CN215375530U - PIN PIN lead device of packaging device - Google Patents
PIN PIN lead device of packaging device Download PDFInfo
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- CN215375530U CN215375530U CN202121804616.6U CN202121804616U CN215375530U CN 215375530 U CN215375530 U CN 215375530U CN 202121804616 U CN202121804616 U CN 202121804616U CN 215375530 U CN215375530 U CN 215375530U
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- clamping plate
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Abstract
The utility model relates to the technical field of optical devices, in particular to a PIN PIN lead device of a packaged device, which comprises a mounting seat and a clamping unit and is characterized in that the mounting seat comprises a base, a product placing seat is mounted on the base, jackscrews are mounted on the product placing seat through screw pairs, two vertical mounting plates are arranged on one side of the base, a PIN shaft is rotatably mounted between the mounting plates, an upper clamping plate and a lower clamping plate are rotatably mounted on the PIN shaft, lead grooves are formed in the upper clamping plate and the lower clamping plate, elastic leads are embedded in the lead grooves of the upper clamping plate and the lower clamping plate, and an elastic contact of each elastic lead is driven to be in contact with a PIN PIN of the product, so that the PIN PIN can be led out of the device, and the performance of the device can be reliably and conveniently tested.
Description
Technical Field
The utility model relates to the technical field of optical devices, in particular to a PIN lead device of a packaging device.
Background
With the development of information technology, the demand of the market for optical devices is increasing, and in order TO improve the performance of the devices and reduce the cost of the devices, the packaging forms of the devices are also various, and besides common coaxial packaging such as TO-CAN, the market commonly adopts packaging forms such as COB, COC, BOX and the like. However, when various packaged devices are subjected to photoelectric testing, most packaged devices have short PIN PINs, so that the testing is inconvenient and lead wires are needed. Based on this, a PIN lead arrangement for packaging devices is presented herein.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the defects in the prior art and provides a PIN lead device of a packaged device.
In order to achieve the purpose, the utility model adopts the following technical scheme:
the utility model provides a PIN foot lead wire device of encapsulation device, includes mount pad and centre gripping unit, its characterized in that, the mount pad includes the base, installs the product on the base and places the seat, and the product is placed and is installed the jackscrew through the screw thread pair on the seat, and one side of base is provided with two mounting panels that erect, rotates between the mounting panel and installs the round PIN axle, and epaxial rotation of round PIN installs punch holder and lower plate, and punch holder and lower plate all are provided with the lead wire recess, and the embedded elasticity lead wire that is equipped with of lead wire recess of punch holder and lower plate.
Preferably, a torsion spring is arranged between the two ends of the pin shaft and the mounting plate.
Preferably, one side of the bottom of the elastic lead is provided with an elastic contact.
Preferably, the upper clamping plate and the lower clamping plate are identical in structure, and are symmetrical about the pin shaft.
The utility model has the beneficial effects that:
the device is contacted with the PIN PIN of the product through the elastic contact which drives the elastic lead, so that the PIN PIN of the device can be led out, and the performance of the device can be tested reliably and conveniently.
Drawings
Fig. 1 is a schematic structural diagram of a PIN lead apparatus of a packaged device according to the present invention;
fig. 2 is a schematic structural diagram of a mounting seat of a PIN lead device of a packaged device according to the present invention;
fig. 3 is a schematic structural diagram of a clamping unit of a PIN lead device of a packaged device according to the present invention;
fig. 4 is a schematic structural diagram of an elastic lead of a PIN lead device of a packaged device according to the present invention;
fig. 5 is a schematic structural diagram of a PIN lead apparatus of a packaged device according to the present invention.
In the figure: the device comprises a mounting seat 1, a clamping unit 2, a product 3, a base 4, a jackscrew 5, a lower clamping plate 6, a pin shaft 7, an upper clamping plate 8, an elastic lead 9, an elastic contact 10 and a lead groove 11.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-5, a PIN lead device of packaging device, including mount pad 1 and clamping unit 2, mount pad 1 includes base 4, install the product on base 4 and place the seat, the product is placed and is installed jackscrew 5 through the screw thread pair on the seat, and one side of base 4 is provided with two mounting panels of sticking up, rotate between the mounting panel and install round PIN axle 7, install the torsional spring between the both ends of round PIN axle 7 and the mounting panel, it installs punch holder 8 and lower plate 6 to rotate on round PIN axle 7, and punch holder 8 and lower plate 6 all are provided with lead wire recess 11, and the embedded flexible lead wire 9 of installing of punch holder 8 and lower plate 6 in lead wire recess 11, bottom one side of flexible lead wire 9 is provided with elastic contact 10.
Further, the upper clamp plate 8 and the lower clamp plate 6 have the same structure, and the upper clamp plate 8 and the lower clamp plate 6 are symmetrical about the pin 7.
In this embodiment, manually pinch the punch holder 8 and the lower plate 6 tightly, both drive elasticity lead 9 respectively and open to opposite direction, and the left hand is holding product 3 and is being put into the recess that the seat was placed to the product, loosens the right hand, and under the effect of torsional spring torsion, drive punch holder 8 and lower plate 6 rotate around round PIN axle 7, drives elasticity lead 9's elastic contact and product 3's PIN foot contact, screws jackscrew 5, makes product 3 fixed completely.
To this end, the PIN of the product 3 is led out through the elastic lead 9.
This device contacts through the elastic contact who drives elastic lead 9 and the PIN foot of product 3 to can be used for drawing forth the PIN foot of device, thereby can reliably, conveniently test the performance of device.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.
Claims (4)
1. The utility model provides a PIN foot lead wire device of encapsulation device, includes mount pad (1) and centre gripping unit (2), a serial communication port, mount pad (1) includes base (4), installs the product on base (4) and places the seat, and the product is placed and is installed jackscrew (5) through screw thread pair on the seat, and one side of base (4) is provided with two mounting panels of sticking up, rotates between the mounting panel and installs round PIN axle (7), rotates on round PIN axle (7) and installs punch holder (8) and lower plate (6), and punch holder (8) and lower plate (6) all are provided with lead wire recess (11), and the embedded elasticity lead wire (9) of being equipped with in lead wire recess (11) of punch holder (8) and lower plate (6).
2. The PIN leg lead arrangement of a packaged device according to claim 1, wherein a torsion spring is mounted between the mounting plate and both ends of the PIN (7).
3. PIN leadthrough arrangement according to claim 1, characterised in that the spring leads (9) are provided with spring contacts (10) on the bottom side.
4. The PIN leg lead arrangement of a packaged device according to claim 1, wherein the upper clamp (8) and the lower clamp (6) are identical in structure, the upper clamp (8) and the lower clamp (6) being symmetrical about the PIN axis (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121804616.6U CN215375530U (en) | 2021-08-04 | 2021-08-04 | PIN PIN lead device of packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121804616.6U CN215375530U (en) | 2021-08-04 | 2021-08-04 | PIN PIN lead device of packaging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215375530U true CN215375530U (en) | 2021-12-31 |
Family
ID=79615147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121804616.6U Active CN215375530U (en) | 2021-08-04 | 2021-08-04 | PIN PIN lead device of packaging device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215375530U (en) |
-
2021
- 2021-08-04 CN CN202121804616.6U patent/CN215375530U/en active Active
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