CN210224591U - Semiconductor laser sintering clamping mechanism - Google Patents
Semiconductor laser sintering clamping mechanism Download PDFInfo
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- CN210224591U CN210224591U CN201920981068.0U CN201920981068U CN210224591U CN 210224591 U CN210224591 U CN 210224591U CN 201920981068 U CN201920981068 U CN 201920981068U CN 210224591 U CN210224591 U CN 210224591U
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Abstract
The utility model relates to the technical field of sintering auxiliary devices, in particular to a semiconductor laser sintering clamping mechanism which can adjust the height of a pressing block according to the requirement, realize the clamping of semiconductor lasers with various specifications and reduce the use limitation; comprises an upper fixing plate, a lower fixing plate, a pressing block, a left supporting plate and a right supporting plate; still include left connecting rod, right connecting rod, movable plate, dwang, carousel and handle, upper fixed plate bottom central zone is provided with the spread groove, and the left half regional left side of movable plate top and right half regional left connecting hole and right connecting hole of vertically being provided with respectively, and the regional first screw hole that vertically is provided with of upper fixed plate top central zone, movable plate top central zone are provided with the rotation groove, and the first region of dwang lateral wall is provided with the external screw thread, is provided with ball bearing between dwang and the rotation inslot lateral wall.
Description
Technical Field
The utility model relates to a technical field of sintering auxiliary device especially relates to a semiconductor laser sintering fixture.
Background
As is well known, a semiconductor laser sintering clamping mechanism is an auxiliary device for clamping a semiconductor laser in a semiconductor laser sintering process, and is widely used in the field of sintering; the existing semiconductor laser sintering clamping mechanism comprises an upper fixing plate, a lower fixing plate, a pressing block, a left supporting plate and a right supporting plate, wherein the top end of the pressing block is connected with the central area of the bottom end of the upper fixing plate; when the conventional semiconductor laser sintering clamping mechanism is used, a worker puts a semiconductor laser into a fixing groove, an upper fixing plate is covered at the top end of a lower fixing plate, and the bottom end of a pressing block extends into the fixing groove and presses the semiconductor laser in the fixing groove; the existing semiconductor laser sintering clamping mechanism is found that a pressing block can only clamp a semiconductor laser with a specified specification in use, so that the use limitation of the existing semiconductor laser sintering clamping mechanism is high.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a can adjust the height of briquetting as required, realize carrying out the centre gripping to the semiconductor laser of multiple specification, reduce the semiconductor laser sintering fixture who uses the limitation.
The utility model discloses a semiconductor laser sintering clamping mechanism, including an upper fixed plate, a lower fixed plate, a pressing block, a left support plate and a right support plate, wherein a fixed groove is arranged in the central region of the top end of the lower fixed plate, the bottom end of the pressing block extends into the fixed groove, and the top ends of the left support plate and the right support plate are respectively connected with the left half region and the right half region of the bottom end of the lower fixed plate; the novel automatic transmission mechanism also comprises a left connecting rod, a right connecting rod, a movable plate, a rotating rod, a rotating disk and a handle, wherein a connecting groove is arranged in the central area of the bottom end of the upper fixed plate, a left connecting hole and a right connecting hole are respectively and longitudinally arranged in the left half area and the right half area of the top end of the movable plate, the top ends of the left connecting rod and the right connecting rod respectively penetrate through the left connecting hole and the right connecting hole and are respectively connected with the left half area and the right half area of the inner top side wall of the connecting groove, a first threaded hole is longitudinally arranged in the central area of the top end of the upper fixed plate and is communicated with the connecting groove, a rotating groove is arranged in the central area of the top end of the movable plate, the top end of the rotating rod is connected with the central area of the bottom end of the rotating disk, an external thread, the top end of the pressing block is connected with the central area of the bottom end of the moving plate.
The utility model discloses a semiconductor laser sintering clamping mechanism, which also comprises a first left supporting rod, a first right supporting rod, a second left supporting rod, a second right supporting rod, a left pull rod and a right pull rod, wherein the lower half area of the left side wall and the right side wall of an upper fixing plate is respectively provided with a first left clamping groove and a first right clamping groove, the left side wall and the right side wall of a lower fixing plate are respectively provided with a second left clamping groove and a second right clamping groove, the left ends of the first left supporting rod and the second left supporting rod are respectively connected with the upper half area and the lower half area of the right side wall of the left pull rod, the right ends of the first left supporting rod and the second left supporting rod respectively extend into the first left clamping groove and the second left clamping groove, first right branch pole and second right branch pole right-hand member respectively with right pull rod left side wall first half regional with half regional connection down, first right branch pole and second right branch pole left end stretch into respectively to first right screens inslot and second right screens inslot.
The utility model discloses a semiconductor laser sintering fixture still includes left threaded rod, right threaded rod, left rotor plate, right rotor plate, left extension board and right extension board, and first half regional second left screw hole and the right screw hole of transversely being provided with respectively of left side backup pad and right support plate left side wall, left side threaded rod left end and right threaded rod right-hand member are connected with left extension board right side wall and right extension board left side wall central zone respectively, and left side threaded rod right-hand member and right threaded rod left end spiral shell dress respectively pass second left screw hole and second right screw hole and are connected with left rotor plate left side wall and right rotor plate right side wall central zone respectively.
The utility model discloses a semiconductor laser sintering fixture still includes left bottom plate and right bottom plate, and left support plate and right support plate bottom are connected with left bottom plate and right bottom plate top central authorities region respectively.
The utility model discloses a semiconductor laser sintering fixture still includes left baffle and right baffle, and left connecting rod and right connecting rod bottom are connected with left baffle and right baffle top central authorities region respectively.
The utility model discloses a semiconductor laser sintering fixture still includes the stabilizer bar, stabilizer bar left end and right-hand member are connected with left branch fagging right side wall and right branch fagging left side wall second region respectively.
The utility model discloses a semiconductor laser sintering fixture still includes left pull ring and right pull ring, left side pull ring and right pull ring bottom respectively with half regional connection on the left side of upper fixed plate top and half regional connection on the right side.
The utility model discloses a semiconductor laser sintering fixture, the handle outside is provided with the handle cover.
Compared with the prior art, the beneficial effects of the utility model are that: the staff puts into the fixed slot to semiconductor laser, go up the fixed plate lid dress on the bottom plate top, the staff passes through the handle rotation carousel this moment, the carousel drives the dwang and rotates, because the first region of dwang lateral wall is provided with the external screw thread, and the dwang bottom spiral shell dress passes first screw hole, the dwang can be at the rotation of rotation inslot, ball bearing can reduce the produced frictional resistance of dwang when the rotation of rotation inslot, it is more smooth-going when making the dwang rotate, the downshifting when dwang pivoted, and then make the movable plate lapse, left side connecting rod and right connecting rod play spacing effect to the movable plate, the movable plate drives the briquetting downshifting, the accessible is adjusted the distance between briquetting bottom and the fixed slot inner bottom lateral wall and is realized carrying out the centre gripping to the semiconductor laser of multiple specification, reduce and.
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
FIG. 2 is an enlarged view of a portion of FIG. 1;
FIG. 3 is an enlarged view of a portion B of FIG. 1;
FIG. 4 is a schematic perspective view of the connection of the upper fixing plate, the left pull ring and the right pull ring;
in the drawings, the reference numbers: 1. an upper fixing plate; 2. a lower fixing plate; 3. briquetting; 4. a left support plate; 5. a right support plate; 6. a left connecting rod; 7. a right connecting rod; 8. moving the plate; 9. rotating the rod; 10. a turntable; 11. a handle; 12. a ball bearing; 13. a first left strut; 14. a first right strut; 15. a second left strut; 16. a second right strut; 17. a left pull rod; 18. a right pull rod; 19. a left threaded rod; 20. a right threaded rod; 21. a left rotating plate; 22. a right rotating plate; 23. a left support plate; 24. a right support plate; 25. a left bottom plate; 26. a right base plate; 27. a left baffle plate; 28. a right baffle plate; 29. a stabilizer bar; 30. a left pull ring; 31. a right pull ring; 32. a handle sleeve.
Detailed Description
The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.
As shown in fig. 1 to 4, the semiconductor laser sintering clamping mechanism of the present invention comprises an upper fixing plate 1, a lower fixing plate 2, a pressing block 3, a left support plate 4 and a right support plate 5, wherein a fixing groove is formed in a central region of a top end of the lower fixing plate 2, a bottom end of the pressing block 3 extends into the fixing groove, and top ends of the left support plate 4 and the right support plate 5 are respectively connected with a left half region and a right half region of a bottom end of the lower fixing plate 2; the novel rotary table further comprises a left connecting rod 6, a right connecting rod 7, a movable plate 8, a rotary rod 9, a rotary table 10 and a handle 11, wherein a connecting groove is arranged in the central area of the bottom end of the upper fixed plate 1, a left connecting hole and a right connecting hole are respectively and longitudinally arranged in the left half area and the right half area of the top end of the movable plate 8, the top ends of the left connecting rod 6 and the right connecting rod 7 respectively penetrate through the left connecting hole and the right connecting hole and are respectively connected with the left half area and the right half area of the inner top side wall of the connecting groove, a first threaded hole is longitudinally arranged in the central area of the top end of the upper fixed plate 1 and is communicated with the connecting groove, a rotary groove is arranged in the central area of the top end of the movable plate 8, the top end of the rotary rod 9 is connected with the central area of the, the bottom end of the handle 11 is connected with the left half area of the top end of the rotary table 10, and the top end of the pressing block 3 is connected with the central area of the bottom end of the movable plate 8; the staff puts into the fixed slot to semiconductor laser, go up the fixed plate lid dress on the bottom plate top, the staff passes through the handle rotation carousel this moment, the carousel drives the dwang and rotates, because the first region of dwang lateral wall is provided with the external screw thread, and the dwang bottom spiral shell dress passes first screw hole, the dwang can be at the rotation of rotation inslot, ball bearing can reduce the produced frictional resistance of dwang when the rotation of rotation inslot, it is more smooth-going when making the dwang rotate, the downshifting when dwang pivoted, and then make the movable plate lapse, left side connecting rod and right connecting rod play spacing effect to the movable plate, the movable plate drives the briquetting downshifting, the accessible is adjusted the distance between briquetting bottom and the fixed slot inner bottom lateral wall and is realized carrying out the centre gripping to the semiconductor laser of multiple specification, reduce and.
The utility model relates to a semiconductor laser sintering clamping mechanism, which also comprises a first left supporting rod 13, a first right supporting rod 14 and a second left supporting rod 15, the left side wall and the right side wall of the upper fixed plate 1 are respectively provided with a first left clamping groove and a first right clamping groove, the left side wall and the right side wall of the lower fixed plate 2 are respectively provided with a second left clamping groove and a second right clamping groove, the left ends of the first left support rod 13 and the second left support rod 15 are respectively connected with the upper half area and the lower half area of the right side wall of the left pull rod 17, the right ends of the first left support rod 13 and the second left support rod 15 respectively extend into the first left clamping groove and the second left clamping groove, the right ends of the first right support rod 14 and the second right support rod 16 are respectively connected with the upper half area and the lower half area of the left side wall of the right pull rod 18, and the left ends of the first right support rod 14 and the second right support rod 16 respectively extend into the first right clamping groove and the second right clamping groove; can realize quick installation and the dismantlement of upper fixed plate and bottom plate through first left branch, first right branch, second left branch and second right branch, improve the convenience of use.
The utility model discloses a semiconductor laser sintering fixture, still include left threaded rod 19, right threaded rod 20, left rotor plate 21, right rotor plate 22, left branch board 23 and right branch board 24, left support plate 4 and right support plate 5 left side wall upper half region transversely is provided with second left screw hole and second right screw hole respectively, left threaded rod 19 left end and right threaded rod 20 right-hand member respectively with left branch board 23 right side wall and right branch board 24 left side wall central zone connection, left threaded rod 19 right-hand member and right threaded rod 20 left end respectively the spiral shell dress pass second left screw hole and second right screw hole and respectively with left rotor plate 21 left side wall and right rotor plate 22 right side wall central zone connection; rotate left threaded rod and right threaded rod through left rotating plate and right rotating plate respectively, left threaded rod and right threaded rod drive left extension board and right extension board and do relative or back-to-back motion, and accessible left extension board and right extension board contact with the sintering machine inside wall for upper fixed plate and bottom plate are more steady, improve stability in use.
The utility model discloses a semiconductor laser sintering clamping mechanism, which also comprises a left bottom plate 25 and a right bottom plate 26, wherein the bottom ends of the left support plate 4 and the right support plate 5 are respectively connected with the central areas of the top ends of the left bottom plate 25 and the right bottom plate 26; the left bottom plate and the right bottom plate can enable the device to be more stable, and the use stability is improved.
The utility model discloses a semiconductor laser sintering clamping mechanism, which also comprises a left clapboard 27 and a right clapboard 28, wherein the bottom ends of a left connecting rod 6 and a right connecting rod 7 are respectively connected with the central areas of the top ends of the left clapboard 27 and the right clapboard 28; the left partition plate and the right partition plate can limit the moving plate, and the use safety is improved.
The utility model discloses a semiconductor laser sintering clamping mechanism, which also comprises a stabilizer bar 29, wherein the left end and the right end of the stabilizer bar 29 are respectively connected with the lower half area of the right side wall of a left support plate 4 and the left side wall of a right support plate 5; the stabilizer bar can play the effect of support to left branch fagging and right branch fagging, improves stability in use.
The utility model discloses a semiconductor laser sintering clamping mechanism, which also comprises a left pull ring 30 and a right pull ring 31, wherein the bottom ends of the left pull ring 30 and the right pull ring 31 are respectively connected with the left half area and the right half area of the top end of an upper fixing plate 1; left pull ring and right pull ring can be convenient for remove upper fixed plate, improve the convenience of use.
The utility model discloses a semiconductor laser sintering clamping mechanism, a handle sleeve 32 is arranged outside a handle 11; the handle sleeve can protect the palm of a worker, and the use safety is improved.
The utility model discloses a semiconductor laser sintering clamping mechanism, when in operation, a worker puts a semiconductor laser into a fixed groove, an upper fixed plate is covered on the top of a lower fixed plate, at the moment, the worker rotates a turntable through a handle, the turntable drives a rotating rod to rotate, as the upper half area of the outer side wall of the rotating rod is provided with an external thread, and the bottom end of the rotating rod is screwed through a first threaded hole, the rotating rod can rotate in a rotating groove, a ball bearing can reduce the friction resistance generated when the rotating rod rotates in the rotating groove, so that the rotating rod rotates more smoothly, the rotating rod moves downwards while rotating, and further the moving plate slides downwards, a left connecting rod and a right connecting rod play a limiting role on the moving plate, the moving plate drives a pressing block to move downwards, and the semiconductor laser with various specifications can be clamped by adjusting the distance between the bottom end of the pressing block and the inner, the use limitation is reduced; the first left supporting rod, the first right supporting rod, the second left supporting rod and the second right supporting rod can realize quick installation and disassembly of the upper fixing plate and the lower fixing plate, and use convenience is improved; the left threaded rod and the right threaded rod are respectively rotated through the left rotating plate and the right rotating plate, the left threaded rod and the right threaded rod drive the left supporting plate and the right supporting plate to move oppositely or oppositely, and the left supporting plate and the right supporting plate can be in contact with the inner side wall of the sintering machine, so that the upper fixing plate and the lower fixing plate are more stable, and the use stability is improved; the left bottom plate and the right bottom plate can make the device more stable and improve the use stability; the left partition plate and the right partition plate can limit the movable plate, so that the use safety is improved; the stabilizer bar can support the left support plate and the right support plate, so that the use stability is improved; the left pull ring and the right pull ring can conveniently move the upper fixing plate, so that the use convenience is improved; the handle sleeve can protect the palm of a worker, and the use safety is improved.
The utility model discloses a semiconductor laser sintering fixture, above the mounting means, the connected mode or the mode that sets up of all parts are common mechanical system to the concrete structure, model and the coefficient index of its all parts are its from taking the technique, as long as can reach all can implementing of its beneficial effect, so do not add at much and give unnecessary detail.
In the semiconductor laser sintering clamping mechanism of the utility model, under the condition of not being described reversely, the orientation words contained in the terms of 'up-down, left-right, front-back, inside-outside, vertical and horizontal' and the like only represent the orientation of the term in the normal use state, or be a trivial term understood by those skilled in the art, and should not be considered as limiting the term, at the same time, the numerical terms "first," "second," and "third," etc. do not denote any particular quantity or order, but rather are used to distinguish one from another, furthermore, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements, but also includes other elements not expressly listed or inherent to such process, method, article, or apparatus.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (8)
1. A semiconductor laser sintering clamping mechanism comprises an upper fixing plate (1), a lower fixing plate (2), a pressing block (3), a left supporting plate (4) and a right supporting plate (5), wherein a fixing groove is formed in the central area of the top end of the lower fixing plate (2), the bottom end of the pressing block (3) extends into the fixing groove, and the top ends of the left supporting plate (4) and the right supporting plate (5) are respectively connected with the left half area and the right half area of the bottom end of the lower fixing plate (2); the novel multifunctional connecting rod is characterized by further comprising a left connecting rod (6), a right connecting rod (7), a moving plate (8), a rotating rod (9), a rotating disc (10) and a handle (11), wherein a connecting groove is formed in the central area of the bottom end of an upper fixing plate (1), a left connecting hole and a right connecting hole are respectively and longitudinally formed in the left half area and the right half area of the top end of the moving plate (8), the top ends of the left connecting rod (6) and the right connecting rod (7) respectively penetrate through the left connecting hole and the right connecting hole and are respectively connected with the left half area and the right half area of the inner top side wall of the connecting groove, a first threaded hole is longitudinally formed in the central area of the top end of the upper fixing plate (1), the first threaded hole is communicated with the connecting groove, a rotating groove is formed in the central area of the top end of the moving plate (, dwang (9) bottom spiral shell dress passes the screw hole and inserts to rotating the inslot, is provided with ball bearing (12) between dwang (9) and the rotating groove inside wall, handle (11) bottom is connected with carousel (10) top left half region, and briquetting (3) top is connected with movable plate (8) bottom central authorities region.
2. The semiconductor laser sintering clamping mechanism as claimed in claim 1, further comprising a first left support rod (13), a first right support rod (14), a second left support rod (15), a second right support rod (16), a left pull rod (17) and a right pull rod (18), wherein the lower half regions of the left side wall and the right side wall of the upper fixing plate (1) are respectively provided with a first left clamping groove and a first right clamping groove, the left side wall and the right side wall of the lower fixing plate (2) are respectively provided with a second left clamping groove and a second right clamping groove, the left ends of the first left support rod (13) and the second left support rod (15) are respectively connected with the upper half region and the lower half region of the right side wall of the left pull rod (17), the right ends of the first left support rod (13) and the second left support rod (15) respectively extend into the first left clamping groove and the second left clamping groove, the right ends of the first right support rod (14) and the second right support rod (16) are respectively connected with the upper half region and the lower half region of the left side wall of the right pull rod (18), the left ends of the first right supporting rod (14) and the second right supporting rod (16) respectively extend into the first right clamping groove and the second right clamping groove.
3. The semiconductor laser sintering clamping mechanism as claimed in claim 2, further comprising a left threaded rod (19), a right threaded rod (20), a left rotating plate (21), a right rotating plate (22), a left support plate (23) and a right support plate (24), wherein a second left threaded hole and a second right threaded hole are respectively transversely arranged on upper half regions of left side walls of the left support plate (4) and the right support plate (5), left ends of the left threaded rod (19) and the right threaded rod (20) are respectively connected with central regions of right side walls of the left support plate (23) and the right support plate (24), and left ends of the left threaded rod (19) and the right threaded rod (20) are respectively screwed through the second left threaded hole and the second right threaded hole and are respectively connected with central regions of left side walls of the left rotating plate (21) and the right side walls of the right rotating plate (22).
4. A semiconductor laser sintering clamping mechanism as claimed in claim 3, characterized in that, it further comprises a left base plate (25) and a right base plate (26), the bottom ends of the left support plate (4) and the right support plate (5) are respectively connected with the central areas of the top ends of the left base plate (25) and the right base plate (26).
5. A semiconductor laser sintering clamping mechanism as claimed in claim 4 further comprising a left spacer (27) and a right spacer (28), wherein the bottom ends of the left connecting rod (6) and the right connecting rod (7) are respectively connected with the central areas of the top ends of the left spacer (27) and the right spacer (28).
6. A semiconductor laser sintering clamping mechanism as claimed in claim 5, characterized in that, it further comprises a stabilizer bar (29), the left end and the right end of the stabilizer bar (29) are respectively connected with the right side wall of the left support plate (4) and the lower half area of the left side wall of the right support plate (5).
7. The semiconductor laser sintering clamping mechanism as claimed in claim 6, further comprising a left pull ring (30) and a right pull ring (31), wherein the bottom ends of the left pull ring (30) and the right pull ring (31) are respectively connected with the left half area and the right half area of the top end of the upper fixing plate (1).
8. A semiconductor laser sintering clamping mechanism as claimed in claim 7, characterized in that the handle (11) is provided with a handle sleeve (32) on the outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920981068.0U CN210224591U (en) | 2019-06-26 | 2019-06-26 | Semiconductor laser sintering clamping mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920981068.0U CN210224591U (en) | 2019-06-26 | 2019-06-26 | Semiconductor laser sintering clamping mechanism |
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| Publication Number | Publication Date |
|---|---|
| CN210224591U true CN210224591U (en) | 2020-03-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920981068.0U Active CN210224591U (en) | 2019-06-26 | 2019-06-26 | Semiconductor laser sintering clamping mechanism |
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| CN (1) | CN210224591U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112735978A (en) * | 2020-12-16 | 2021-04-30 | 全球能源互联网研究院有限公司 | Crimping device and pressure sintering equipment |
| CN113241581A (en) * | 2021-05-19 | 2021-08-10 | 冯锐 | Multi-single-tube high-power semiconductor laser packaging structure and laser |
-
2019
- 2019-06-26 CN CN201920981068.0U patent/CN210224591U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112735978A (en) * | 2020-12-16 | 2021-04-30 | 全球能源互联网研究院有限公司 | Crimping device and pressure sintering equipment |
| CN112735978B (en) * | 2020-12-16 | 2024-01-30 | 全球能源互联网研究院有限公司 | Crimping device and pressure sintering equipment |
| CN113241581A (en) * | 2021-05-19 | 2021-08-10 | 冯锐 | Multi-single-tube high-power semiconductor laser packaging structure and laser |
| CN113241581B (en) * | 2021-05-19 | 2024-01-12 | 华夏天信传感科技(大连)有限公司 | Multi-single-tube high-power semiconductor laser packaging structure |
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