CN215418153U

CN215418153U - Dustproof integrated circuit chip

Info

Publication number: CN215418153U
Application number: CN202121660516.0U
Authority: CN
Inventors: 刘刚; 周黄金; 范旭
Original assignee: Milstar Shenzhen Information Technology Co ltd
Current assignee: Milstar Shenzhen Information Technology Co ltd
Priority date: 2021-07-20
Filing date: 2021-07-20
Publication date: 2022-01-04
Anticipated expiration: 2031-07-20

Abstract

The utility model discloses a dustproof integrated circuit chip, and relates to the technical field of circuit chips. Including the chip board, the top of chip board is provided with the bed course, the top of bed course is provided with dustproof mechanism, dustproof mechanism's inside is provided with the dust screen, dustproof mechanism's outer wall is provided with linking frame, the mounting groove has been seted up to linking frame's inner wall. Through setting up connection frame, make it cross the mounting groove and effectively connect the installation to the dust screen, and fix it through the spring fastener, and then the effect through fixing bolt, install dustproof mechanism respectively and set up top and bottom at the chip board, so that to the chip board carry out two-sided dustproof, the effect through bed course and spring cushion simultaneously, lifting dustproof mechanism and chip inter-plate space height, for the use of heat dissipation baffle, reserve and establish the heat dissipation space, and then strengthen its radiating effect, and convenient device's installation is used, promote its practicality.

Description

Dustproof integrated circuit chip

Technical Field

The utility model relates to the technical field of circuit chips, in particular to a dustproof integrated circuit chip.

Background

The integrated circuit chip is an electronic element comprising a silicon substrate, at least one circuit, a fixed seal ring, a grounding ring and at least one protective ring.

The electronic component of the present integrated circuit chip is exposed outside, thereby leading to the dust to pile up on its surface easily, thereby causing electronic component's damage easily, current integrated circuit chip is in long-time use simultaneously, and its radiating effect is relatively poor, leads to its thermal wear great, and life is shorter, and the last complicated structure setting of circuit chip leads to its dustproof effect mechanism installation comparatively inconvenient, for this reason, but provides a dustproof integrated circuit chip and solves above-mentioned problem.

SUMMERY OF THE UTILITY MODEL

The utility model provides a dustproof integrated circuit chip, which has the advantages of dust prevention, good heat dissipation effect and convenience in installation, and solves the problems that a common circuit chip does not have the advantages of dust prevention, good heat dissipation effect and convenience in installation.

In order to achieve the purposes of dust prevention, good heat dissipation effect and convenient installation, the utility model provides the following technical scheme: a dustproof integrated circuit chip comprises a chip board, wherein a cushion layer is arranged on the top of the chip board, a dustproof mechanism is arranged on the top of the cushion layer, and a dustproof net is arranged in the dustproof mechanism;

the outer wall of the dustproof mechanism is provided with a connecting frame, the inner wall of the connecting frame is provided with a mounting groove, a spring fastener is arranged inside the connecting end of the connecting frame, a connecting clamping groove is formed in the connecting end of the connecting frame, and a fixing bolt is arranged inside the connecting frame.

As a preferred technical scheme of the utility model, a chip main board is arranged inside the chip board, a heat dissipation guide plate is arranged at the top of the chip main board, and a spring cushion block is arranged at the top of the chip board.

As a preferred technical scheme of the utility model, the number of the dustproof mechanisms is two, the two dustproof mechanisms are respectively arranged at the top and the bottom of the chip board, and the two dustproof mechanisms are movably connected with the chip board through fixing bolts.

As a preferred technical scheme of the utility model, the shape and the size of the spring clamping piece are matched with those of the connecting clamping groove, and the spring clamping piece is movably clamped with the connecting clamping groove.

As a preferable technical scheme of the utility model, the shape and size of the installation groove are matched with those of the dustproof net, and the dustproof net is clamped and arranged in the connecting frame through the installation groove.

As a preferred technical solution of the present invention, the fixing bolt penetrates through the inside of the top dust-proof mechanism and the inside of the chip board, and extends to the inside of the bottom dust-proof mechanism, and the top dust-proof mechanism, the chip board and the bottom dust-proof mechanism are movably stacked on the outer wall of the fixing bolt.

Compared with the prior art, the utility model provides a dustproof integrated circuit chip, which has the following beneficial effects:

1. this can dirt-proof integrated circuit chip, through setting up linking frame, make it cross the mounting groove and effectively connect the installation to the dust screen, and fix it through the spring fastener, and then the effect through fixing bolt, install the dustproof mechanism respectively and set up top and bottom at the chip board, so that to the chip board carry out two-sided dustproof, simultaneously through the effect of bed course and spring cushion, the interval height between lifting dustproof mechanism and the chip board, for the use of heat dissipation baffle, reserve and establish the heat dissipation space, and then strengthen its radiating effect, and the installation of convenient device is used, promote its practicality.

2. This but dirt-proof integrated circuit chip, through setting up the mounting groove, make it effectively carry out the joint installation to the dust screen, and through spring fastener and connecting slot's effect, set up the dust screen joint in connecting frame's inside, ensure the stability of its use, and then effectively install dustproof mechanism in the outside of chip board through fixing bolt, carry out dustproof effect to it, promote its durability, and the device structure sets up simply, the simple operation, make things convenient for user of service's installation and use, and then strengthen its availability, improve its usability.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a front cross-sectional view of the present invention;

FIG. 3 is a schematic view of the connecting frame structure of the present invention;

fig. 4 is an enlarged schematic view of a portion a in fig. 2 according to the present invention.

In the figure: 1. a chip board; 101. a heat dissipation guide plate; 102. a spring cushion block; 103. a chip main board; 2. a cushion layer; 3. a dust-proof mechanism; 301. a connecting frame; 302. mounting grooves; 303. a spring clip; 304. a connecting clamping groove; 305. fixing the bolt; 4. a dust screen.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-4, the utility model discloses a dustproof integrated circuit chip, which comprises a chip board 1, wherein a cushion layer 2 is arranged on the top of the chip board 1, a dustproof mechanism 3 is arranged on the top of the cushion layer 2, and a dustproof net 4 is arranged inside the dustproof mechanism 3.

The outer wall of dustproof mechanism 3 is provided with connecting frame 301, mounting groove 302 has been seted up to connecting frame 301's inner wall, the inside spring fastener 303 that is provided with of link of connecting frame 301, connecting slot 304 has been seted up to connecting frame 301's link, the inside of connecting frame 301 is provided with fixing bolt 305.

Specifically, a chip main board 103 is arranged inside the chip board 1, a heat dissipation guide plate 101 is arranged at the top of the chip main board 103, and a spring cushion block 102 is arranged at the top of the chip board 1.

In this embodiment, the chip main board 103 is provided with a heat dissipation space for the use of the heat dissipation guide plate 101 by the spacing height between the lifting dustproof mechanism 3 and the chip board 1 under the action of the spring cushion block 102, so that the heat dissipation effect is enhanced, and the durability is improved.

Specifically, the number of the dustproof mechanisms 3 is two, the two dustproof mechanisms 3 are respectively arranged at the top and the bottom of the chip board 1, and the two dustproof mechanisms 3 are movably connected with the chip board 1 through fixing bolts 305.

In this embodiment for the device effectively carries out two-sided dustproof effect to chip board 1 through the dustproof mechanism 3 that sets up at the top of chip board 1 and bottom, promotes its dustproof effect, strengthens its usability.

Specifically, the shape and size of the spring clip 303 are matched with the shape and size of the connecting slot 304, and the spring clip 303 is movably clamped with the connecting slot 304.

In this embodiment, make connecting frame 301, effectively through spring fastener 303 and connecting slot 304's activity joint, carry out the equipment connection to carry out spacing fixed to the dust screen 4 that its inside set up, and then ensure its stability of using.

Specifically, the shape and size of mounting groove 302 matches each other with the shape and size of dust screen 4, dust screen 4 passes through mounting groove 302 joint and sets up the inside at linking frame 301.

In this embodiment, the installation and use of the convenient dust screen 4 save the installation time and reduce the installation cost investment.

Specifically, the fixing bolt 305 penetrates through the inside of the top dust-proof mechanism 3 and the inside of the chip board 1 and extends to the inside of the bottom dust-proof mechanism 3, and the top dust-proof mechanism 3, the chip board 1 and the bottom dust-proof mechanism 3 are movably stacked on the outer wall of the fixing bolt 305.

In this embodiment for the device is when using, connects the equipment through fixing bolt 305 to dustproof mechanism 3 and chip board 1, and convenient its dismantlement is conveniently maintained the inspection and is changed it, and then ensures the stability of its use.

The working principle and the using process of the utility model are as follows: when using, through linking frame 301, make it cross mounting groove 302 and effectively connect the installation to dust screen 4, and fix it through spring fastener 303, and then the effect through fixing bolt 305, install dustproof mechanism 3 respectively and set up top and bottom at chip board 1, so as to two-sided dustproof the carrying on of chip board 1, simultaneously through bed course 2 and spring cushion 102's effect, lifting dustproof mechanism 3 and the interval height between chip board 1, for the use of heat dissipation baffle 101, reserve and establish the heat dissipation space, and then strengthen its radiating effect, and the installation of convenient device is used, accomplish the operation to the device through the aforesaid.

To sum up, this but dirt-proof integrated circuit chip, through setting up mounting groove 302, make it effectively carry out the joint installation to dust screen 4, and through spring fastener 303 and connecting slot 304's effect, set up the inside at linking frame 301 with dust screen 4 joint, ensure its stability of using, and then effectively install dustproof mechanism 3 in chip board 1's outside through fixing bolt 305, carry out dustproof effect to it, promote its durability, and the device structure sets up simply, and the operation is convenient, make things convenient for user of service's installation and use, and then strengthen its availability factor, improve its usability.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A dustproof integrated circuit chip comprises a chip board (1), and is characterized in that: the top of the chip board (1) is provided with a cushion layer (2), the top of the cushion layer (2) is provided with a dustproof mechanism (3), and a dustproof net (4) is arranged inside the dustproof mechanism (3);

the outer wall of dustproof mechanism (3) is provided with connected frame (301), mounting groove (302) have been seted up to the inner wall of connected frame (301), the inside spring fastener (303) that is provided with of link of connected frame (301), connecting slot (304) have been seted up to the link of connected frame (301), the inside of connected frame (301) is provided with fixing bolt (305).

2. The integrated circuit chip of claim 1, wherein: the chip board is characterized in that a chip main board (103) is arranged inside the chip board (1), a heat dissipation guide plate (101) is arranged at the top of the chip main board (103), and a spring cushion block (102) is arranged at the top of the chip board (1).

3. The integrated circuit chip of claim 1, wherein: the quantity of dustproof mechanism (3) is two, and two dustproof mechanism (3) set up respectively in the top and the bottom of chip board (1), two dustproof mechanism (3) all through fixing bolt (305) and chip board (1) swing joint.

4. The integrated circuit chip of claim 1, wherein: the spring clamping piece (303) is matched with the connecting clamping groove (304) in shape and size, and the spring clamping piece (303) is movably clamped with the connecting clamping groove (304).

5. The integrated circuit chip of claim 1, wherein: the shape and size of mounting groove (302) and the shape and size of dust screen (4) match each other, dust screen (4) set up the inside at linking frame (301) through mounting groove (302) joint.

6. The integrated circuit chip of claim 3, wherein: fixing bolt (305) run through the inside of top dustproof mechanism (3) and the inside of chip board (1) to extend to the inside of bottom dustproof mechanism (3), and top dustproof mechanism (3), chip board (1) and bottom dustproof mechanism (3) activity stack set up the outer wall at fixing bolt (305).