CN215492787U - In-situ mechanical property testing device and equipment thereof - Google Patents
In-situ mechanical property testing device and equipment thereof Download PDFInfo
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- CN215492787U CN215492787U CN202120415065.8U CN202120415065U CN215492787U CN 215492787 U CN215492787 U CN 215492787U CN 202120415065 U CN202120415065 U CN 202120415065U CN 215492787 U CN215492787 U CN 215492787U
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Abstract
The utility model relates to the technical field of material mechanical property testing equipment, in particular to an in-situ mechanical property testing device and equipment thereof. The in-situ mechanical property testing device comprises a base, a connecting rod, a testing probe, a control system and a pressure testing system; the base is used for sealing and connecting with commercial material analysis testing equipment; the connecting rod comprises a first connecting rod and a second connecting rod which are sequentially connected, the free end of the first connecting rod is connected with the base, and the free end of the second connecting rod is connected with the test probe; the control system controls the movement of the connecting rod; the pressure test system is used for controlling and measuring the applied stress of the test probe. The in-situ mechanical property testing device provided by the utility model is matched with the existing commercialized material analysis testing equipment, and the mode can be that the device is directly inserted through the existing interfaces on SEM and FIB, and then the system integration is realized by vacuum sealing; can be extracted when not in use, and cannot influence the normal use of the SEM and the FIB.
Description
Technical Field
The utility model relates to the technical field of material mechanical property testing equipment, in particular to an in-situ mechanical property testing device and equipment thereof.
Background
The testing of the mechanical properties of the microcells of nano-or micro-sized film materials or other two-dimensional materials (fibers, tubes, etc.) is an important characterization test in modern manufacturing and scientific research. Over the past 30 years, many corresponding testing techniques and devices have been commercialized.
The current reported methods for testing the mechanical properties of the microcells are many and can be mainly divided into two major types, namely mechanical methods and non-mechanical methods. The former includes a direct peeling method, a laser peeling method, an indentation method, a scratching method, a stretching method, a bending and spreading method, an abrasion method, a tape sticking method, and the like; the latter includes thermal methods, nucleation methods, capacitance methods, X-ray diffraction methods, and the like. Compared with the non-mechanical method, the mechanical method has stronger practicability, the most common mechanical methods comprise an indentation method, a scratching method and a stretching method, and the combination of the corresponding theory and the testing method is widely applied in the industry.
In terms of the commercial testing equipment on the market, the testing equipment is mostly integrated on a platform of an optical microscope or an atomic force microscope. The disadvantages are that:
1. the resolution of optical microscopy is low and no localized testing is possible for small sized films and materials, such as those on the nanometer or submicron scale.
2. The method is not suitable for testing and analyzing the mechanical property of the film layer of the device level. The process layers in the device are typically complex (patterned) and have dimensions as small as the nanometer scale. In addition, some assays require testing the small areas of those substrates for the binding energy of a certain film layer or between specific film layers. Such as analysis of the bonding force of M1 and the overlying dielectric layer in CMOS devices. In this case, no such testing techniques and equipment are currently available on the market.
3. Some of the films tested by exposure to air are easily oxidized in air or greatly affected by humidity, and thus may be affected by the environment during the test to cause changes in the structure or performance of the films.
There are also some commercial electron microscope based stress testing systems on the market today. But are essentially discrete and require separate mounting to a sample stage of either the SEM or FIB for testing, such as the in-situ indentation test system developed by the swiss federal materials science and technology laboratory (EMPA); hysitron corporation PI85 SEM PicoInder in situ indentor; all the devices are designed in a tray mode, namely the devices are arranged on an SEM sample table for testing, and therefore, the normal use of the SEM/FIB is influenced.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to solving at least one of the problems of the prior art or the related art.
Therefore, the present invention is directed to provide an in-situ mechanical property testing apparatus, which can be integrated into various types of commercially available material analysis equipment currently on the market, such as SEM (scanning electron microscope), FIB (focused ion beam), etc., to implement in-situ stress testing on a nanometer scale. The in-situ mechanical property testing device provided by the utility model can be used for testing the mechanical properties of bulk materials, wire rods and multilayer films, and can realize the testing of the mechanical properties of different process film layers in a semiconductor device and the stress testing of the bonding force between the process layers.
In order to achieve the aim, the utility model provides an in-situ mechanical property testing device which comprises a base, a connecting rod, a testing probe, a control system and a pressure testing system, wherein the base is provided with a base seat;
the base is used for being in sealing connection with the material analysis testing equipment;
the connecting rod comprises a first connecting rod and a second connecting rod which are sequentially connected, the free end of the first connecting rod is connected with the base, and the free end of the second connecting rod is connected with the test probe;
the control system controls the movement of the connecting rod;
the pressure test system is used for controlling and measuring the applied stress of the test probe.
In some possible embodiments, the control system comprises a displacement sensor, a driving motor and control software.
In some possible embodiments, the first connecting rod and the second connecting rod are both telescopic rods, the first connecting rod and the second connecting rod are both provided with displacement sensors and driving motors, different displacement sensors are used for monitoring the movement positions of different connecting rods, and the control software controls the telescopic movement of different telescopic rods respectively.
In some possible embodiments, the base is further provided with a universal rotary connection mechanism, the universal rotary connection mechanism is connected with the first connection rod, the control system further controls the movement of the universal rotary connection mechanism, and the movement of the universal rotary connection mechanism drives the movement of the connection rod.
In some possible embodiments, the pressure testing system comprises a pressure sensor and stress measurement software.
In some possible embodiments, the pressure sensor of the pressure test system is disposed at a position where the connecting rod is connected with the test probe or at a position where the first connecting rod is connected with the second connecting rod.
In some possible embodiments, the base is sealingly connected to an external interface of the material analysis testing apparatus.
In some possible embodiments, a connection port through which the base is sealingly connected to the external interface of the material analysis testing apparatus is provided at a position between the base and the connection rod.
In some possible embodiments, the connection port is further provided with a sealing member and a fixing member for fixing the base to the material analysis and test apparatus.
In some possible embodiments, the test probe comprises a connecting portion and a test portion, the test portion being connected to the connecting rod through the connecting portion;
the test part is selected from any one of the following shapes:
arc, plane, cone, triangle, sharp angle, knife edge, etc.
The utility model also provides in-situ mechanical testing equipment which comprises the in-situ mechanical property testing device and material analysis testing equipment, wherein the in-situ mechanical property testing device is connected with an external interface of the material analysis testing equipment in a vacuum sealing manner;
the material analysis testing equipment is FIB or SEM.
The in-situ mechanical testing equipment provided by the utility model is additionally provided with an in-situ mechanical performance testing device by means of the existing material analysis testing equipment, the in-situ mechanical performance testing device is inserted into the existing material analysis testing equipment such as SEM or FIB, and the system integration is realized by vacuum sealing, so that the nano-scale in-situ stress test can be realized. The method can be used for testing the mechanical properties of the bulk material, the wire and the multilayer film, and can realize the mechanical property test of different process film layers in the semiconductor device and the stress test of the binding force between the process layers.
Compared with the prior art, the utility model has the following beneficial effects:
(1) the in-situ mechanical property testing device provided by the utility model is matched with the existing scanning electron microscope, the existing focused ion beam equipment and the like, and the mode can be that the in-situ mechanical property testing device is directly inserted through the existing interfaces on SEM and FIB, and then the system integration is realized by vacuum sealing; can be extracted when not in use, and cannot influence the normal use of the SEM and the FIB.
(2) According to the in-situ mechanical property testing device provided by the utility model, all tests are carried out in a high-vacuum environment, so that the deviation of a testing result caused by the influence of the environment in the testing process of the film layer can be avoided.
(3) The in-situ mechanical property testing device provided by the utility model can realize the purposes of experimental analysis of in-situ testing and observation of nano materials and structures by utilizing high-resolution imaging of a scanning electron microscope, observe dynamic strain and microstructure change of the materials in the testing and failure processes, and realize nano-scale accurate positioning and observation analysis.
(4) The in-situ mechanical property testing device provided by the utility model can be used for testing and analyzing the mechanical property of the device-level film layer; and the conventional scratch test technology is difficult to realize the bonding force analysis between process layers in the device. The utility model provides a method for testing the bonding force between films in a device, which comprises the steps of utilizing focused ion beam equipment to strip the films to be analyzed (including a bottom process layer) in the device and pattern a testing module, so as to test and analyze the bonding force between the films in the device; in addition, the mechanical property test (such as the test of breaking strength, elastic modulus and the like) of a specific film layer of the semiconductor device can also be realized.
(5) The in-situ mechanical property testing device provided by the utility model can be used for testing the mechanical properties of blocks, wires and multilayer films, such as the testing of film bonding force and nano cutting, the testing of the mechanical properties of nano films and the like.
(6) The mechanical properties tested by the in-situ mechanical property testing device provided by the utility model include but are not limited to hardness, elastic modulus, breaking strength, film interface binding force and the like.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic diagram illustrating an in-situ mechanical property testing apparatus provided by an embodiment of the present invention;
FIG. 2 is a schematic diagram of an in-situ mechanical property testing apparatus in another state according to an embodiment of the present invention;
FIG. 3 shows a schematic of an electron beam chamber (e-column)/ion beam chamber (I-column) and stress test directions of a commercial FIB apparatus according to an embodiment of the present invention;
FIG. 4 shows a schematic of an electron beam chamber (e-column)/ion beam chamber (I-column) and stress test directions of another commercial FIB apparatus in accordance with an embodiment of the present invention;
FIG. 5 shows a schematic view of a different test probe involved in an embodiment of the utility model;
in the figure, 100-base; 101-connection port; 102-universal swivel connection; 200-a connecting rod; 210-a first connecting rod; 220-a second connecting rod; 201-a pressure sensor; 300-test probe.
Detailed Description
In order that the above objects, features and advantages of the present invention can be more clearly understood, a more particular description of the utility model will be rendered by reference to the appended drawings. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited to the specific embodiments disclosed below.
Based on the foregoing, an in-situ mechanical property testing apparatus according to some embodiments of the present invention is described below with reference to the drawings.
An embodiment of the present invention provides an in-situ mechanical property testing apparatus, as shown in fig. 1 and fig. 2, including a base 100, a connecting rod 200, a testing probe 300, a control system, and a pressure testing system;
the base 100 is used for being connected with material analysis and test equipment in a sealing mode;
the connecting rod 200 comprises a first connecting rod 210 and a second connecting rod 220 which are sequentially connected, the free end of the first connecting rod 210 is connected with the base 100, and the free end of the second connecting rod 220 is connected with the test probe 300;
the control system controls the movement of the connecting rod 200;
the pressure test system is used to control and measure the applied stress of the test probe 300.
The in-situ mechanical property testing device provided by the utility model can be well integrated on the existing SEM and FIB equipment in the market, and the mode can be that the in-situ mechanical property testing device is directly inserted through the existing interfaces on the SEM and FIB, and then the system integration is realized by vacuum sealing; the plug-in module can be drawn out when not in use, so that the plug-in module can be used immediately, and the normal use of the SEM and the FIB is not influenced.
In the utility model, the base 100 is connected with the SEM/FIB cavity in vacuum, and the connection between the base and the SEM/FIB cavity can be correspondingly designed according to interfaces of SEM/FIB equipment of different manufacturers and different models.
Further, the base 100 is hermetically connected to an external interface of the material analysis testing apparatus.
Further, a connection port 101, to which the base 100 is hermetically connected with an external interface of the material analysis testing apparatus, is provided at a position between the base 100 and the connection bar 200.
In the present invention, the base 100 is generally outside the external interface of the material analysis and testing apparatus, and the driving motor and its related connection circuit can be generally disposed inside the base 100. A portion of the base 100 near the connection bar 200 or a portion between the base 100 and the connection bar 200 may be provided with a connection port 101 for sealing connection with an external interface of the material analysis testing apparatus.
Further, the connection port 101 is further provided with a sealing member and a fixing member for fixing the base 100 and the material analysis and test apparatus.
The seal is to maintain a vacuum environment in the testing chamber of the material analysis testing apparatus after the base 100 is inserted into the material analysis testing apparatus. The shape of the sealing element can be designed accordingly according to the situation of the part to be sealed. For example, the sealing element can be a sealing ring, a sealing sleeve and the like. In the utility model, the sealing element is a broad meaning, and can refer to one sealing element or a plurality of sealing elements; may refer to a single seal or may refer to a seal assembly.
The fixture is used to secure the base 100 to the material analysis testing apparatus. The fixing piece can be an existing fixing part, such as a flange, according to the fixing requirement. In the utility model, the fixing part is a broad meaning, and can refer to one fixing part or a plurality of fixing parts; may refer to a single fastener or to a fastener assembly.
For commercial SEM and FIB equipment, there are typically multiple interfaces external. The in-situ mechanical property testing device of the utility model can be inserted by utilizing the interfaces so as to realize high integration with SEM/FIB.
Fig. 3 shows the general external interface of a commercial FIB tool, the relative position of the electron beam chamber/ion beam chamber, and the orientation of the stress test of the present invention. As shown in fig. 3, the test probe 300 of the present invention is inserted into the plane of the electron beam cavity/the ion beam cavity at an oblique angle of about 50 degrees (the insertion angles of the devices of different manufacturers may be different), and this oblique insertion can simplify the design of the in-situ test system and save space. The oblique angle insertion can realize the test of normal pressurization and parallel pressurization in one step.
Fig. 4 shows how the direction (angle) of the pressurization needs to be adjusted, and the interface connection and insertion are adopted for testing the binding force of some special film samples.
In order to realize the adjustment of different pressurizing directions, the in-situ mechanical performance testing device can be inserted along the interface of the same plane of the electron beam cavity/the ion beam cavity, so that the stress test analysis in different directions can be realized by utilizing the tilting of the sample stage of the SEM/FIB equipment, as shown in FIG. 4, and more test solutions are provided for the testing equipment provided by the utility model.
In the present invention, the base 100 is generally disposed outside the external interface of the material analysis and testing apparatus, and the driving motor and its related connection circuit can be disposed inside the base 100. The portion of the base 100 near the connection pipe or the connection port 101 of the base 100 hermetically connected with the external interface of the material analysis testing apparatus of the connection rod 200.
In the present invention, the connecting rod 200 is used in a broad sense, and may refer to a single connecting rod 200 or a connecting rod 200 assembly. In the utility model, the connecting rod 200 can be set in various modes, such as an automatic telescopic rod, and the aim of adjusting the position of the test probe 300 is fulfilled by controlling the motion of the telescopic rod through a control system; for another example, the connecting rod 200 may be a sliding connecting rod assembly, the sliding assembly is provided with a sliding slot, and the connecting rod 200 can slide in the sliding slot; and so on.
In the utility model, the control system comprises a displacement sensor, a driving motor and control software.
In the present invention, the control system is used in a broad sense and may comprise at least one displacement sensor, at least one drive motor and at least one control software.
In the utility model, the control system is used for inserting the in-situ mechanical property testing device into the SEM/FIB cavity during testing, accurately moving the testing probe to be close to a sample testing area, and realizing interactive adjustment with the SEM/FIB sample stage; and after the test is finished, the test system is withdrawn from the SEM/FIB cavity, so that the operation and the use of the main body equipment are not influenced.
The control system can control different components, for example, the control system can control the extension and contraction of the rod body of the connecting rod 200, or control the displacement of the rod body of the connecting rod 200; it is also possible to control the displacement of the connection portion between the link 200 and the base 100, thereby controlling the link 200 to be turned in different directions.
Further, the first connecting rod 210 and the second connecting rod 220 are both telescopic rods, the first connecting rod 210 and the second connecting rod 220 are both provided with displacement sensors and driving motors, the displacement sensors are used for monitoring the movement positions of different connecting rods, and the control software controls the telescopic movement of different telescopic rods respectively.
The precision of the first connecting rod 210 and its displacement control and driving device does not need to be very high, the maximum driving displacement can range from millimeter level to tens of centimeters, and on one hand, the first connecting rod is used for inserting the test probe 300 into the SEM/FIB cavity during test analysis; on the other hand, the test probe 300 is drawn out when the test is completed, so that the operation and use of the main body equipment are not affected. The displacement of the second connecting rod 220 needs high precision, generally in nanometer or sub-nanometer scale, and the displacement control and driving system aims to accurately move the test probe to be close to the sample test area, realize the interactive adjustment with the sample stage of the SEM/FIB, and avoid the collision with the sample stage of the FIB/SEM.
The telescopic rod can be a pneumatic telescopic rod or a threaded telescopic rod.
The displacement sensors arranged on different connecting rods are used for monitoring the movement positions of the connecting rods, and the control system can better control the telescopic motion of the telescopic rod through the monitoring of the displacement sensors.
In some possible embodiments, the base 100 is further provided with a universal rotation connection mechanism 102, the universal rotation connection mechanism 102 is connected with the first connection rod 210, and the control system further controls the movement of the universal rotation connection mechanism 102, and the movement of the universal rotation connection mechanism 102 drives the movement of the connection rod 200.
In the present invention, the universal rotation connection mechanism 102 has a broad meaning, and may refer to a universal rotation joint, or a universal rotation joint and its auxiliary components.
In the arrangement, the displacement sensors are respectively arranged on the telescopic rod and the universal rotary connecting mechanism 102, and the number of the driving motor and the control software can be one. The driving motor drives the universal rotation connecting mechanism 102 to move and the connecting rod 200 to extend and retract respectively, and meanwhile, the universal rotation connecting mechanism 102 can drive the connecting rod 200 to move while moving. This is because the universal rotation connecting mechanism 102 is connected to the connecting rod 200, and the universal rotation connecting mechanism 102 moves while moving the connecting rod 200. And the connection rod 200 can move by itself when performing the telescopic motion.
The software of the control system is generally digital control system software.
The driving motor provides propulsion for the test probe 300 during stress testing, and the test probe 300 can perform nano scratch test, nano interface peeling test, nano cutting test analysis and the like.
Further, the pressure testing system comprises a pressure sensor 201 and stress measurement software.
The pressure test system is used for realizing the control and monitoring of the loading stress during the stress test.
The stress application speed and the stress magnitude can be simultaneously controlled by the pressure testing system and the control system; or a pressure testing system and a control system matched with the pressure testing system can be separately arranged, for example, the pressure testing system can comprise a high-precision pressure sensor 201, a high-precision displacement sensor, a high-precision driving motor, high-precision digital control system software and stress testing software.
In the above, the stress test software may exist alone, or may be embedded into the corresponding control software for use.
In various embodiments of the present invention, the pressure sensor 201 of the pressure test system is disposed at a position where the connection rod 200 is connected to the test probe 300 or at a position where the first connection rod 210 is connected to the second connection rod 220.
Further, the test probe 300 includes a connection part and a test part, and the test part is connected with the connection rod 200 through the connection part;
the test part is selected from any one of the following shapes:
arc, plane, cone, triangle, sharp angle, knife edge, etc.
In the present invention, the connection part of the test probe 300 is detachably connected to the connection rod 200, and the test probe 300 can be replaced with different test probes 300 according to different test purposes.
The design of the replaceable test probe is designed for different test purposes.
The replaceable test probe and its attachment design will ensure that the test probe is sufficiently rigid during testing.
The replaceable test probe and its connection design will ensure sufficient operability during test probe replacement.
Shown in fig. 5 is a typical test probe 300 (also referred to as a test probe) proposed in the present invention. There may be different test probes for different test film materials and test purposes.
Wherein the arc-shaped test probe (4a) is used for stress test of the FIB-patterned circular column-shaped test module (such as the description of a subsequent in-situ nano-patterned interface stripping test scheme); the planar test probe (4b) is used for stress testing of the FIB-patterned tetragonal prism-shaped test module (as described in the following in-situ nano-patterned interface peeling test scheme); the tapered test probe (4c) is used for smaller nano-scratch tests (as described in the subsequent in-situ nano-scratch test protocol) for those film layer hardnesses; the pointed test probe (4d) is used for larger nano-scratch tests (as described in the subsequent in-situ nano-scratch test protocol) for those film layer hardnesses; the blade-shaped probe (4e) is used for a nano-cutting test; the pointed probe (4f) is used for mechanical property test (equivalent nano indentation) of a device-level nano film layer.
The utility model also provides in-situ mechanical testing equipment which comprises the in-situ mechanical property testing device and material analysis testing equipment, wherein the in-situ mechanical property testing device is connected with an external interface of the material analysis testing equipment in a vacuum sealing manner;
the material analysis testing equipment is FIB or SEM.
According to the in-situ mechanical testing equipment provided by the utility model, an in-situ mechanical performance testing device is added by means of the existing material analysis testing equipment, the in-situ mechanical performance testing device is inserted into the existing material analysis testing equipment such as SEM or FIB, the system integration is realized by vacuum sealing, the nanoscale in-situ mechanical testing can be realized, and the mechanical performance comprises but is not limited to hardness, elastic modulus, breaking strength, membrane interface binding force and the like. The method can be used for testing the mechanical properties of the bulk material, the wire and the multilayer film, and can realize the mechanical property test of different process film layers in the semiconductor device and the stress test of the binding force between the process layers.
The in-situ mechanical property testing device provided by the utility model can realize the following tests:
1. in-situ nano-scratch testing (non-device level);
2. in-situ nano-scratch testing (device level);
3. in-situ nano-strip testing (non-device level);
4. in-situ nano-strip testing (device level);
5. testing in-situ cutting of the wire;
6. in-situ testing of mechanical properties of the nanolayer film (non-device level);
7. in-situ testing of mechanical properties of the nanolayer film (device level).
In the present invention, the material analysis testing equipment is FIB (focused ion beam) or SEM (Scanning electron microscope), and may refer to FIB with SEM function or FIB alone, or may refer to SEM with FIB function or SEM alone.
In the present invention, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; the term "plurality" means two or more unless expressly limited otherwise. The terms "mounted," "connected," "fixed," and the like are to be construed broadly, and for example, "connected" may be a fixed connection, a removable connection, an integral connection, or a virtual connection; "coupled" may be direct or indirect through an intermediary. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "left", "right", "front", "rear", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or unit must have a specific direction, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description herein, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only exemplary of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (11)
1. An in-situ mechanical property testing device is characterized by comprising a base, a connecting rod, a testing probe, a control system and a pressure testing system;
the base is used for being in sealing connection with the material analysis testing equipment;
the connecting rod comprises a first connecting rod and a second connecting rod which are sequentially connected, the free end of the first connecting rod is connected with the base, and the free end of the second connecting rod is connected with the test probe;
the control system controls the movement of the connecting rod;
the pressure test system is used for controlling and measuring the applied stress of the test probe.
2. The in-situ mechanical property testing device of claim 1, wherein the control system comprises a displacement sensor, a driving motor and control software.
3. The in-situ mechanical property testing device of claim 2, wherein the first connecting rod and the second connecting rod are both telescopic rods, the first connecting rod and the second connecting rod are both provided with displacement sensors and driving motors, different displacement sensors are used for monitoring the movement positions of different connecting rods, and the control software respectively controls the telescopic movements of different telescopic rods.
4. The in-situ mechanical property testing device of claim 2, wherein the base further comprises a universal rotation connection mechanism, the universal rotation connection mechanism is connected to the first connection rod, the control system further controls the movement of the universal rotation connection mechanism, and the movement of the universal rotation connection mechanism drives the movement of the connection rod.
5. The in-situ mechanical property testing device of claim 1, wherein the pressure testing system comprises a pressure sensor and stress measurement software.
6. The in-situ mechanical property testing device of claim 5, wherein the pressure sensor of the pressure testing system is disposed at a position where the connecting rod is connected with the testing probe or at a position where the first connecting rod is connected with the second connecting rod.
7. The in-situ mechanical property testing device of claim 1, wherein the base is sealingly connected to an external interface of the material analysis testing apparatus.
8. The in-situ mechanical property testing device of claim 7, wherein a connection port for sealing connection of the base and the external interface of the material analysis testing apparatus is disposed at a position between the base and the connection rod.
9. The in-situ mechanical property testing device of claim 8, wherein the connection port is further provided with a sealing member and a fixing member for fixing the base and the material analysis testing apparatus.
10. The in-situ mechanical property testing device of any one of claims 1 to 9, wherein the testing probe comprises a connecting part and a testing part, and the testing part is connected with the connecting rod through the connecting part;
the test part is selected from any one of the following shapes:
arc, plane, cone, triangle, sharp corner, knife edge.
11. An in-situ mechanical testing device, comprising the in-situ mechanical testing apparatus of any one of claims 1 to 10 and a material analysis testing apparatus, wherein the in-situ mechanical testing apparatus is connected with an external interface of the material analysis testing apparatus in a vacuum sealing manner;
the material analysis test equipment is FIB (focused ion beam) or SEM (Scanning electron microscope).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202120415065.8U CN215492787U (en) | 2021-02-25 | 2021-02-25 | In-situ mechanical property testing device and equipment thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202120415065.8U CN215492787U (en) | 2021-02-25 | 2021-02-25 | In-situ mechanical property testing device and equipment thereof |
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| CN215492787U true CN215492787U (en) | 2022-01-11 |
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| CN202120415065.8U Active CN215492787U (en) | 2021-02-25 | 2021-02-25 | In-situ mechanical property testing device and equipment thereof |
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