CN215472270U - Adjustable tension device for silicon wafer processing - Google Patents
Adjustable tension device for silicon wafer processing Download PDFInfo
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- CN215472270U CN215472270U CN202121263246.XU CN202121263246U CN215472270U CN 215472270 U CN215472270 U CN 215472270U CN 202121263246 U CN202121263246 U CN 202121263246U CN 215472270 U CN215472270 U CN 215472270U
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- disks
- tension device
- wire supporting
- adjustable tension
- silicon wafer
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Abstract
The utility model discloses an adjustable tension device for silicon wafer processing, and relates to the technical field of silicon wafer processing. The wire drawing device comprises two circular fixed disks, four movable wire drawing disks are arranged between the two circular fixed disks, the wire drawing disks are used for limiting a diamond wire, and the wire drawing device is further provided with a limiting mechanism and a moving mechanism, the limiting mechanism comprises a fixed plate, the fixed plate is fixed between the two circular fixed disks, two sliding support rods are connected inside the fixed plate in a sliding mode, one ends, close to the wire drawing disks, of the two sliding support rods are fixedly connected with the wire drawing disks, and one ends, far away from the wire drawing disks, of the two sliding support rods are fixedly connected with pushing blocks. The distance between the plurality of wire supporting discs is adjusted through the rotary transmission cap head, the tensioning degree of the wire supporting discs on the adjusting diamond wires is adjusted, the difficulty of installation, disassembly and adjustment of the diamond wires is greatly reduced, the adjustment is simple, and great convenience is brought to a user.
Description
Technical Field
The utility model belongs to the technical field of silicon wafer processing, and particularly relates to an adjustable tension device for silicon wafer processing.
Background
The diamond wire slicing machine is an advanced silicon wafer processing technology in the world at present, and the principle of the diamond wire slicing machine is that a steel wire moving at a high speed drives cutting edge materials attached to the steel wire to rub hard and brittle materials such as semiconductors, so that the purpose of cutting is achieved.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide an adjustable tension device for processing a silicon wafer, which solves the existing problems: the wire guide wheel of current slicer can not effectively adjust the tensioning degree of buddha's warrior attendant line, leads to the buddha's warrior attendant line installation, dismantles and adjusts the degree of difficulty great.
In order to solve the technical problems, the utility model is realized by the following technical scheme:
the utility model relates to an adjustable tension device for processing a silicon wafer, which comprises two circular fixed disks, wherein four movable wire supporting disks are arranged between the two circular fixed disks, and the wire supporting disks are used for limiting a diamond wire;
also provided with:
the limiting mechanism is used for limiting the moving range of the wire supporting disc;
and the moving mechanism is used for fixing the position of the wire supporting disc.
Further, stop gear is including the fixed plate, the fixed plate is fixed between two circular fixed disks, the inside sliding connection of fixed plate has two slip vaulting poles, two the slip vaulting pole is close to the one end and the drum fixed connection of drum, two the slip vaulting pole is kept away from the one end fixedly connected with that the drum promotes the piece, reset spring has been cup jointed in the outside of slip vaulting pole, just reset spring is located the fixed plate and promotes between the piece.
Further, the moving mechanism comprises a fixing box, a threaded support rod is connected to the middle of the fixing box in a threaded mode, a conical positioning table is fixedly connected to the lower end of the threaded support rod, and a transmission cap head is fixedly connected to the upper end of the threaded support rod.
Further, the transmission cap head is one of an outer hexagonal cap head and an inner hexagonal cap head.
Furthermore, the shape of the upper end of the conical positioning table is cylindrical, and the shape of the lower end of the conical positioning table is conical.
Further, the upper end fixedly connected with of fixed box strengthens the dish, strengthen dish and screw thread vaulting pole threaded connection.
The utility model has the following beneficial effects:
the distance between the plurality of wire supporting discs is adjusted through the rotary transmission cap head, the tensioning degree of the wire supporting discs on the adjusting diamond wires is adjusted, the difficulty of installation, disassembly and adjustment of the diamond wires is greatly reduced, the adjustment is simple, and great convenience is brought to a user.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an adjustable tension device for processing silicon wafers according to the present invention;
FIG. 2 is a schematic view of a partial sectional structure of an adjustable tension device for processing a silicon wafer according to the present invention;
FIG. 3 is a schematic view of a partial structure of an adjustable tension device for processing silicon wafers according to the present invention;
FIG. 4 is a schematic view of a partial cut-away structure of an adjustable tension device moving mechanism for processing silicon wafers according to the present invention.
In the drawings, the components represented by the respective reference numerals are listed below:
1. a circular fixed disk; 2. a wire supporting disc; 3. a fixing box; 4. reinforcing the disc; 5. a threaded brace rod; 6. a driving cap head; 7. a conical positioning table; 8. a pushing block; 9. a fixing plate; 10. a sliding stay bar; 11. a return spring.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, the utility model relates to an adjustable tension device for silicon wafer processing, which comprises two circular fixed disks 1, wherein four movable wire supporting disks 2 are arranged between the two circular fixed disks 1, and the wire supporting disks 2 are used for limiting diamond wires;
also provided with:
the limiting mechanism is used for limiting the moving range of the wire supporting disc 2;
the moving mechanism is used for fixing the position of the wire supporting disc 2;
furthermore, the limiting mechanism comprises a fixing plate 9, the fixing plate 9 is fixed between the two circular fixing plates 1, the fixing plate 9 is connected with two sliding support rods 10 in a sliding manner, one ends of the two sliding support rods 10, which are close to the wire supporting plate 2, are fixedly connected with the wire supporting plate 2, one ends of the two sliding support rods 10, which are far away from the wire supporting plate 2, are fixedly connected with a pushing block 8, the outer sides of the sliding support rods 10 are sleeved with return springs 11, and the return springs 11 are located between the fixing plate 9 and the pushing block 8;
furthermore, the moving mechanism comprises a fixed box 3, a threaded support rod 5 is connected to the middle position of the fixed box 3 in a threaded manner, a conical positioning table 7 is fixedly connected to the lower end of the threaded support rod 5, and a transmission cap head 6 is fixedly connected to the upper end of the threaded support rod 5;
here, the driving cap 6 may be one of an outer hexagonal cap and an inner hexagonal cap;
specifically, the upper end of the conical positioning table 7 is cylindrical, and the lower end of the conical positioning table 7 is conical;
in order to strengthen the connection between the fixed box 3 and the threaded stay bar 5, the upper end of the fixed box 3 is fixedly connected with a reinforcing disc 4, and the reinforcing disc 4 is in threaded connection with the threaded stay bar 5.
One specific application of this embodiment is: when using, use the spanner to rotate transmission hat head 6, can drive screw thread vaulting pole 5 when transmission hat head 6 rotates and rotate together, because screw thread vaulting pole 5 and 3 threaded connection of fixed box, can carry out vertical movement when screw thread vaulting pole 5 rotates, can drive circular cone locating platform 7 and move together when screw thread vaulting pole 5 moves, can drive when circular cone locating platform 7 moves vertically and promote piece 8 and carry out horizontal migration, adjust a plurality of intervals that promote between the piece 8, can drive slip vaulting pole 10 and move together when promoting piece 8 and remove, can drive vaulting pole 2 and move together when slip vaulting pole 10 removes, adjust a plurality of intervals between the vaulting pole 2, can adjust the tensioning degree to the buddha's warrior attendant line when vaulting pole 2 removes, great reduction buddha's warrior attendant line installation, the degree of difficulty of dismantlement and regulation, and it is comparatively simple to adjust, bring very big facility for the user.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the utility model disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the utility model to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, to thereby enable others skilled in the art to best utilize the utility model. The utility model is limited only by the claims and their full scope and equivalents.
Claims (6)
1. The adjustable tension device for processing the silicon wafers is characterized by comprising two circular fixed disks (1), wherein four movable wire supporting disks (2) are arranged between the two circular fixed disks (1), and the wire supporting disks (2) are used for limiting diamond wires;
also provided with:
the limiting mechanism is used for limiting the moving range of the wire supporting disc (2);
and the moving mechanism is used for fixing the position of the wire supporting disc (2).
2. The adjustable tension device for processing the silicon wafers as claimed in claim 1, wherein the limiting mechanism comprises a fixing plate (9), the fixing plate (9) is fixed between two circular fixing plates (1), two sliding support rods (10) are slidably connected inside the fixing plate (9), one ends of the two sliding support rods (10) close to the wire supporting plate (2) are fixedly connected with the wire supporting plate (2), one ends of the two sliding support rods (10) far away from the wire supporting plate (2) are fixedly connected with a pushing block (8), a reset spring (11) is sleeved outside the sliding support rods (10), and the reset spring (11) is located between the fixing plate (9) and the pushing block (8).
3. The adjustable tension device for silicon wafer processing as claimed in claim 2, wherein the moving mechanism comprises a fixed box (3), a threaded support rod (5) is connected to the middle position of the fixed box (3) in a threaded manner, a conical positioning table (7) is fixedly connected to the lower end of the threaded support rod (5), and a driving cap head (6) is fixedly connected to the upper end of the threaded support rod (5).
4. The adjustable tension device for silicon wafer processing as claimed in claim 3, wherein the driving cap head (6) is one of an outer hexagonal cap head and an inner hexagonal cap head.
5. The adjustable tension device for silicon wafer processing as claimed in claim 3, wherein the upper end of the conical positioning table (7) is cylindrical, and the lower end of the conical positioning table (7) is conical.
6. The adjustable tension device for silicon wafer processing as claimed in claim 3, wherein the upper end of the fixing box (3) is fixedly connected with a reinforcing disc (4), and the reinforcing disc (4) is in threaded connection with the threaded support rod (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121263246.XU CN215472270U (en) | 2021-06-07 | 2021-06-07 | Adjustable tension device for silicon wafer processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121263246.XU CN215472270U (en) | 2021-06-07 | 2021-06-07 | Adjustable tension device for silicon wafer processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215472270U true CN215472270U (en) | 2022-01-11 |
Family
ID=79783420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121263246.XU Active CN215472270U (en) | 2021-06-07 | 2021-06-07 | Adjustable tension device for silicon wafer processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215472270U (en) |
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2021
- 2021-06-07 CN CN202121263246.XU patent/CN215472270U/en active Active
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Address after: No.158, Nanhu Middle Road, Xuelang street, Binhu District, Wuxi City, Jiangsu Province, 214100 Patentee after: Hoyuan Green Energy Co.,Ltd. Address before: No.158, Nanhu Middle Road, Xuelang street, Binhu District, Wuxi City, Jiangsu Province, 214100 Patentee before: WUXI SHANGJI AUTOMATION Co.,Ltd. |