82 is disposed between the first elastic pad 4 and the bracket 6 (or the housing 7 integrated with the bracket 6), the reinforcing sheet 82 is fixed to the bracket 6 (or the housing 7 integrated with the bracket 6), and the first elastic pad 4 is fixed to the reinforcing sheet 82.
The reinforcing plate 82 may be a steel plate or other material. The reinforcing sheet 82 may be provided with a back adhesive to be bonded and fixed to the bracket 6 or the housing 7, or the reinforcing sheet 82 may be fixed by welding or the like.
The reinforcing plate 82 can reinforce the support of the sensor 3 and protect the sensor 3.
In some exemplary embodiments, as shown in fig. 6a to 6e, the edge of the bracket 6 is provided with a plurality of fixing portions 61 arranged along the circumferential direction, and the plurality of fixing portions 61 are provided to be fixedly connected with the housing 7 of the electronic device.
In an exemplary embodiment, as shown in fig. 6a, the plurality of fixing portions 61 includes a plurality of fixing holes arranged along the circumferential direction and opened at the edge of the bracket 6, the plurality of fixing holes may be symmetrically arranged, and the bracket 6 may be fixed to the housing 7 of the electronic device by screws.
As shown in fig. 6a, the bracket 6 is rectangular, and four corners of the bracket 6 may be provided with fixing holes. Further, one or more fixing holes may be disposed along the long side of the bracket 6, and the one or more fixing holes may be located at the bisector (e.g., trisection point, quartering point, etc.) of the long side of the bracket 6.
In another exemplary embodiment, as shown in fig. 6b to 6e, the plurality of fixing portions 61 include a plurality of outwardly protruding fixing lugs provided at the edge of the bracket 6, and the plurality of fixing lugs are arranged along the circumferential direction of the bracket 6 and may be symmetrically arranged. Each fixing lug is provided with a fixing hole so as to be fixed to the shell 7 of the electronic equipment through a screw.
As shown in fig. 6 b-6 d, the bracket 6 is rectangular, and the short edge of each side of the bracket 6 is provided with two fixing lugs protruding outwards, the fixing lugs can extend outwards along the length direction of the bracket 6, and the fixing lugs can be close to the corner of the bracket 6 or far away from the corner of the bracket 6. As shown in fig. 6e, the bracket 6 is rectangular, and four corners of the bracket 6 are provided with fixing lugs protruding outwards, and the fixing lugs extend along the diagonal direction of the bracket 6. Further, as shown in fig. 6c to 6e, fixing lugs protruding outward may be further provided on the long sides of the bracket 6, and the fixing lugs may extend outward in the width direction of the bracket 6. One or more fixing ears may be disposed on the long side of the bracket 6, and the fixing ears may be located at the bisector (e.g., trisection or quartering) of the long side of the bracket 6.
In other exemplary embodiments, as shown in fig. 7 and 8, the bracket 6 is in the form of a cantilever beam, one end of the bracket 6 is provided with a fixed portion, the fixed portion is configured to be fixedly connected with the housing 7 of the electronic device, and the other end of the bracket 6 is a free end, and the free end is in press fit with the first elastic pad 4.
The support 6 is in a cantilever beam form, one end of the support is a fixed end and can be fixed to a shell 7 of the electronic equipment, and the other end of the support is a free end and can be in extrusion fit with the first elastic pad 4. The cantilever-type bracket 6 makes the sensor 3 simply stressed, and is helpful to simplify the subsequent algorithm for processing the detection data of the sensor 3.
The free end of the bracket 6 may be provided with a mounting hole 62 for mounting the first resilient pad 4. The first resilient pad 4 may be bonded to the free end of the support 6 and/or the sensor 3. The first resilient pad 4 may be double-sided adhesive backed to bond the sensor 3 and the bracket 6 together, or the first resilient pad 4 may be single-sided adhesive backed to secure one of the sensor 3 and the bracket 6 and press fit the other of the sensor 3 and the bracket 6. The first elastic pad 4 may be a solid cylinder, a mounting groove 41 with a counter bore structure may be dug at a position of the first elastic pad 4 corresponding to the sensor 3, and the sensor 3 may be pressed against a bottom wall of the mounting groove 41.
In still other exemplary embodiments, as shown in fig. 9-11, the stand is provided as a unitary structure with the housing 7 of the electronic device. Wherein the housing 7 may be provided with shoulders for supporting the sensor.
The bracket and the shell 7 of the electronic equipment are of an integrated structure, so that the number of parts can be reduced, and the structure and the assembly steps of the product can be simplified.
In some exemplary embodiments, the sensor 3 may be an elastic wave sensor. Such as: elastic wave sensors include, but are not limited to, piezoelectric sensors, strain sensors, etc., which may include piezoelectric ceramic sensors, piezoelectric film sensors, piezoelectric crystal sensors, or other sensors having a piezoelectric effect, etc.
In some exemplary embodiments, the sensor 3 may be mounted to the circuit board 2 by SMT (Surface Mounting Technology) or adhesive bonding.
In some exemplary embodiments, the material of the first elastic pad 4 may be rubber or foam. Such as: the first elastic pad 4 can be made of foam-like material with proper thickness, but the first elastic pad 4 is required to be in contact with the sensor 3 and can be squeezed to generate positive pressure. Of course, the first elastic pad 4 may be made of other materials.
In some exemplary embodiments, the second elastic pad 81 may be made of rubber or foam. When the first elastic pad 4 and the second elastic pad 81 are conductive pads, they may be conductive rubber or conductive foam.
In some exemplary embodiments, the material of the position limiting pad 5 may be rubber. Of course, the spacing pad 5 may be made of other materials. The hardness degree of the material of the limiting pad 5 is relevant to the user's pressing hand feeling, the motor vibration feeling (vibration feedback after pressing) and other tests, and materials with reasonable hardness need to be selected according to the specific requirements of products.
In some exemplary embodiments, the material of the bracket 6 may be steel. Of course, the bracket 6 may be made of other materials. In some exemplary embodiments, the bracket 6 may be sheet-like or plate-like, such as: the support 6 may be a steel sheet.
In some exemplary embodiments, the touch substrate 1 is usually made of glass (such as tempered glass) or plastic (such as PMMA). The touch substrate 1 needs to meet certain design requirements, and belongs to a direct contact component of a user.
An embodiment of the present application further provides an electronic device, including the touch module according to any one of the above embodiments.
In some exemplary embodiments, the electronic device may be a notebook computer, and the housing 7 of the electronic device may be a C-shell (C-Cover) of the notebook computer, where the C-shell is a main external component of the notebook computer and provides structural support for a touch module, a keyboard, and the like.
Of course, the electronic device may also be a product with a touch function other than a notebook computer.
In some exemplary embodiments, the electronic device is a notebook computer, and as shown in fig. 1 and 7, the bracket 6 of the touch module is fixed to the C-shell of the notebook computer, or as shown in fig. 9 and 10, the bracket of the touch module is integrally formed with the C-shell of the notebook computer.
As shown in fig. 9 and 10, two ends (left and right ends in fig. 9 and 10) of the touch substrate 1 of the touch module extend to the edge of the C shell along the length direction of the C shell (along the left and right directions in fig. 9 and 10), and at this time, the touch substrate 1 may be an integral structure; alternatively, as shown in fig. 1 and 7, the length of the touch substrate 1 (the dimension in the left-right direction in fig. 1 and 7) is smaller than the length of the C-shell (the dimension in the left-right direction in fig. 1 and 7), and then the touch substrate 1 may be a free-standing structure.
As shown in fig. 1, 7 and 10, the length (dimension in the left-right direction in fig. 1, 7 and 10) of the circuit board 2 of the touch module is equal to the length (dimension in the left-right direction in fig. 1, 7 and 10) of the touch substrate 1; alternatively, as shown in fig. 9, the length (dimension in the left-right direction in fig. 9) of the circuit board 2 of the touch module is smaller than the length (dimension in the left-right direction in fig. 9) of the touch substrate 1.
As shown in fig. 1, 7 and 10, the entire surface of the touch substrate 1 is a touch area, and the projection of the sensor 3 on the touch substrate 1 is located in the touch area. As shown in fig. 9, the surface of the touch substrate 1 has a touch area 11 and a non-touch area 12. Since the sensor 3 is mounted on the edge of the circuit board 2, as shown in fig. 9, the area of the touch substrate 1 facing the circuit board 2 may be a touch area 11, and the other areas may be non-touch areas 12, and the projection of the sensor 3 on the touch substrate 1 is located in the touch area 11.
The embodiment of the application provides a sensor module, includes: a sensor 3 and a first elastic pad 4, the sensor 3 being fixed to the first elastic pad 4. Wherein, the sensor module is set to be fixable between circuit board 2 and support 6 of touch module, and sensor 3 is set to install to circuit board 2, and first cushion 4 is set to compress tightly to be fixed between sensor 3 and support 6.
In some exemplary embodiments, the first end surface of the first elastic pad 4 may be formed with a mounting groove 41, the mounting groove 41 is a counterbore (non-through hole), the sensor 3 is mounted to the mounting groove 41, and the sensor 3 is press-fitted to the bottom wall of the mounting groove 41, that is, the sensor 3 is press-fitted to the bracket 6 to press the bottom wall of the mounting groove 41. Wherein, the sensor 3 can protrude from the mounting groove 41, that is, the sensor 3 is partially accommodated in the mounting groove 41 and partially positioned outside the mounting groove 41, so that a gap S1 is formed between the first end surface of the first elastic pad 4 and the circuit board 2; alternatively, the sensor 3 may be completely accommodated in the mounting groove 41, and the sensor 3 is flush with the first end surface of the first elastic pad 4, so that the first end surface of the first elastic pad 4 is in contact with the circuit board 2.
In other exemplary embodiments, the first elastic pad 4 may not have a mounting groove formed thereon, and the sensor 3 may be fixed to the first end surface of the first elastic pad 4.
Wherein the first elastic pad 4 may be adhesively fixed to the first elastic pad 4, or the sensor 3 and the first elastic pad 4 may be manufactured using an integral molding type process.
In some exemplary embodiments, the sensor module 8 further includes a second elastic pad 81, and the second elastic pad 81 is disposed on a side of the sensor 3 away from the first elastic pad 4.
In some exemplary embodiments, the sensor module 8 may further include a reinforcing sheet 82. The reinforcing sheet 82 is disposed on a side of the first elastic pad 4 away from the sensor 3, and the first elastic pad 4 is fixed to the reinforcing sheet 82.
In some exemplary embodiments, as shown in fig. 13 and 14, the sensor 3 has a positive electrode and a negative electrode, the positive electrode and the negative electrode of the sensor 3 are respectively located at two sides, and the first elastic pad 4 and the second elastic pad 81 are both conductive pads and are respectively connected with the positive electrode and the negative electrode of the sensor 3.
The sensor module 8 further includes an electrical connector 84, the first and second elastic pads 4 and 81 may be electrically connected to the electrical connector 84, and the electrical connector 84 is electrically connected to the circuit board 2. The electrical connector 84 may be an FPC (Flexible Printed Circuit) or other electrical connector. The electrical connection 84 may be disposed on a side of the first resilient pad 4 away from the sensor 3, such as with the electrical connection 84 disposed between the first resilient pad 4 and the reinforcing patch 82.
The reinforcing sheet 82, the electrical connector 84, the first elastic pad 4, the sensor 3 and the second elastic pad 81 are sequentially arranged and can be connected through gluing to form the sensor module 8.
In other exemplary embodiments, as shown in fig. 15, the sensor 3 has flanged electrodes, and the positive and negative electrodes of the sensor 3 may be located on the side away from the first elastic pad 4 and may be electrically connected to the circuit board 2 through the electrical connectors 84, and thus, the first elastic pad 4 may not have a conductive function. The electrical connector 84 may be an FPC or other electrical connector. The electrical connection 84 may be provided on a side of the sensor 3 remote from the first resilient pad 4.
The reinforcing sheet 82, the first elastic pad 4, the sensor 3 and the electrical connector 84 are sequentially arranged and can be connected by gluing to form the sensor module 8.
In some exemplary embodiments, as shown in fig. 12 to 15, the center of the sensor module 8 may be provided with a first through hole 85 so that the fixing member 9 may be fixed to the circuit board 2 through the bracket 6 and the first through hole 85.
To sum up, the touch module of this application embodiment provides multiple structural scheme who realizes that the sensor forward pressurized deformation to have following advantage:
1. the sensor can be arranged at the edge of the circuit board, so that the space is saved;
2. the sensor can be glued or directly SMT on the circuit board, which is convenient for realizing batch production;
3. the sensor bears positive pressure, so that stable output of deformation and detection signals is facilitated, the number of the sensors is reduced, convenience is brought to algorithm implementation, and product performance is improved to the maximum extent.
In the description of the present application, the term "plurality" refers to two or more.
Although the embodiments disclosed in the present application are described above, the descriptions are only for the convenience of understanding the present application, and are not intended to limit the present application. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as defined by the appended claims.
Claims (11)
1. A touch module, comprising: touch-control base plate, support, circuit board and first cushion, the touch-control base plate the circuit board with the support sets gradually, being close to of circuit board one side of support is installed and is used for detecting the sensor of the touch-control dynamics on the touch-control base plate, first cushion compresses tightly to be fixed the sensor with between the support.
2. The touch module of claim 1, wherein at least one of the sensors and the first elastic pads is provided, and the sensors and the first elastic pads are equal in number and correspond to each other one by one;
a first end face of the first elastic pad, which is close to the circuit board, is provided with a mounting groove, the sensor is mounted to the mounting groove corresponding to the first elastic pad and is in extrusion fit with the bottom wall of the mounting groove, and a gap is formed between the first end face of the first elastic pad and the circuit board, or the first end face of the first elastic pad is in contact with the circuit board; or the sensor is in press fit with the first end face of the corresponding first elastic pad close to the circuit board.
3. The touch module of claim 2, further comprising a limiting pad, wherein the limiting pad is disposed between the circuit board and the support, and an avoiding hole is disposed on the limiting pad to avoid the first elastic pad and the sensor.
4. The touch module of claim 3, wherein the sensor is disposed at an edge of the circuit board, the position limiting pad is of an annular structure and disposed along the edge of the circuit board, and a hardness of the position limiting pad is less than a hardness of the first elastic pad, wherein:
the limiting pad is fixedly connected with one of the circuit board and the bracket, and a gap is reserved between the limiting pad and the other of the circuit board and the bracket; or the circuit board and the bracket are fixedly connected with the limiting pad.
5. The touch module of claim 1, wherein the first elastic pad has one and annular structure, the first end surface of the first elastic pad, which is close to the circuit board, is provided with at least one mounting groove, the sensors are provided with at least one, the number of the mounting grooves is equal to that of the sensors, the mounting grooves correspond to the sensors one by one, and the sensors are mounted to the corresponding mounting grooves and are in press fit with the bottom walls of the corresponding mounting grooves;
the first elastic pad is fixedly connected with the support, and a gap is formed between the first end surface of the first elastic pad and the circuit board; or the first elastic pad is fixedly connected with the circuit board, and a gap is formed between a second end face of the first elastic pad, which is close to one side of the bracket, and the bracket; or, the first elastic pad is fixedly connected to the circuit board and the bracket.
6. The touch module according to any one of claims 1 to 5, wherein the sensor has a positive electrode and a negative electrode, the positive electrode and the negative electrode are respectively located at a side close to the bracket and a side close to the circuit board, the touch module further comprises a second elastic pad and an electrical connector, the second elastic pad is disposed between the sensor and the circuit board, the first elastic pad and the second elastic pad are conductive pads and are respectively electrically connected with the positive electrode and the negative electrode of the sensor, and the first elastic pad and the second elastic pad are electrically connected to the circuit board through the electrical connector;
or the sensor is provided with a positive pole and a negative pole, the positive pole and the negative pole are positioned on one side close to the circuit board, the touch module further comprises an electric connector, and the positive pole and the negative pole of the sensor are electrically connected to the circuit board through the electric connector.
7. The touch module according to any one of claims 1 to 5, wherein the sensor has a positive electrode and a negative electrode, the positive electrode and the negative electrode are respectively located at a side close to the bracket and a side close to the circuit board, the touch module further comprises a second elastic pad, an electrical connector, and a fixing member, the second elastic pad is disposed between the sensor and the circuit board, the first elastic pad and the second elastic pad are conductive pads and are respectively electrically connected to the positive electrode and the negative electrode of the sensor, the fixing member comprises a connecting portion and a limiting portion, one end of the connecting portion is connected to the limiting portion, the other end of the connecting portion passes through the bracket, the first elastic pad, the sensor, and the second elastic pad and is fixed to the circuit board, and the limiting portion is located at a side of the bracket away from the first elastic pad, a gap is arranged between the limiting part and the bracket, a first conductive part and a second conductive part are arranged on the fixing piece, the first elastic pad and the second elastic pad are respectively electrically connected to the electric connecting piece through the first conductive part and the second conductive part, and the electric connecting piece is electrically connected with the circuit board;
or, the sensor has positive pole and negative pole, positive pole and negative pole are located and are close to one side of circuit board, the touch module still includes electric connector and mounting, the positive pole and the negative pole of sensor pass through the electric connector electricity is connected to the circuit board, the mounting includes connecting portion and spacing portion, the one end of connecting portion with spacing portion connects, the other end of connecting portion passes the support, first cushion with the sensor, and fix to the circuit board, spacing position in one side of keeping away from of support first cushion, just spacing portion with be equipped with the clearance between the support.
8. The touch module according to any one of claims 1 to 5, wherein the bracket is provided at an edge thereof with a plurality of fixing portions arranged along a circumferential direction, the plurality of fixing portions being configured to be fixedly connected to a housing of an electronic device;
or, the support is in a cantilever beam form, one end of the support is provided with a fixing part which is fixedly connected with a shell of the electronic equipment, the other end of the support is a free end, and the free end is in press fit with the first elastic cushion;
or the bracket is arranged to be in an integrated structure with the shell of the electronic equipment.
9. An electronic device, comprising the touch module of any one of claims 1-8.
10. The electronic device according to claim 9, wherein the electronic device is a notebook computer, and the bracket of the touch module is fixed to or integrally formed with a C-shell of the notebook computer;
two ends of a touch substrate of the touch module extend to the edge of the C shell along the length direction of the C shell, or the length of the touch substrate is smaller than that of the C shell;
the surface of the touch substrate is provided with a touch area and a non-touch area, or the whole surface of the touch substrate is the touch area;
the length of the circuit board of the touch module is smaller than or equal to the length of the touch substrate.
11. A sensor module, comprising: the touch control module comprises a sensor and a first elastic pad, wherein the sensor is fixed to the first elastic pad, the sensor module is arranged to be fixed between a circuit board of the touch control module and a support, the sensor is arranged to be installed on the circuit board, and the first elastic pad is arranged to be compressed and fixed between the sensor and the support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121710202.7U CN215494938U (en) | 2021-07-26 | 2021-07-26 | Sensor module, touch module and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202121710202.7U CN215494938U (en) | 2021-07-26 | 2021-07-26 | Sensor module, touch module and electronic equipment |
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| CN215494938U true CN215494938U (en) | 2022-01-11 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114740999A (en) * | 2022-04-18 | 2022-07-12 | 深圳市汇顶科技股份有限公司 | Pressure touch pad, pressure touch pad assembly and electronic equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114740999A (en) * | 2022-04-18 | 2022-07-12 | 深圳市汇顶科技股份有限公司 | Pressure touch pad, pressure touch pad assembly and electronic equipment |
| CN114740999B (en) * | 2022-04-18 | 2023-11-14 | 深圳市汇顶科技股份有限公司 | Pressure touch pad, pressure touch pad assembly and electronic equipment |
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