CN212242016U - Heat dissipation injection molding device for high polymer plastic - Google Patents

Heat dissipation injection molding device for high polymer plastic Download PDF

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Publication number
CN212242016U
CN212242016U CN202020626510.0U CN202020626510U CN212242016U CN 212242016 U CN212242016 U CN 212242016U CN 202020626510 U CN202020626510 U CN 202020626510U CN 212242016 U CN212242016 U CN 212242016U
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CN
China
Prior art keywords
support frame
injection molding
polymer plastic
cooling
water inlet
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN202020626510.0U
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Chinese (zh)
Inventor
詹高
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Wuhu Rongji Industrial Co ltd
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Wuhu Rongji Industrial Co ltd
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Priority to CN202020626510.0U priority Critical patent/CN212242016U/en
Application granted granted Critical
Publication of CN212242016U publication Critical patent/CN212242016U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a heat dissipation injection molding device for high polymer plastic, which comprises a fixed die, wherein the upper end of the fixed die is provided with a movable die matched with the fixed die, the lower end of the fixed die is provided with a support frame, the inner side of the support frame is provided with a track, the track is slidably connected with a slide block, a cooling frame fixedly connected with the slide block is arranged in the middle of the support frame, the lower end of the cooling frame is connected with a first electric telescopic push rod connected with the support frame, the telescopic end of the first electric telescopic push rod is fixedly connected with the cooling frame, a coiled pipe is arranged in the cooling frame, the coiled pipe is provided with a water inlet and a water outlet, the water inlet is positioned at the central position of the cooling frame, the lower end of the water inlet is communicated with a water inlet pipe through a water pump, the coiled pipe rises to be attached to the lower end face of the fixed die, so that the heat of the high polymer plastic product is conveniently dissipated.

Description

Heat dissipation injection molding device for high polymer plastic
Technical Field
The utility model discloses polymer plastic processing technology field especially indicates a heat dissipation injection moulding device for polymer plastic.
Background
Injection molding, also known as injection molding, is a method of molding by injection and molding. The injection molding method has the advantages of high production speed, high efficiency, automation of operation, various colors, various shapes from simple to complex, small sizes, accurate product size, easy replacement of products, capability of forming products with complex shapes, and suitability for the molding processing fields of mass production, products with complex shapes and the like. Stirring the completely molten plastic material by a screw at a certain temperature, injecting the plastic material into a mold cavity by high pressure, and cooling and solidifying to obtain a molded product.
However, in the prior art, the temperature points in the injection molding device are not uniform, the polymer plastic product cannot be rapidly and uniformly cooled, and part of the polymer plastic product is adhered to the mold, so that the product is easily damaged and deformed, and the molding of the product is not facilitated.
Disclosure of Invention
In view of the above, the present invention is directed to a heat dissipation injection molding apparatus for polymer plastic, so as to solve all or one of the problems in the background art.
Based on above-mentioned purpose the utility model provides a pair of a heat dissipation injection moulding device for polymer plastics, including the cover half, the cover half upper end is provided with the movable mould rather than the cooperation setting, the cover half lower extreme is provided with the support frame, the support frame inboard is provided with the track, sliding connection has the slider in the track, be provided with in the middle of the support frame with slider fixed connection's cooling frame, cooling frame lower extreme be connected with the first electric telescopic push rod that the support frame is connected, first electric telescopic push rod's flexible end with cooling frame fixed connection, be provided with the coiled pipe in the cooling frame, the coiled pipe is provided with water inlet and delivery port, the water inlet is located the central point of cooling frame puts, the water inlet lower extreme has the inlet tube through the water pump intercommunication, the delivery port intercommunication has.
Optionally, a cooling water tank is arranged on one side of the support frame, and the water inlet pipe and the water outlet pipe are communicated with the cooling water tank.
Optionally, a condenser is disposed in the cooling water tank.
Optionally, a fan is arranged on the support frame.
Optionally, the fan is arranged in an inclined manner, and the wind direction of the fan points to the movable mold.
Optionally, an angle between the axis of the fan and the horizontal line ranges from thirty degrees to seventy degrees.
Optionally, heat dissipation fins are arranged above and below the serpentine tube.
Optionally, an air deflector is arranged on the outer side of the movable mold and connected with the support frame through a connecting rod.
As can be seen from the above, the utility model is provided with a fixed die, a movable die, a supporting frame, a cooling frame, a first electric telescopic push rod and a coiled pipe, when the product is still subjected to injection molding, the cooling frame is separated from the fixed die, so that the heating of the coiled pipe and the cooling frame by long-term high temperature is prevented, the heat dissipation of the unshaped high polymer plastic product by the coiled pipe is prevented, the uneven molding is prevented when the injection molding is influenced, after a period of time, then the first electric telescopic push rod is started, the first electric telescopic push rod is telescopic to conveniently drive the coiled pipe to move up and down so as to conveniently dissipate heat of the fixed die and the high polymer plastic products in the fixed die, the coiled pipe moves up and down so as to conveniently drive the circulation of air around the supporting frame and conveniently generate wind to dissipate heat of the fixed die and the high polymer plastic products in the fixed die, the coiled pipe rises to be attached to the lower end face of the fixed die, so that the fixed die and the polymer plastic products in the fixed die can be conveniently cooled.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a cooling frame according to an embodiment of the present invention.
In the figure: the device comprises a fixed die 1, a movable die 2, a support frame 3, a track 4, a sliding block 5, a cooling frame 6, a water inlet pipe 7, a water outlet pipe 8, a water pump 9, a first electric telescopic push rod 10 and a coiled pipe 11.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings.
It should be noted that unless otherwise defined, technical or scientific terms used in the embodiments of the present invention should have the ordinary meaning as understood by those having ordinary skill in the art to which the present disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
A heat dissipation injection molding device for high polymer plastic comprises a fixed mold 1, wherein a movable mold 2 matched with the fixed mold 1 is arranged at the upper end of the fixed mold 1, a support frame 3 is arranged at the lower end of the fixed mold 1, a track 4 is arranged on the inner side of the support frame 3, a slider 5 is slidably connected in the track 4, a cooling frame 6 fixedly connected with the slider 5 is arranged in the middle of the support frame 3, a first electric telescopic push rod 10 connected with the support frame 3 is connected at the lower end of the cooling frame 6, the telescopic end of the first electric telescopic push rod 10 is fixedly connected with the cooling frame 6, a coiled pipe 11 is arranged in the cooling frame 6, the coiled pipe 11 is provided with a water inlet and a water outlet, the water inlet is positioned at the central position of the cooling frame 6, the lower end of the water inlet is communicated with a water inlet, when the product is still moulding plastics, cooling frame 6 is with cover half 1 separation, be convenient for prevent long-term high temperature to the heating of coiled pipe 11 and cooling frame 6 like this, prevent that coiled pipe 11 from dispelling the heat to the polymer plastics product that does not have the shaping, the shaping is inhomogeneous when influencing moulding plastics, a period of time later, then start first electric telescopic push rod 10, first electric telescopic push rod 10 is flexible and is convenient for drive coiled pipe 11 and reciprocate, be convenient for dispel the heat to the polymer plastics product in cover half 1 and the cover half 1, coiled pipe 11 reciprocates, be convenient for drive the circulation of the air around support frame 3, be convenient for produce wind and dispel the heat to the polymer plastics product in cover half 1 and the cover half 1, it is convenient for dispel the heat to the polymer plastics product in cover half 1 and the cover half 1 to rise to attached under cover half 1 terminal surface in coiled pipe 11.
In order to facilitate heat dissipation of the fixed die 1 and the polymer plastic product in the fixed die 1, a cooling water tank is arranged on one side of the support frame 3, and the water inlet pipe 7 and the water outlet pipe 8 are communicated with the cooling water tank.
In order to facilitate the movement of the coiled pipe 11 up and down without affecting the circulation of water in the coiled pipe 11, the water inlet pipe 7 and the water outlet pipe 8 are both telescopic pipes.
In order to facilitate the cooling of the water in the cooling water tank, a condenser is arranged in the cooling water tank.
In order to further radiate the heat of the fixed die 1 and the polymer plastic products in the fixed die 1, a fan is arranged on the support frame 3, the fan is arranged in an inclined mode, the wind direction of the fan points to the movable die 2, and the angle range between the axis of the fan and the horizontal line is thirty degrees to seventy degrees.
In order to further radiate the fixed die 1 and the polymer plastic products in the fixed die 1, radiating fins are arranged above and below the coiled pipe 11.
In order to further dissipate heat of the fixed die 1 and the polymer plastic products in the fixed die 1 and facilitate heat dissipation and cooling of the side surfaces of the fixed die 1 and the movable die 2, so that the polymer plastic products are cooled, an air deflector is arranged on the outer side of the movable die 2 and connected with the support frame 3 through a connecting rod.
When the product is still moulding plastics, cooling frame 6 is with cover half 1 separation, be convenient for prevent long-term high temperature to the heating of coiled pipe 11 and cooling frame 6 like this, prevent that coiled pipe 11 from dispelling the heat to the polymer plastics product that does not have the shaping, the shaping is inhomogeneous when influencing moulding plastics, a period of time later, then start first electric telescopic push rod 10, first electric telescopic push rod 10 is flexible and is convenient for drive coiled pipe 11 and reciprocate, be convenient for dispel the heat to the polymer plastics product in cover half 1 and the cover half 1, coiled pipe 11 reciprocates, be convenient for drive the circulation of the air around support frame 3, be convenient for produce wind and dispel the heat to the polymer plastics product in cover half 1 and the cover half 1, it is convenient for dispel the heat to the polymer plastics product in cover half 1 and the cover half 1 to rise to attached under cover half 1 terminal surface in coiled pipe 11.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, is limited to these examples; within the spirit of the present disclosure, features from the above embodiments or from different embodiments may also be combined, steps may be implemented in any order, and there are many other variations of different aspects of one or more embodiments of the present description as described above, which are not provided in detail for the sake of brevity.
In addition, well-known power/ground connections to Integrated Circuit (IC) chips and other components may or may not be shown in the provided figures, for simplicity of illustration and discussion, and so as not to obscure one or more embodiments of the disclosure. Furthermore, devices may be shown in block diagram form in order to avoid obscuring the understanding of one or more embodiments of the present description, and this also takes into account the fact that specifics with respect to implementation of such block diagram devices are highly dependent upon the platform within which the one or more embodiments of the present description are to be implemented (i.e., specifics should be well within purview of one skilled in the art). Where specific details (e.g., circuits) are set forth in order to describe example embodiments of the disclosure, it should be apparent to one skilled in the art that one or more embodiments of the disclosure can be practiced without, or with variation of, these specific details. Accordingly, the description is to be regarded as illustrative instead of restrictive.
While the present disclosure has been described in conjunction with specific embodiments thereof, many alternatives, modifications, and variations of these embodiments will be apparent to those of ordinary skill in the art in light of the foregoing description. For example, other memory architectures, such as Dynamic RAM (DRAM), may use the discussed embodiments.
It is intended that the one or more embodiments of the present specification embrace all such alternatives, modifications and variations as fall within the broad scope of the appended claims. Therefore, any omissions, modifications, substitutions, improvements, and the like that may be made without departing from the spirit and principles of one or more embodiments of the present disclosure are intended to be included within the scope of the present disclosure.

Claims (8)

1. The heat dissipation injection molding device for the high polymer plastic is characterized by comprising a fixed mold (1), wherein the upper end of the fixed mold (1) is provided with a movable mold (2) which is matched with the fixed mold to be arranged, the lower end of the fixed mold (1) is provided with a support frame (3), the inner side of the support frame (3) is provided with a track (4), the track (4) is internally and slidably connected with a slider (5), a cooling frame (6) which is fixedly connected with the slider (5) is arranged in the middle of the support frame (3), the lower end of the cooling frame (6) is connected with a first electric telescopic push rod (10) which is connected with the support frame (3), the telescopic end of the first electric telescopic push rod (10) is fixedly connected with the cooling frame (6), a coiled pipe (11) is arranged in the cooling frame (6), the coiled pipe (11) is provided with a water inlet and a water outlet, the water inlet, the lower end of the water inlet is communicated with a water inlet pipe (7) through a water pump (9), and the water outlet is communicated with a water outlet pipe (8).
2. The heat dissipation injection molding device for polymer plastic according to claim 1, wherein a cooling water tank is arranged on one side of the support frame (3), and the water inlet pipe (7) and the water outlet pipe (8) are both communicated with the cooling water tank.
3. The heat-dissipating injection molding apparatus for polymer plastic according to claim 2, wherein a condenser is disposed in the cooling water tank.
4. The heat dissipation injection molding device for polymer plastic according to claim 1, wherein a fan is disposed on the support frame (3).
5. The heat-dissipating injection molding device for polymer plastic as claimed in claim 4, wherein the fan is disposed obliquely, and an axis of the fan is directed to the movable mold (2).
6. The heat-dissipating injection molding apparatus for polymer plastic as claimed in claim 5, wherein an angle between the axis of the blower and a horizontal line ranges from thirty degrees to seventy degrees.
7. The heat-dissipating injection molding apparatus for polymer plastic as claimed in claim 1, wherein heat-dissipating fins are provided above and below the serpentine tube (11).
8. The heat dissipation injection molding device for polymer plastic according to claim 1, wherein an air deflector is arranged outside the movable mold (2), and the air deflector is connected with the support frame (3) through a connecting rod.
CN202020626510.0U 2020-04-23 2020-04-23 Heat dissipation injection molding device for high polymer plastic Expired - Fee Related CN212242016U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020626510.0U CN212242016U (en) 2020-04-23 2020-04-23 Heat dissipation injection molding device for high polymer plastic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020626510.0U CN212242016U (en) 2020-04-23 2020-04-23 Heat dissipation injection molding device for high polymer plastic

Publications (1)

Publication Number Publication Date
CN212242016U true CN212242016U (en) 2020-12-29

Family

ID=73995793

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020626510.0U Expired - Fee Related CN212242016U (en) 2020-04-23 2020-04-23 Heat dissipation injection molding device for high polymer plastic

Country Status (1)

Country Link
CN (1) CN212242016U (en)

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Granted publication date: 20201229