CN215486549U - Electronic water pump casing - Google Patents
Electronic water pump casing Download PDFInfo
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- CN215486549U CN215486549U CN202121233513.9U CN202121233513U CN215486549U CN 215486549 U CN215486549 U CN 215486549U CN 202121233513 U CN202121233513 U CN 202121233513U CN 215486549 U CN215486549 U CN 215486549U
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- bottom plate
- water pump
- shell body
- circuit board
- heat dissipation
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Abstract
The utility model discloses an electronic water pump casing which comprises a casing body, wherein a bottom plate and a heat dissipation cover are arranged on the casing body, a circuit board accommodating cavity is arranged between the bottom plate and the heat dissipation cover, and the circuit board is arranged on the bottom plate; the bottom plate positioned in the shell body is provided with a heat radiation structure, and the bottom plate at the same side with the circuit board is provided with an avoiding structure and an installation positioning structure. In use, circuit board accessible heat conduction insulating cement pastes with the bottom plate and leans on the setting, at the in-process that fluid circulation such as water pump impeller drive coolant liquid flows, through fluid through heat radiation structure, and take away the heat on casing body and the bottom plate, and then realize quick heat dissipation with the cooperation of heat dissipation lid, the radiating efficiency has been improved greatly, for realizing doing powerful water pump and providing good condition, simultaneously, solved the high temperature and lead to water pump stop work and vehicle to go in the big problem of potential safety hazard.
Description
Technical Field
The utility model belongs to the technical field of electronic water pumps, and particularly relates to an electronic water pump casing.
Background
At present, a circuit board on the electronic water pump is installed at the end of a casing through a bracket and the like, the heat dissipation of the casing is realized through the heat dissipation fins installed on the casing and the flow of gas, the heat dissipation efficiency of the water pump is low due to the high ambient temperature in an engine cabin, meanwhile, the circuit board has a temperature protection function, when the temperature exceeds a certain temperature, the water pump stops working, the running of a vehicle has great potential safety hazard, and in addition, the electronic water pump is limited by the problems and cannot be used as a high-power (100W and above) water pump.
SUMMERY OF THE UTILITY MODEL
The utility model provides an electronic water pump casing, which aims to improve the heat dissipation efficiency and can be used as a high-power water pump.
In order to solve the technical problems, the technical scheme of the utility model is as follows: an electronic water pump casing comprises a casing body, wherein a bottom plate and a heat dissipation cover are arranged on the casing body, a circuit board accommodating cavity is arranged between the bottom plate and the heat dissipation cover, and a circuit board is arranged on the bottom plate;
the bottom plate is positioned in the shell body, the heat dissipation structure is arranged on the bottom plate, and the avoidance structure and the installation positioning structure are arranged on the bottom plate at the same side as the circuit board.
As an improvement, the heat dissipation structure comprises a positioning support sleeve which is used for being in sealing fit with the periphery of the spacer sleeve, the positioning support sleeve is arranged on the bottom plate and protrudes out, and a fluid flowing cavity communicated with the inside of the spacer sleeve is arranged in the positioning support sleeve.
As a further improvement, the inner wall of the positioning support sleeve is provided with a step structure extending annularly.
As an improvement, the avoiding structure comprises a plurality of avoiding grooves and avoiding holes arranged on the bottom plate, and the avoiding holes are arranged on the periphery of the area where the positioning support sleeve is arranged.
As an improvement, the mounting and positioning structure comprises at least two positioning columns which are arranged on the bottom plate and used for positioning the circuit board, and the bottom plate is also provided with a plurality of mounting holes or buckles.
As a further improvement, the positioning column is provided with a limiting block.
As an improvement, the bottom plate and the casing body are of an integrally formed structure, and a first sealing element is arranged between the casing body and the heat dissipation cover;
the bottom plate and the shell body are made of metal materials; or the bottom plate and the machine shell body are made of plastic materials.
As an improvement, the bottom plate and the case body are of a split molding structure, and the bottom plate and the case body are sleeved, matched and fixedly connected together; second sealing elements are arranged between the bottom plate and the machine shell body as well as between the machine shell body and the heat dissipation cover;
the bottom plate and the shell body are made of metal materials; or the bottom plate and the machine shell body are both made of plastic materials; or one of the bottom plate and the casing body is made of plastic material, and the other one is made of metal material.
As a further improvement, a plug interface is integrally formed on the housing body, and the plug interface penetrates through the bottom plate and is communicated with the circuit board accommodating cavity.
After the technical scheme is adopted, the utility model has the effects that:
the electronic water pump casing comprises a casing body, a bottom plate and a heat dissipation cover are arranged on the casing body, a circuit board accommodating cavity is arranged between the bottom plate and the heat dissipation cover, and the circuit board is arranged on the bottom plate; the bottom plate positioned in the shell body is provided with a heat dissipation structure, the bottom plate at the same side with the circuit board is provided with an avoidance structure and an installation positioning structure, based on the structure, when the electronic water pump casing is in use, the circuit board can be attached to the bottom plate through the heat-conducting insulating glue, in the process that the impeller of the water pump drives the cooling liquid and other fluids to circularly flow, the heat on the circuit board is directly transferred to the bottom plate through the heat-conducting insulating glue, the heat of the bottom plate is conducted through the shell body and the heat dissipation structure, finally, part of the heat is dissipated through air, the other part of the heat is directly taken away by the cooling liquid of the water pump impeller, thus, the heat dissipation cover is matched with the heat dissipation cover to realize rapid heat dissipation, the heat dissipation efficiency is greatly improved, good conditions are provided for realizing high-power water pumps, meanwhile, the problems that the water pump stops working and potential safety hazards are large during vehicle running due to overhigh temperature are solved.
Because the heat radiation structure comprises the positioning support sleeve which is used for being in sealing fit with the periphery of the spacer sleeve, the positioning support sleeve is arranged on the bottom plate and protrudes, and the positioning support sleeve is internally provided with the fluid flow cavity communicated with the inside of the spacer sleeve, so that when the electronic water pump casing is in actual use, the spacer sleeve is arranged in the positioning support sleeve and is in sealing fit with the inside of the positioning support sleeve, and thus, fluid in the spacer sleeve can only enter the fluid flow cavity on the positioning support sleeve, thereby providing a space for fluid circulation flow (the flowing fluid enters the fluid flow cavity through the rotor and the spacer sleeve, and the spacer sleeve is provided with a hole communicated with the fluid flow cavity), taking away a large amount of heat on the casing body and the bottom plate in the flow, and simultaneously cooling and heat radiation are performed on the circuit board.
The inner wall of the positioning support sleeve is provided with the step structure extending annularly, so that the spacer sleeve (the rotor assembly is arranged in the spacer sleeve) is convenient to support and position, and meanwhile, the sealing element is convenient to be arranged between the spacer sleeve and the positioning support sleeve, and flowing fluid is prevented from entering an installation area of the stator assembly.
The avoiding structure comprises a plurality of avoiding grooves and avoiding holes which are arranged on the bottom plate, the avoiding holes are arranged on the periphery of the area where the positioning support sleeve is located, so that the related structures on the circuit board are avoided through the avoiding grooves, the stator pins are avoided through the avoiding holes, the avoiding holes are arranged on the periphery of the area where the positioning support sleeve is located, and the problem that fluid flows through the cavity and the cavity where the circuit board is accommodated are communicated with each other and fluid enters the cavity where the circuit board is accommodated is solved.
Because installation location structure still is equipped with a plurality of mounting holes or buckle including setting up two at least reference columns that are used for positioning circuit board on the bottom plate to come the mounted position of express delivery positioning circuit board through the reference column, realize the installation of circuit board on the bottom plate through mounting hole and buckle, simple structure, circuit board installation is quick, convenient.
Because the positioning column is provided with the limiting block, the mounting position of the circuit board is blocked and limited by the limiting block.
Because integrated into one piece has the plug interface on the casing body, the plug interface runs through the bottom plate and holds the chamber intercommunication with the circuit board to be convenient for circuit plug and circuit board electricity through the plug interface and be connected, and circuit plug's fixed effectual.
Drawings
The utility model is further illustrated with reference to the following figures and examples.
Fig. 1 is a schematic structural diagram of a first embodiment of the present invention (a chassis body and a bottom plate are an integral structure);
FIG. 2 is a schematic structural view of the housing body of FIG. 1;
FIG. 3 is a schematic view of the structure of FIG. 2 from another angle;
FIG. 4 is a schematic diagram of the structure of the circuit board of FIG. 1 being clamped;
fig. 5 is a schematic structural view of a second embodiment of the present invention (the casing body and the bottom plate are in a split structure);
wherein, 1-the machine shell body; 100-a plug interface; 101-a base plate; 102-avoidance slot; 103-avoiding holes; 104-a positioning column; 105-mounting holes; 106-buckle; 107-a limiting block; 2-a heat dissipation cover; 3-a circuit board; 4-positioning the supporting sleeve; 401-a fluid flow cavity; 402-a step structure; 5-a first sealing element; 6-a second sealing element; 7-plug.
Detailed Description
The present invention is described in further detail below with reference to specific examples.
The first embodiment is as follows:
as shown in fig. 1 to fig. 3, an electronic water pump casing includes a casing body 1, a bottom plate 101 and a heat dissipation cover 2 are disposed on the casing body 1, a circuit board accommodating cavity (not shown in the figures) is disposed between the bottom plate 101 and the heat dissipation cover 2, and a circuit board 3 is disposed in the circuit board accommodating cavity and disposed on the bottom plate 101; a heat dissipation structure is arranged on the bottom plate 101 positioned in the machine shell body 1, and an avoidance structure and an installation positioning structure are arranged on the bottom plate 101 on the same side as the circuit board 3; the housing body 1 is integrally formed with a plug connector 100 for inserting the plug 7, and the plug connector 100 penetrates the bottom plate 101 and communicates with the circuit board receiving cavity.
The heat dissipation structure comprises a positioning support sleeve 4 which is arranged on the bottom plate 101 and protrudes out of the bottom plate 101, a fluid flow cavity 401 is arranged in the positioning support sleeve 4, and a step structure 402 which extends annularly is arranged on the inner wall of the positioning support sleeve 4. The spacer bush of the electronic water pump is placed in the positioning support sleeve 4, the periphery of the spacer bush is in sealing fit with the positioning support sleeve, and the fluid flowing cavity 401 is communicated with the inside of the spacer bush.
The avoiding structure comprises a plurality of avoiding grooves 102 arranged on the bottom plate 101 and used for avoiding the structure on the circuit board 3 and avoiding holes 103 used for avoiding the stator pins, and the avoiding holes 103 are arranged on the periphery of the area where the positioning support sleeve 4 is located.
The mounting and positioning structure comprises at least two positioning columns 104 arranged on a bottom plate 101 and used for positioning the circuit board, the bottom plate 101 is also provided with a plurality of mounting holes 105 (threaded holes) or buckles 106, and the corresponding circuit board 3 is provided with a bayonet (see fig. 4); in this embodiment, the positioning column 104 is provided with a limiting block 107.
The bottom plate 101 and the casing body 1 are integrally formed, and a first sealing element 5 (such as a sealing ring) is arranged between the casing body 1 and the heat dissipation cover 2; the bottom plate 101 and the casing body 1 are made of metal materials; alternatively, the bottom plate 101 and the housing body 1 are both made of plastic material.
Example two:
the structure of this embodiment is substantially the same as that of the first embodiment, and the difference is that:
as shown in fig. 5, the bottom plate 101 and the casing body 1 are formed separately, the bottom plate 101 and the casing body 1 are fitted and fixed together by a connecting element (bolt, etc.), and a second sealing element 6 (such as a sealing ring) is provided between the bottom plate 101 and the casing body 1, and between the casing body 1 and the heat dissipation cover 2; the bottom plate 101 and the casing body 1 are made of metal materials; or, the bottom plate 101 and the casing body 1 are both made of plastic material; alternatively, one of the bottom plate 101 and the housing body 1 is made of a plastic material, and the other is made of a metal material.
The above-mentioned embodiments are merely descriptions of the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, and various modifications and alterations made to the technical solution of the present invention without departing from the spirit of the present invention are intended to fall within the scope of the present invention defined by the claims.
Claims (9)
1. The utility model provides an electronic water pump casing, includes casing body, its characterized in that: a bottom plate and a heat dissipation cover are arranged on the shell body, a circuit board accommodating cavity is arranged between the bottom plate and the heat dissipation cover, and the circuit board is arranged on the bottom plate;
the bottom plate is positioned in the shell body, the heat dissipation structure is arranged on the bottom plate, and the avoidance structure and the installation positioning structure are arranged on the bottom plate at the same side as the circuit board.
2. The electronic water pump housing of claim 1, wherein: the heat dissipation structure comprises a positioning support sleeve which is used for being matched with the periphery of the spacer sleeve in a sealing mode, the positioning support sleeve is arranged on the bottom plate and protrudes out, and a fluid flowing cavity communicated with the inside of the spacer sleeve is arranged in the positioning support sleeve.
3. The electronic water pump housing of claim 2, wherein: and the inner wall of the positioning support sleeve is provided with an annularly extending step structure.
4. The electronic water pump housing of claim 3, wherein: dodge the structure including set up in a plurality of grooves of dodging on the bottom plate and dodge the hole, dodge the hole set up in the periphery in location support cover place region.
5. The electronic water pump housing of claim 1, wherein: the mounting and positioning structure comprises at least two positioning columns which are arranged on the bottom plate and used for positioning the circuit board, and a plurality of mounting holes or buckles are further arranged on the bottom plate.
6. The electronic water pump housing of claim 5, wherein: and the positioning column is provided with a limiting block.
7. The electronic water pump housing of claim 1, wherein: the bottom plate and the machine shell body are of an integrally formed structure, and a first sealing element is arranged between the machine shell body and the heat dissipation cover;
the bottom plate and the shell body are made of metal materials; or the bottom plate and the machine shell body are made of plastic materials.
8. The electronic water pump housing of claim 1, wherein: the bottom plate and the machine shell body are of a split forming structure, and the bottom plate and the machine shell body are in sleeved fit and are fixedly connected together; second sealing elements are arranged between the bottom plate and the machine shell body as well as between the machine shell body and the heat dissipation cover;
the bottom plate and the shell body are made of metal materials; or the bottom plate and the machine shell body are both made of plastic materials; or one of the bottom plate and the casing body is made of plastic material, and the other one is made of metal material.
9. The electronic water pump casing of any one of claims 1 to 8, wherein: the shell body is integrally formed with a plug interface, and the plug interface penetrates through the bottom plate and is communicated with the circuit board accommodating cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121233513.9U CN215486549U (en) | 2021-06-03 | 2021-06-03 | Electronic water pump casing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121233513.9U CN215486549U (en) | 2021-06-03 | 2021-06-03 | Electronic water pump casing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215486549U true CN215486549U (en) | 2022-01-11 |
Family
ID=79782554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121233513.9U Active CN215486549U (en) | 2021-06-03 | 2021-06-03 | Electronic water pump casing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215486549U (en) |
-
2021
- 2021-06-03 CN CN202121233513.9U patent/CN215486549U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: No. 8, Xinfeng Hexi Road, Tangshi, Yangshe Town, Zhangjiagang City, Suzhou City, Jiangsu Province 215600 Patentee after: Jiangsu Langxin Electric Co.,Ltd. Address before: 215600 2 Fuxin Road, Yang Shi Town, Zhangjiagang, Suzhou, Jiangsu Patentee before: JIANGSU LANGXIN ELECTRIC Co.,Ltd. |