CN215390507U - Glue homogenizing device and glue homogenizing machine - Google Patents
Glue homogenizing device and glue homogenizing machine Download PDFInfo
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- CN215390507U CN215390507U CN202120885299.9U CN202120885299U CN215390507U CN 215390507 U CN215390507 U CN 215390507U CN 202120885299 U CN202120885299 U CN 202120885299U CN 215390507 U CN215390507 U CN 215390507U
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- circular guide
- guide rail
- rotating carrier
- roller
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Abstract
The utility model relates to a spin coater and a spin coater, comprising: the circular rotating carrier is used for bearing a workpiece to be glued, and a circular guide rail concentric with the rotating carrier is arranged on the rotating carrier; the driving mechanism drives the rotating carrying platform to rotate; the limiting assembly comprises at least two fixed supporting rods, the supporting ends of the supporting rods are provided with idler wheels matched with the circular guide rail, the idler wheels rotate on the circular guide rail along with the rotation of the rotating carrier platform, and the at least two supporting rods are uniformly distributed on the circular guide rail to form limiting support for the rotating carrier platform. The guide limit for the rotation of the rotating carrier is formed by the matching of the roller and the rotating carrier, so that the shaking amplitude of the rotating carrier during rotation is reduced, and the stable rotation of a wafer workpiece on the rotating carrier is ensured. Therefore, the thickness uniformity of the photoresist coated on the surface of the wafer can be improved, and the quality of the product is improved.
Description
Technical Field
The utility model relates to the field of chip manufacturing, in particular to a glue homogenizing device and a glue homogenizing machine.
Background
In the chip manufacturing process, a film needs to be coated on a cut wafer to improve the oxidation resistance and temperature resistance of the wafer, a photoresist film coated on the surface of the wafer can be photoresist, and the uniformity of the thickness of the photoresist must be ensured during gluing. The uniformity of the thickness of the photoresist is influenced by the characteristics of the photoresist, the ambient temperature and the like, and also influenced by the shaking amplitude of the wafer during the rotary gluing of the wafer, and when the shaking amplitude of the rotation of the wafer is large, the uniformity of the thickness of the photoresist on the surface of the wafer can be seriously influenced.
Therefore, how to improve the uniformity of the photoresist coating on the wafer surface is an urgent problem to be solved.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned deficiencies of the related art, the present application provides a spin coater and a spin coater, which aims to solve the problem of uniformity of photoresist coating on the surface of a wafer.
A glue homogenizing device is characterized by comprising:
the circular rotating carrier is used for bearing a workpiece to be glued, and a circular guide rail concentric with the rotating carrier is arranged on the rotating carrier;
the driving mechanism drives the rotating carrying platform to rotate;
the limiting assembly comprises at least two fixed supporting rods, the supporting ends of the supporting rods are provided with idler wheels matched with the circular guide rail, the idler wheels rotate on the circular guide rail along with the rotation of the rotating carrying platform, and the at least two supporting rods are uniformly distributed on the circular guide rail to form limiting support for the rotating carrying platform.
The glue homogenizing device forms support for the outer circumference of the rotating carrier through the matching between the roller on the supporting rod and the circular guide rail of the rotating carrier, so that the shaking amplitude of the rotating carrier during rotation is reduced, and the stable rotation of a workpiece to be glued, namely a wafer, on the rotating carrier is ensured. Therefore, the uniformity of the thickness of the photoresist coated on the surface of the workpiece to be coated with the glue, namely the wafer, can be improved, and the quality of the product is improved. The roller has the function of reducing friction, so that the limiting of the limiting assembly on the rotation of the rotating carrier can be ensured, and the resistance to the rotation of the rotating carrier can be reduced.
Optionally, the circular guide rail includes a first circular guide rail disposed on the side wall of the rotating stage, and the limiting assembly includes at least two first support rods uniformly distributed on the first circular guide rail. At least two first supporting rods are matched with the first circular guide rail on the side wall of the rotating carrier through the roller wheel to form a support for the outer circumference of the rotating carrier, so that the shaking amplitude of the rotating carrier during rotation is reduced.
Optionally, the circular guide rail includes a second circular guide rail disposed on a surface of the rotating stage away from the workpiece, and the limiting assembly includes at least two second support rods uniformly distributed on the second circular guide rail. At least two second support rods are matched with a second circular guide rail on the side wall of the rotating carrier through rollers, and can also form a support for the outer circumference of the rotating carrier, so that the shaking amplitude of the rotating carrier during rotation is reduced.
Based on the same utility model conception, this application still provides a spin coater, include as above spin coater.
The spin coater can reduce the shaking amplitude of the rotating carrying platform during rotation, ensures the stable rotation of a workpiece to be coated with glue, namely a wafer, on the rotating carrying platform, and improves the uniformity of the thickness of photoresist coated on the surface of the wafer.
Drawings
Fig. 1 is a schematic view of a glue spreading device according to an embodiment of the present invention;
FIG. 2 is an enlarged view A of FIG. 1;
fig. 3 is a schematic view of a position limiting assembly according to an embodiment of the present invention;
FIG. 4 is a schematic view of another stop assembly according to an embodiment of the present invention;
FIG. 5 is another schematic view of the circular guide rail and the roller according to the embodiment of the present invention;
FIG. 6 is an enlarged view B of FIG. 5;
FIG. 7 is another schematic view of a fixing support rod according to an embodiment of the present invention;
FIG. 8 is a schematic view of a spin coater according to another alternative embodiment of the present invention;
FIG. 9 is an enlarged view C of FIG. 8;
FIG. 10 is a cross-sectional view D-D of FIG. 8;
FIG. 11 is a schematic view of a spin coater according to yet another alternative embodiment of the present invention;
description of reference numerals:
1-a rotating carrier, 101-a circular guide rail, 2-a driving mechanism, 3-a limiting component, 301-a first support rod, 302-a first roller, 303-a second support rod, 304-a second roller, 4-a shield and 5-a wafer.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
The thickness uniformity of the photoresist on the surface of the wafer can be influenced by the shaking amplitude of the wafer during the rotation gluing of the wafer, and the thickness uniformity of the photoresist on the surface of the wafer can be seriously influenced when the shaking amplitude of the rotation of the wafer is large.
Based on this, the present application intends to provide a solution to the above technical problem, the details of which will be explained in the following embodiments.
An adhesive spreading device, as shown in fig. 1-6, comprises:
the glue spreading device comprises a circular rotating carrier 1 and a glue spreading device, wherein the circular rotating carrier 1 is used for bearing a workpiece to be glued, and a circular guide rail 101 concentric with the rotating carrier 1 is arranged on the rotating carrier 1; the workpiece can rotate along with the rotating carrier 1, and the workpiece can be a wafer to be coated with photoresist, but is not limited to the wafer, and can also be other parts needing surface gluing processing, such as an optical filter.
The driving mechanism 2 drives the rotating carrier 1 to rotate;
the limiting assembly 3 comprises at least two fixed supporting rods, the supporting ends of the supporting rods are provided with rollers matched with the circular guide rail 101, the rollers rotate on the circular guide rail 101 along with the rotation of the rotating carrier 1, and the at least two supporting rods are uniformly distributed on the circular guide rail 101 to form limiting support for the rotating carrier 1.
Illustratively, the glue homogenizing device further comprises a protective cover 4, the rotary carrier 1 and the driving mechanism 2 are arranged in the protective cover 4, and the support rod is fixed on the side wall of the protective cover 4. The upper end of the protective cover 4 is provided with an opening, so that the workpiece to be glued is conveniently arranged on the rotary carrying platform 1. The protective cover 4 can prevent the glue from being sprayed outwards all around in the rotating process of the rotating carrier 1, thereby avoiding pollution and waste. Alternatively, as shown in fig. 7, the support rod can be fixed on the base station for fixing the glue homogenizing device of the present invention, and the support rod is optionally fixed on the side wall of the shield 4 in this embodiment.
Illustratively, the circular guide 101 includes a first circular guide disposed on a side wall of the rotating stage 1, and the limiting assembly 3 includes at least two first support rods 301 uniformly distributed on the first circular guide. At least two first supporting rods 301 are matched with the first circular guide rail on the side wall of the rotating carrier 1 through the roller wheel to form a support for the outer circumference of the rotating carrier 1, so that the circumferential shaking amplitude of the rotating carrier 1 during rotation is limited, the up-and-down fluctuation amplitude of the rotating carrier 1 can be limited, and the fluctuation of the rotating carrier 1 during rotation is reduced. The rotation of the rotating carrier 1 is well limited, which is beneficial to improving the uniformity of gluing.
In the above embodiment, the first circular guide rail is provided with an annular groove, the support end of the first support rod 301 is provided with the first roller 302, and the first roller 302 is fitted in the annular groove. The first roller 302 is fitted in the annular groove to form a support of the first support rod 301 for the outer circumference of the rotating carrier 1.
Alternatively, the first circular guide rail is provided with an annular flange, the support end of the first support rod 301 is provided with a first roller 302, the first roller 302 is a pulley with a groove on the circumferential wall, and the annular flange is matched in the groove of the pulley. The engagement of said annular flange in the groove of the pulley also forms a support for the outer circumference of the rotating carrier 1 by the first support bar 301. The embodiment adopts the first circular guide rail to arrange the annular groove.
Illustratively, the limiting assembly 3 comprises two, three or four first supporting rods 301 uniformly distributed on the first circular guide rail.
In the above embodiment, the driving mechanism 2 includes a motor and a driving rod, the motor 201 drives the driving rod to rotate through shaft transmission or gear transmission, and the driving rod is vertically connected to the center of the rotating carrier 1. The control of the rotation speed of the rotary stage 1 is facilitated by the motor drive.
When the glue spreading machine is used, the driving mechanism 2 drives the rotating carrying platform 1 to rotate, so that a workpiece to be glued, which is fixed on the rotating carrying platform 1, is driven to rotate, after glue is dripped on the surface of the workpiece to be glued, the glue can be gradually spread on the surface of the workpiece along with the rotation of the workpiece until the surface of the workpiece is uniformly coated with a layer of glue.
The glue homogenizing device forms a support for the outer circumference of the rotating carrier 1 through the matching between the roller on the support rod and the circular guide rail 101 of the rotating carrier 1, so that the shaking amplitude of the rotating carrier 1 during rotation is reduced, and the stable rotation of a workpiece to be glued, namely the wafer 5, on the rotating carrier 1 is ensured. Therefore, the uniformity of the thickness of the photoresist coated on the surface of the workpiece to be coated with the photoresist, namely the wafer 5, can be improved, and the quality of the product is improved. The roller has the function of reducing friction, so that the limiting of the limiting component 3 on the rotation of the rotating carrier 1 can be ensured, and the resistance to the rotation of the rotating carrier 1 can be reduced.
Another alternative embodiment of the present invention, as shown in fig. 8-10, is the same as the above-mentioned embodiment in the rest structure, and is different from the above-mentioned embodiment in that the circular guide 101 includes a second circular guide disposed on a side of the rotating carrier 1 away from the workpiece, and the limiting assembly 3 includes at least two second support rods 303 uniformly distributed on the second circular guide. At least two second support rods 303 are matched with a second circular guide rail on the side wall of the rotating carrier 1 through rollers, and can also form a support for the outer circumference of the rotating carrier 1, so that the shaking amplitude of the rotating carrier 1 during rotation is reduced.
Illustratively, the second circular guide rail is provided with an annular groove, the supporting end of the second supporting rod 303 is provided with a second roller 304, and the second roller 304 is matched in the annular groove. The second roller 304 is fitted in the annular groove to form a support for the outer circumference of the rotating carrier 1 by the second support bar 303.
Or, the second circular guide rail is provided with an annular flange, the support end of the second support rod 303 is provided with a second roller 304, the second roller 304 is a pulley with a groove on the circumferential wall, and the annular flange is matched in the groove of the pulley. The engagement of said annular flange in the groove of the pulley also forms a support for the outer circumference of the turntable 1 by the second support bar 303. The second circular guide rail is adopted in the embodiment to be provided with the annular groove.
In another alternative embodiment of the present invention, as shown in fig. 11, the rest structure is the same as that of the first embodiment, except that the circular guide 101 includes a first circular guide rail disposed on the side wall of the rotating carrier 1, and the limiting assembly 3 includes at least two first supporting rods 301 uniformly distributed on the first circular guide rail. The circular guide rail 101 further includes a second circular guide rail disposed on a surface of the rotary stage 1 away from the workpiece, and the limiting assembly 3 includes at least two second support rods 303 uniformly distributed on the second circular guide rail. Therefore, the limiting component 3 simultaneously limits the side wall of the rotating carrier 1 and one surface far away from the workpiece, and the limiting component 3 can better support the outer circumference of the rotating carrier 1, so that the shaking amplitude of the rotating carrier 1 during rotation can be reduced to a greater extent, and the uniformity of the thickness of the photoresist on the surface of the workpiece to be coated, namely the wafer 5, is improved.
The embodiment also provides a spin coater, which comprises the spin coater, the shaking amplitude of the rotating carrier 1 during rotation can be reduced through the spin coater, so that the smooth rotation of a workpiece to be coated, namely the wafer 5, on the rotating carrier 1 is ensured, and the uniformity of the thickness of the photoresist coated on the surface of the wafer 5 is improved.
It is to be understood that the utility model is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the utility model as defined by the appended claims.
Claims (10)
1. A glue homogenizing device is characterized by comprising:
the glue spreading device comprises a circular rotating carrier (1) and a glue spreading device, wherein the circular rotating carrier (1) is used for bearing a workpiece to be glued, and a circular guide rail (101) concentric with the rotating carrier (1) is arranged on the rotating carrier (1);
the driving mechanism (2), the said driving mechanism (2) drives the said rotation carrying platform (1) to rotate;
the limiting assembly (3) comprises at least two fixed supporting rods, the supporting ends of the supporting rods are provided with rollers matched with the circular guide rail (101), the rollers rotate on the circular guide rail (101) along with the rotation of the rotating carrier (1), and the at least two supporting rods are uniformly distributed on the circular guide rail (101) to form limiting support for the rotating carrier (1).
2. The glue spreading device according to claim 1, further comprising a cover (4), wherein the rotating stage (1) and the driving mechanism (2) are disposed in the cover (4), and the support bar is fixed to a side wall of the cover (4).
3. The glue spreading device according to claim 1, wherein the circular guide rail (101) comprises a first circular guide rail arranged on a side wall of the rotating carrier (1), and the limiting assembly (3) comprises at least two first support rods (301) uniformly distributed on the first circular guide rail.
4. A glue spreading device according to claim 3, wherein the first circular guide rail is provided with an annular groove, the support end of the first support rod (301) is provided with a first roller (302), and the first roller (302) is fitted in the annular groove.
5. A glue spreading device according to claim 3, wherein the first circular guide rail is provided with an annular flange, the support end of the first support rod (301) is provided with a first roller (302), the first roller (302) is a pulley with a groove on the circumferential wall, and the annular flange is fitted in the groove of the pulley.
6. A glue spreading device according to claim 3 wherein the stop assembly (3) comprises two, three or four first support bars (301) evenly distributed on the first circular guide rail.
7. A glue spreading device according to any one of claims 1 to 6, wherein the circular guide (101) comprises a second circular guide arranged on a side of the rotary stage (1) remote from the workpiece, and the limiting assembly (3) comprises at least two second support rods (303) uniformly distributed on the second circular guide.
8. The glue spreading device according to claim 7, wherein the second circular guide rail is provided with an annular groove, the support end of the second support rod (303) is provided with a second roller (304), and the second roller (304) is fitted in the annular groove.
9. The glue spreading device according to claim 7, wherein the second circular guide rail is provided with an annular flange, the support end of the second support rod (303) is provided with a second roller (304), the second roller (304) is a pulley with a groove on the circumferential wall, and the annular flange is fitted in the groove of the pulley.
10. A glue spreader comprising a glue spreading apparatus according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120885299.9U CN215390507U (en) | 2021-04-27 | 2021-04-27 | Glue homogenizing device and glue homogenizing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120885299.9U CN215390507U (en) | 2021-04-27 | 2021-04-27 | Glue homogenizing device and glue homogenizing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215390507U true CN215390507U (en) | 2022-01-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120885299.9U Active CN215390507U (en) | 2021-04-27 | 2021-04-27 | Glue homogenizing device and glue homogenizing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215390507U (en) |
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2021
- 2021-04-27 CN CN202120885299.9U patent/CN215390507U/en active Active
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