CN214081110U - Clamping device for chip capacitor - Google Patents
Clamping device for chip capacitor Download PDFInfo
- Publication number
- CN214081110U CN214081110U CN202023333278.0U CN202023333278U CN214081110U CN 214081110 U CN214081110 U CN 214081110U CN 202023333278 U CN202023333278 U CN 202023333278U CN 214081110 U CN214081110 U CN 214081110U
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- China
- Prior art keywords
- clamping
- vacuum
- chip capacitor
- capacitor
- base
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000003990 capacitor Substances 0.000 title claims abstract description 72
- 238000001179 sorption measurement Methods 0.000 claims abstract description 38
- 239000000872 buffer Substances 0.000 claims abstract description 36
- 230000003068 static effect Effects 0.000 claims abstract description 22
- 230000005611 electricity Effects 0.000 claims abstract description 18
- 230000003139 buffering effect Effects 0.000 claims abstract description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- 238000006386 neutralization reaction Methods 0.000 claims description 3
- 239000007853 buffer solution Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The utility model provides a pair of paster electric capacity clamping device, include base, vacuum clamping platform, elasticity arm lock device, prevent static portion. Wherein, vacuum clamping platform sets up on the base for through vacuum adsorption's mode with paster electric capacity adsorption be fixed in vacuum clamping bench, vacuum clamping platform is including the vacuum adsorption structure that is used for vacuum adsorption paster electric capacity and be used for the buffer structure of the pressure that buffering paster electric capacity received. The elastic clamping arm device is arranged on the base and used for providing clamping force for the chip capacitor on the vacuum clamping table. The anti-static part is arranged on the vacuum clamping table and the elastic clamping arm device and is used for eliminating static electricity on the vacuum clamping table and the elastic clamping arm device. The utility model provides a paster electric capacity clamping device when can pressing from both sides the stability of paster electric capacity tightly, can not press from both sides and hinder paster electric capacity.
Description
Technical Field
The utility model relates to an electric capacity processing field especially relates to a paster electric capacity clamping device.
Background
The chip capacitor is made of a capacitor material. The chip capacitors are all called: multilayer (laminated) chip ceramic capacitors, also called chip capacitors, chip capacitors. When the chip capacitor is produced, the chip capacitor needs to be clamped, but when the clamping force is too small, the clamping is not firm, and when the clamping force is too large, the chip capacitor is easily damaged, so that the chip capacitor cannot be guaranteed not to be damaged by the clamping force while the chip capacitor is firmly clamped.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defect that electric capacity clamping device exists among the prior art, the utility model discloses the problem that needs to solve lies in providing a paster electric capacity clamping device, can not press from both sides the paster electric capacity when can pressing from both sides the stability of paster electric capacity tight.
To achieve the purpose, the utility model adopts the following technical proposal:
the utility model provides a pair of paster electric capacity clamping device, include:
a base seat is arranged on the base seat,
the vacuum clamping table is arranged on the base and used for adsorbing and fixing the chip capacitor on the vacuum clamping table in a vacuum adsorption mode, and the vacuum clamping table comprises a vacuum adsorption structure used for vacuum adsorption of the chip capacitor and a buffer structure used for buffering pressure applied to the chip capacitor;
the elastic clamping arm device is arranged on the base and used for providing clamping force for the chip capacitor on the vacuum clamping table;
and the anti-static part is arranged on the vacuum clamping table and the elastic clamping arm device and is used for eliminating static electricity on the vacuum clamping table and the elastic clamping arm device.
Preferably, the vacuum adsorption structure includes:
the vacuum adsorption hole is formed in the upper surface of the vacuum clamping table and used for applying vacuum adsorption force to the surface of the chip capacitor;
and the vacuum output end of the vacuum generator is communicated with the vacuum adsorption hole through a pipeline, and the vacuum generator is used for providing the vacuum degree required by vacuum adsorption.
Preferably, the buffer structure includes:
the buffer bottom plate is arranged on the upper surface of the base, and the upper surface of the buffer bottom plate is provided with a slotted hole;
the lower end of the supporting rod is arranged in the slot hole in a sliding manner;
the clamping plate is used for supporting the surface-mounted capacitor, and the bottom of the clamping plate is fixedly connected with the top of the supporting rod;
the buffer spring is arranged in the slotted hole of the buffer bottom plate, one end of the buffer spring is connected with the lower end of the supporting rod, and the other end of the buffer spring is connected with the bottom of the slotted hole of the buffer bottom plate.
Preferably, the elastic clip arm device comprises:
the sliding rod is perpendicular to the base and is arranged on the surface of the base;
the clamping arm is sleeved on the sliding rod in a sliding mode, the end portion of one end of the clamping arm acts on the chip capacitor and is used for clamping the chip capacitor, and a layer of cushion pad is arranged on the surface, in contact with the chip capacitor, of the clamping arm;
the clamping spring is arranged on the clamping arm between the sliding rod and the patch capacitor, one end of the clamping spring is connected with the clamping arm, the other end of the clamping spring is connected with the base, and the clamping spring is in a stretched state during clamping.
Preferably, the static electricity preventing part includes:
the anti-static silica gel sheet is arranged on the surface of the vacuum clamping table, which is contacted with the surface mount capacitor, and is used for isolating static electricity on the vacuum clamping table and avoiding static electricity on the vacuum clamping table from damaging the surface mount capacitor;
and the grounding wire is electrically connected with the vacuum clamping table and the elastic clamping arm device and is used for conducting static electricity in the vacuum clamping table and the elastic clamping arm device to the ground for neutralization, so that the static electricity is eliminated.
The utility model has the advantages that:
the utility model provides a pair of paster electric capacity clamping device, include base, vacuum clamping platform, elasticity arm lock device, prevent static portion. Wherein, vacuum clamping platform sets up on the base for through vacuum adsorption's mode with paster electric capacity adsorption be fixed in vacuum clamping bench, vacuum clamping platform is including the vacuum adsorption structure that is used for vacuum adsorption paster electric capacity and be used for the buffer structure of the pressure that buffering paster electric capacity received. The elastic clamping arm device is arranged on the base and used for providing clamping force for the chip capacitor on the vacuum clamping table. The anti-static part is arranged on the vacuum clamping table and the elastic clamping arm device and is used for eliminating static electricity on the vacuum clamping table and the elastic clamping arm device. The chip capacitor is adsorbed by vacuum adsorption force in the vacuum clamping table, and the elastic clamping arm device is used for clamping the chip capacitor, so that the clamping stability of the chip capacitor is improved. And the buffer structure in the vacuum clamping table is used for buffering, so that the pressure applied to the chip capacitor is buffered, and the chip capacitor is prevented from being damaged due to overlarge clamping force. Meanwhile, the anti-static part is arranged on the vacuum clamping table and the elastic clamping arm device, so that static electricity on the chip capacitor clamping device is prevented from damaging the chip capacitor. To sum up, the utility model provides a paster electric capacity clamping device when can pressing from both sides paster electric capacity stable clamping, can not press from both sides and hinder paster electric capacity.
Drawings
Fig. 1 is a schematic structural view of a chip capacitor clamping device disclosed in the present invention;
fig. 2 is a schematic diagram of the arrangement of vacuum adsorption holes.
In the figure:
1. a base; 2. a vacuum clamping table; 3. an elastic clamping arm device; 4. an antistatic section; 5. a chip capacitor; 21. a vacuum adsorption structure; 22. a buffer structure; 31. a slide bar; 32. clamping arms; 33. clamping the spring; 41. antistatic silica gel skin; 42. a ground line; 211. a vacuum adsorption hole; 212. a vacuum generator; 221. a buffer base plate; 222. a support bar; 223. installing a clamping plate; 224. a buffer spring.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.
As shown in fig. 1 to 2, the clamping device for a chip capacitor provided in this embodiment includes a base, a vacuum clamping table, an elastic clamping arm device, and an anti-static portion. Wherein, vacuum clamping platform sets up on the base for through vacuum adsorption's mode with paster electric capacity adsorption be fixed in vacuum clamping bench, vacuum clamping platform is including the vacuum adsorption structure that is used for vacuum adsorption paster electric capacity and be used for the buffer structure of the pressure that buffering paster electric capacity received. The elastic clamping arm device is arranged on the base and used for providing clamping force for the chip capacitor on the vacuum clamping table. The anti-static part is arranged on the vacuum clamping table and the elastic clamping arm device and is used for eliminating static electricity on the vacuum clamping table and the elastic clamping arm device. The chip capacitor is adsorbed by vacuum adsorption force in the vacuum clamping table, and the elastic clamping arm device is used for clamping the chip capacitor, so that the clamping stability of the chip capacitor is improved. And the buffer structure in the vacuum clamping table is used for buffering, so that the pressure applied to the chip capacitor is buffered, and the chip capacitor is prevented from being damaged due to overlarge clamping force. Meanwhile, the anti-static part is arranged on the vacuum clamping table and the elastic clamping arm device, so that static electricity on the chip capacitor clamping device is prevented from damaging the chip capacitor. In summary, the present embodiment provides a chip capacitor clamping device, which can stably clamp a chip capacitor without damaging the chip capacitor.
Further, the vacuum adsorption structure comprises a vacuum generator and a vacuum adsorption hole. The vacuum adsorption hole is arranged on the upper surface of the vacuum clamping table and is used for applying vacuum adsorption force to the surface of the chip capacitor. The vacuum output end of the vacuum generator is communicated with the vacuum adsorption hole through a pipeline, and the vacuum generator is used for providing the vacuum degree required by vacuum adsorption.
Furthermore, the buffer structure comprises a buffer bottom plate, a buffer spring, a clamping plate and a supporting rod. The buffer bottom plate is arranged on the upper surface of the base, and a slotted hole is formed in the upper surface of the buffer bottom plate. The lower end of the support rod is arranged in the slotted hole in a sliding mode. The clamping plate is used for supporting the surface-mounted capacitor, and the bottom of the clamping plate is fixedly connected with the top of the supporting rod. The buffer spring is arranged in the slotted hole of the buffer bottom plate, one end of the buffer spring is connected with the lower end of the supporting rod, and the other end of the buffer spring is connected with the bottom of the slotted hole of the buffer bottom plate.
Furthermore, the elastic clamping arm device comprises a clamping arm, a sliding rod and a clamping spring. The slide bar is vertical to the base and is arranged on the surface of the base. The clamping arm is sleeved on the sliding rod in a sliding mode, the end portion of one end of the clamping arm acts on the patch capacitor and is used for clamping the patch capacitor, and a layer of cushion pad is arranged on the surface, in contact with the patch capacitor, of the clamping arm. The clamping spring is arranged on the clamping arm between the sliding rod and the patch capacitor, one end of the clamping spring is connected with the clamping arm, the other end of the clamping spring is connected with the base, and the clamping spring is in a stretched state during clamping.
Further, the anti-static part comprises an anti-static silica gel skin and a grounding wire. The anti-static silica gel skin is arranged on the surface of the vacuum clamping table, which is contacted with the surface mount capacitor, and is used for isolating static on the vacuum clamping table and avoiding static on the vacuum clamping table from damaging the surface mount capacitor. The grounding wire is electrically connected with the vacuum clamping table and the elastic clamping arm device and is used for conducting static electricity in the vacuum clamping table and the elastic clamping arm device to the ground for neutralization, and then eliminating the static electricity.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the invention. The present invention is not to be limited by the specific embodiments disclosed herein, and other embodiments that fall within the scope of the claims of the present application are intended to be within the scope of the present invention.
Claims (5)
1. A chip capacitor clamping device, comprising:
a base seat is arranged on the base seat,
the vacuum clamping table is arranged on the base and used for adsorbing and fixing the chip capacitor on the vacuum clamping table in a vacuum adsorption mode, and the vacuum clamping table comprises a vacuum adsorption structure used for vacuum adsorption of the chip capacitor and a buffer structure used for buffering pressure applied to the chip capacitor;
the elastic clamping arm device is arranged on the base and used for providing clamping force for the chip capacitor on the vacuum clamping table;
and the anti-static part is arranged on the vacuum clamping table and the elastic clamping arm device and is used for eliminating static electricity on the vacuum clamping table and the elastic clamping arm device.
2. A patch capacitor gripping device as claimed in claim 1, wherein the vacuum suction structure comprises:
the vacuum adsorption hole is formed in the upper surface of the vacuum clamping table and used for applying vacuum adsorption force to the surface of the chip capacitor;
and the vacuum output end of the vacuum generator is communicated with the vacuum adsorption hole through a pipeline, and the vacuum generator is used for providing the vacuum degree required by vacuum adsorption.
3. A patch capacitor gripping device as claimed in claim 1, wherein the buffer structure comprises:
the buffer bottom plate is arranged on the upper surface of the base, and the upper surface of the buffer bottom plate is provided with a slotted hole;
the lower end of the supporting rod is arranged in the slot hole in a sliding manner;
the clamping plate is used for supporting the surface-mounted capacitor, and the bottom of the clamping plate is fixedly connected with the top of the supporting rod;
the buffer spring is arranged in the slotted hole of the buffer bottom plate, one end of the buffer spring is connected with the lower end of the supporting rod, and the other end of the buffer spring is connected with the bottom of the slotted hole of the buffer bottom plate.
4. A patch capacitor clamping device as claimed in claim 1, wherein said resilient clip arm means comprises:
the sliding rod is perpendicular to the base and is arranged on the surface of the base;
the clamping arm is sleeved on the sliding rod in a sliding mode, a layer of buffer cushion is arranged on the surface, in contact with the chip capacitor, of the clamping arm and used for clamping the chip capacitor, and the end portion of one end of the clamping arm acts on the chip capacitor;
the clamping spring is arranged on the clamping arm between the sliding rod and the patch capacitor, one end of the clamping spring is connected with the clamping arm, the other end of the clamping spring is connected with the base, and the clamping spring is in a stretched state during clamping.
5. A patch capacitor gripping device according to claim 1, wherein the anti-static portion comprises:
the anti-static silica gel sheet is arranged on the surface of the vacuum clamping table, which is contacted with the surface mount capacitor, and is used for isolating static electricity on the vacuum clamping table and avoiding static electricity on the vacuum clamping table from damaging the surface mount capacitor;
and the grounding wire is electrically connected with the vacuum clamping table and the elastic clamping arm device and is used for conducting static electricity in the vacuum clamping table and the elastic clamping arm device to the ground for neutralization, so that the static electricity is eliminated.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202023333278.0U CN214081110U (en) | 2020-12-31 | 2020-12-31 | Clamping device for chip capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202023333278.0U CN214081110U (en) | 2020-12-31 | 2020-12-31 | Clamping device for chip capacitor |
Publications (1)
Publication Number | Publication Date |
---|---|
CN214081110U true CN214081110U (en) | 2021-08-31 |
Family
ID=77436738
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202023333278.0U Expired - Fee Related CN214081110U (en) | 2020-12-31 | 2020-12-31 | Clamping device for chip capacitor |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN214081110U (en) |
-
2020
- 2020-12-31 CN CN202023333278.0U patent/CN214081110U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 342100 Chengbei Industrial Park, Anyuan County, Ganzhou, Jiangxi Patentee after: Jiangxi Jiasheng Electronics Co.,Ltd. Address before: 342100 Chengbei Industrial Park, Anyuan County, Ganzhou, Jiangxi Patentee before: ANYUAN NAN JIA SHENG ELECTRONIC TECHNOLOGY Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210831 |