CN215429939U - LED chip adhesive deposite device based on LED production - Google Patents
LED chip adhesive deposite device based on LED production Download PDFInfo
- Publication number
- CN215429939U CN215429939U CN202120066091.4U CN202120066091U CN215429939U CN 215429939 U CN215429939 U CN 215429939U CN 202120066091 U CN202120066091 U CN 202120066091U CN 215429939 U CN215429939 U CN 215429939U
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- Prior art keywords
- glue
- led chip
- led
- dispensing
- storage tank
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000000853 adhesive Substances 0.000 title claims description 4
- 230000001070 adhesive effect Effects 0.000 title claims description 4
- 239000003292 glue Substances 0.000 claims abstract description 116
- 238000003860 storage Methods 0.000 claims abstract description 37
- 230000003139 buffering effect Effects 0.000 claims abstract description 27
- 238000007790 scraping Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 7
- 238000004026 adhesive bonding Methods 0.000 abstract description 6
- 238000007711 solidification Methods 0.000 abstract description 4
- 230000008023 solidification Effects 0.000 abstract description 4
- 239000004576 sand Substances 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model belongs to the technical field of LEDs, and particularly relates to an LED chip dispensing device based on LED production. Can be used to transport the LED chip through the drive belt that sets up and process the use, can be used to cut apart different transport passage through the spacing sand grip that sets up on the drive belt surface and place different batches of LED chip respectively, the buffering glue storage tank through setting up can be used to carry out the point to the LED chip and use, the heater through setting up can be used to heat the glue of buffering glue storage tank inside storage and prevent that the inside glue solidification of buffering glue storage tank from causing the inside glue solidification of buffering glue storage tank to block up out the mouth of gluing, it is inhomogeneous to cause the LED chip point, the limiting plate can be used to cooperate with buffering glue storage tank through the point of setting up and realize gluing the LED chip, even point is glued the operation, can improve LED chip point precision when, promote LED chip point efficiency greatly.
Description
Technical Field
The utility model belongs to the technical field of LEDs, and particularly relates to an LED chip glue dispensing device based on LED production.
Background
A solid semiconductor device, the heart of the LED is a semiconductor wafer, one end of the wafer is attached to a support, the other end is a cathode, and the other end is connected with the anode of a power supply, so that the whole wafer is packaged by epoxy resin. Also called led light emitting chip, is the core component of led lamp, also called P-N junction. The main functions are as follows: the electric energy is converted into light energy, and the main material of the chip is monocrystalline silicon. The semiconductor wafer is composed of two parts, one of which is a P-type semiconductor in which holes predominate and the other of which is an N-type semiconductor in which electrons predominate. When the two semiconductors are connected, a P-N junction is formed between them. When current is applied to the wafer through the wire, electrons are pushed to the P region where they recombine with holes and then emit energy in the form of photons, which is the principle of LED light emission. The wavelength of the light, i.e., the color of the light, is determined by the material forming the P-N junction.
The most critical step in the current LED lamp production process is a dispensing process, namely, dispensing is carried out on an LED chip arranged on a production line, the current LED lamp dispensing process is generally carried out through a processing table by transmission, dispensing is carried out through manual work or a dispensing machine, so that the dispensing position is inaccurate, the dispensing amount is not uniform, or the phenomenon that coating is not in place possibly occurs in the dispensing process is avoided, so that the quality of an LED lamp is influenced, the automation degree of the processing of the current LED lamp is not high enough, and the production efficiency is low.
SUMMERY OF THE UTILITY MODEL
To solve the problems set forth in the background art described above. The utility model provides an LED chip glue dispensing device based on LED production, which solves the problems that the glue dispensing position is not accurate, the glue amount distribution is not uniform or the phenomenon of coating failure possibly occurs in the glue dispensing process due to the glue dispensing of the existing manual work or a glue dispenser, so that the quality of an LED lamp is influenced, and the automation degree of the processing of the existing LED lamp is not high enough and the production efficiency is low.
In order to achieve the purpose, the utility model provides the following technical scheme: an LED chip glue dispensing device based on LED production comprises an LED chip glue dispensing base, wherein an LED chip conveying base station is arranged at the top of the LED chip glue dispensing base, a first electric slide rail is arranged on one side of the LED chip conveying base station, a motor is arranged at one end of the LED chip glue dispensing base, a second drive wheel is arranged at one end of the LED chip conveying base station, one end of the second drive wheel penetrates through the LED chip conveying base station and is provided with a drive belt through a flange, limit convex strips are uniformly arranged on the surface of the drive belt, an L-shaped glue dispensing support frame is slidably arranged at the top of the first electric slide rail, a limit guide groove is formed in one side of the L-shaped glue dispensing support frame, an electric push rod is arranged at the top end of the limit guide groove, an L-shaped support frame is fixedly connected with one end of the electric push rod, and a buffer glue storage tank is uniformly arranged on the surface of the L-shaped support frame, the buffering stores up the surface mounting who glues the jar and has the heater, the opposite side of support frame is glued to L type point is installed and is stored up gluey case, store up one side of gluing the case and install the hot plate, LED chip carries the top of base station to install and glues the limiting plate, be equipped with the support frame directly over the drive belt, support substrate is installed at the support frame top, the top of support substrate inner wall evenly is equipped with the UV lamp.
Preferably, the output end of the motor is provided with a first driving wheel through a flange, and a driving belt is arranged between the first driving wheel and the second driving wheel.
Preferably, the L-shaped support frame is connected with the L-shaped dispensing support frame through a limiting guide groove.
Preferably, a glue injection port is formed in the top of the glue storage box, a glue pump is arranged inside the glue storage box, a glue conveying hose is connected to the output port of the glue pump, and the glue pump is connected with the buffer glue storage tank through the glue conveying hose.
Preferably, the surface of the glue dispensing limiting plate is uniformly provided with a glue dispensing limiting hole, one side of the glue dispensing limiting hole is provided with a second electric sliding rail, the top of the second electric sliding rail is provided with a glue scraping plate, and one end of the second electric sliding rail is provided with a collecting box.
Preferably, the structural size and the position between the dispensing limit hole and the buffering glue storage tank are completely matched correspondingly.
Compared with the prior art, the utility model has the beneficial effects that:
can be used to transport the LED chip through the drive belt that sets up and process the use, can be used to cut apart different transport passage through the spacing sand grip that sets up on the drive belt surface and place different batches of LED chip respectively, the buffering glue storage tank through setting up can be used to carry out the point to the LED chip and use, the heater through setting up can be used to heat the glue of buffering glue storage tank inside storage and prevent that the inside glue solidification of buffering glue storage tank from causing the inside glue solidification of buffering glue storage tank to block up out the mouth of gluing, it is inhomogeneous to cause the LED chip point, the limiting plate can be used to cooperate with buffering glue storage tank through the point of setting up and realize gluing the LED chip, even point is glued the operation, can improve LED chip point precision when, promote LED chip point efficiency greatly.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model and not to limit the utility model. In the drawings:
FIG. 1 is a first perspective view of the present invention;
FIG. 2 is a second perspective view of the present invention;
fig. 3 is a three-dimensional structure diagram of a first L-shaped dispensing support frame according to the present invention;
fig. 4 is a three-dimensional structure diagram of a second L-shaped dispensing support frame according to the present invention;
FIG. 5 is a three-dimensional structure diagram of a dispensing limiting plate according to the present invention;
FIG. 6 is a cross-sectional view of the glue storage box of the present invention.
In the figure: 1, dispensing a base for an LED chip; 2, the LED chip conveying base station; 3 a first electric slide rail; 4, a motor; 5 a first drive wheel; 6 a second driving wheel; 7, a transmission belt; 8, limiting convex strips; 9L-shaped dispensing support frames; 10 limiting guide grooves; 11, an electric push rod; a 12L-shaped support frame; 13 a buffer glue storage tank; 14 a heater; 15, a glue storage box; 16, a glue injection port; 17, a glue conveying hose; 18 glue pump; 19 heating the plate; 20 dispensing limit plates; 21 a second motorized slide rail; 22 scraping a rubber plate; 23 dispensing limiting holes; 24 a collection box; 25 supporting the bracket; 26 support the substrate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides the following technical solutions: an LED chip glue dispensing device based on LED production comprises an LED chip glue dispensing base 1, wherein the top of the LED chip glue dispensing base 1 is provided with an LED chip conveying base station 2, one side of the LED chip conveying base station 2 is provided with a first electric slide rail 3, one end of the LED chip glue dispensing base 1 is provided with a motor 4, one end of the LED chip conveying base station 2 is provided with a second driving wheel 6, one end of the second driving wheel 6 penetrates through the LED chip conveying base station 2 and is provided with a driving belt 7 through a flange, the surface of the driving belt 7 is uniformly provided with limiting convex strips 8 which can be used for conveying LED chips for processing through the arranged driving belt 7, the limiting convex strips 8 arranged on the surface of the driving belt 7 can be used for dividing different transportation channels to respectively place LED chips in different batches, the buffering glue storage tank 13 can be used for glue dispensing the LED chips, the top of the first electric slide rail 3 is slidably provided with an L-shaped glue dispensing support frame 9, a limiting guide groove 10 is arranged on one side of an L-shaped dispensing support frame 9, an electric push rod 11 is arranged at the top end of the limiting guide groove 10, one end of the electric push rod 11 is fixedly connected with an L-shaped support frame 12, a buffering glue storage tank 13 is uniformly arranged on the surface of the L-shaped support frame 12, a heater 14 is arranged on the surface of the buffering glue storage tank 13, the heater 14 can be used for heating glue stored in the buffering glue storage tank 13 to prevent glue in the buffering glue storage tank 13 from solidifying to cause glue solidifying in the buffering glue storage tank 13 to block a glue outlet, so that LED chip dispensing is not uniform, a glue storage tank 15 is arranged on the other side of the L-shaped dispensing support frame 9, a heating plate 19 is arranged on one side of the glue storage tank 15, a dispensing limiting plate 20 is arranged on the top of the LED chip conveying base platform 2, a support bracket 25 is arranged right above the driving belt 7, and a support base plate 26 is arranged on the top of the support bracket 25, the top of the inner wall of the supporting substrate 26 is uniformly provided with UV lamps, and the UV lamps can be used for accelerating the curing of matched glue.
Specifically, a first driving wheel 5 is installed at the output end of the motor 4 through a flange, a driving belt is installed between the first driving wheel 5 and the second driving wheel 6, and the driving belt 7 can be used for transporting the LED chips through the first driving wheel 5, the second driving wheel 6 and the driving belt.
Specifically, the L-shaped support frame 12 is connected with the L-shaped dispensing support frame 9 through the limiting guide groove 10, and the limiting guide groove 10 provided through can be used for stabilizing the use stability of the L-shaped support frame 12 for descending.
Specifically, glue injection mouth 16 has been seted up at the top of storing up gluey case 15, the inside of storing up gluey case 15 is equipped with glues pump 18, the delivery outlet department of gluing pump 18 is connected with glue conveying hose 17, glue pump 18 is stored up gluey jar 13 with the buffering through glue conveying hose 17 and is connected, glue dispensing limiting plate 20 through setting up can be used for storing up gluey jar 13 with the buffering and cooperate the realization to carry out the accuracy to the LED chip, even point is glued the operation, can improve LED chip point and glue the precision when, promote LED chip point greatly and glue efficiency.
Specifically, the surface of some glue limiting plate 20 has evenly seted up some glue spacing hole 23, one side of some glue spacing hole 23 is equipped with second electronic slide rail 21, glue scraping plate 22 is installed at the top of second electronic slide rail 21, the one end of second electronic slide rail 21 is equipped with collecting box 24, some glue spacing hole 23 through setting up can cooperate with buffering storage glue jar 13 and accomplish the point of LED chip and glue accurate use, the unnecessary surplus glue in some glue limiting plate 20 surfaces is clear away to accessible glue scraping plate 22 simultaneously, and the colloid that will clear away pushes away to the inside of collecting box 24 and stores the use.
Specifically, the structural size and the position between the dispensing limiting hole 23 and the buffering glue storage tank 13 are completely matched in a corresponding mode, and the dispensing limiting hole 23 and the buffering glue storage tank 13 are matched with each other to achieve accurate dispensing of the LED chip.
The working principle and the using process of the utility model are as follows: when the LED dispensing device is used, the LED chips can be placed into the placing channel formed by the limiting convex strips 8 one by one for transportation, the motor 4 drives the transmission belt 7 to transport at a constant speed, when the LED chips on the surface of the transmission belt 7 move to be under the dispensing limiting holes 23, the L-shaped support frame 12 can be lowered through the electric push rod 11, the dispensing processing operation can be carried out on the surfaces of the LED chips through the buffering glue storage tank 13, then the glue scraping plate 22 can clean the glue on the surfaces of the dispensing limiting plates 20 through the second electric slide rail 21 and push the cleaned glue to the inside of the collection box 24, the LED chips after dispensing can be accelerated to be cured and irradiated through the UV lamp for use, and all electric equipment in the device can be powered through the external power supply.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that various changes, modifications and substitutions can be made without departing from the spirit and scope of the utility model as defined by the appended claims. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. The utility model provides a LED chip adhesive deposite device based on LED production, includes LED chip adhesive deposite base (1), its characterized in that: the LED dispensing device is characterized in that an LED chip conveying base (2) is arranged at the top of the LED chip dispensing base (1), a first electric sliding rail (3) is installed at one side of the LED chip conveying base (2), a motor (4) is arranged at one end of the LED chip dispensing base (1), a second driving wheel (6) is installed at one end of the LED chip conveying base (2), one end of the second driving wheel (6) penetrates through the LED chip conveying base (2) and is provided with a driving belt (7) through a flange, limiting convex strips (8) are uniformly arranged on the surface of the driving belt (7), an L-shaped dispensing support frame (9) is slidably installed at the top of the first electric sliding rail (3), a limiting guide groove (10) is formed in one side of the L-shaped dispensing support frame (9), an electric push rod (11) is installed at the top end of the limiting guide groove (10), and one end of the electric push rod (11) is fixedly connected with an L-shaped support frame (12), the surface of L type support frame (12) evenly installs the buffering and stores up gluey jar (13), the buffering stores up the surface mounting who glues jar (13) has heater (14), the opposite side of L type point support frame (9) is installed and is stored up gluey case (15), hot plate (19) are installed to one side of storing up gluey case (15), LED chip carries the top of base station (2) to install and glues limiting plate (20), be equipped with support bracket (25) directly over drive belt (7), support substrate (26) are installed at support bracket (25) top, the top of support substrate (26) inner wall evenly is equipped with the UV lamp.
2. The LED chip glue dispensing device based on LED production according to claim 1, characterized in that: the output end of the motor (4) is provided with a first driving wheel (5) through a flange, and a driving belt is arranged between the first driving wheel (5) and the second driving wheel (6).
3. The LED chip glue dispensing device based on LED production according to claim 1, characterized in that: the L-shaped support frame (12) is connected with the L-shaped dispensing support frame (9) through a limiting guide groove (10).
4. The LED chip glue dispensing device based on LED production according to claim 1, characterized in that: the glue storage tank is characterized in that a glue injection port (16) is formed in the top of the glue storage tank (15), a glue pump (18) is arranged inside the glue storage tank (15), a glue conveying hose (17) is connected to an output port of the glue pump (18), and the glue pump (18) is connected with the buffer glue storage tank (13) through the glue conveying hose (17).
5. The LED chip glue dispensing device based on LED production according to claim 1, characterized in that: the surface of some glue limiting plate (20) has evenly seted up some glue spacing hole (23), one side of some glue spacing hole (23) is equipped with second electronic slide rail (21), rubber scraping plate (22) are installed at the top of second electronic slide rail (21), the one end of second electronic slide rail (21) is equipped with collecting box (24).
6. The LED chip glue dispensing device based on LED production according to claim 5, characterized in that: the structural size and the position of the dispensing limiting hole (23) and the buffering glue storage tank (13) are completely matched correspondingly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120066091.4U CN215429939U (en) | 2021-01-11 | 2021-01-11 | LED chip adhesive deposite device based on LED production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120066091.4U CN215429939U (en) | 2021-01-11 | 2021-01-11 | LED chip adhesive deposite device based on LED production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215429939U true CN215429939U (en) | 2022-01-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120066091.4U Expired - Fee Related CN215429939U (en) | 2021-01-11 | 2021-01-11 | LED chip adhesive deposite device based on LED production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215429939U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116475011A (en) * | 2023-04-25 | 2023-07-25 | 芯朋半导体科技(如东)有限公司 | Auxiliary heating seat for dispensing chip copper substrate |
-
2021
- 2021-01-11 CN CN202120066091.4U patent/CN215429939U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116475011A (en) * | 2023-04-25 | 2023-07-25 | 芯朋半导体科技(如东)有限公司 | Auxiliary heating seat for dispensing chip copper substrate |
| CN116475011B (en) * | 2023-04-25 | 2023-09-19 | 芯朋半导体科技(如东)有限公司 | Auxiliary heating seat for dispensing chip copper substrate |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220107 |
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| CF01 | Termination of patent right due to non-payment of annual fee |