CN215451447U - Electroplating device - Google Patents

Electroplating device Download PDF

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Publication number
CN215451447U
CN215451447U CN202121199488.7U CN202121199488U CN215451447U CN 215451447 U CN215451447 U CN 215451447U CN 202121199488 U CN202121199488 U CN 202121199488U CN 215451447 U CN215451447 U CN 215451447U
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China
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cleaning
tank
electroplating
cleaning tank
solar cell
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CN202121199488.7U
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Chinese (zh)
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童洪波
张洪超
李华
刘继宇
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Taizhou Longi Solar Technology Co Ltd
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Taizhou Longi Solar Technology Co Ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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Abstract

The present invention provides an electroplating apparatus, comprising: the device comprises a conveying mechanism, at least one electroplating bath, a plurality of cleaning devices and a plurality of cleaning tanks, wherein the conveying mechanism is used for driving the solar cell pieces to move according to a preset conveying path; a plurality of cleaning tanks are arranged at the downstream of each electroplating tank along the preset conveying path, and one cleaning device is correspondingly arranged above each cleaning tank; along the preset conveying path, in every two adjacent cleaning tanks, the cleaning device above the upstream cleaning tank is connected with the downstream cleaning tank. The electroplating device in the embodiment of the utility model can improve the electroplating efficiency of the solar cell, relieve the pressure of wastewater treatment and reduce the electroplating production cost and environmental protection pressure of the solar cell.

Description

Electroplating device
Technical Field
The utility model relates to the technical field of electroplating devices, in particular to an electroplating device.
Background
In recent years, crystalline silicon solar cells have a high market share in the photovoltaic industry due to high energy conversion efficiency. In order to reduce the cost competitiveness of the crystalline silicon solar cell, research on a plating method used by the crystalline silicon solar cell is also actively carried out in the photovoltaic industry.
At present, the electroplating process of the crystalline silicon solar cell is generally carried out in an electroplating solution tank, the electroplating metallization process of the crystalline silicon solar cell needs to electroplate and deposit one or more different metal layers, after each metal is deposited, the crystalline silicon solar cell needs to be cleaned, then the crystalline silicon solar cell enters the next electroplating tank to deposit another metal, and the electroplating metallization of the crystalline silicon solar cell is completed by repeating the above processes.
However, in the cleaning process of the crystalline silicon solar cell, the crystalline silicon solar cell needs to come out from one cleaning tank and enter another cleaning tank for cleaning, and the crystalline silicon solar cell needs to be lifted and lowered for many times in the cleaning process, so that the process is complex, and the electroplating efficiency of the crystalline silicon solar cell is easily reduced. Crystalline silicon solar cell is coming out the in-process that gets into the washing tank from the plating bath, carries the plating solution to get into the washing tank easily, and washs crystalline silicon solar cell intrusion washing tank in, and the water yield that needs is more for waste water treatment pressure is great, and environmental protection pressure is great, and the electroplating cost is higher.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present invention has been made to provide a plating apparatus that overcomes or at least partially solves the above problems.
In order to solve the above problems, the present invention discloses an electroplating apparatus, comprising: the device comprises a conveying mechanism, at least one electroplating bath, a plurality of cleaning devices and a plurality of cleaning tanks, wherein the conveying mechanism is used for driving the solar cell pieces to move according to a preset conveying path; wherein the content of the first and second substances,
a plurality of cleaning tanks are arranged at the downstream of each electroplating tank along the preset conveying path, and one cleaning device is correspondingly arranged above each cleaning tank;
along the preset conveying path, in every two adjacent cleaning tanks, the cleaning device above the upstream cleaning tank is connected with the downstream cleaning tank.
Optionally, along the preset conveying path, in every two adjacent cleaning tanks, the cleaning device above the upstream cleaning tank is connected with the downstream cleaning tank through a first pipeline;
the first pipeline is internally provided with a first pump which is used for pumping the cleaning solution in the downstream cleaning tank into the cleaning device above the upstream cleaning tank.
Optionally, the electroplating apparatus further comprises at least one clean water tank;
and the cleaning tank close to the most downstream is a first cleaning tank, and a cleaning device above the first cleaning tank is connected with the clean water tank.
Optionally, the cleaning device above the first cleaning tank is connected with the clean water tank through a second pipeline, a second pump is arranged in the second pipeline, and the second pump is used for pumping the clean water in the clean water tank into the cleaning device above the first cleaning tank.
Optionally, the cleaning tank close to the most upstream of the plurality of cleaning tanks connected in sequence along the preset conveying path is a second cleaning tank, and a recovery device is arranged in the second cleaning tank and used for recovering the electroplating solution in the second cleaning tank;
the recovery device is connected with the electroplating bath close to the second cleaning tank through a third pipeline, a third pump is arranged in the third pipeline, and the third pump is used for pumping the electroplating solution recovered by the recovery device into the electroplating bath close to the second cleaning tank.
Optionally, the cleaning device comprises: atomizing sprays mechanism and air knife mechanism.
Optionally, the conveying mechanism comprises a power source, an expansion piece and a conveying belt, the power source is connected with the conveying belt, and the power source is used for driving the conveying belt to move;
the conveying belt is arranged above the cleaning tank and the electroplating tank and used for driving the solar cell to move according to a preset conveying path;
the telescopic piece is fixedly connected to the conveying belt and used for driving the solar cell piece to do lifting motion.
Optionally, a cleaning device is correspondingly arranged above each electroplating bath, and the cleaning device is used for cleaning the electroplating solution on the surface of the solar cell to the corresponding electroplating bath.
Optionally, the clearing means comprises a plurality of air knife mechanisms.
Optionally, the distribution of the plurality of air knife mechanisms includes: at least one of a row distribution, a column distribution, and an array distribution.
The utility model has the following advantages:
in an embodiment of the utility model, along the preset conveying path, after the solar cell is electroplated from one electroplating tank, the solar cell may sequentially pass through a plurality of cleaning tanks. Every washing tank top all corresponds and is equipped with one belt cleaning device, like this, solar wafer can pass through earlier after once electroplate belt cleaning device washs, and solar wafer need not to promote and descend at the cleaning process, and technology is comparatively simple, can improve solar wafer's electroplating efficiency. The solar cell cleaning device comprises a cleaning tank, a conveying path, a cleaning tank, a cleaning device and a cleaning tank, wherein the cleaning tank is arranged above the cleaning tank, the conveying path is arranged in every two adjacent cleaning tanks, the cleaning device is arranged above the cleaning tank and is connected with the cleaning tank arranged at the lower reaches, so that the cleaning device is arranged above the cleaning tank arranged at the upper reaches and can clean the solar cell by using the cleaning liquid in the cleaning tank arranged at the lower reaches, the cleaning liquid can be recycled, the pressure of wastewater treatment is relieved, and the electroplating production cost and the environmental protection pressure of the solar cell are reduced.
Drawings
FIG. 1 is a first schematic structural view of an electroplating apparatus according to the present invention;
FIG. 2 is a second schematic structural view of an electroplating apparatus according to the present invention;
FIG. 3 is a schematic structural view III of an electroplating apparatus according to the present invention;
FIG. 4 is a schematic view of the arrangement of a cleaning apparatus of the present invention;
fig. 5 is a schematic view of the arrangement of a clearing device of the present invention.
Description of reference numerals:
1-electroplating bath, 2-cleaning bath, 21-first cleaning bath, 22-second cleaning bath, 31-cleaning device, 32-cleaning device, 4-conveying mechanism, 41-conveying belt, 42-telescopic piece, 5-connecting mechanism, 6-solar cell, 71-first pipeline, 72-third pipeline and 8-third pump.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
One of the core ideas of the utility model is to disclose an electroplating device.
Referring to fig. 1, a first structural schematic diagram of an electroplating apparatus according to the present invention is shown, where the electroplating apparatus may specifically include: the device comprises a conveying mechanism 4 for driving the solar cell 6 to move according to a preset conveying path, at least one electroplating bath 1 for electroplating the solar cell 6, a plurality of cleaning devices 31 and a plurality of cleaning tanks 2; wherein, along the preset conveying path, the downstream of each electroplating bath 1 is provided with a plurality of cleaning tanks 2, and a cleaning device 31 is correspondingly arranged above each cleaning tank 2; along the preset conveyance path, of every two adjacent washing tanks 2, the washing device 31 located above the upstream washing tank 2 can be connected to the downstream washing tank 2.
In the embodiment of the utility model, along the predetermined conveying path, after the solar cell 6 is electroplated from one electroplating tank 1, the solar cell may sequentially pass through a plurality of cleaning tanks 2. Every washing tank 2 top all corresponds and is equipped with a belt cleaning device 31, like this, solar wafer 6 can wash through belt cleaning device 31 earlier after once electroplating, and solar wafer 6 need not to promote and descend in the cleaning process, and technology is comparatively simple, can improve solar wafer 6's electroplating efficiency. Along predetermineeing transfer path, in every two adjacent washing tank 2, the belt cleaning device 31 that is located the washing tank 2 top of upper reaches can be connected with the washing tank 2 that is located the low reaches for the belt cleaning device 31 that is located the washing tank 2 top of upper reaches can use the washing liquid that is located the washing tank 2 of low reaches to wash solar wafer 6, can realize the cyclic utilization of washing liquid, alleviates waste water treatment's pressure, reduces solar wafer 6's electroplating manufacturing cost and environmental protection pressure.
The plating tank 1 in the embodiment of the utility model is used for storing a plating solution, so that the solar cell 6 can be subjected to a plating treatment in the plating tank 1 to complete an electrodeposited metal layer. In the case that the number of the plating tanks 1 is at least two, the plating solutions stored in the at least two plating tanks 1 may be different, and the number of the plating tanks 1 may be 1, 3, 4, or 6, which may be specifically set according to actual requirements, and this is not specifically limited in the embodiment of the present invention. For example, the solar cell 6 needs to be plated with three metal layers of nickel, copper and tin, the number of the plating tanks 1 can be set to three, one plating tank 1 stores a plating solution containing nickel, one plating tank 1 stores a plating solution containing copper, and one plating tank 1 stores a plating solution containing tin.
The cleaning devices 31 in the embodiment of the present invention are used for cleaning the solar cell pieces 6, and specifically, at least two cleaning devices 31 may be disposed at the downstream of each electroplating bath 1 along the preset conveying path, so that after the electroplating of the solar cell pieces 6 from one electroplating bath 1 is completed, a plurality of cleaning processes may be performed first, which may reduce the environmental protection pressure, and may also prevent the solar cell pieces 6 from carrying the electroplating solution to enter the next electroplating bath 1, thereby improving the electroplating effect of the solar cell pieces 6.
Further, a cleaning device 31 is disposed above each cleaning tank 2, and the cleaning tank 2 can be used for receiving the cleaning liquid sprayed by the cleaning device 31 above the cleaning tank and the electroplating solution removed from the surface of the solar cell 6. At least two cleaning tanks 2 can be arranged between two adjacent electroplating tanks 1.
Specifically, the preset conveying path is a moving direction of the solar cell 6 in the electroplating process, and may be set according to actual requirements, which is not specifically limited in the embodiment of the present invention.
As shown in fig. 1, the predetermined conveying path may be in the direction of the arrow shown in fig. 1, specifically, fig. 1 shows two cleaning tanks 2, and two cleaning devices 31 are correspondingly disposed above the two cleaning tanks 2. Specifically, in the arrow direction, two cleaning tanks 2 are a cleaning tank a1 and a cleaning tank a2 in this order, and a cleaning device 31 above the cleaning tank a1 is connected to the cleaning tank a2 in the cleaning tank a1 and the cleaning tank a 2.
As shown in fig. 2, the predetermined conveying path may be in the direction of the arrow shown in fig. 2, specifically, fig. 2 shows three cleaning tanks 2, and three cleaning devices 31 are correspondingly disposed above the three cleaning tanks 2. Specifically, along the arrow direction, three cleaning tanks 2 are cleaning tank B1, cleaning tank B2, and cleaning tank B3 in this order, cleaning device 31 above cleaning tank B1 is connected to cleaning tank B2, and cleaning device 31 above cleaning tank B2 is connected to cleaning tank B3.
As shown in fig. 3, the predetermined conveying path may be in the direction of the arrow shown in fig. 3, specifically, fig. 3 shows four cleaning tanks 2, and four cleaning devices 31 are correspondingly disposed above the four cleaning tanks 2. Specifically, along the arrow direction, four cleaning tanks 2 are cleaning tank C1, cleaning tank C2, cleaning tank C3 and cleaning tank C4 in this order, cleaning device 31 above cleaning tank C1 is connected to cleaning tank C2, cleaning device 31 above cleaning tank C2 is connected to cleaning tank C3, and cleaning device 31 above cleaning tank C3 is connected to cleaning tank C4.
Further, the electroplating apparatus may further include a pretreatment tank, which may be disposed before the first electroplating tank 1 on the preset conveying path, and may be configured to clean and remove dirt or oxidation on the surface of the solar cell 6, and specifically, the pretreatment tank may include a pickling tank and a rinsing tank.
Further, a temperature control device may be provided in the plating tank 1. The temperature control device can be used for controlling the temperature of the electroplating solution in the electroplating bath 1, so that the solar cell piece 6 can be subjected to electroplating treatment under a constant temperature condition, and the electroplating quality of the solar cell piece 6 is improved.
Alternatively, along the preset conveyance path, the cleaning device 31 located above the upstream cleaning tank 2 may be connected to the downstream cleaning tank 2 through the first pipe 71, in every adjacent two cleaning tanks 2; a first pump may be provided in the first pipe 71, and the first pump may be used to pump the cleaning liquid in the downstream cleaning tank 2 into the cleaning apparatus 31 above the upstream cleaning tank 2.
In the embodiment of the present invention, in every two adjacent cleaning tanks 2, the cleaning device 31 located above the upstream cleaning tank 2 and the downstream cleaning tank 2 are connected by the first pipeline 71, and the first pump is disposed in the first pipeline 71, so that the cleaning device 31 located above the upstream cleaning tank 2 can use the cleaning liquid in the downstream cleaning tank 2.
As shown in fig. 1, the cleaning apparatus 31 above the cleaning bath a1 and the cleaning bath a2 can be connected by a first pipe 71, and the cleaning solution in the cleaning bath a2 is pumped into the cleaning apparatus 31 above the cleaning bath a1 by a first pump.
Specifically, the first pump may be a water pump, an oil pump, or the like, and the embodiment of the present invention is not particularly limited thereto.
In practical application, follow predetermine transfer path, solar wafer 6 passes through a plurality of washing tanks 2 in proper order in the cleaning process, and in every two adjacent washing tanks 2, the plating solution concentration that is located the washing tank 2 of low reaches is less than the plating solution concentration that is located the washing tank 2 of upper reaches for belt cleaning device 31 can extract comparatively clean washing liquid from the washing tank 2 that is located transfer path the place ahead and wash solar wafer 6, can realize the recycle washing liquid when guaranteeing the cleaning performance to solar wafer 6.
In particular, the operating parameters of each washing device 31 may be the same, which may include: the working time, the voltage, the flow rate and other parameters in the working state may specifically be set according to actual requirements, and this is not specifically limited in the embodiment of the present invention.
Optionally, the electroplating apparatus further comprises at least one clean water tank; among the plurality of cleaning tanks 2 connected in sequence along the conveyance path, the cleaning tank 2 closest to the most downstream may be a first cleaning tank 21, and a cleaning device 31 above the first cleaning tank 21 may be connected to the clean water tank.
In the embodiment of the present invention, along the preset conveying path, the first cleaning tank 21 is close to the most downstream, so that the cleaning device 31 above the first cleaning tank 21 is close to the next electroplating tank 1, and the cleaning device 31 above the first cleaning tank 21 is connected to the clean water tank, so that the cleaning device 31 above the first cleaning tank 21 can clean the solar cell 6 with clean water before the solar cell 6 enters the next electroplating tank 1, and the electroplating effect of the solar cell 6 can be further improved.
Specifically, the clean water tank is used for storing clean water, the number of the clean water tanks may be one, and in the case where the number of the plating tanks 1 is plural, a plurality of cleaning devices 31 may be connected to one clean water tank. Or the number of the clean water tanks may be multiple, one clean water tank may be arranged between every two electroplating baths 1, and one cleaning device 31 corresponds to one clean water tank. In practical applications, every three cleaning devices 31 may share one clean water tank, or every five cleaning devices 31 may share one clean water tank, which may be specifically set according to practical requirements, and this is not specifically limited in the embodiment of the present invention.
In practical application, before the solar cell 6 enters the next electroplating bath 1, the solar cell can be sequentially subjected to multiple washing treatments, in the previous washing treatments, relatively clean washing liquid in the later washing tank 2 in the adjacent washing tank 2 can be utilized to wash the previous step, the washed washing liquid falls into the previous washing tank 2 in the adjacent washing tank 2, the washing liquid in the previous washing tank 2 is used for washing the previous step, only clean water without electroplating liquid can be stored in the clean water tank, so that the last washing can use completely clean washing water, and the surface of the solar cell 6 subjected to multiple washing treatments is relatively thorough.
As shown in fig. 1, two cleaning tanks 2 are cleaning tank a1 and cleaning tank a2 in order in the direction of the arrow, cleaning tank a2 is located near the most downstream, and cleaning tank a2 may be first cleaning tank 21.
As shown in fig. 2, the three cleaning tanks 2 are a cleaning tank B1, a cleaning tank B2, and a cleaning tank B3 in this order in the direction of the arrow, the cleaning tank B3 is located closest to the downstream, and the cleaning tank B3 may be the first cleaning tank 21.
As shown in fig. 3, the four cleaning tanks 2 are, in the direction of the arrow, a cleaning tank C1, a cleaning tank C2, a cleaning tank C3 and a cleaning tank C4 in this order, the cleaning tank C4 is located at the most downstream side, and the cleaning tank C4 may be the first cleaning tank 21.
Alternatively, the cleaning device 31 above the first cleaning tank 21 may be connected to the cleaning tank through a second pipeline, and a second pump may be disposed in the second pipeline, and the second pump is used for pumping the cleaning water in the cleaning tank into the cleaning device 31 above the first cleaning tank 21.
In the embodiment of the present invention, the cleaning device 31 above the first cleaning tank 21 is connected to the clean water tank through a second pipeline, and a second pump is disposed in the second pipeline, so that the cleaning device 31 above the first cleaning tank 21 can use the clean water in the clean water tank.
Specifically, the second pump may be a water pump, an oil pump, or the like, and the embodiment of the present invention is not particularly limited thereto.
Optionally, among the plurality of cleaning tanks 2 connected in sequence along the preset conveying path, the cleaning tank 2 closest to the most upstream may be a second cleaning tank 22, and a recovery device may be disposed in the second cleaning tank 22, and the recovery device may be configured to recover the plating solution in the second cleaning tank 22; the recycling device can be connected with the electroplating bath 1 close to the second cleaning tank 22 through a third pipeline 72, a third pump 8 is arranged in the third pipeline 72, and the third pump 8 can be used for pumping the electroplating solution recycled by the recycling device into the electroplating bath 1 close to the second cleaning tank 22.
In the embodiment of the present invention, the third pump 8 pumps the electroplating solution recovered by the recovery device into the electroplating tank 1 close to the second cleaning tank 22, so as to supplement the consumption of the electroplating solution in the electroplating tank 1 close to the second cleaning tank 22, improve the utilization rate of the electroplating solution, and reduce the discharge of wastewater.
Specifically, in the cleaning process of the solar cell 6, the cleaning device 31 above the second cleaning tank 22 can clean the solar cell 6 for the first time, the concentration level of the electroplating solution in the second cleaning tank 22 is high, the recovery device can recover the electroplating solution in the second cleaning tank 22, and the utilization rate of the electroplating solution is improved.
Further, the cleaning solution in the second cleaning tank 22 can be discharged according to actual requirements, specifically, in every two adjacent cleaning tanks 2, the cleaning solution in the downstream cleaning tank 2 can flow to the cleaning device 31 above the upstream cleaning tank 2 and then flow to the upstream cleaning tank 2, and finally the cleaning solution can flow into the second cleaning tank 22, and the electroplating solution in the second cleaning tank 22 can be recycled, so that the electroplating apparatus in the embodiment of the present invention can implement non-discharge electroplating.
As shown in fig. 1, two cleaning tanks 2 are cleaning tank a1 and cleaning tank a2 in order along the direction of the arrow, cleaning tank a1 being located closest to the upstream, cleaning tank a1 may be second cleaning tank 22.
As shown in fig. 2, the three cleaning tanks 2 are a cleaning tank B1, a cleaning tank B2, and a cleaning tank B3 in this order in the direction of the arrow, the cleaning tank B1 is located closest to the most upstream, and the cleaning tank B1 may be the second cleaning tank 22.
As shown in fig. 3, the four cleaning tanks 2 are, in the direction of the arrow, a cleaning tank C1, a cleaning tank C2, a cleaning tank C3 and a cleaning tank C4 in this order, the cleaning tank C1 is located closest to the upstream, and the cleaning tank C1 may be the second cleaning tank 22.
Specifically, the third pump 8 may be a water pump, an oil pump, or the like, and the embodiment of the present invention is not particularly limited thereto.
Specifically, the recovery device may be an evaporation device that increases the concentration level of the plating liquid in second cleaning tank 22 by evaporation or a concentration device that recovers the plating liquid after detecting that the plating liquid level in plating tank 1 located upstream has been reached. The concentration device can recover the electroplating solution in a concentration mode.
Alternatively, the washing device 31 may include: atomizing sprays mechanism and air knife mechanism. In practical application, the atomization spraying structure can clean the electroplating solution carried on the surface of the solar cell piece 6, and the air knife mechanism can blow off the electroplating solution and the cleaning solution carried on the surface of the solar cell piece 6, so that the solar cell piece 6 can be prevented from carrying the electroplating solution and the cleaning solution to enter the next electroplating bath 1, and the electroplating effect of the solar cell piece 6 can be further improved.
In practical applications, the cleaning device 31 may include a plurality of atomizing spray mechanisms and air knife mechanisms, and the plurality of atomizing spray mechanisms and air knife mechanisms may be distributed in rows, columns or arrays. As shown in fig. 4, the plurality of atomizing spray mechanisms and the air knife mechanisms are distributed in an array, and may be specifically set according to actual requirements, which is not specifically limited in the embodiment of the present invention.
Further, under the condition that a plurality of atomizing spray structures and air knife mechanism arrays are distributed, the air knife mechanism can be only arranged in the horizontal direction, so that electroplating liquid and cleaning liquid carried on the surface of the electroplated part 6 can be blown off quickly. In practical application, the working time of the air knife mechanism can be longer than that of the atomization spraying mechanism, so that the electroplating liquid and the cleaning liquid carried on the surface of the electroplated part 6 can be removed cleanly.
Specifically, the atomizing spray mechanism includes: the water tank is used for storing the atomization spraying mechanism, the atomization spraying mechanism is arranged along the preset conveying path, the cleaning liquid pumped out from the adjacent downstream cleaning tank 2 is arranged in the water tank, the water pump can convey the cleaning liquid in the water tank to the atomizer, and the cleaning liquid is atomized by the atomizer and then is sent into the atomization nozzle. The amount of the cleaning liquid sprayed by the atomization spraying mechanism can be adjusted, and the amount of the cleaning liquid sprayed can be adjusted according to actual needs, which is not particularly limited in the embodiment of the utility model.
Further, the time of each spraying operation of the atomization spraying mechanism can be no more than 15 seconds, such as 2-8 seconds, and the amount of the sprayed cleaning solution can be 1-20 ml/min. When the atomizing and spraying mechanism is cleaned, the nozzle of the atomizing and spraying mechanism can move up and down or left and right, the left and right moving speed can be balanced, the ascending speed can be slower and the descending speed can be faster when the atomizing and spraying mechanism moves up and down. When the atomization spraying mechanisms are distributed in an array mode, the nozzles on the two opposite sides of the atomization spraying mechanisms can be opened alternately to avoid interference during spraying.
The air knife mechanism may be a long tube disposed along the preset conveying path, or the air knife mechanism may also be a long tube disposed perpendicular to the preset conveying path, which is not specifically limited in this embodiment of the present invention. In practical application, the long pipe is provided with a plurality of air outlet holes along the axial direction, and the long pipe is simple in structure and high in working reliability. The air outlet is opposite to the solar cell piece 6, so that cleaning liquid and electroplating liquid on the surface of the solar cell piece 6 can be effectively removed, and the electroplating quality of the solar cell piece 6 is improved.
Alternatively, the conveying mechanism 4 may include a power source connected to the conveyor belt 41, an expansion member 42, and the conveyor belt 41, and the power source may be used to drive the conveyor belt 41 to move; the conveyor belt 41 can be arranged above the cleaning tank 2 and the electroplating tank 1 and is used for driving the solar cell 6 to move according to the preset conveying path; the expansion member 42 may be fixedly connected to the conveyor belt 41, and is used for driving the solar cells 6 to perform a lifting motion.
In the embodiment of the present application, the expansion member 42 is fixedly connected to the conveyor belt 41, and the expansion member 42 drives the solar cell 6 to perform a lifting motion, so that the solar cell 6 can enter the electroplating bath 1 for electroplating treatment. The conveyor belt 41 drives the solar cell 6 to move according to the preset conveying path, so that the solar cell 6 can sequentially pass through the upper parts of the plurality of cleaning tanks 2 and is cleaned by the cleaning device 31.
Specifically, the solar cell 6 may be connected to the expansion member 42, and driven by the expansion member 42 to move up and down, and driven by the conveyor belt 41 through the expansion member 42 to move along the preset conveying path.
In practical applications, the conveyor 41 may be disposed on the top of the electroplating apparatus, and the conveyor 41 may be disposed above the clean water tank, the cleaning tank 2, the electroplating tank 1, and the pretreatment tank. Specifically, the electroplating device may further include a top frame, and the cleaning device 31, the removing device 32 and the conveying mechanism 4 may be all fixedly connected to the top frame; the conveyor mechanism 4 further comprises a guide rail which may be provided on the inner side wall of the top frame, and the conveyor belt 41 may be slidably connected to the guide rail.
Specifically, the conveyor belt 41 may be a conveyor belt embedded in the guide rail or a traveling device sliding along the guide rail, and the embodiment of the present invention is not particularly limited thereto.
Further, the electroplating device can also comprise a connecting mechanism 5, and the connecting mechanism 5 can be connected with the telescopic piece 42; the connecting mechanism 5 may be provided with a plurality of clamping jaws, and the clamping jaws may be used for clamping the solar cell sheet 6. In the embodiment of the utility model, the connecting mechanism 5 is provided with the plurality of clamping jaws, so that the plurality of solar cells 6 can be subjected to electroplating treatment simultaneously, and the electroplating efficiency of the solar cells 6 can be improved.
Specifically, one clamping jaw may be used to fix one solar cell sheet 6, a plurality of clamping jaws may be distributed in rows, columns or arrays, and one connection mechanism 5 may connect several or dozens of solar cell sheets 6 at a time for electroplating.
Further, the conveyor belts 41 may include a plurality of sets arranged in parallel, and the plurality of link mechanisms 5 may be provided on the plurality of sets of conveyor belts 41, so that the plurality of link mechanisms 5 may be arranged in a plurality of rows.
In practical application, the connecting mechanism 5 may be a conductive member, and in the electroplating process of the solar cell 6, the connecting mechanism 5 may guide current to the solar cell 6, so as to improve the electroplating quality of the solar cell 6.
Optionally, a removing device 32 may be disposed above the plating tank 1, and the removing device 32 may be used to remove the plating solution on the surface of the solar cell 6 to the plating tank 1.
In the embodiment of the utility model, the removing device 32 can remove the electroplating solution on the surface of the solar cell 6 into the electroplating bath 1, so that the electroplating solution can be recycled, and the electroplating cost and the environmental protection pressure of the solar cell 6 are reduced.
Alternatively, the clearing device 32 may comprise a plurality of air knife mechanisms. In practical application, the air knife mechanism is adopted, so that the electroplating solution carried on the surface of the solar cell piece 6 can be blown down into the electroplating bath 1, the recovery rate of the electroplating solution is improved, and the cleaning pressure of the solar cell piece 6 is reduced.
Optionally, the distribution mode of the plurality of air knife mechanisms may include: at least one of a row distribution, a column distribution, and an array distribution. As shown in fig. 5, the plurality of air knife mechanisms are distributed in an array.
In practical application, a plurality of air knife mechanisms are arranged above the electroplating bath 1, the solar cell piece 6 rises from the electroplating bath 1, the solar cell piece 6 can be blown downwards from the top by the plurality of air knife mechanisms, the electroplating solution carried on the surface of the solar cell piece 6 is blown down to the electroplating bath 1, the waste of the electroplating solution is reduced, the solar cell piece 6 with higher temperature after electroplating can be cooled, and the metal layer electroplated on the surface of the solar cell piece 6 is prevented from being oxidized and discolored in a higher temperature state.
The electroplating device disclosed by the embodiment of the utility model at least has the following advantages:
in the embodiment of the utility model, along the preset conveying path, after the solar cell is electroplated, the solar cell sequentially passes through the plurality of cleaning tanks. Every washing tank top all corresponds and is equipped with one belt cleaning device, like this, solar wafer can pass through earlier after once electroplate belt cleaning device washs, and solar wafer need not to promote and descend at the cleaning process, and technology is comparatively simple, can improve solar wafer's electroplating efficiency. The edge predetermine transfer path, every adjacent two in the washing tank, be located the upper reaches the washing tank top belt cleaning device with be located the low reaches the washing tank is connected for be located the upper reaches the washing tank top belt cleaning device can use the washing liquid that is located the low reaches the washing tank is right the solar wafer washs, can realize the cyclic utilization of washing liquid, alleviates waste water treatment's pressure, reduces the electroplating manufacturing cost and the environmental protection pressure of solar wafer.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.
The electroplating apparatus provided by the present invention is described in detail above, and the principle and the implementation manner of the present invention are explained in the present document by applying specific examples, and the description of the above examples is only used to help understanding the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.

Claims (10)

1. An electroplating apparatus, comprising: the device comprises a conveying mechanism, at least one electroplating bath, a plurality of cleaning devices and a plurality of cleaning tanks, wherein the conveying mechanism is used for driving the solar cell pieces to move according to a preset conveying path; wherein the content of the first and second substances,
a plurality of cleaning tanks are arranged at the downstream of each electroplating tank along the preset conveying path, and one cleaning device is correspondingly arranged above each cleaning tank;
along the preset conveying path, in every two adjacent cleaning tanks, the cleaning device above the upstream cleaning tank is connected with the downstream cleaning tank.
2. The plating apparatus as recited in claim 1, wherein, in every adjacent two of said cleaning tanks along said predetermined conveyance path, said cleaning device located above said upstream cleaning tank and said cleaning tank located downstream are connected by a first pipe;
the first pipeline is internally provided with a first pump which is used for pumping the cleaning solution in the downstream cleaning tank into the cleaning device above the upstream cleaning tank.
3. The electroplating apparatus of claim 1, further comprising at least one clean water tank;
and the cleaning tank close to the most downstream is a first cleaning tank, and a cleaning device above the first cleaning tank is connected with the clean water tank.
4. The electroplating apparatus as claimed in claim 3, wherein the cleaning apparatus above the first cleaning tank is connected to the clean water tank via a second pipeline, and a second pump is disposed in the second pipeline and is used for pumping the clean water in the clean water tank into the cleaning apparatus above the first cleaning tank.
5. The plating apparatus as recited in claim 1, wherein, among a plurality of cleaning tanks connected in sequence along the predetermined conveying path, a cleaning tank near the most upstream is a second cleaning tank, and a recovery device is provided in the second cleaning tank for recovering the plating solution in the second cleaning tank;
the recovery device is connected with the electroplating bath close to the second cleaning tank through a third pipeline, a third pump is arranged in the third pipeline, and the third pump is used for pumping the electroplating solution recovered by the recovery device into the electroplating bath close to the second cleaning tank.
6. The plating apparatus as recited in claim 1, wherein said cleaning device comprises: atomizing sprays mechanism and air knife mechanism.
7. The electroplating device according to claim 1, wherein the conveying mechanism comprises a power source, an expansion piece and a conveying belt, the power source is connected with the conveying belt, and the power source is used for driving the conveying belt to move;
the conveying belt is arranged above the cleaning tank and the electroplating tank and used for driving the solar cell to move according to a preset conveying path;
the telescopic piece is fixedly connected to the conveying belt and used for driving the solar cell piece to do lifting motion.
8. The electroplating device according to claim 1, wherein a cleaning device is correspondingly arranged above each electroplating bath, and the cleaning device is used for cleaning the electroplating solution on the surface of the solar cell to the corresponding electroplating bath.
9. The electroplating apparatus of claim 8, wherein the purging device comprises a plurality of air knife mechanisms.
10. The plating apparatus as recited in claim 9, wherein said plurality of air knife mechanisms are distributed in a manner comprising: at least one of a row distribution, a column distribution, and an array distribution.
CN202121199488.7U 2021-05-31 2021-05-31 Electroplating device Active CN215451447U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121199488.7U CN215451447U (en) 2021-05-31 2021-05-31 Electroplating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121199488.7U CN215451447U (en) 2021-05-31 2021-05-31 Electroplating device

Publications (1)

Publication Number Publication Date
CN215451447U true CN215451447U (en) 2022-01-07

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Family Applications (1)

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CN202121199488.7U Active CN215451447U (en) 2021-05-31 2021-05-31 Electroplating device

Country Status (1)

Country Link
CN (1) CN215451447U (en)

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