CN215414095U - Intelligent wire clamp - Google Patents
Intelligent wire clamp Download PDFInfo
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- CN215414095U CN215414095U CN202120995362.4U CN202120995362U CN215414095U CN 215414095 U CN215414095 U CN 215414095U CN 202120995362 U CN202120995362 U CN 202120995362U CN 215414095 U CN215414095 U CN 215414095U
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Abstract
The utility model relates to an intelligent wire clamp which comprises an MCU (microprogrammed control unit), a plurality of temperature sampling sensors, a plurality of temperature signal processing circuits, an Internet of things card module, an NB-IoT wireless communication module, a power supply control circuit and a power supply module, the input end of the temperature sampling sensor detects the temperature of the wire clamp connection point, the output end of the temperature sampling sensor is connected with the input end of the temperature signal processing circuit, the output end of the temperature signal processing circuit is connected with the input end of the MCU, the Internet of things card module is connected with the NB-IoT wireless communication module, the NB-IoT wireless communication module is connected with the MCU, the output end of the MCU and the power supply module are respectively connected with the input end of the power supply control circuit, the output end of the power supply control circuit respectively provides working voltage for the temperature sampling sensor and the NB-IoT wireless communication module, and the power supply module provides working voltage for the MCU. The intelligent wire clamp has the advantages of high temperature acquisition precision, low power consumption, quick data transmission and long service life.
Description
Technical Field
The utility model relates to the technical field of power monitoring, in particular to an intelligent wire clamp.
Background
The high voltage transmission and distribution line is actually formed by connecting a section of power transmission line, the fastener plays the connection effect in the junction department, these tie points all have contact resistance generally, along with the rapid increase of urban and rural power consumption, the increase of power consumption is especially when the power consumption peak, the power transmission line often can overload operation, the big bigger pressure drop of electric current that passes through on the power transmission and distribution line is higher, the power of consumption is more, thereby it is higher to generate heat and heat up, the time has long can burn out the power transmission line, this has just developed the electric wire netting power failure accident by contact failure fault. Therefore, the power transmission line joint is required to be subjected to temperature measurement, temperature rise is found in time, alarm processing is carried out in time, and faults and accidents are avoided.
The existing wire clamp has the following defects: 1. the detection precision of the heating temperature of the connection point is not high, and the temperature signal detected by the controller has an error with the actual temperature on the wire clamp, so that a worker can make an error judgment or cause a false alarm; 2. the data transmission module for collecting signals on the wire clamp has the technical problems of high time delay, low transmission rate and high power consumption; 3. the power supply for the module power supply on the wire clamp is not durable and needs to be frequently replaced, which undoubtedly increases the maintenance work and cost.
Disclosure of Invention
In view of this, the utility model aims to provide an intelligent wire clamp with high temperature acquisition precision, low power consumption, low data transmission delay and long service life of a power supply.
In order to achieve the above purpose, the utility model adopts such an intelligent wire clamp, which comprises an MCU, a plurality of temperature sampling sensors, a plurality of temperature signal processing circuits, an Internet of things card module, an NB-IoT wireless communication module, a power supply control circuit and a power supply module, the input end of the temperature sampling sensor detects the temperature of the wire clamp connection point, the output end of the temperature sampling sensor is connected with the input end of the temperature signal processing circuit, the output end of the temperature signal processing circuit is connected with the input end of the MCU, the Internet of things card module is connected with the NB-IoT wireless communication module, the NB-IoT wireless communication module is connected with the MCU, the output end of the MCU and the power supply module are respectively connected with the input end of the power supply control circuit, the output end of the power supply control circuit respectively provides working voltage for the temperature sampling sensor and the NB-IoT wireless communication module, and the power supply module provides working voltage for the MCU.
The intelligent wire clamp is provided with a plurality of temperature sampling sensors to acquire the temperature of each power transmission line connecting point, and the temperature signal processing circuit processes signals output by the temperature sampling sensors to improve the temperature sampling precision; the MCU is used for remotely uploading the received temperature signals to the cloud platform by adopting a narrowband Internet of things technology (NB-IoT technology) based on the NB-IoT wireless communication module, the communication is stable and fast, the mobile terminal and the PC terminal can be conveniently added with an intelligent puncture wire clamp for management, the temperature is automatically pre-warned, the mobile terminal is reminded, a user can find problems in time, and the problem is quickly responded and solved; and set up power control circuit and control the work supply voltage of temperature sampling sensor, NB-IoT wireless communication module, save power module's power consumption, make the power consumption energy consumption reduction on the intelligence fastener to have the life of a longer time, need not frequently to change or maintain.
The utility model discloses it is thermistor J3 to set up to temperature sampling sensor further, temperature signal processing circuit includes resistance R7, electric capacity C9, the high level is connected to thermistor J3's one end, and thermistor J3's output is connecting resistance R7's one end and electric capacity C9's one end respectively, resistance R7's the other end and electric capacity C9's the other end all ground connection, electric capacity C9's one end output temperature signal to MCU's input.
The temperature signal output by the temperature sampling sensor is filtered and interference is shielded by the grounding resistor and the grounding capacitor, so that the temperature sampling precision is further improved.
The utility model is further arranged that the internet of things card module comprises an internet of things card packaging chip U2, a resistor R3, a resistor R4, a resistor R6, a capacitor C1, a capacitor C2, a capacitor C3, a capacitor C4 and an ESD protection diode array U3, the internet of things card packaging chip U2 adopts QFN5 x 6-8 chip, the NB-IoT wireless communication module is BC28JB-02-STD in model, a first pin of the internet of things card packaging chip U2 is connected with one end of the capacitor C4, a third pin of the internet of things card packaging chip U2 is connected with one end of a resistor R6, the other end of the resistor R6 is connected with one end of the capacitor C2, a sixth pin of the internet of things card packaging chip U2 is connected with one end of a resistor R4, the other end of the resistor R4 is connected with one end of the capacitor C3, a seventh pin of the internet of the card packaging chip U3 is connected with one end of the resistor R3, the other end of the capacitor C1, the other end of the capacitor C2 and the other end of the capacitor C3 are all grounded, the other end of the capacitor C4, the eighth pin of the internet of things card packaging chip U2, the other end of the resistor R3, the other end of the resistor R4 and the other end of the resistor R6 are respectively connected with the cathode of the ESD protection diode array U3, the anode of the ESD protection diode array U3 is grounded, and the first pin of the internet of things card packaging chip U2, the eighth pin of the internet of things card packaging chip U2, the other end of the resistor R6, the other end of the resistor R4 and the other end of the resistor R3 are respectively connected with the NB-IoT wireless communication module.
The NB-IoT wireless communication module with the model of BC28JB-02-STD has the advantages of compact structure, multi-band communication and low power consumption, can be connected with a SIM card on an Internet of things card packaging chip, transmits data acquired on a wire clamp to a cloud platform, and can be used for monitoring the real-time temperature on the wire clamp at a PC end or a mobile end.
The utility model discloses a power module is further set up to be lithium cell J7, power control circuit includes electric capacity C22, electric capacity C23, resistance R14, resistance R15, resistance R17, resistance R18, field effect transistor Q1, triode Q2, electric capacity C22 and electric capacity C23 connect in parallel respectively at the both ends of lithium cell J7, the source of field effect transistor Q1 and the one end of resistance R14 are connected respectively to one end of electric capacity C23, the other end of resistance R14 connects the grid of field effect transistor Q14 and the one end of resistance R14 respectively, the other end of resistance R14 connects the collecting electrode of triode Q14, the emitter ground of triode Q14, the output of MCU is connected to one end of resistance R14, the other end of resistance R14 connects the base of triode Q14 and the one end of resistance R14 respectively, the emitter of resistance R14 connects triode Q14, the drain output of field effect transistor Q14 is 3.7V's operating voltage.
The utility model discloses further set up to power control circuit still includes resistance R6, electric capacity C24, electric capacity C25, thyristor U5, 3.7V's operating voltage is connected to resistance R16's one end, and thyristor U5's negative pole and electric capacity C25's one end are connected respectively to resistance R16's the other end, and electric capacity C25's one end is connected to thyristor U5's gate pole, and electric capacity C24's one end connecting resistance R16's one end, electric capacity C24's the other end, thyristor U5's positive pole, electric capacity C25's the other end all ground connection, electric capacity C25's both ends output 2.5V's operating voltage.
The MCU sends a control signal to the power supply control circuit, and the output of 3.7V control working voltage is realized according to the conduction characteristics of the triode Q2 and the field-effect transistor Q1, so that the temperature sampling sensor and the NB-IoT wireless communication module are controlled to be electrified and operated.
The utility model that further sets up to MCU is FM33LC 023N.
Drawings
Fig. 1 is a schematic block diagram of an embodiment of the present invention.
Fig. 2 is a schematic circuit diagram of an internet of things card module according to an embodiment of the present invention.
Fig. 3 is a circuit schematic diagram of an NB-IoT wireless communication module according to an embodiment of the present invention.
Fig. 4 is a schematic circuit diagram of a temperature sampling sensor and a temperature signal processing circuit according to an embodiment of the present invention.
FIG. 5 is a schematic diagram of an MCU circuit according to an embodiment of the present invention.
FIG. 6 is a schematic diagram of a power module and power control circuit according to an embodiment of the utility model.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
As shown in fig. 1-6, the utility model is an intelligent wire clamp, comprising an MCU, three temperature sampling sensors, three temperature signal processing circuits, an internet of things card module, an NB-IoT wireless communication module, a power control circuit, and a power module, wherein the input end of the temperature sampling sensor detects the temperature of a wire clamp connection point, the output end of the temperature sampling sensor is connected to the input end of the temperature signal processing circuit, the output end of the temperature signal processing circuit is connected to the input end of the MCU, the internet of things card module is connected to the NB-IoT wireless communication module, the NB-IoT wireless communication module is connected to the MCU, the output end of the MCU and the power module are respectively connected to the input end of the power control circuit, the output end of the power control circuit respectively provides working voltages for the temperature sampling sensor and the NB-IoT wireless communication module, the power module provides working voltages for the MCU, the model of the MCU is FM33LC 023N.
As shown in fig. 4, taking one of the temperature sampling sensors and the temperature signal processing circuit as an example in the figure for explanation, the temperature sampling sensor is a thermistor J3, the temperature signal processing circuit includes a resistor R7 and a capacitor C9, one end of the thermistor J3 is connected to a high level, an output end of the thermistor J3 is respectively connected to one end of a resistor R7 and one end of a capacitor C9, the other end of the resistor R7 and the other end of the capacitor C9 are both grounded, and one end of the capacitor C9 outputs a temperature signal to an input end of the MCU.
As shown in fig. 2 and 3, the internet of things card module includes an internet of things card packaging chip U2, a resistor R3, a resistor R4, a resistor R6, a capacitor C1, a capacitor C2, a capacitor C3, a capacitor C4, and an ESD protection diode array U3, the internet of things card packaging chip U2 is QFN5 × 6-8 chip, the NB-IoT wireless communication module is BC28JB-02-STD in model, a first pin of the internet of things card packaging chip U2 is connected to one end of the capacitor C4, a third pin of the internet of things card packaging chip U2 is connected to one end of the resistor R6, the other end of the resistor R6 is connected to one end of the capacitor C2, a sixth pin of the internet of things card packaging chip U2 is connected to one end of the resistor R4, the other end of the resistor R4 is connected to one end of the capacitor C3, a seventh pin of the internet of the card packaging chip U3 is connected to one end of the resistor R3, the other end of the capacitor C1, the other end of the capacitor C2 and the other end of the capacitor C3 are all grounded, the other end of the capacitor C4, the eighth pin of the internet of things card packaging chip U2, the other end of the resistor R3, the other end of the resistor R4 and the other end of the resistor R6 are respectively connected with the cathode of the ESD protection diode array U3, the anode of the ESD protection diode array U3 is grounded, and the first pin of the internet of things card packaging chip U2, the eighth pin of the internet of things card packaging chip U2, the other end of the resistor R6, the other end of the resistor R4 and the other end of the resistor R3 are respectively connected with the NB-IoT wireless communication module.
As shown in fig. 6, the power module is a lithium battery J7, the power control circuit includes a capacitor C22, a capacitor C23, a resistor R14, a resistor R15, a resistor R17, a resistor R18, a field-effect transistor Q1, and a transistor Q2, the capacitor C22 and the capacitor C23 are respectively connected in parallel to two ends of the lithium battery J7, one end of the capacitor C23 is respectively connected to a source of the field-effect transistor Q1 and one end of the resistor R14, the other end of the resistor R14 is respectively connected to a gate of the field-effect transistor Q1 and one end of the resistor R15, the other end of the resistor R15 is connected to a collector of the transistor Q2, an emitter of the transistor Q2 is grounded, one end of the resistor R17 is connected to an output terminal of the MCU, the other end of the resistor R17 is respectively connected to a base of the transistor Q2 and one end of the resistor R18, the other end of the resistor R18 is connected to an emitter of the transistor Q2, a drain of the field-effect transistor Q1 outputs a working voltage of 3.7V, and the drain of the field-effect transistor Q1, and the resistor R6 further includes a resistor R6, The circuit comprises a capacitor C24, a capacitor C25 and a thyristor U5, wherein one end of a resistor R16 is connected with a 3.7V working voltage, the other end of the resistor R16 is respectively connected with a cathode of the thyristor U5 and one end of a capacitor C25, a gate of the thyristor U5 is connected with one end of the capacitor C25, one end of a capacitor C24 is connected with one end of the resistor R16, the other end of the capacitor C24, an anode of the thyristor U5 and the other end of the capacitor C25 are grounded, and 2.5V working voltage is output from two ends of the capacitor C25.
According to the embodiment, the intelligent wire clamp is provided with the three temperature sampling sensors to acquire the temperature of each power transmission line connecting point, so that the requirement on the number of the connecting points on the wire clamp is met, and the temperature signal processing circuit is used for processing the signals output by the temperature sampling sensors to improve the temperature sampling precision; the MCU is used for remotely uploading the received temperature signals to the cloud platform by adopting a narrowband Internet of things technology (NB-IoT technology) based on the NB-IoT wireless communication module, the communication is stable and fast, the mobile terminal and the PC terminal can be conveniently added with an intelligent puncture wire clamp for management, the temperature is automatically pre-warned, the mobile terminal is reminded, a user can find problems in time, and the problem is quickly responded and solved; and set up power control circuit and control the work supply voltage of temperature sampling sensor, NB-IoT wireless communication module, save power module's power consumption, make the power consumption energy consumption reduction on the intelligence fastener to have the life of a longer time, need not frequently to change or maintain.
The present invention may be embodied in many other forms without departing from the spirit or essential characteristics thereof, and it should be understood that various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the utility model as defined in the appended claims.
Claims (6)
1. The utility model provides an intelligence fastener which characterized in that: the temperature-sensing wire clamp comprises an MCU, a plurality of temperature sampling sensors, a plurality of temperature signal processing circuits, an Internet of things card module, an NB-IoT wireless communication module, a power supply control circuit and a power supply module, wherein the input end of each temperature sampling sensor is used for detecting the temperature of a wire clamp connection point, the output end of each temperature sampling sensor is connected with the input end of the corresponding temperature signal processing circuit, the output end of each temperature signal processing circuit is connected with the input end of the MCU, the Internet of things card module is connected with the NB-IoT wireless communication module, the NB-IoT wireless communication module is connected with the MCU, the output end of the MCU and the power supply module are respectively connected with the input end of the power supply control circuit, the output end of the power supply control circuit respectively provides working voltage for the temperature sampling sensors and the NB-IoT wireless communication module, and the power supply module provides working voltage for the MCU.
2. The intelligent clamp of claim 1, wherein: the temperature sampling sensor is thermistor J3, temperature signal processing circuit includes resistance R7, electric capacity C9, the high level is connected to thermistor J3's one end, and thermistor J3's output connects resistance R7's one end and electric capacity C9's one end respectively, resistance R7's the other end and electric capacity C9's the other end all ground connection, electric capacity C9's one end output temperature signal to MCU's input.
3. The intelligent clamp of claim 1 or 2, wherein: the internet of things card module comprises an internet of things card packaging chip U2, a resistor R3, a resistor R4, a resistor R6, a capacitor C1, a capacitor C2, a capacitor C3, a capacitor C4 and an ESD protection diode array U3, wherein the internet of things card packaging chip U2 adopts a QFN5 ^ 6-8 chip, the NB-IoT wireless communication module is BC 28-JB-02-STD in model, a first pin of the internet of things card packaging chip U2 is connected with one end of a capacitor C4, a third pin of the internet of things card packaging chip U2 is connected with one end of a resistor R6, the other end of a resistor R6 is connected with one end of a capacitor C2, a sixth pin of the internet of the card packaging chip U2 is connected with one end of a resistor R2, the other end of the resistor R2 is connected with one end of the capacitor C2, and the other end of the capacitor C2 is connected with one end of the capacitor C2, and the seventh pin of the internet of the chip 2, The other end of the capacitor C2 and the other end of the capacitor C3 are grounded, the other end of the capacitor C4, the eighth pin of the internet of things card packaging chip U2, the other end of the resistor R3, the other end of the resistor R4, and the other end of the resistor R6 are respectively connected to the cathode of the ESD protection diode array U3, the anode of the ESD protection diode array U3 is grounded, and the first pin of the internet of things card packaging chip U2, the eighth pin of the internet of things card packaging chip U2, the other end of the resistor R6, the other end of the resistor R4, and the other end of the resistor R3 are respectively connected to the NB-IoT wireless communication module.
4. The intelligent clamp of claim 1 or 2, wherein: the power supply module is a lithium battery J7, the power supply control circuit comprises a capacitor C22, a capacitor C23, a resistor R14, a resistor R15, a resistor R17, a resistor R18, a field-effect tube Q1 and a triode Q2, the capacitor C22 and the capacitor C23 are respectively connected to two ends of the lithium battery J7 in parallel, one end of the capacitor C23 is respectively connected with a source electrode of the field-effect tube Q1 and one end of the resistor R14, the other end of the resistor R14 is respectively connected with a grid electrode of the field-effect tube Q1 and one end of the resistor R15, the other end of the resistor R15 is connected with a collector electrode of the triode Q2, an emitter electrode of the triode Q2 is grounded, one end of the resistor R17 is connected with an output end of the MCU, the other end of the resistor R17 is respectively connected with a base electrode of the triode Q2 and one end of the resistor R18, the other end of the resistor R18 is connected with an emitter electrode of the triode Q2, and a drain electrode of the field-effect tube Q1 outputs a working voltage of 3.7V.
5. The intelligent clamp of claim 4, wherein: the power supply control circuit further comprises a resistor R6, a capacitor C24, a capacitor C25 and a thyristor U5, wherein one end of the resistor R16 is connected with a 3.7V working voltage, the other end of the resistor R16 is respectively connected with the cathode of the thyristor U5 and one end of the capacitor C25, the gate of the thyristor U5 is connected with one end of a capacitor C25, one end of the capacitor C24 is connected with one end of a resistor R16, the other end of the capacitor C24, the anode of the thyristor U5 and the other end of the capacitor C25 are grounded, and 2.5V working voltage is output from two ends of the capacitor C25.
6. The intelligent clamp of claim 1 or 2, wherein: the model of the MCU is FM33LC 023N.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120995362.4U CN215414095U (en) | 2021-05-11 | 2021-05-11 | Intelligent wire clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120995362.4U CN215414095U (en) | 2021-05-11 | 2021-05-11 | Intelligent wire clamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215414095U true CN215414095U (en) | 2022-01-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120995362.4U Active CN215414095U (en) | 2021-05-11 | 2021-05-11 | Intelligent wire clamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215414095U (en) |
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2021
- 2021-05-11 CN CN202120995362.4U patent/CN215414095U/en active Active
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