CN215473030U - Electronic packaging material plastic suction mold fast in heat dissipation - Google Patents
Electronic packaging material plastic suction mold fast in heat dissipation Download PDFInfo
- Publication number
- CN215473030U CN215473030U CN202121343403.8U CN202121343403U CN215473030U CN 215473030 U CN215473030 U CN 215473030U CN 202121343403 U CN202121343403 U CN 202121343403U CN 215473030 U CN215473030 U CN 215473030U
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- CN
- China
- Prior art keywords
- wall
- plastic suction
- groove
- mould
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000004033 plastic Substances 0.000 title claims abstract description 50
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 19
- 239000005022 packaging material Substances 0.000 title claims abstract description 14
- 238000004100 electronic packaging Methods 0.000 title claims abstract description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000003825 pressing Methods 0.000 claims description 10
- 230000005494 condensation Effects 0.000 claims description 4
- 238000009833 condensation Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims 1
- 239000002131 composite material Substances 0.000 claims 1
- 239000010959 steel Substances 0.000 claims 1
- 239000002994 raw material Substances 0.000 abstract description 19
- 239000000110 cooling liquid Substances 0.000 abstract description 18
- 238000000034 method Methods 0.000 abstract description 13
- 238000001816 cooling Methods 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002826 coolant Substances 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
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- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model discloses a plastic suction mould for an electronic packaging material with fast heat dissipation, which comprises a lower mould and a telescopic device, wherein a positioning groove is formed in the lower mould, a placing groove is formed in the middle of the lower mould, a positioning rod is arranged on the inner wall of the placing groove, a plastic suction groove is formed in the top of the positioning rod, a heat dissipation fan is arranged on the outer wall of the lower mould, a circulating pipe is arranged in the lower mould, a water pump is arranged at one end of the circulating pipe, a condensing pipe is arranged on the outer wall of the circulating pipe, an upper mould is arranged on the outer wall of the top of the lower mould, and a positioning plate is arranged on the outer wall of the bottom of the upper mould. According to the utility model, through the placing groove, the cooling liquid is poured into the placing groove, the cooling liquid circulates through the circulating pipe, the condensing pipe is started to cool the cooling liquid, so that the cooling liquid takes away heat generated by the raw materials in the plastic suction groove in the flowing process, the cooling speed of the raw materials is improved, and cracks generated in the cooling process of the raw materials are reduced.
Description
Technical Field
The utility model relates to the field of plastic suction molds, in particular to a plastic suction mold for an electronic packaging material with fast heat dissipation.
Background
The plastic suction mould is all moulds in plastic suction production, the cost is the gypsum mould with the lowest cost, the electroplated copper mould with the highest cost is the aluminum mould, small holes are drilled in the mould and used for vacuum adsorption of a thermalized hard film to form a plastic suction product, the plastic suction mould is widely applied to the industries of plastic packaging, lamp decoration, advertisement, decoration and the like, and after the production of electronic products is finished, the products which are made by plastic suction are required to be packaged.
However, in practical use, in the process of plastic suction manufacturing, heated plastic raw materials need to be poured into a mold, the raw materials are formed and cooled after molding, and the raw materials are cooled for a long time, so that the molded plastic package is easy to crack, and the rejection rate of the plastic shell is high.
Therefore, it is necessary to provide a plastic suction mold for electronic packaging materials with fast heat dissipation to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a plastic suction mould for an electronic packaging material with high heat dissipation, which is characterized in that cooling liquid is poured into a placing groove through the placing groove, the cooling liquid circulates through a circulating pipe, a condensing pipe is started to cool the cooling liquid, so that the heat generated by raw materials in the plastic suction groove is taken away by the cooling liquid in the flowing process, the cooling speed of the raw materials is improved, cracks generated in the cooling process of the raw materials are reduced, and the defects in the technology are overcome.
In order to achieve the above purpose, the utility model provides the following technical scheme: the utility model provides a fast electron packaging material plastic suction mould dispels heat, includes bed die and telescoping device, the constant head tank has been seted up to the bed die inside, the standing groove has been seted up in the middle of the bed die, the standing groove inner wall is provided with the locating lever, the locating lever top is provided with the plastic uptake groove, the bed die outer wall is provided with the heat dissipation fan, the inside of bed die one side is provided with the circulating pipe, circulating pipe one end is provided with the water pump, the circulating pipe outer wall is provided with the condenser pipe, the outer wall at bed die top is provided with the mould, the outer wall of going up the mould bottom is provided with the locating plate, the telescoping device sets up in the top of last mould, it is provided with the briquetting to go up the mould bottom.
Preferably, the cross section of constant head tank is the rectangle, constant head tank and locating plate sliding connection, the outer wall of locating plate and the inner wall laminating of constant head tank.
Preferably, the diameter of the outer wall of the plastic suction groove is equal to that of the outer wall of the pressing block, and the height of the pressing block is smaller than that of the plastic suction groove.
Preferably, the condensation pipes are arranged at two ends of the circulating pipe, and the condensation pipes are spirally distributed on the outer wall of the circulating pipe.
Preferably, the telescopic device comprises a fixing rod, a fixing groove, a telescopic pipe and a positioning block, the fixing rod is arranged on the upper die, the fixing groove is formed in the outer wall of the fixing rod, the telescopic pipe is arranged on the outer wall of the fixing rod, and the positioning block is arranged on the inner wall of the telescopic pipe.
Preferably, the number of the fixing grooves is six, and six fixing grooves are annularly arrayed on the outer wall of the fixing rod.
In the technical scheme, the utility model provides the following technical effects and advantages:
1. through the placing groove, cooling liquid is poured into the placing groove, the cooling liquid circulates through the circulating pipe, the condensing pipe is started, and the cooling liquid is cooled, so that the cooling liquid takes away heat generated by raw materials in the plastic suction groove in the flowing process, the cooling speed of the raw materials is improved, and cracks generated in the cooling process of the raw materials are reduced;
2. through the telescoping device, the telescoping device can pour the raw materials after heating into the plastic uptake inslot, can take out the air in the plastic uptake inslot simultaneously to when can making the lower mould of mould remove through the telescoping device, dead lever and telescopic link keep sealed, prevent that outside air from entering into between the mould, improve the leakproofness between the mould.
Drawings
In order to more clearly illustrate the embodiments of the present application or technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present invention, and other drawings can be obtained by those skilled in the art according to the drawings.
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a front cross-sectional view of the present invention;
FIG. 3 is a perspective view of the water pump of the present invention;
fig. 4 is a perspective cross-sectional view of the retractor of the present invention.
Description of reference numerals:
1. a lower die; 2. positioning a groove; 3. a placement groove; 4. positioning a rod; 5. a plastic suction groove; 6. a heat dissipation fan; 7. a circulation pipe; 8. a water pump; 9. a condenser tube; 10. an upper die; 11. positioning a plate; 12. A telescoping device; 1201. fixing the rod; 1202. fixing grooves; 1203. a telescopic pipe; 1204. positioning blocks; 13. and (7) briquetting.
Detailed Description
In order to make the technical solutions of the present invention better understood, those skilled in the art will now describe the present invention in further detail with reference to the accompanying drawings.
The utility model provides a plastic suction mould for an electronic packaging material with fast heat dissipation, which comprises a lower mould 1 and a telescopic device 12, wherein a positioning groove 2 is formed in the lower mould 1, a placing groove 3 is formed in the middle of the lower mould 1, a positioning rod 4 is arranged on the inner wall of the placing groove 3, a plastic suction groove 5 is formed in the top of the positioning rod 4, a heat dissipation fan 6 is arranged on the outer wall of the lower mould 1, a circulating pipe 7 is arranged in the inner part of one side of the lower mould 1, a water pump 8 is arranged at one end of the circulating pipe 7, a condensing pipe 9 is arranged on the outer wall of the circulating pipe 7, an upper mould 10 is arranged on the outer wall of the top of the lower mould 1, a positioning plate 11 is arranged on the outer wall of the bottom of the upper mould 10, the telescopic device 12 is arranged on the top of the upper mould 10, and a pressing block 13 is arranged at the bottom of the upper mould 10.
Further, in above-mentioned technical scheme, the cross section of constant head tank 2 is the rectangle, constant head tank 2 and locating plate 11 sliding connection, the outer wall of locating plate 11 and the inner wall laminating of constant head tank 2 can be fixed a position between cope match-plate pattern 10 and bed die 1 through constant head tank 2 and locating plate 11, prevent that cope match-plate pattern 10 from producing the skew at the in-process of lapse.
Further, in the above technical scheme, the diameter of the outer wall of the blister groove 5 is equal to the diameter of the outer wall of the pressing block 13, the height of the pressing block 13 is smaller than the height of the blister groove 5, the blister groove 5 can be sealed through the pressing block 13, and external air is prevented from entering the blister groove 5 in the exhaust process of the blister groove 5.
Further, in above-mentioned technical scheme, condenser pipe 9 sets up in the both ends of circulating pipe 7, condenser pipe 9 spiral distribution is in the outer wall of circulating pipe 7, and the condenser pipe 9 that the multiunit set up can carry out rapid cooling to the coolant liquid in the condenser pipe 9, reduces the temperature of coolant liquid, can make the raw materials in the standing groove 3 can rapid cooling.
Further, in the above technical solution, the telescopic device 12 includes a fixing rod 1201, a fixing groove 1202, a telescopic tube 1203, and a positioning block 1204, the fixing rod 1201 is disposed on the upper mold 10, the fixing groove 1202 is disposed on an outer wall of the fixing rod 1201, the telescopic tube 1203 is disposed on an outer wall of the fixing rod 1201, the positioning block 1204 is disposed on an inner wall of the telescopic tube 1203, the telescopic device can pour heated raw materials into the plastic suction groove 5, and simultaneously can draw out air in the plastic suction groove 5, and the fixing rod 1201 and the telescopic rod maintain sealing while the upper mold 10 can be moved toward the lower mold 1 by the telescopic device 12, so that external air is prevented from entering between the molds, and the sealing performance between the molds is improved.
Further, in the above technical solution, the number of the fixing grooves 1202 is six, the six fixing grooves 1202 are annularly arrayed on the outer wall of the fixing rod 1201, and the multiple sets of the fixing grooves 1202 can seal the telescopic shaft in a sliding manner, so as to prevent external air from entering the blister groove 5.
This practical theory of operation:
referring to the attached drawings 1-4 of the specification, when the electronic component package is required to be produced through plastic suction, cooling liquid is poured into a placing groove 3, the height of the cooling liquid is two thirds of that of a plastic suction groove 5, then heated plastic raw materials are arranged in the plastic suction groove 5 in a lower die 1 through a telescopic device 12, then an external driving device is used for driving an upper die 10 to move towards the lower die 1, a positioning plate 11 at the bottom of the upper die 10 is inserted into a positioning groove 2 outside the lower die 1, the upper die 1 and the lower die 1 are attached, and in the attaching process, a pressing plate at the bottom of the upper die 10 is attached to the inner wall of the plastic suction groove 5 to seal the upper die 10 and the lower die 1;
referring to the attached drawings 1-4 of the specification, in the moving process of the upper mold 10, the upper mold 10 pulls the fixing rod 1201 to move downwards, the fixing groove 1202 on the outer wall of the fixing rod 1201 slides on the outer wall of the positioning block 1204 on the outer wall of the extension tube 1203, so that the fixing rod 1201 and the extension tube 1203 keep sealed in the moving process, then the air in the plastic suction groove 5 is sucked out through the extension device 12, so that vacuum is generated in the plastic suction groove 5, the heating raw material is pressed close to the inside of the plastic suction groove 5, then the cooling liquid in the plastic suction groove 5 is cooled by the cooling liquid in the placing groove 3, the air pump is started, the water pump 8 drives the cooling liquid to circulate through the circulating pipe 7, the condensing pipe 9 is started, the cooling liquid in the circulating pipe 7 is cooled by the condensing pipe 9, the heat dissipation fan 6 is started, the temperature of the condensing pipe is reduced by the heat dissipation fan 6, so that the raw material can be cooled quickly, after the plastic suction of the raw material is completed, the upper mold 10 is moved upward, the manufactured electronic component package case is taken out, and the above operation is repeated to perform a circulation process of the outer package of the electronic component.
While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that the described embodiments may be modified in various different ways without departing from the spirit and scope of the utility model. Accordingly, the drawings and description are illustrative in nature and should not be construed as limiting the scope of the utility model.
Claims (6)
1. The utility model provides a fast electronic packaging material plastic suction mould dispels heat, includes bed die (1) and telescoping device (12), its characterized in that: the improved plastic-steel composite material mould is characterized in that a positioning groove (2) is formed in the lower mould (1), a placing groove (3) is formed in the middle of the lower mould (1), a positioning rod (4) is arranged on the inner wall of the placing groove (3), a plastic suction groove (5) is formed in the top of the positioning rod (4), a heat dissipation fan (6) is arranged on the outer wall of the lower mould (1), a circulating pipe (7) is arranged in the inner portion of one side of the lower mould (1), a water pump (8) is arranged at one end of the circulating pipe (7), a condensing pipe (9) is arranged on the outer wall of the circulating pipe (7), an upper mould (10) is arranged on the outer wall of the top of the lower mould (1), a positioning plate (11) is arranged on the outer wall of the bottom of the upper mould (10), a telescopic device (12) is arranged on the top of the upper mould (10), and a pressing block (13) is arranged on the bottom of the upper mould (10).
2. The electronic packaging material plastic suction mold with fast heat dissipation of claim 1, wherein: the cross section of constant head tank (2) is the rectangle, constant head tank (2) and locating plate (11) sliding connection, the outer wall of locating plate (11) and the inner wall laminating of constant head tank (2).
3. The electronic packaging material plastic suction mold with fast heat dissipation of claim 1, wherein: the diameter of the outer wall of the plastic suction groove (5) is equal to that of the outer wall of the pressing block (13), and the height of the pressing block (13) is smaller than that of the plastic suction groove (5).
4. The electronic packaging material plastic suction mold with fast heat dissipation of claim 1, wherein: the condensation pipes (9) are arranged at two ends of the circulating pipe (7), and the condensation pipes (9) are spirally distributed on the outer wall of the circulating pipe (7).
5. The electronic packaging material plastic suction mold with fast heat dissipation of claim 1, wherein: the telescopic device (12) comprises a fixed rod (1201), a fixed groove (1202), a telescopic pipe (1203) and a positioning block (1204), the fixed rod (1201) is arranged on the upper die (10), the fixed groove (1202) is formed in the outer wall of the fixed rod (1201), the telescopic pipe (1203) is arranged on the outer wall of the fixed rod (1201), and the positioning block (1204) is arranged on the inner wall of the telescopic pipe (1203).
6. The electronic packaging material plastic suction mold with fast heat dissipation of claim 5, wherein: the number of the fixing grooves (1202) is six, and the six fixing grooves (1202) are annularly arrayed on the outer wall of the fixing rod (1201).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121343403.8U CN215473030U (en) | 2021-06-16 | 2021-06-16 | Electronic packaging material plastic suction mold fast in heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121343403.8U CN215473030U (en) | 2021-06-16 | 2021-06-16 | Electronic packaging material plastic suction mold fast in heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215473030U true CN215473030U (en) | 2022-01-11 |
Family
ID=79719232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121343403.8U Expired - Fee Related CN215473030U (en) | 2021-06-16 | 2021-06-16 | Electronic packaging material plastic suction mold fast in heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215473030U (en) |
-
2021
- 2021-06-16 CN CN202121343403.8U patent/CN215473030U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220111 |