CN215393136U - Sensor and laser processing device - Google Patents

Sensor and laser processing device Download PDF

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Publication number
CN215393136U
CN215393136U CN202120779390.2U CN202120779390U CN215393136U CN 215393136 U CN215393136 U CN 215393136U CN 202120779390 U CN202120779390 U CN 202120779390U CN 215393136 U CN215393136 U CN 215393136U
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sensor
communicating
laser
section
hole
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肖球
温旺古
封雨鑫
陈焱
高云峰
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Shenzhen Han's Smart Control Technology Co ltd
Han s Laser Technology Industry Group Co Ltd
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Shenzhen Han's Smart Control Technology Co ltd
Han s Laser Technology Industry Group Co Ltd
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Abstract

The utility model discloses a sensor and a laser processing device, wherein the sensor is used for connecting a laser emitter and a laser processing head, the sensor is provided with a through hole, and laser emitted by the laser emitter is transmitted to the laser processing head through the through hole; the sensor is provided with a flow channel, a liquid inlet and a liquid outlet which are communicated with the flow channel, and the flow channel is circumferentially arranged on the outer side of the through hole. The sensor of the technical scheme of the utility model has good heat dissipation effect, and the laser processing device using the sensor has good processing performance.

Description

Sensor and laser processing device
Technical Field
The utility model relates to the technical field of processing equipment, in particular to a sensor and a laser processing device using the sensor.
Background
The laser processing apparatus is widely used because it has various advantages such as high processing efficiency and good molding quality. The laser processing is to use light energy to reach high energy density at a focus after being focused by a lens, and the laser processing is processed by light effect.
The laser processing device is carrying out the laser beam machining in-process, and sensor work can produce the heat, especially carries out high-power testing process at the sensor, can produce a large amount of heats, if the heat can not in time be discharged then can influence the detection effect of sensor, influence the follow-up performance of processing head, lead to the processing quality poor.
Disclosure of Invention
The utility model provides a sensor, which has good heat dissipation effect and good processing performance of a laser processing device using the sensor.
The sensor is used for connecting a laser emitter and a laser processing head and is characterized in that the sensor is provided with a through hole, and laser emitted by the laser emitter is transmitted to the laser processing head through the through hole;
the sensor is provided with a flow channel, a liquid inlet and a liquid outlet which are communicated with the flow channel, and the flow channel is circumferentially arranged on the outer side of the through hole.
Optionally, the sensor has a first mounting portion and a second mounting portion, which are oppositely arranged, the first mounting portion is used for connecting the laser emitter, the second mounting portion is used for connecting the laser processing head, and the through hole penetrates through the first mounting portion and the second mounting portion;
the runner is including locating the first intercommunication section and the second intercommunication section of sensor, first intercommunication section is close to first installation department, the second intercommunication section is close to the second installation department.
Optionally, the number of the first communicating sections is multiple, and the multiple first communicating sections are circumferentially distributed at intervals on the outer side of the through hole;
and/or the second communicating sections are distributed on the outer side of the through hole at intervals along the circumferential direction.
Optionally, the runner is still including locating the third intercommunication section of sensor, the third intercommunication section by first installation department orientation the second installation department direction extends, and the intercommunication first intercommunication section with the second intercommunication section.
Optionally, the sensor includes a main body and a cover, the first mounting portion is disposed on the main body, and the second mounting portion is disposed on the cover;
the end part, deviating from the first installation part, of the main body part is provided with a groove, and the cover body is connected with the main body and encloses the groove to form the second communication section.
Optionally, the sensor further includes a sealing ring annularly disposed outside the groove, and the cover elastically abuts against the sealing ring along the circumferential direction.
Optionally, a forming opening is formed in the outer surface of the sensor, and one end of the first communicating section extends to communicate with the forming opening;
the sensor is also provided with a plugging piece, and the plugging piece is connected with the sensor and plugs the forming opening.
Optionally, the liquid inlet and the liquid outlet are adjacent.
Optionally, the sensor is further provided with a gas channel, and a gas inlet and a gas outlet which are communicated with the gas channel.
The utility model also provides a laser processing device, which comprises a laser emitter, a laser processing head and a sensor;
the sensor is used for connecting the laser emitter and the laser processing head and is characterized in that the sensor is provided with a through hole, and laser emitted by the laser emitter is transmitted to the laser processing head through the through hole;
the sensor is provided with a flow channel, a liquid inlet and a liquid outlet which are communicated with the flow channel, and the flow channel is circumferentially arranged on the outer side of the through hole in a surrounding manner;
the sensor is connected with the laser emitter and the laser processing head.
In the technical scheme of the utility model, laser emitted by the laser emitter is transmitted to the laser processing head through the through hole, the laser processing head utilizes the laser to process a workpiece with the laser, and the sensor detects the laser processing head in the process, so that a large amount of heat can be generated. The sensor is provided with a flow channel and a liquid inlet and a liquid outlet which are communicated with the flow channel. In the coolant liquid lets in the runner from the inlet, the coolant liquid in the runner carries out temperature exchange with the sensor, and the higher sensor of temperature can be with heat transfer to the lower coolant liquid of temperature, and after the coolant liquid absorbed the heat, by the outside of liquid outlet discharge to the sensor to take away the heat of sensor, make the temperature of sensor obtain reducing.
The runner on the sensor encloses the outside of locating the perforating hole along circumference, and the coolant liquid can flow in the outside of perforating hole along the runner at the in-process that cools down to the sensor for the sensor can be comprehensive, even cooling, and the radiating effect is good, makes the working property of sensor improve, detection effect is accurate, and the laser beam machining device of using this sensor processing performance is good.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural view of an embodiment of a laser processing apparatus of the present invention with a laser processing head mounted thereon;
FIG. 2 is a schematic view of the sensor and laser processing head of FIG. 1 from another perspective;
FIG. 3 is a schematic diagram of the sensor of FIG. 2;
FIG. 4 is a schematic diagram of the sensor of FIG. 3 after the body and cover have exploded;
FIG. 5 is a schematic diagram of the body of the sensor of FIG. 4 showing the flow path;
FIG. 6 is a cross-sectional view of FIG. 4 taken along the first communication segment;
FIG. 7 is a schematic diagram of the body of the sensor of FIG. 4 showing the gas passages;
fig. 8 is an enlarged view of fig. 7 at a.
The reference numbers illustrate:
Figure BDA0003022357340000031
Figure BDA0003022357340000041
the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
As shown in fig. 1, the present invention provides a sensor 100 and a laser processing apparatus using the sensor 100, where the sensor 100 is mainly used for detecting a laser processing head of the laser processing apparatus and sending a detection result to a corresponding adjusting apparatus, and the adjusting apparatus adjusts the laser processing head according to the obtained detection result.
Referring to fig. 1 and 2, the sensor 100 may be a capacitance sensor, and the laser processing apparatus may be a laser cutter. The laser cutting machine includes a laser cutting head, a nozzle 202 and the sensor 100. The sensor 100 can detect the distance between the nozzle 202 and the workpiece, convert the change of the distance into a capacitance signal, amplify the capacitance signal by an amplification plate, and transmit the capacitance signal to a signal connector (which may be a TNC signal connector), wherein the signal connector is connected with an external adjusting device, and the adjusting device is connected to the laser processing head and adjusts the laser processing head according to the acquired signal.
With further reference to fig. 3, the sensor 100 according to an embodiment of the present invention is used to connect a laser emitter (not shown) and a laser processing head 200, the sensor 100 has a through hole 70, laser emitted from the laser emitter is transmitted to the laser processing head 200 through the through hole 70, the laser processing head 200 performs laser processing on a workpiece by using laser, and in the process, the sensor 100 detects the laser processing head 200, and a large amount of heat is generated.
Referring to fig. 4 and 5, the sensor 100 has a flow channel 50, and a liquid inlet 54 and a liquid outlet 55 communicating with the flow channel 50. Let in the runner 50 with the coolant liquid from inlet 54 in, the coolant liquid in the runner 50 carries out temperature exchange with sensor 100, and the higher sensor 100 of temperature can be with heat transfer to the lower coolant liquid of temperature, and the coolant liquid absorbs the heat back, is discharged to the outside of sensor 100 by liquid outlet 55 to take away the heat of sensor 100, make the temperature of sensor 100 obtain reducing.
The flow channel 50 on the sensor 100 is circumferentially arranged outside the through hole 70 in a surrounding manner, and the cooling liquid can flow along the flow channel 50 outside the through hole 70 in the process of cooling the sensor 100, so that the sensor 100 can be cooled comprehensively and uniformly, the heat dissipation effect is good, the working performance of the sensor 100 is improved, the detection effect is accurate, and the laser processing device using the sensor 100 has good processing performance.
The flow channel 50 of the technical scheme of the utility model can be arranged on the outer side of the through hole along the circumferential direction in different modes, specifically can be arranged in a spiral shape, can also be arranged in a ring shape, can also be arranged in a multi-section shape, and can be adaptively selected according to the actual processing difficulty.
Referring to fig. 4, in the embodiment of the present invention, the sensor 100 may have a first mounting portion 11 and a second mounting portion 31 disposed opposite to each other, the first mounting portion 11 is used for connecting the laser emitter, the second mounting portion 31 is used for connecting the laser processing head 200, and the through hole 70 penetrates through the first mounting portion 11 and the second mounting portion 31.
After the sensor 100 is connected to the laser emitter and the laser processing head 200, the through hole 70 can be opposite to the laser emitting part of the laser emitter, and the laser emitted by the laser emitter at the emitting part is transmitted to the laser processing head 200 through the through hole 70. The laser processing head 200 may be provided with a processing hole 201, the processing hole 201 is communicated with the through hole 70, and the laser emitted by the laser emitter passes through the through hole 70 and the processing hole 201 in sequence and then irradiates on the workpiece to perform laser processing on the workpiece. This processing hole 201 can also be used for communicateing gaseous emitter, and the gaseous emission that gas generator produced is erupted through processing hole 201 for carry out gas impact to the processing position of work piece, to erode the processing waste material.
With further reference to fig. 5 and 6, the flow passage 50 includes a first communicating section 51 and a second communicating section 52 provided to the sensor 100, the first communicating section 51 being adjacent to the first mounting portion 11, and the second communicating section 52 being adjacent to the second mounting portion 31. In this embodiment, the cooling liquid in the flow channel 50 can flow through the first communicating section 51 adjacent to the first mounting portion 11 and the second communicating section 52 adjacent to the second mounting portion 31, so as to cool the sensor 100 more comprehensively and uniformly, and thus the heat dissipation effect of the sensor 100 is more comprehensive.
The first communicating section 51 and the second communicating section 52 may be separate flow passages 50 that are not communicated with each other, that is, the sensor 100 may be provided with a liquid inlet 54 and a liquid outlet 55 that are communicated with only the first communicating section 51, and further provided with a liquid inlet 54 and a liquid outlet 55 that are communicated with only the second communicating section 52.
The first communicating section 51 and the second communicating section 52 may be the flow passage 50 communicating with each other, and in this embodiment, the flow passage 50 may further include a third communicating section 53 provided in the sensor 100, and the third communicating section 53 extends from the first mounting portion 11 toward the second mounting portion 31 and communicates the first communicating section 51 and the second communicating section 52. The coolant can pass through the first communicating section 51, the second communicating section 52 and the third communicating section 53 to dissipate heat of different parts of the sensor 100, so that the heat dissipation efficiency of the sensor 100 is further ensured, and the sensing effect of the sensor 100 is good.
The flow passage 50 may be variously formed by combining the first communication section 51, the second communication section 52 and the third communication section 53.
When the first communicating section 51 and the second communicating section 52 are both one, the third communicating section 53 may also be one, and the structure of the flow passage 50 may be: the liquid inlet 54 is directly communicated with the first communicating section 51, the liquid outlet 55 is directly communicated with the second communicating section 52, and the cooling liquid entering the flow channel 50 from the liquid inlet 54 flows through the first communicating section 51, the third communicating section 53 and the second communicating section 52 in sequence and then is discharged out of the sensor 100 through the liquid outlet 55. In this embodiment, the first communicating section 51 and the second communicating section 52 may be both arc-shaped structures or straight structures, and the positions of the liquid inlet 54 and the liquid outlet 55 of this embodiment may be interchanged, that is, the liquid inlet 54 may be directly communicated with the second communicating section 52, the liquid outlet 55 may be directly communicated with the first communicating section 51, and the cooling liquid is discharged to the outside of the sensor 100 through the liquid outlet 55 after sequentially flowing through the second communicating section 52, the third communicating section 53, and the first communicating section 51.
When there are two first communicating sections 51 and one second communicating section 52, there may be two third communicating sections 53, and the structure of the flow passage 50 may be: the liquid inlet 54 and the liquid outlet 55 are respectively communicated with one end of the two first communicating sections 51, the other ends of the two first communicating sections 51 are respectively communicated with two ends of the second communicating section 52 through the two third communicating sections 53, the cooling liquid entering the flow channel 50 from the liquid inlet 54 flows into one end of the second communicating section 52 through the first communicating section 51 and the third communicating section 53, and is discharged to the outside of the sensor 100 from the liquid outlet 55 after flowing out to the other third communicating section 53 and the other first communicating section 51 from the other end of the second communicating section 52. In this embodiment, the first communicating section 51 and the second communicating section 52 may be both arc-shaped structures and also straight structures, and the structures of the first communicating section 51 and the second communicating section 52 may be interchanged, that is, the first communicating section 51 is one, when the second communicating section 52 is two, the third communicating section 53 may be two, and the structure of the flow channel 50 may be: the liquid inlet 54 and the liquid outlet 55 are respectively communicated with one end of the two second communicating sections 52, the other ends of the two second communicating sections 52 are respectively communicated with two ends of the first communicating section 51 through the two third communicating sections 53, the cooling liquid entering the flow channel 50 from the liquid inlet 54 flows into one end of the first communicating section 51 through the one second communicating section 52 and the one third communicating section 53, and is discharged to the outside of the sensor 100 from the liquid outlet 55 after flowing out to the other third communicating section 53 and the other second communicating section 52 from the other end of the first communicating section 51.
It can be understood that, in the above embodiment, when the first communicating section 51 is plural, the plural first communicating sections 51 are distributed at intervals along the circumferential direction outside the through hole 70;
and/or, when there are a plurality of second communication sections 52, the plurality of second communication sections 52 are circumferentially distributed at intervals outside the through hole 70.
The first communicating section 51 and the second communicating section 52 may be separate flow passages 50 that are not communicated with each other, or may be communicated with each other through a third communicating section 53. When the first and second communicating sections 51 and 52 are communicated with each other through the third communicating section 53, the number of the third communicating section 53 may be determined according to the number of the first and second communicating sections 51 and 52. This scheme can prolong 50 whole lengths of runner, makes the coolant liquid prolong with sensor 100 heat transfer time, can fully carry out the heat transfer with sensor 100, takes away the heat of sensor 100 more effectively.
In an embodiment of the present invention, the first mounting portion 11 may have a first mounting surface facing the laser emitter, and the extending direction of the first connecting section 51 is parallel to the first mounting surface. The second mounting portion 31 may have a second mounting surface facing the laser-processed portion, and the extending direction of the second communicating portion 52 may be parallel to the second mounting surface. The flow channels 50 are distributed more regularly and uniformly, and the heat dissipation effect on the sensor 100 is more sufficient.
In the embodiment shown in fig. 4 and 5, there are three first communicating sections 51, four second communicating sections 52, and eight third communicating sections 53, wherein each of the six third communicating sections 53 is used to communicate the first communicating section 51 with the second communicating section 52, and the other two third communicating sections 53 are used to communicate a second communicating section 52 with the liquid inlet 54 and a second communicating section 52 with the liquid outlet 55. Specifically, the three first communicating sections 51 are sequentially arranged at intervals along the circumferential direction outside the through hole 70 and adjacent to the first mounting portion 11; the four second communicating sections 52 are sequentially arranged at intervals along the circumferential direction outside the through hole 70 and adjacent to the second mounting portion 31. The two ends of the first communicating section 51 are respectively communicated with the two second communicating sections 52 through a third communicating section 53, and the arrows in the flow channel 50 in fig. 5 show the flowing direction of the cooling liquid introduced into the cooling liquid port.
It is understood that, besides the arrangement manner of the above-mentioned embodiments, the number of the first communicating sections 51 and the second communicating sections 52 may be smaller or larger, and the number of the third communicating sections 53 is determined according to the number of the first communicating sections 51 and the second communicating sections 52, and is within the protection scope of the present invention.
In an embodiment of the present invention, the sensor 100 may include a main body 10 and a cover 30, wherein the first mounting portion 11 is disposed on the main body 10, and the second mounting portion 31 is disposed on the cover 30; the main body 10 is connected to the cover 30 and jointly encloses a second communicating section 52. In this embodiment, the second communicating section 52 is formed by enclosing the main body 10 and the cover body 30 together, so that the processing and forming operations of the second communicating section 52 are more convenient, a groove can be directly formed on the main body 10 or directly formed on the cover body 30, or grooves can be formed on the main body 10 and the cover body 30 at corresponding positions, and the grooves are enclosed to form the second communicating section 52 by connecting the main body 10 and the cover body 30. Specifically, as shown in fig. 4, a groove 13 is formed in an end portion of the main body 10 away from the first mounting portion 11, the cover 30 is connected to the main body 10, and the groove 13 is surrounded by the cover 30 to form a second communicating section 52, so as to form the second communicating section 52. With this structure, the third communicating section 53 may be further formed directly on the main body 10, specifically, the groove bottom wall of the groove 13 may be formed with an opening toward the first mounting portion 11.
The sensor 100 further includes a sealing ring 20 disposed around the outer side of the groove 13, and the cover 30 elastically abuts against the sealing ring 20 along the circumferential direction. The seal ring 20 seals the circumferential direction of the groove 13, that is, the circumferential direction of the second communicating portion 52, and prevents the coolant from overflowing from a portion where the main body 10 and the cover 30 are connected.
Specifically, the main body 10 is provided with a sealing groove along the circumferential direction outside the groove 13, and the sealing ring 30 is limited in the sealing groove, which facilitates the installation and positioning of the sealing ring 30.
Because the second installation part 31 is arranged on the cover body 30, the second installation part 31 is used for connecting the laser processing head 200, the laser processing head 200 generates a large amount of heat in the process of processing a workpiece, the heat can be transferred to the cover body 30, and the detection effect of the sensor 100 is affected, the second communication section 52 is formed by the main body 10 and the cover body 30 together in a surrounding manner, so that the contact area between the cover body 30 and the second communication section 52 is large, the cooling liquid flowing through the second communication section 52 can fully dissipate heat and cool the cover body 30, thereby reducing the heat transferred from the laser processing head 200 to the cover body 30, further ensuring that the temperature of the sensor 100 is maintained in a reasonable range, and ensuring that the sensing effect of the sensor 100 is good.
Specifically, the laser processing head 200 includes a nozzle 202 and a ceramic ring, the ceramic ring is connected between the nozzle 202 and the cover 30, a ceramic ring through hole is formed on the ceramic ring, a nozzle through hole is formed on the nozzle 202, the ceramic ring through hole and the nozzle through hole are butted and form a processing hole together, laser emitted by the laser emitter passes through the through hole 70 on the sensor 100 and irradiates the workpiece through the ceramic ring through hole and the nozzle through hole, and heat generated in the process of processing the workpiece by the laser processing device is transferred to the cover 30 and the main body 10 through the nozzle 202 and the ceramic ring. The laser processing head 200 further includes a mounting nut 204, and the mounting nut 204 is sleeved on the outer side of the ceramic ring for connecting the ceramic ring and the cover 30.
In the embodiment of the present invention, one end of the first communicating section 51 penetrates through the outer surface of the sensor 100, which is convenient for the processing and forming of the first communicating section 51, and the first communicating section 51 can be directly formed by drilling a hole from the outer surface of the sensor 100 to the inner side direction of the sensor 100. Specifically, the outer surface of the sensor 100 is provided with a forming opening 15, one end of the first communicating section 51 extends to communicate with the forming opening 15, the hole digging device processes and forms the first communicating section 51 to form the forming opening 15 on the outer surface of the sensor 100, the sensor 100 is further provided with a blocking piece 40, and the blocking piece 40 is connected with the sensor 100 and blocks the forming opening 15. The number of the forming openings 15 is consistent with that of the first communicating sections 51, so that the first communicating sections 51 are convenient to form and good in forming effect. The blocking piece 40 corresponds to the number of the forming openings 15 to seal the first communicating section 51.
In the present embodiment, the inlet 54 and the outlet 55 are adjacent. The structure of the cooling liquid flowing into the flow channel 50 from the liquid inlet 54 and discharging to the outside of the sensor 100 from the liquid outlet 55 enables the flow channel 50 to occupy more space of the sensor 100, and the cooling liquid entering the flow channel 50 from the liquid inlet 54 can stay in the flow channel 50 for a longer time, so as to sufficiently dissipate heat of the sensor 100.
The inlet 54 and the outlet 55 are adjacent to the second mounting portion 31 to facilitate connection of the pipe joints without affecting the machining of the workpiece by the laser machining head 200.
With reference to fig. 7 and 8, the sensor 100 may further be provided with a gas passage 60, and a gas inlet 61 and a gas outlet 63 communicating with the gas passage 60. The gas channel 60 in combination with the flow channel 50 enables a further cooling of the sensor 100. The gas channel 60 may be disposed adjacent to the laser processing head 200, so that the sensor 100 is less affected by the working heat of the sensor 100, and the heat transferred by the laser processing head 200 is less affected, thereby ensuring the detection effect of the sensor 100. The gas inlet 61 may be opened in the main body 10, the gas outlet 63 may be opened in the lid 30 and may further penetrate the laser processing head 200, and the cooling gas enters the gas channel 60 through the gas inlet 61 and is discharged through the gas outlet 63 to cool and cool the laser processing head 200. Specifically, the air outlet 63 is opened in the cover 30 and the mounting nut 204 of the sensor 100, and can transfer heat transferred through the nozzle 202 and the ceramic ring to reduce the temperature rise of the sensor 100, and further protect the sensor 100, so that the detection effect of the sensor 100 is improved.
The utility model also proposes a laser machining device comprising a laser emitter and a laser machining head 200 and a sensor 100. The specific structure of the sensor 100 refers to the above embodiments, and since the laser processing apparatus adopts all technical solutions of all the above embodiments, at least all the beneficial effects brought by the technical solutions of the above embodiments are achieved, and no further description is given here. The sensor 100 is connected to a laser transmitter and a laser processing head 200.
The sensor 100 may be specifically a capacitance sensor, and may detect a distance between the laser processing head 200 and the workpiece, and send a detection result to an external lifting mechanism, the lifting mechanism is connected to the laser processing head 200, and may adjust a height of the laser processing head 200 from the workpiece, and the lifting mechanism adjusts a height of the laser processing head 200 from the workpiece according to the detection result of the sensor 100. According to the technical scheme, the sensor 100 is provided with the flow channel 50, the cooling liquid in the flow channel 50 can cool the sensor 100, so that the sensor 100 is less influenced by self-working heating, the influence of the temperature transmitted by the laser processing head 200 is less, better detection performance can be ensured, the processing effect of a laser processing device using the sensor 100 is better, and the processing precision is higher.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (10)

1. A sensor is used for connecting a laser emitter and a laser processing head and is characterized in that the sensor is provided with a through hole, and laser emitted by the laser emitter is transmitted to the laser processing head through the through hole;
the sensor is provided with a flow channel, a liquid inlet and a liquid outlet which are communicated with the flow channel, and the flow channel is circumferentially arranged on the outer side of the through hole.
2. The sensor of claim 1, wherein the sensor has first and second oppositely disposed mounts, the first mount for connection to the laser emitter and the second mount for connection to the laser processing head, the through-hole passing through the first and second mounts;
the runner is including locating the first intercommunication section and the second intercommunication section of sensor, first intercommunication section is close to first installation department, the second intercommunication section is close to the second installation department.
3. The sensor of claim 2, wherein the first communication section is a plurality of first communication sections, and the plurality of first communication sections are circumferentially distributed at intervals outside the through hole;
and/or the second communicating sections are distributed on the outer side of the through hole at intervals along the circumferential direction.
4. The sensor of claim 2, wherein the flow channel further comprises a third communicating section provided in the sensor, the third communicating section extending from the first mounting portion toward the second mounting portion and communicating the first communicating section with the second communicating section.
5. The sensor of claim 2, wherein the sensor comprises a body and a cover, the first mounting portion being provided on the body and the second mounting portion being provided on the cover;
the end part, deviating from the first installation part, of the main body part is provided with a groove, and the cover body is connected with the main body and encloses the groove to form the second communication section.
6. The sensor of claim 5, further comprising a seal ring disposed around the outside of the groove, wherein the cover resiliently abuts the seal ring in a circumferential direction.
7. The sensor of claim 2, wherein the outer surface of the sensor is provided with a forming opening, and one end of the first communicating section extends to communicate with the forming opening;
the sensor is also provided with a plugging piece, and the plugging piece is connected with the sensor and plugs the forming opening.
8. The sensor of claim 2, wherein the liquid inlet and the liquid outlet are adjacent.
9. The sensor of any one of claims 1 to 8, wherein the sensor is further provided with a gas channel, and a gas inlet and a gas outlet communicating with the gas channel.
10. A laser machining device comprising a laser emitter and a laser machining head, and a sensor as claimed in any one of claims 1 to 9, wherein the sensor connects the laser emitter and the laser machining head.
CN202120779390.2U 2021-04-15 2021-04-15 Sensor and laser processing device Active CN215393136U (en)

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Application Number Priority Date Filing Date Title
CN202120779390.2U CN215393136U (en) 2021-04-15 2021-04-15 Sensor and laser processing device

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Application Number Priority Date Filing Date Title
CN202120779390.2U CN215393136U (en) 2021-04-15 2021-04-15 Sensor and laser processing device

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