CN215420213U - Adopt high rigidity glass encapsulation crystal oscillator - Google Patents
Adopt high rigidity glass encapsulation crystal oscillator Download PDFInfo
- Publication number
- CN215420213U CN215420213U CN202121747817.7U CN202121747817U CN215420213U CN 215420213 U CN215420213 U CN 215420213U CN 202121747817 U CN202121747817 U CN 202121747817U CN 215420213 U CN215420213 U CN 215420213U
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- base
- crystal oscillator
- fixedly connected
- shell
- reinforcing pad
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- Oscillators With Electromechanical Resonators (AREA)
Abstract
The utility model discloses a crystal oscillator packaged by high-hardness glass, which comprises a base, wherein a rubber ring is connected inside the base in a matching manner, pins are connected on the inner surface of the rubber ring in a matching manner, a crystal plate is welded at the upper ends of the pins, a reinforcing pad is arranged on the outer surface of the crystal plate, an upper shell structure is fixedly connected to the lower surface of the reinforcing pad, and the lower surface of the upper shell structure is fixedly connected with the base. According to the utility model, the upper shell structure and the reinforcing pad are arranged, and the reinforcing pad is used for protecting the welding point of the pin and the crystal plate, so that the phenomenon that the welding point is loosened due to vibration and the pin and the crystal plate are not smoothly connected is avoided.
Description
Technical Field
The utility model relates to the field of electronic components, in particular to a crystal oscillator packaged by high-hardness glass.
Background
Some electronic devices require ac signals with highly stable frequencies, and LC oscillators have poor stability and easily drift in frequency (i.e., the frequency of the generated ac signal is easily changed). A highly stable signal can be generated by using a specific element, a quartz crystal, in an oscillator called a crystal oscillator.
The internal pin and the crystal plate of the existing crystal oscillator are welded, the connection mode is not stable enough, and the situation of unsmooth connection is easy to occur after the oscillation occurs.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the defects in the prior art, and provides a crystal oscillator packaged by high-hardness glass.
In order to achieve the purpose, the utility model adopts the following technical scheme: the utility model provides an adopt high rigidity glass encapsulation crystal oscillator, includes the base, the inside cooperation of base is connected with the rubber ring, the interior surface fit of rubber ring is connected with the pin, the upper end welding of pin has brilliant board, the surface of brilliant board is provided with the reinforcement pad, the lower fixed surface of reinforcement pad is connected with the epitheca structure, the lower surface and the base fixed connection of epitheca structure, the shell is made by pottery.
As a further description of the above technical solution:
the upper shell structure comprises a shell and a supporting plate, the inner surface of the shell is fixedly connected with the supporting plate, the upper surface of the supporting plate is fixedly connected with a reinforcing pad, and the lower surface of the shell is fixedly connected with the base.
As a further description of the above technical solution:
the lower surface of the base is fixedly connected with a protective pad.
As a further description of the above technical solution:
the pins pass through the interior of the base.
The utility model has the following beneficial effects:
1. compared with the prior art, this adopt high rigidity glass encapsulation crystal oscillator, through setting up epitheca structure and reinforcing pad, utilize reinforcing pad protection pin and the welding point of brilliant board, avoid leading to the welding point to relax because of vibrations, lead to pin and brilliant board to be connected unsmoothly.
2. Compared with the prior art, this adopt high rigidity glass encapsulation crystal oscillator, through setting up the rubber ring, not only can play the cushioning effect to the pin, can also be when welding the device, the heat transfer of pin when blockking the welding.
3. Compared with the prior art, this adopt high rigidity glass encapsulation crystal oscillator, through setting up the protection pad, can protect the circuit board not rubbed by the base during installation crystal oscillator to avoid the circuit board to damage.
Drawings
FIG. 1 is a front view of a crystal oscillator packaged by high hardness glass according to the present invention;
FIG. 2 is a side view of a crystal oscillator packaged by high hardness glass according to the present invention;
FIG. 3 is a top view of a crystal oscillator packaged by high hardness glass according to the present invention;
fig. 4 is a schematic structural diagram of a crystal oscillator packaged by high-hardness glass according to the present invention.
Illustration of the drawings:
1. a base; 2. an upper shell structure; 3. a protective pad; 4. a pin; 5. reinforcing the cushion; 6. a crystal plate; 7. a rubber ring; 201. a housing; 202. and a support plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-4, one embodiment of the present invention is provided: a crystal oscillator packaged by high-hardness glass comprises a base 1, a protective pad 3 is fixedly connected to the lower surface of the base 1, the protective pad 3 can protect a circuit board from being rubbed by the base 1 when the crystal oscillator is installed on the protective pad 3, so that the circuit board is prevented from being damaged, a rubber ring 7 is connected to the inside of the base 1 in a matching mode, the rubber ring 7 can play a role in damping pins and can also block heat transfer of the pins during welding when the crystal oscillator is welded, pins 4 are connected to the inner surface of the rubber ring 7 in a matching mode, the pins 4 penetrate through the inside of the base 1, a crystal plate 6 is welded to the upper ends of the pins 4, a reinforcing pad 5 is arranged on the outer surface of the crystal plate 6, an upper shell structure 2 is fixedly connected to the lower surface of the reinforcing pad 5, the upper shell structure 2 has a protective supporting function on the inner structure, the upper shell structure 2 comprises a shell 201 and a supporting plate 202, and the inner surface of the shell 201 is fixedly connected with the supporting plate 202, the shell 201 is made by pottery, the upper surface and the reinforcing pad 5 fixed connection of backup pad 202, the lower surface and the base 1 fixed connection of shell 201, the lower surface and the base 1 fixed connection of epitheca structure 2, epitheca structure 2 and reinforcing pad 5 utilize reinforcing pad 5 protection pin 4 and brilliant board 6's welding point, avoid leading to the solder joint to relax because of vibrations, lead to pin 4 and brilliant board 6 to be connected unsmoothly.
The working principle is as follows: after the crystal plate 6 and the pins 4 are welded, the crystal plate is fixed by the reinforcing pad 5, then the crystal plate is fixed on the supporting plate 202, and finally the upper shell structure 2 and the base 1 are packaged.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the utility model.
Claims (4)
1. The utility model provides an adopt high rigidity glass encapsulation crystal oscillator, includes base (1), its characterized in that: the interior cooperation of base (1) is connected with rubber ring (7), the interior surface cooperation of rubber ring (7) is connected with pin (4), the upper end welding of pin (4) has brilliant board (6), the surface of brilliant board (6) is provided with reinforcing pad (5), the lower fixed surface of reinforcing pad (5) is connected with epitheca structure (2), the lower surface and base (1) fixed connection of epitheca structure (2).
2. The crystal oscillator packaged by the high-hardness glass according to claim 1, wherein: the upper shell structure (2) comprises a shell (201) and a supporting plate (202), the inner surface of the shell (201) is fixedly connected with the supporting plate (202), the upper surface of the supporting plate (202) is fixedly connected with a reinforcing pad (5), the lower surface of the shell (201) is fixedly connected with a base (1), and the shell (201) is made of ceramics.
3. The crystal oscillator packaged by the high-hardness glass according to claim 1, wherein: the lower surface of the base (1) is fixedly connected with a protective pad (3).
4. The crystal oscillator packaged by the high-hardness glass according to claim 1, wherein: the pins (4) pass through the inside of the base (1).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202121747817.7U CN215420213U (en) | 2021-07-29 | 2021-07-29 | Adopt high rigidity glass encapsulation crystal oscillator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202121747817.7U CN215420213U (en) | 2021-07-29 | 2021-07-29 | Adopt high rigidity glass encapsulation crystal oscillator |
Publications (1)
Publication Number | Publication Date |
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CN215420213U true CN215420213U (en) | 2022-01-04 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202121747817.7U Active CN215420213U (en) | 2021-07-29 | 2021-07-29 | Adopt high rigidity glass encapsulation crystal oscillator |
Country Status (1)
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CN (1) | CN215420213U (en) |
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2021
- 2021-07-29 CN CN202121747817.7U patent/CN215420213U/en active Active
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