CN215390888U - Line laser detection device and silicon wafer detection and sorting equipment - Google Patents
Line laser detection device and silicon wafer detection and sorting equipment Download PDFInfo
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- CN215390888U CN215390888U CN202121007769.8U CN202121007769U CN215390888U CN 215390888 U CN215390888 U CN 215390888U CN 202121007769 U CN202121007769 U CN 202121007769U CN 215390888 U CN215390888 U CN 215390888U
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Abstract
The utility model provides a line laser detection device and silicon wafer detection and sorting equipment, wherein the line laser detection device comprises: the device comprises a substrate, at least two detection units and a calibration mechanism of each detection unit; the detecting element is installed on the base plate, has still seted up on the base plate and has walked the material passageway, and the detecting element includes the relative line laser module that sets up from top to bottom, and the line laser module of relative setting distributes in the both sides of walking the material passageway, and one side of arbitrary detecting element is provided with respective calibration mechanism, and calibration mechanism includes: the calibration piece is located between the line laser modules which are arranged up and down oppositely, and the driving module can drive the calibration piece to move from an initial position to a calibration position. The utility model has at least two detection units, and the calibration mechanism of each detection unit is independently arranged, so that each detection unit can be independently calibrated. In addition, each detecting element can conveniently adjust the installation position according to actual demand, and then be favorable to each detecting element's installation and debugging.
Description
Technical Field
The utility model relates to the technical field of silicon wafer detection and sorting, in particular to a linear laser detection device and silicon wafer detection and sorting equipment.
Background
Silicon wafers are widely used as important industrial raw materials for the production and manufacture of products such as solar cells and circuit boards. Therefore, before the silicon wafer is produced and shipped, the quality of the silicon wafer needs to be strictly controlled so as to ensure the quality of products such as solar cells, circuit boards and the like manufactured by the silicon wafer.
At present, in the process of detecting and sorting silicon wafers, a linear laser module is required to be used for detecting the thickness of the silicon wafers so as to judge whether the thickness of the silicon wafer products meets the corresponding standard. Before line laser detection is carried out, the line laser module is calibrated by using the calibration sheet, the original point position of the detected silicon wafer is positioned, and the detection requirement of the line laser module is further met. However, in the existing device, the calibration sheets of the plurality of line laser modules are calibrated synchronously, so that it is difficult to consider all the line laser modules simultaneously in the calibration process, and further calibration errors are caused. Therefore, it is necessary to provide a further solution to the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a line laser detection device and silicon wafer detection and sorting equipment to overcome the defects in the prior art.
In order to solve the technical problems, the technical scheme of the utility model is as follows:
a line laser inspection device, comprising: the device comprises a substrate, at least two detection units and a calibration mechanism of each detection unit;
the detecting unit is installed on the base plate, a material feeding channel is further formed in the base plate, the detecting unit comprises line laser modules which are oppositely arranged from top to bottom, the line laser modules which are oppositely arranged are distributed on two sides of the material feeding channel, one side of any detecting unit is provided with a respective calibrating mechanism, and the calibrating mechanism comprises: the calibration piece is positioned between the line laser modules which are arranged oppositely up and down, and the driving module can drive the calibration piece to move from an initial position to a calibration position.
As an improvement of the line laser detection device, the line laser module is fixed on a base, the base is provided with fixing holes, the base plate is provided with row holes, and the base is arranged on the base plate through fasteners penetrating through the fixing holes and the row holes.
As an improvement of the line laser detection device, the fixing hole is a waist-shaped hole, and the base is adjustably mounted on the substrate through the waist-shaped hole.
In the line laser detection device according to the present invention, the number of the detection units is three, two of the three detection units are mounted on one side of the substrate, the remaining one is mounted on the other side of the substrate, and one detection unit on the other side is disposed opposite to a region between the two detection units on one side.
As an improvement of the line laser detection device, the calibration mechanism is directly fixed on the substrate and/or fixed on the substrate through a connecting plate perpendicular to the substrate.
As an improvement of the line laser detection device, the driving module is obliquely arranged relative to the detection unit, and the power output end of the driving module extends to the position between the line laser modules which are oppositely arranged up and down and is in transmission connection with the calibration sheet.
As an improvement of the line laser detection device, the driving module is an air cylinder.
In order to solve the technical problems, the technical scheme of the utility model is as follows:
a silicon wafer detecting and sorting device comprises the line laser detecting device.
Compared with the prior art, the utility model has the beneficial effects that: the line laser detection device provided by the utility model is provided with at least two detection units, and the calibration mechanism of each detection unit is independently arranged, so that each detection unit can be independently calibrated, and the technical problem that accurate calibration of each line laser module is difficult to be considered simultaneously in the prior art is solved. In addition, each detecting element can conveniently adjust the installation position according to actual demand, and then be favorable to each detecting element's installation and debugging.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic perspective view of a line laser detection device according to an embodiment of the present invention;
FIG. 2 is a perspective view of the line laser inspection device shown in FIG. 1 from another angle;
fig. 3 is a top view of the line laser inspection device of fig. 2.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 and 2, an embodiment of the present invention provides a line laser inspection apparatus, which includes: a substrate 10, at least two detection units 20, and a calibration mechanism 30 for each detection unit 20.
The detection unit 20 is used for measuring the thickness of the silicon wafer to be detected through the line laser module.
Specifically, the detecting unit 20 is mounted on a substrate 10. The base plate 10 is a vertical plate in practical application, the vertical plate is fixed on the bottom plate, and a reinforcing member is disposed between the bottom plate and the vertical plate. In order to facilitate the silicon wafer conveyed to reach the detection unit 20 for detection, the substrate 10 is further provided with a feeding channel 11, and the feeding channel 11 is designed to be suitable for the silicon wafer conveyed to pass through.
The detecting unit 20 includes line laser modules 21 disposed oppositely, and the line laser modules 21 disposed oppositely are distributed on two sides of the material feeding channel 11. Therefore, when the silicon wafer reaches the position between the upper and lower opposite linear laser modules 21 through the feeding channel 11, the upper and lower linear laser modules 21 can feed back the thickness of the silicon wafer.
In order to facilitate the installation and adjustment of the detection unit 20, the line laser module 21 is fixed on a base 210, the base 210 is provided with a fixing hole 211, the substrate 10 is provided with a row hole 11, and the base 210 is installed on the substrate 10 through a fastener penetrating through the fixing hole 211 and the row hole 11. In this way, by selecting different holes in the row of holes 11, adjustment of the mounting position of the line laser module 21 can be achieved. In addition, each line laser module 21 can be finely adjusted, in this case, the fixing hole 211 is a waist-shaped hole, and the base 210 is adjustably mounted on the substrate 10 through the waist-shaped hole. Thus, the line laser module 21 can be finely adjusted within the length range of the waist-shaped hole, so that the installation and debugging of each detection unit 20 are facilitated.
As shown in fig. 3, in order to meet the requirement of detecting the thickness dimension of the silicon wafer, there are three detecting units 20. At this time, two of the three sensing units 20 are mounted on one side of the substrate 10, the remaining one is mounted on the other side of the substrate 10, and one sensing unit 20 on the other side is disposed opposite to an area between the two sensing units 20 on one side. Therefore, the thickness sizes of the two sides and the middle position of the silicon wafer can be conveniently detected.
As described in the background art, when the line laser module 21 is used for detection, the line laser module 21 needs to detect based on the original position on the silicon wafer. In the prior art, the origin position is located by a calibration sheet, so that the calibration sheet needs to be used for calibration operation before online laser mode detection.
In order to facilitate independent calibration of each detection unit 20 and further overcome the technical problem in the prior art that it is difficult to simultaneously consider accurate calibration of each line laser module 21, a calibration mechanism 30 is disposed on one side of each detection unit 20.
Specifically, the calibration mechanism 30 includes: a calibration sheet 31 and a driving module 32. The calibration sheet 31 is used for positioning an original point position during detection on the silicon wafer, and the calibration sheet 31 is located between the line laser modules 21 which are arranged oppositely up and down. The driving module 32 is used for being in transmission connection with the calibration sheet 31 and can drive the calibration sheet 31 to move, so that the calibration sheet 31 can move from an initial position to a calibration position. In this way, independent calibration of each detection unit 20 can be completed.
Since the calibration process of the calibration sheet 31 belongs to the prior art, the present embodiment will not be described in detail, and the following embodiment exemplifies the installation manner and specific structural form of the calibration mechanism 30.
Further, when the number of the detecting units 20 is three, it is considered that the installation space between the two detecting units 20 on the same side is limited, which is not favorable for the installation of the two calibration mechanisms 30. At this time, the calibration mechanisms 30 of the two detection units 20 on the same side are fixed on the base plate 10 through a connecting plate 33 perpendicular to the base plate 10, so as to avoid the area between the two detection units 20 and avoid the interference when the two calibration mechanisms 30 are installed. For the other detection unit 20, its calibration mechanism 30 is directly fixed on the substrate 10.
In order to facilitate the driving module 32 to be in transmission connection with the calibration sheet 31, the driving module 32 is disposed obliquely relative to the detection unit 20, and a power output end of the driving module extends to a position between the line laser modules 21 disposed oppositely up and down and is in transmission connection with the calibration sheet 31. In one embodiment, the driving module 32 is a pneumatic cylinder. And the driving module 32 does not use the servo driving method to drive the calibration sheet.
Another embodiment of the present invention further provides a silicon wafer detecting and sorting apparatus, which includes the line laser detecting device described in the above embodiment.
In summary, the line laser detection device of the present invention has at least two detection units, and the calibration mechanism of each detection unit is independently disposed, so that each detection unit can be independently calibrated, and the technical problem that it is difficult to simultaneously consider accurate calibration of each line laser module in the prior art is solved. In addition, each detecting element can conveniently adjust the installation position according to actual demand, and then be favorable to each detecting element's installation and debugging.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (8)
1. A line laser detection device, characterized in that, line laser detection device includes: the device comprises a substrate, at least two detection units and a calibration mechanism of each detection unit;
the detecting unit is installed on the base plate, a material feeding channel is further formed in the base plate, the detecting unit comprises line laser modules which are oppositely arranged from top to bottom, the line laser modules which are oppositely arranged are distributed on two sides of the material feeding channel, one side of any detecting unit is provided with a respective calibrating mechanism, and the calibrating mechanism comprises: the calibration piece is positioned between the line laser modules which are arranged oppositely up and down, and the driving module can drive the calibration piece to move from an initial position to a calibration position.
2. The line laser inspection device according to claim 1, wherein the line laser module is fixed to a base, the base has a fixing hole, the substrate has a row of holes, and the base is mounted on the substrate by a fastener passing through the fixing hole and the row of holes.
3. The line laser inspection device according to claim 2, wherein the fixing hole is a slotted hole, and the base is adjustably mounted on the substrate through the slotted hole.
4. The line laser inspection device according to claim 1, wherein the number of the inspection units is three, two of the three inspection units are mounted on one side of the substrate, the remaining one is mounted on the other side of the substrate, and one inspection unit on the other side is disposed opposite to an area between two inspection units on one side.
5. The line laser inspection device according to claim 1 or 4, wherein the calibration mechanism is directly fixed on the base plate and/or fixed on the base plate through a connecting plate perpendicular to the base plate.
6. The line laser inspection device according to claim 5, wherein the driving module is disposed obliquely with respect to the inspection unit, and a power output end of the driving module extends between the line laser modules disposed oppositely and is in transmission connection with the calibration sheet.
7. The line laser inspection device according to claim 1 or 6, wherein the driving module is a cylinder.
8. A silicon wafer detecting and sorting apparatus, characterized in that the silicon wafer detecting and sorting apparatus comprises the line laser detecting device as claimed in any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121007769.8U CN215390888U (en) | 2021-05-12 | 2021-05-12 | Line laser detection device and silicon wafer detection and sorting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121007769.8U CN215390888U (en) | 2021-05-12 | 2021-05-12 | Line laser detection device and silicon wafer detection and sorting equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215390888U true CN215390888U (en) | 2022-01-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121007769.8U Active CN215390888U (en) | 2021-05-12 | 2021-05-12 | Line laser detection device and silicon wafer detection and sorting equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215390888U (en) |
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2021
- 2021-05-12 CN CN202121007769.8U patent/CN215390888U/en active Active
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