CN215383848U - Image sensor data transmission device of 3D endoscope and 3D endoscope - Google Patents
Image sensor data transmission device of 3D endoscope and 3D endoscope Download PDFInfo
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Abstract
The utility model provides an image sensor data transmission device and 3D endoscope of 3D endoscope, 3D endoscope are including setting up first image sensor module and the second image sensor module in the camera to and connect in the data processing system of camera, first image sensor module and second image sensor module are used for converting the light signal who gathers into first electric signal and second electric signal, image sensor data transmission device includes: and the logic chip comprises a logic circuit connected with the first image sensor module and the second image sensor module, and is used for receiving the first electric signal and the second electric signal and outputting corresponding first image data and second image data to the data processing system. The utility model designs the logic circuit by a logic chip with extremely small encapsulation, thereby reducing the occupation of the space in the camera while completing the synchronous transmission of two paths of image data and leading the structural design of the camera to be simpler.
Description
Technical Field
The application relates to the technical field of endoscopes, in particular to an image sensor data transmission device of a 3D endoscope and the 3D endoscope.
Background
The endoscope is a medical electronic optical instrument which can be inserted into human body cavity and internal organ cavity to make direct observation, diagnosis and treatment, and is characterized by that it adopts optical lens with very small size to make optical imaging of intracavity object to be observed by means of miniature objective lens imaging system, then utilizes image-guiding fibre bundle to send the optical imaging to image processing main machine, and finally outputs the observed image after image processing on the display screen for doctor to observe and diagnose.
The conventional endoscope basically has only one image sensor and only completes the processing of the image data output by the image sensor and the 2D image display. However, the 2D image cannot embody scene depth information, cannot sense the specific position of a lesion in diagnosis or surgery, and does not provide a more accurate and realistic visual experience for a doctor in diagnosis or treatment of a patient.
In order to improve the perception of the endoscope to the spatial depth during diagnosis or treatment and provide more accurate and real stereoscopic visual perception, the 3D endoscope is produced and can replace the traditional endoscope. In a 3D endoscope, a binocular image sensor is generally used to acquire image data, and an image transmission module is used to transmit the image data to an image processing system for image processing and image output display over a long distance through a signal cable.
The existing image sensor data transmission generally transmits data of two image sensors independently, or transmits two-way image sensor data through a logic module and a high-speed serial interface extension module, or transmits image sensor data through wireless radio frequency. The transmission methods need to use more chip devices to complete the transmission of the data of the two paths of image sensors, occupy more internal spaces of the cameras, increase power consumption and heat dissipation, and have higher design difficulty.
SUMMERY OF THE UTILITY MODEL
The application provides an image sensor data transmission device of 3D endoscope, when accomplishing double-circuit image sensor data transmission, has reduced camera inner space's among the 3D endoscope occupation.
According to an aspect of the present application, an embodiment provides an image sensor data transmission device of a 3D endoscope, the image sensor data transmission device of the 3D endoscope, the 3D endoscope including a first image sensor module and a second image sensor module disposed within a camera head, and a data processing system connected to the camera head; the first image sensor module is used for collecting optical signals and converting the optical signals into first electric signals; the second image sensor module is used for collecting optical signals and converting the optical signals into second electric signals; wherein the image sensor data transmission device comprises:
the logic chip comprises a logic circuit connected with the first image sensor module and the second image sensor module, and is used for receiving the first electric signal and the second electric signal, outputting first image data corresponding to the first electric signal to the data processing system, and outputting second image data corresponding to the second electric signal to the data processing system; the data processing system is used for receiving the first image data and the second image data, synthesizing the first image data and the second image data, and outputting synthesized image data for 3D display.
In one embodiment, the logic circuit comprises: the image display device comprises a first signal receiving circuit, a second signal receiving circuit, an image pixel alignment circuit, a parallel-to-serial circuit and a data interface circuit;
the image sensor comprises a first signal receiving circuit, a second signal receiving circuit, an image pixel alignment circuit, a parallel-to-serial circuit and a data interface circuit, wherein the first signal receiving circuit is connected with a first image sensor module, the second signal receiving circuit is connected with a second image sensor module, the image pixel alignment circuit is respectively connected with the first signal receiving circuit and the second signal receiving circuit, the parallel-to-serial circuit is connected with the image pixel alignment circuit, and the data interface circuit is connected with the parallel-to-serial circuit;
the first signal receiving circuit is used for receiving a first electric signal and converting the first electric signal into a first parallel signal;
the second signal receiving circuit is used for receiving a second electric signal and converting the second electric signal into a second parallel signal;
the image pixel alignment circuit is used for carrying out pixel alignment processing on the first parallel signals and the second parallel signals and outputting the first parallel signals and the second parallel signals after pixel alignment;
the parallel-to-serial circuit is used for converting the first parallel signals and the second parallel signals after the pixels are aligned into first image data and second image data respectively;
the data interface circuit is used for outputting the first image data and the second image data to a data processing system.
In one embodiment, the first signal receiving circuit includes:
a first interface circuit for receiving a first electrical signal;
and the first parallel conversion circuit is connected to the first interface circuit and is used for converting the first electric signal received by the first interface circuit into a first parallel signal.
In one embodiment, the second signal receiving circuit includes:
a second interface circuit for receiving a second electrical signal;
and the second parallel-to-parallel circuit is connected to the second interface circuit and is used for converting the second electric signal received by the second interface circuit into a second parallel signal.
In an embodiment, the first interface circuit and the second interface circuit are both D-PHY interface circuits, and the first parallel-to-parallel conversion circuit and the second parallel-to-parallel conversion circuit are both MIPI parallel-to-parallel conversion circuits.
In one embodiment, the data interface circuit is an LVDS interface circuit.
In one embodiment, the method further comprises:
and the synchronous circuit is arranged in the camera, connected to the first image sensor module and the second image sensor module, and used for receiving the exposure signal generated by the first image sensor module and outputting a synchronous exposure signal corresponding to the exposure signal to the second image sensor module.
In one embodiment, the method further comprises:
the camera comprises a camera head, a clock circuit, a first image sensor module and a second image sensor module, wherein the clock circuit is arranged in the camera head, connected to the first image sensor module and the second image sensor module and used for outputting a first clock signal and a second clock signal, the first image sensor module converts an optical image formed by return light after irradiating a target object into a first electric signal under the triggering of the first clock signal, and the second image sensor module converts an optical image formed by the return light after irradiating the target object into a second electric signal under the triggering of the second clock signal.
In one embodiment, the method further comprises:
and the power supply circuit is arranged in the camera, connected to the first image sensor module, the second image sensor module and the logic circuit and used for providing power supply voltage signals for the first image sensor module, the second image sensor module and the logic circuit.
According to an aspect of the application, there is provided in one embodiment a 3D endoscope comprising:
the system comprises an optical lens, a camera and a data processing system;
the first image sensor module is arranged in the camera and used for collecting optical signals and converting the optical signals into first electric signals;
the second image sensor module is arranged in the camera and used for collecting optical signals and converting the optical signals into second electric signals;
the image sensor data transmission device according to the above embodiment is used for transmitting the first electrical signal and the second electrical signal to a data processing system.
According to the image sensor data transmission device of the 3D endoscope and the 3D endoscope of the embodiments, the processing and transmission of the first electrical signal output by the first image sensor module and the second electrical signal output by the second image sensor module are realized through the logic circuit which is arranged in the camera and connected to the first image sensor module and the second image sensor module, and the first image data and the second image data are output to the data processing system for processing and displaying the image data. Therefore, the utility model designs the logic circuit by one logic chip with extremely small encapsulation, reduces the occupation of the space in the camera, reduces the power consumption and the heat of the camera and simplifies the structural design of the camera while completing the synchronous transmission of two paths of image data.
Drawings
FIG. 1 is a schematic structural diagram of a 3D endoscope according to an embodiment;
FIG. 2 is a schematic view of a camera structure in a 3D endoscope according to an embodiment;
FIG. 3 is a diagram of a first parallel signal, a second parallel signal, and a first parallel signal and a second parallel signal after pixel alignment;
FIG. 4 is a circuit schematic of a 3D endoscope according to an embodiment.
Detailed Description
The present application will be described in further detail below with reference to the accompanying drawings by way of specific embodiments. Wherein like elements in different embodiments are numbered with like associated elements. In the following description, numerous details are set forth in order to provide a better understanding of the present application. However, those skilled in the art will readily recognize that some of the features may be omitted or replaced with other elements, materials, methods in different instances. In some instances, certain operations related to the present application have not been shown or described in detail in order to avoid obscuring the core of the present application from excessive description, and it is not necessary for those skilled in the art to describe these operations in detail, so that they may be fully understood from the description in the specification and the general knowledge in the art.
Furthermore, the features, operations, or characteristics described in the specification may be combined in any suitable manner to form various embodiments, and the operation steps involved in the embodiments may be interchanged or modified in order as will be apparent to those skilled in the art. Accordingly, the description and drawings are merely for clarity of description of certain embodiments and are not intended to necessarily refer to a required composition and/or order.
The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings).
Referring to fig. 1, fig. 1 is a schematic structural diagram of a 3D endoscope according to an embodiment, where the 3D endoscope includes an optical lens 101, a first image sensor module 102, a second image sensor module 103, an image sensor data transmission device 104, a data processing system 105, and a light source 106.
The light source 106 is used to generate light that illuminates a target object. The light source 106 in this embodiment produces white light suitable for medical endoscope illumination.
The optical lens 101 is an optical path system composed of various optical mirrors, and provides an optical path for light generated by the light source 106 to be directed to a target object, and the light generated by the light source 106 is directed to the target object to form return light, and the optical path system also provides an optical path for the return light, and can guide the return light to a light field range where the first image sensor module 102 and the second image sensor module 103 collect light signals.
The first image sensor module 102 is configured to collect an optical signal and convert the optical signal into a first electrical signal.
The second image sensor module 103 is used for collecting the optical signal and converting the optical signal into a second electrical signal.
The image sensor data transmission device 104 is configured to receive the first electrical signal and the second electrical signal, output first image data corresponding to the first electrical signal to a data processing system, and output second image data corresponding to the second electrical signal to the data processing system.
The data processing system 105 is configured to receive the first image data and the second image data, synthesize the first image data and the second image data, and output synthesized image data for 3D display.
In this embodiment, the 3D endoscope can be electrically divided into a camera and an image processing host, the camera mainly includes an optical lens 101, a first image sensor module 102, a second image sensor module 103, an image sensor data transmission device 104 and a light source 105, the image processing host includes a data processing system 105, the camera and the image processing host are connected by a transmission cable, the camera and the image processing host also perform signal transmission by a signal line in the transmission cable, the camera is used for collecting an electrical signal (pixel data) corresponding to an optical image of a target object in a body cavity, the electrical signal is sent to a monitor through the transmission cable for image processing and display, and a user sends a control command to the optical lens 101, the first image sensor module 102, the second image sensor module 103, the image sensor data transmission device 104 and the light source 106 through the monitor, so as to control the first image sensor module 102 and the second image sensor module 103 to acquire the electric signal corresponding to the optical image of the target object required by the user.
Referring to fig. 2, fig. 2 is a schematic view of a camera structure in a 3D endoscope according to an embodiment, where the camera includes a first image sensor module 102, a second image sensor module 103, and an image sensor data transmission device 104.
The specific implementation of the first image sensor module 102 and the second image sensor module 103 has been described in detail in the above embodiments, and is not described herein again.
The image sensor data transmission device 104 includes a logic chip disposed in the camera, the logic chip includes a logic circuit 201 connected to the first image sensor module 102 and the second image sensor module 103, the logic circuit 201 is configured to receive the first electrical signal and the second electrical signal, output first image data corresponding to the first electrical signal to the data processing system, and output second image data corresponding to the second electrical signal to the data processing system.
The logic chip is a universal integrated circuit, has a very small volume, and has logic functions determined according to the programming of devices in the logic chip by a user, in other words, the user can program a digital system to be integrated on one logic chip. The difference between the logic chip and the general digital chip is that the digital circuit inside the logic chip can be planned and determined after the logic chip leaves the factory, some types of logic chips allow the logic chip to be changed and changed again after the logic chip is planned and determined, and the general digital chip determines the internal circuit before leaving the factory and cannot be changed again after leaving the factory. In the present embodiment, the processing and transmission of the first and second electrical signals may be implemented by an existing logic chip, for example, a Field Programmable Gate Array (FPGA), an erasable programmable logic device EPLD, or the like.
In one embodiment, the logic circuit 201 includes a first signal receiving circuit 2011, a second signal receiving circuit 2012, an image pixel alignment circuit 2013, a parallel-to-serial circuit 2014, and a data interface circuit 2015.
The first signal receiving circuit 2011 is connected to the first image sensor module 102, the second signal receiving circuit 2012 is connected to the second image sensor module 103, the image pixel alignment circuit 2013 is connected to both the first signal receiving circuit 2011 and the second signal receiving circuit 2012, the parallel-to-serial circuit 2014 is connected to the image pixel alignment circuit 2013, and the data interface circuit 2015 is connected to the parallel-to-serial circuit 2014.
The first signal receiving circuit 2011 is configured to receive the first electrical signal and convert the first electrical signal into a first parallel signal.
In the present embodiment, the first signal receiving circuit 2011 includes the first interface circuit 301 and the first parallel-to-parallel circuit 302.
The first interface circuit 301 is configured to receive a first electrical signal output by the first image sensor module 102, and convert a physical level of the first electrical signal into a physical level in a preset format. Since the first electrical signal output by the first image sensor unit 102 is an MIPI signal having a specific physical level protocol and cannot be processed by the FPGA, in this embodiment, the physical level of the MIPI signal output by the first image sensor unit 102 needs to be converted into a physical level in a preset format that can be processed by the FPGA, and thus, the obtained first electrical signal can be processed by the FPGA. The first interface circuit 301 in this embodiment is a D-PHY interface circuit.
The first parallel-to-parallel circuit 302 is connected to the first interface circuit 301, and is configured to convert the first electrical signal converted into the physical level in the preset format into a first parallel signal. In this embodiment, the first parallel-to-parallel circuit 302 converts the first electrical signal converted into the physical level of the preset format into a first parallel signal composed of a vertical signal and a horizontal signal, please refer to fig. 3, where (a) in fig. 3 is a schematic diagram of the first parallel signal. The first parallel-to-parallel circuit in this embodiment is an MIPI parallel-to-parallel circuit.
The second signal receiving circuit 2012 is used for receiving the second electrical signal and converting the second electrical signal into a second parallel signal.
In the present embodiment, the second signal receiving circuit 2012 includes the second circuit 303 and the second parallel circuit 304.
The second interface circuit 303 is configured to receive the second electrical signal output by the second image sensor module 103, and convert a physical level of the second electrical signal into a physical level in a preset format. Since the second electrical signal output by the second image sensor unit 103 is an MIPI signal having a specific physical level protocol and cannot be processed by the FPGA, in this embodiment, the physical level of the MIPI signal output by the second image sensor unit 103 needs to be converted into a physical level in a preset format that can be processed by the FPGA, and thus, the obtained second electrical signal can be processed by the FPGA. The second interface circuit 303 in this embodiment is a D-PHY interface circuit.
The second parallel-to-parallel circuit 304 is connected to the second interface circuit 303, and is configured to convert the second electrical signal converted into the physical level in the preset format into a second parallel signal. In this embodiment, the second parallel-to-parallel circuit 304 converts the second electrical signal converted into the physical level with the preset format into a second parallel signal composed of a vertical signal and a horizontal signal, please refer to fig. 3, and fig. 3 (b) is a schematic diagram of the second parallel signal. The second parallel-to-parallel circuit in this embodiment is an MIPI parallel-to-parallel circuit.
The image pixel alignment circuit 2013 is configured to perform pixel alignment processing on the first parallel signal and the second parallel signal, and output the pixel-aligned first parallel signal and second parallel signal.
In this embodiment, the first parallel signal and the second parallel signal are pixel-aligned by a fixed time delay, so that the first parallel signal and the second parallel signal share one clock signal and one vertical signal and one horizontal signal, please refer to fig. 3, where (c) in fig. 3 is a schematic diagram of the pixel-aligned first parallel signal and second parallel signal.
The parallel-to-serial circuit 2014 is used for converting the pixel-aligned first parallel signal and the pixel-aligned second parallel signal into first image data and second image data, respectively.
And after the first parallel signal and the second parallel signal are aligned in pixel, converting the first parallel signal and the second parallel signal into serial data to obtain first image data and second image data.
The data interface circuit 2015 is configured to output the first image data and the second image data to the data processing system. The present embodiment transfers the first image data and the second image data to the data processing system through the data interface circuit 2015 for the synthesis processing of the image data and the display output of the 3D format synthesized image data. The data interface circuit 2015 in this embodiment adopts a high-speed LVDS interface circuit.
In order to enable the first image sensor module 102 and the second image sensor module 103 to simultaneously expose and convert the optical signal into the electrical signal, the image sensor data transmission device provided in this embodiment further includes a synchronization circuit 202, the synchronization circuit 202 is disposed in the camera and connected to the first image sensor module 102 and the second image sensor module 103, the synchronization circuit 202 is configured to receive the exposure signal generated by the first image sensor module and output a synchronization exposure signal corresponding to the exposure signal to the second image sensor module, and the second image sensor module can simultaneously expose and convert the optical signal into the electrical signal with the first image sensor module under the trigger of the synchronization exposure signal.
The image sensor data transmission device provided by this embodiment further includes a clock circuit 203, the clock circuit 203 is disposed in the camera and connected to the first image sensor module 102 and the second image sensor module 103, the clock circuit 203 is configured to output a first clock signal and a second clock signal, the first image sensor module 102 converts an optical image formed by the return light after the light irradiates the target object into a first electrical signal under the trigger of the first clock signal, and the second image sensor module 103 converts an optical image formed by the return light after the light irradiates the target object into a second electrical signal under the trigger of the second clock signal.
The image sensor data transmission device provided by this embodiment further includes a power supply circuit 204, where the power supply circuit 204 is disposed in the camera and connected to the first image sensor module 102, the second image sensor module 103, and the logic circuit 201, and is configured to provide a power supply voltage signal to the first image sensor module 102, the second image sensor module 103, and the logic circuit 201.
Referring to fig. 4, fig. 4 is a schematic circuit diagram of a 3D endoscope according to an embodiment, where the 3D endoscope includes an optical lens, a camera and a data processing system, where the camera includes a first image sensor module, a second image sensor module and an image sensor data transmission device, and specific embodiments of the first image sensor module, the second image sensor module and the image sensor data transmission device have been described in detail in the above embodiments, and are not repeated herein.
The data processing system comprises a cable interface, an FPGA image processor and an image output module, wherein the cable interface is used for receiving two-way image data (first image data and second image data) output by the camera, the FPGA image processor is used for carrying out image processing on the two-way image data and outputting synthesized image data to the image output module, and the image output module is used for converting the synthesized image data into a plurality of different formats and then outputting and displaying the synthesized image data.
In an embodiment, the FPGA image processor sequentially includes an LVDS to LVCM OS interface circuit, a serial to parallel circuit, a black level correction circuit, a shading correction circuit, an image data noise reduction circuit, an image black and white balance circuit, a bilinear difference distortion correction circuit, an RGB color difference circuit, a color/saturation correction circuit, a two-way image feature extraction circuit, a two-way image stereo fusion circuit, and an image output interface according to a transmission path of image data. It should be noted that each circuit in the FPGA image processor is a circuit in an FPGA image processor in an existing endoscope, and is not explained in detail here.
In one embodiment, the image output module includes a 3G-SDI interface circuit, a VGA interface circuit, a DVI interface circuit, and an HDMI interface circuit.
The present invention has been described in terms of specific examples, which are provided to aid understanding of the utility model and are not intended to be limiting. For a person skilled in the art to which the utility model pertains, several simple deductions, modifications or substitutions may be made according to the idea of the utility model.
Claims (10)
1. An image sensor data transmission device of a 3D endoscope, wherein the 3D endoscope comprises a first image sensor module and a second image sensor module which are arranged in a camera head, and a data processing system connected to the camera head; the first image sensor module is used for collecting optical signals and converting the optical signals into first electric signals; the second image sensor module is used for collecting optical signals and converting the optical signals into second electric signals; characterized in that the image sensor data transmission device comprises:
the logic chip comprises a logic circuit connected with the first image sensor module and the second image sensor module, and is used for receiving the first electric signal and the second electric signal, outputting first image data corresponding to the first electric signal to the data processing system, and outputting second image data corresponding to the second electric signal to the data processing system; the data processing system is used for receiving the first image data and the second image data, synthesizing the first image data and the second image data, and outputting synthesized image data for 3D display.
2. The image sensor data transmission apparatus of claim 1, wherein the logic circuit comprises: the image display device comprises a first signal receiving circuit, a second signal receiving circuit, an image pixel alignment circuit, a parallel-to-serial circuit and a data interface circuit;
the image sensor comprises a first signal receiving circuit, a second signal receiving circuit, an image pixel alignment circuit, a parallel-to-serial circuit and a data interface circuit, wherein the first signal receiving circuit is connected with a first image sensor module, the second signal receiving circuit is connected with a second image sensor module, the image pixel alignment circuit is respectively connected with the first signal receiving circuit and the second signal receiving circuit, the parallel-to-serial circuit is connected with the image pixel alignment circuit, and the data interface circuit is connected with the parallel-to-serial circuit;
the first signal receiving circuit is used for receiving a first electric signal and converting the first electric signal into a first parallel signal;
the second signal receiving circuit is used for receiving a second electric signal and converting the second electric signal into a second parallel signal;
the image pixel alignment circuit is used for carrying out pixel alignment processing on the first parallel signals and the second parallel signals and outputting the first parallel signals and the second parallel signals after pixel alignment;
the parallel-to-serial circuit is used for converting the first parallel signals and the second parallel signals after the pixels are aligned into first image data and second image data respectively;
the data interface circuit is used for outputting the first image data and the second image data to a data processing system.
3. The image sensor data transmission apparatus according to claim 2, wherein the first signal receiving circuit includes:
a first interface circuit for receiving a first electrical signal;
and the first parallel conversion circuit is connected to the first interface circuit and is used for converting the first electric signal received by the first interface circuit into a first parallel signal.
4. The image sensor data transmission apparatus according to claim 3, wherein the second signal receiving circuit includes:
a second interface circuit for receiving a second electrical signal;
and the second parallel-to-parallel circuit is connected to the second interface circuit and is used for converting the second electric signal received by the second interface circuit into a second parallel signal.
5. The image sensor data transmission device of claim 4, wherein the first interface circuit and the second interface circuit are both D-PHY interface circuits, and the first rotating parallel circuit and the second rotating parallel circuit are both MIPI rotating parallel circuits.
6. The image sensor data transmission device according to claim 2, wherein the data interface circuit is an LVDS interface circuit.
7. The image sensor data transmission device of claim 1, further comprising:
and the synchronous circuit is arranged in the camera, connected to the first image sensor module and the second image sensor module, and used for receiving the exposure signal generated by the first image sensor module and outputting a synchronous exposure signal corresponding to the exposure signal to the second image sensor module.
8. The image sensor data transmission device of claim 1, further comprising:
the camera comprises a camera head, a clock circuit, a first image sensor module and a second image sensor module, wherein the clock circuit is arranged in the camera head, connected to the first image sensor module and the second image sensor module and used for outputting a first clock signal and a second clock signal, the first image sensor module converts an optical image formed by return light after irradiating a target object into a first electric signal under the triggering of the first clock signal, and the second image sensor module converts an optical image formed by the return light after irradiating the target object into a second electric signal under the triggering of the second clock signal.
9. The image sensor data transmission device of claim 1, further comprising:
and the power supply circuit is arranged in the camera, connected to the first image sensor module, the second image sensor module and the logic circuit and used for providing power supply voltage signals for the first image sensor module, the second image sensor module and the logic circuit.
10. A3D endoscope, comprising:
the system comprises an optical lens, a camera and a data processing system;
the first image sensor module is arranged in the camera and used for collecting optical signals and converting the optical signals into first electric signals;
the second image sensor module is arranged in the camera and used for collecting optical signals and converting the optical signals into second electric signals;
the image sensor data transmission device of any one of claims 1 to 9, configured to transmit the first electrical signal and the second electrical signal to a data processing system.
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