CN215458605U

CN215458605U - Depilating instrument with heat dissipation function

Info

Publication number: CN215458605U
Application number: CN202120819385.XU
Authority: CN
Inventors: 雷灿锋
Original assignee: Shenzhen Romoss Technology Co Ltd
Current assignee: Shenzhen Romoss Technology Co Ltd
Priority date: 2021-04-21
Filing date: 2021-04-21
Publication date: 2022-01-11
Anticipated expiration: 2031-04-21

Abstract

The utility model relates to a depilatory instrument with heat dissipation function, comprising: the shell is arranged in the shell, and the hair removal mechanism, the heat conduction mechanism and the heat dissipation mechanism are arranged in the shell; the hair removal mechanism comprises a light emitting part for emitting light; the heat dissipation mechanism comprises a heat dissipation base body and a fan, the heat dissipation base body is provided with a hollow accommodating part, and the fan is positioned in the accommodating part; the light-emitting part is connected with the heat conduction mechanism, and the heat conduction mechanism is connected with the heat dissipation base body. The light emitting part of the depilating instrument is connected with the heat conducting mechanism, and the heat conducting mechanism is connected with the heat radiating mechanism so as to timely radiate heat generated by the light emitting part. The heat dissipation mechanism comprises a heat dissipation base body and a fan, the fan is arranged in the heat dissipation base body, the fan can drive air flows on two side faces of the heat dissipation base body simultaneously, the heat dissipation area is increased, and the heat dissipation efficiency is improved.

Description

Depilating instrument with heat dissipation function

Technical Field

The utility model relates to the technical field of depilating instruments, in particular to a depilating instrument with a heat dissipation function.

Background

The light depilatory instrument is more and more favored by the market by virtue of the safe and fast depilatory technology. The light depilating device adopts a filter to filter out partial wave band light source, so that light with required specific wavelength passes through the epidermis layer of the skin to irradiate the hair follicle and destroy the hair follicle to prevent hair growth. However, in the use process, the working part of the depilating device usually generates a large amount of heat due to the continuous light emission, and if the heat is not dissipated in time, the heat may cause the danger of scalding the user, and the service life of the illumination element is also reduced. When the power of the epilating apparatus is high, more heat is generated in the same time. Not only affects the service life of the epilating apparatus, but also the user experience is not good enough.

SUMMERY OF THE UTILITY MODEL

Accordingly, it is desirable to provide a depilating device with a heat dissipation function, which is directed to the problem of poor heat dissipation function of the depilating device.

An epilating apparatus with heat dissipation function, comprising: the shell is arranged in the shell, and the hair removal mechanism, the heat conduction mechanism and the heat dissipation mechanism are arranged in the shell; the hair removal mechanism comprises a light emitting part for emitting light; the heat dissipation mechanism comprises a heat dissipation base body and a fan, the heat dissipation base body is provided with a hollow accommodating part, and the fan is positioned in the accommodating part; the light-emitting part is connected with the heat conduction mechanism, and the heat conduction mechanism is connected with the heat dissipation base body.

In one embodiment, the accommodating portion has a groove therein, and the heat conducting mechanism is embedded in the groove to form surface contact with the heat dissipating substrate, so as to transfer heat to the heat dissipating substrate.

In one embodiment, the heat conducting mechanism includes a heat conducting substrate and a heat conducting pipe connected to each other, the heat conducting substrate is attached to the light emergent portion, and the heat dissipating mechanism has a heat dissipating surface in contact with the heat conducting pipe.

In one embodiment, the heat conducting substrate is adjacent to the heat dissipating base, and the heat conducting pipe extends into the heat dissipating base and is selectively exposed out of the heat dissipating base; the heat conduction pipe is located below the fan, and the plane where the heat conduction pipe is located is parallel to the plane where the rotation direction of the fan is located.

In one embodiment, the depilating mechanism further includes a PCB main board, the PCB main board is connected to the light-emitting portion and the fan, respectively, and the heat-conducting substrate is located between the light-emitting portion and the PCB main board.

In one embodiment, the PCB main board is provided with a power interface connected with an external power supply; the shell is provided with a switch key, and the switch key is connected with the PCB mainboard.

In one embodiment, the housing includes a front cover plate and a rear cover plate, the front cover plate is provided with a connecting hole matched with the power interface, and the rear cover plate is provided with a heat dissipation through hole.

In one embodiment, the housing is provided with heat dissipation holes and air inlet holes, and the heat dissipation holes and the air inlet holes are respectively located on two sides of the housing.

In one embodiment, the device further comprises a transparent cover plate; the shell is provided with a light outlet hole corresponding to one side of the light outlet part emitting light, and the transparent cover plate is covered on the light outlet hole.

In one embodiment, the heat dissipation base body comprises a plurality of heat dissipation fins stacked on one another, and the heat dissipation fins are provided with through holes.

Above-mentioned appearance that moults with heat dissipation function is connected through light portion and the heat conduction mechanism that will moult the appearance, and heat conduction mechanism is connected with heat dissipation mechanism to in time the effluvium of heat that produces light portion. The heat dissipation mechanism comprises a heat dissipation base body and a fan, the fan is arranged in the heat dissipation base body, the fan can drive air flows on two side faces of the heat dissipation base body simultaneously, the heat dissipation area is increased, and the heat dissipation efficiency is improved.

Drawings

Fig. 1 is an exploded view of the hair removal device with heat dissipation function of the present invention.

Fig. 2 is a schematic structural diagram of a heat conducting mechanism in the hair removal device with heat dissipation function according to the present invention.

FIG. 3 is a schematic structural diagram of a heat-dissipating substrate of the hair removal device with heat dissipation function of the present invention.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the utility model and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the utility model.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Referring to fig. 1, an epilating apparatus with heat dissipation function according to an embodiment of the present invention includes a housing 100, an epilating mechanism 200, a heat conducting mechanism 300, and a heat dissipation mechanism 400. The housing 100 has a receiving space therein, and the hair removing mechanism 200, the heat conducting mechanism 300 and the heat dissipating mechanism 400 are disposed in the receiving space. The epilating mechanism 200 is connected to the heat conducting mechanism 300, and the heat conducting mechanism 300 is connected to the heat dissipating mechanism 400. The heat generated by the hair removing mechanism 200 is conducted to the heat conducting mechanism 300, the heat conducting mechanism 300 conducts the heat to the heat dissipating mechanism 400, and the heat dissipating mechanism 400 dissipates the heat outside the housing 100.

Referring to fig. 2, the heat conducting mechanism 300 includes a heat conducting substrate 310 and a heat conducting pipe 320, wherein the heat conducting substrate 310 is connected to the heat conducting pipe 320. The thermally conductive substrate 310 has an upper end surface 311 and a lower end surface 312 that are attached to the epilating mechanism 200. The size of the thermally conductive substrate 310 is adapted to the size of the epilating mechanism 200. The heat conductive substrate 310 also has a side 313 to which the heat conductive pipe 320 is connected. In the present embodiment, the upper end surface 311 is perpendicular to the side surface 313, and the lower end surface 312 is perpendicular to the side surface 313. The heat pipe 320 is connected to the side 313 and has a predetermined length so as to be connected to the heat dissipation mechanism 400, and has a larger contact area with the heat dissipation mechanism 400, so as to improve the heat conduction efficiency. In the present embodiment, one end of the heat conducting pipe 320 is disposed on the side surface 313 of the heat conducting substrate 310, and the other end extends in a direction away from the side surface 313. The heat conductive pipes 320 are provided in three in number and arranged in parallel in a direction perpendicular to the length thereof. The number of heat pipes 320 can also be set according to the size of the epilating apparatus and the actual requirements.

As shown in fig. 2, in the present embodiment, the heat-conducting substrate 310 includes a plurality of heat-conducting teeth 314, and the heat-conducting teeth 314 are spaced at equal intervals, so as to provide a better heat dissipation effect when the hair removing mechanism 200 conducts the self-heat to the heat-conducting substrate 310. Specifically, the heat conducting teeth 314 extend from the lower end surface 312 of the heat conducting substrate 310 to the upper end surface 311 by a set length, and it can be understood that the effective contact area of the upper end surface 311 is larger than that of the lower end surface 312.

Referring to fig. 1, the hair removal mechanism 200 includes a light emitting portion 210 and a PCB main board 220. The PCB main board 220 is provided with a switch circuit for turning on and off the depilation instrument, and a circuit for supplying power to the light part 210 and the heat dissipation mechanism 400. The light emitting portion 210 is used to generate light to be irradiated to the skin. When the epilating apparatus is in an assembled state, the heat-conducting substrate 310 is located between the light-emitting portion 210 and the PCB main board 220, that is, the light-emitting portion 210 is attached to the upper end surface 311 of the heat-conducting substrate 310, and the PCB main board 220 is attached to the lower end surface 312 of the heat-conducting substrate 310. In this embodiment, the light emitting portion 210 is an LED lamp panel, which is a main heat source, and can efficiently conduct heat to the heat conducting substrate 310 by being attached to the upper end surface 311 having a large effective contact area. The PCB main board 220 is provided with a power interface (not specifically labeled) connected to an external power source, and the external power source can supply power to the depilation instrument through the power interface. The light emitting portion 210 may be another light source having a light depilation function.

Referring to fig. 1, the heat dissipating mechanism 400 includes a heat dissipating base 410 and a fan 420. The heat dissipation substrate 410 has a hollow accommodating portion 430 with two open ends, the fan 420 is located in the accommodating portion 430, and the fan 420 is electrically connected to the PCB main board 220 to supply power during operation. The heat dissipation base 410 is used to connect with the heat conducting mechanism 300 to carry heat of the heat conducting mechanism 300. The fan 420 is used for driving the air around the heat dissipation substrate 410 to form an air flow so as to exhaust the hot air flow from the interior of the housing 100. In the present embodiment, the number of the fans 420 is two, but may be set according to actual conditions.

Referring to fig. 3, in the present embodiment, the accommodating portion 430 has an upper sidewall 431, a lower sidewall 432, a left sidewall 433, a right sidewall 434, a front opening end 435, and a rear opening end 436. The fan 420 is loaded into the accommodating portion 430 from the front opening end 435 or the rear opening end 436, and the rotation direction of the fan 420 is parallel to the upper side wall 431 and the lower side wall 432, so that compared with the case where the fan is arranged on one side of the heat dissipation mechanism, the heat dissipation area is increased, the heat dissipation efficiency is improved, and the depilating device is suitable for a depilating instrument with higher power.

As shown in fig. 3, a groove 441 is disposed in the heat dissipating substrate 410, and the groove 441 is used for forming a surface contact with the heat conducting pipe 320 in the heat conducting mechanism 300, and the surface contact state can be also shown in fig. 1. In the thickness direction of the heat dissipation substrate 410, the groove 441 extends from the lower sidewall 432 of the accommodating portion 430 to a set length in a direction away from the accommodating portion 430, that is, the groove 441 communicates with the accommodating portion 430. The groove 441 has a length on the heat-dissipating base 410 that extends from the front open end 435 to the rear open end 436 of the accommodating portion 430 of the heat-dissipating base 410. The width of the groove 441 is adapted to the diameter of the heat conducting pipe 320, and the shape of the groove 441 can be set according to the shape of the heat conducting pipe 320. One end of the heat pipe 320, which is away from the heat conducting substrate 310, extends to the groove 441 in the accommodating portion 430 through the front opening 435 of the accommodating portion 430, and is selectively exposed to the heat dissipating base 410, in this embodiment, the heat pipe 320 is exposed to the heat dissipating base 410. It is understood that a through hole may be formed on the heat dissipating substrate 410, and the heat pipe 320 is inserted into the through hole; or other suitable means to achieve the purpose of conducting heat between the heat pipe 320 and the heat dissipating substrate 410.

In this embodiment, the heat-dissipating base 410 includes a plurality of heat-dissipating fins stacked on each other, the heat-dissipating fins are provided with through holes in the thickness direction, and the plurality of heat-dissipating fins with through holes are stacked to form the accommodating portion 430. It is understood that the heat dissipating substrate 410 may be a unitary structure.

Referring to fig. 1, the housing 100 includes a housing body 110, a front cover plate 120, and a rear cover plate 130. The housing body 110, the front cover plate 120 and the rear cover plate 130 are detachably connected, and may be, for example, a snap connection or the like. Which has a receiving space for receiving the hair removing mechanism 200, the heat conducting mechanism 300 and the heat dissipating mechanism 400 after being connected. The housing 110 is provided with heat dissipation holes 111 and an air inlet (not shown), and the heat dissipation holes 111 and the air inlet are respectively disposed at two sides of the housing 110 in the thickness direction. In this embodiment, the air inlet hole is disposed on one side of the housing 110 close to the groove 441 of the heat dissipating base 410, and the heat dissipating hole 111 is disposed on the other side of the housing 110 opposite to the air inlet hole. Thus, the cool air entering from the outside of the housing 100 can timely contact with the heat dissipating substrate 410 and the heat pipes 320 embedded in the grooves 441 to reduce the temperature inside the housing 100. In order to irradiate the light emitted from the light emitting part 210 to the outside of the casing 100, a light emitting hole (not shown) is formed on the casing 110 at a side where the air inlet hole is formed. The size of the light outlet is set according to actual needs. The housing 110 is further provided with a switch button 113, and the switch button 113 is connected to the PCB main board 220 inside the housing 100 for activating and deactivating the hair removal device. The front cover plate 120 is provided with a connecting hole 121, and an external power source can be connected with a power interface on the PCB main board 220 through the connecting hole 121 to supply power to the depilation instrument. The rear cover plate 130 is provided with heat dissipating through holes 131 to cooperate with the heat dissipating holes 111 formed in the housing 110 to accelerate the heat dissipation from the interior of the housing 100.

Referring to fig. 1, depilating mechanism 200 further includes a transparent cover 230. The transparent cover 230 covers the light outlet on the housing 110. The size of the transparent cover 230 is suitable to cover the light exit hole. The transparent cover plate 230 may seal the light emitting hole, thereby achieving the effects of preventing water and dust and protecting the light emitting part 210. Meanwhile, the light emitted from the light emitting part 210 can be transmitted through the transparent cover plate 230, and the light effect is not affected.

The overall structure of the depilating instrument is as follows: the portable electronic device includes a housing 100, in this embodiment, the housing 100 is a cuboid, and four edges of the cuboid are provided with round corners to facilitate holding. The epilating mechanism 200, the heat conducting mechanism 300 and the heat dissipating mechanism 400 are all arranged inside the housing 100. Wherein the housing 100 is provided with the hair removal mechanism 200 and the heat dissipation mechanism 400 in sequence along the length direction. The light emitting portion 210 of the epilating mechanism 200 is attached to the upper end surface 311 of the heat conducting substrate 310 of the heat conducting mechanism 300, the PCB main board 220 is attached to the lower end surface 312 of the heat conducting substrate 310, and the heat conducting pipe 320 of the heat conducting mechanism 300 is connected to the side surface 313 of the heat conducting substrate 310. The side 313 of the heat conducting substrate 310 is adjacent to the front opening 435 of the accommodating portion 430 of the heat dissipating mechanism 400, and the heat conducting pipe 320 connected to the side 313 extends into the groove 441 of the heat dissipating base 410 and contacts with the groove 441. The fan 420 is located within the receiving portion 430 and within a spatial region between an upper side wall 431 and a lower side wall 432 of the receiving portion 430. The OCB board 220 is electrically connected to the light emitting part 210 and the fan 420, respectively.

When the depilating apparatus is used, the switch button 113 is pressed to start the apparatus, the light emitting portion 210 starts to generate light, and the fan 420 starts to rotate. The light emitting portion 210 generates heat and transmits the heat to the heat conducting mechanism 300 connected thereto, the heat conducting pipe 320 in the heat conducting mechanism 300 transmits the heat to the heat dissipating base 410 in surface contact with the heat conducting pipe 320, the heat of the air around the heat dissipating base 410 is increased, and the fan 420 drives the air inside the heat dissipating base 410 to form an air flow, and the air flow is guided out of the housing 100 through the heat dissipating hole 111 and the heat dissipating through hole 131. While the hot air flow is guided out, the air outside the casing 100 enters the casing 100 from the air inlet hole under the action of the fan 420, and the inside 100 of the casing is cooled.

The depilating instrument with the heat dissipation function provided by the utility model has the advantages of simple structure, large heat dissipation area and high heat dissipation efficiency, and can be suitable for depilating instruments with different powers.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. An epilating apparatus with a heat dissipation function, comprising: the shell is arranged in the shell, and the hair removal mechanism, the heat conduction mechanism and the heat dissipation mechanism are arranged in the shell; the hair removal mechanism comprises a light emitting part for emitting light; the heat dissipation mechanism comprises a heat dissipation base body and a fan, the heat dissipation base body is provided with a hollow accommodating part, and the fan is positioned in the accommodating part; the light-emitting part is connected with the heat conduction mechanism, and the heat conduction mechanism is connected with the heat dissipation base body.

2. The hair removal device with heat dissipation function as claimed in claim 1, wherein a groove is formed in the accommodating portion, and the heat conduction mechanism is embedded in the groove to form surface contact with the heat dissipation substrate so as to transfer heat to the heat dissipation substrate.

3. The hair removal device with heat dissipation function of claim 1, wherein the heat conduction mechanism comprises a heat conduction substrate and a heat conduction pipe connected with each other, the heat conduction substrate is attached to the light emergent portion, and the heat dissipation mechanism has a heat dissipation surface contacting with the heat conduction pipe.

4. The hair removal device with heat dissipation function of claim 3, wherein said heat conducting substrate is adjacent to said heat dissipation base, said heat conducting pipe extends into said heat dissipation base and is selectively exposed from said heat dissipation base; the heat conduction pipe is located below the fan, and the plane where the heat conduction pipe is located is parallel to the plane where the rotation direction of the fan is located.

5. The hair removal device with heat dissipation function of claim 3, wherein the hair removal mechanism further comprises a PCB main board, the PCB main board is connected to the light-emitting portion and the fan, respectively, and the heat-conductive substrate is located between the light-emitting portion and the PCB main board.

6. The hair removal device with heat dissipation function of claim 5, wherein the PCB main board is provided with a power interface connected with an external power supply; the shell is provided with a switch key, and the switch key is connected with the PCB mainboard.

7. The hair removal device with heat dissipation function of claim 6, wherein the housing comprises a front cover plate and a rear cover plate, the front cover plate is provided with a connection hole for engaging with the power source interface, and the rear cover plate is provided with a heat dissipation through hole.

8. The hair removal device with heat dissipation function of claim 1, wherein the housing has heat dissipation holes and air inlet holes, and the heat dissipation holes and the air inlet holes are respectively located at two sides of the housing.

9. The hair removal instrument with heat dissipation function of claim 1, further comprising a transparent cover plate; the shell is provided with a light outlet hole corresponding to one side of the light outlet part emitting light, and the transparent cover plate is covered on the light outlet hole.

10. The hair removal device with heat dissipation function of claim 1, wherein the heat dissipation base comprises a plurality of heat dissipation fins stacked on each other, and the heat dissipation fins are provided with through holes.