CN215357904U

CN215357904U - Reusable chemical mechanical polishing grinding pad assembly

Info

Publication number: CN215357904U
Application number: CN202121872962.8U
Authority: CN
Inventors: 李玉杰
Original assignee: Onstar Technology Shenzhen Co ltd
Current assignee: Onstar Technology Shenzhen Co ltd
Priority date: 2021-08-11
Filing date: 2021-08-11
Publication date: 2021-12-31
Anticipated expiration: 2031-08-11

Abstract

The utility model discloses a reusable chemical mechanical polishing grinding pad assembly, wherein a detachable fixed ring is sleeved on the periphery of a polishing disk, a bearing flat plate is arranged on the fixed ring, and a polishing pad is bonded on one surface of the bearing flat plate, which faces to the polishing plate, so that when the polishing pad on the polishing disk needs to be replaced or dismounted, the polishing pad can be directly dismounted from the polishing disk along with the fixed ring and the bearing flat plate for maintenance. Therefore, the problem that the polishing pad cannot be reused after being replaced is solved, and the use efficiency of the polishing pad is improved.

Description

Reusable chemical mechanical polishing grinding pad assembly

Technical Field

The utility model relates to the technical field of semiconductor production and processing equipment, in particular to a reusable chemical mechanical polishing grinding pad assembly.

Background

Chemical Mechanical Polishing (CMP), also known as chemical mechanical planarization, is a technique used in the semiconductor device manufacturing process for planarizing a silicon wafer or substrate material under process, and has the basic principle that a workpiece to be polished is rotated relative to a polishing Pad (Pad) under a certain pressure and in the presence of a polishing solution (a mixed solution composed of ultrafine particles, a chemical oxidizing agent, a liquid medium and the like), and the removal of the surface material of the workpiece is completed by means of the mechanical grinding of abrasive particles and the corrosive action of the polishing solution, so that a smooth surface is obtained. The chemical mechanical polishing mainly comprises a polishing machine, polishing liquid, a polishing pad, cleaning equipment, polishing end point detection and process control equipment and the like. Wherein the polishing fluid and polishing pad are consumables that need to be replaced at the end of their useful life. CMP consumables are expensive, and frequent replacement increases production costs. Especially for the development mechanism, the polishing pad or polishing liquid needs to be replaced frequently for testing, which ensures that the replaced polishing pad can still be used at the next time.

At present, a polishing disc of a CMP polishing machine table is fixed with a polishing pad back glue mode, the polishing pad is bonded on the surface of the polishing disc, the polishing pad needs to be replaced at the end of the service life of the polishing pad or during equipment maintenance, the adhesiveness of the polishing pad back glue torn from the polishing disc is reduced, and the polishing pad is curled and bent in the tearing process, so that the surface smoothness of the polishing pad is reduced, and the use value is lost.

SUMMERY OF THE UTILITY MODEL

Aiming at the problems in the prior art, the utility model mainly aims to provide a reusable chemical mechanical polishing grinding pad assembly, which aims to solve the problem that a polishing pad cannot be used after being replaced, improve the use efficiency of the polishing pad and reduce the production or research and development cost.

In order to achieve the purpose, the reusable chemical mechanical polishing and grinding pad assembly provided by the utility model comprises a polishing pad, a polishing disc, a bearing flat plate and a fixing ring, wherein the polishing pad is bonded on the bearing flat plate, the bearing flat plate is sleeved on an upper opening of the fixing ring, and a lower opening of the fixing ring is sleeved on the polishing disc.

Optionally, the bearing plate and the fixing ring are made of metal materials.

Optionally, the bearing plate and the fixing ring are made of stainless steel, aluminum alloy, copper, titanium alloy or common steel.

Optionally, the lower opening of the fixing ring is locked to the polishing disk by a plurality of first fastening screws.

Optionally, the edge of the load-bearing plate is fastened to the retaining ring by a plurality of second fastening screws.

Optionally, the bearing flat plate and the fixing ring are integrally formed by stamping or cast.

Optionally, the thickness of the bearing plate is 3-7mm, and the thickness of the fixing ring is 3-10 mm.

Optionally, the outer diameter of the retainer ring is 0.3-1.1mm larger than the outer diameter of the load-bearing plate.

Optionally, the water storage device further comprises a moisture preservation water tank, wherein a baffle plate for supporting the bearing flat plate is arranged on the inner peripheral wall of the moisture preservation water tank, and a cover plate is arranged on a notch of the moisture preservation water tank; the moisturizing water tank is also communicated with an external liquid supplementing device through a pipeline.

According to the utility model, the detachable fixed ring is sleeved on the periphery of the polishing disk, the bearing flat plate is arranged on the fixed ring, and the polishing pad is bonded on the surface, facing to the polishing plate, of the bearing flat plate, so that when the polishing pad on the polishing disk needs to be replaced or dismounted, the polishing pad can be directly dismounted from the polishing disk along with the fixed ring and the bearing flat plate for maintenance. After maintenance, the polishing pad can be reassembled with the retainer ring and carrier plate onto the polishing disk. Therefore, the problem that the polishing pad cannot be reused after being replaced is solved, and the use efficiency of the polishing pad is improved.

Compared with the prior art, the utility model has the following advantages: the polishing pad can be flexibly replaced and reused on the premise of not changing polishing equipment and the polishing pad; the process or research and development of different polishing pads needing to be replaced can be carried out on the same machine, the production and research and development costs are saved, and the service life and the efficiency of the polishing pads are prolonged.

Drawings

FIG. 1 is a schematic structural diagram of an embodiment of the present invention;

FIG. 2 is an exploded view of an embodiment of the present invention;

fig. 3 is a schematic structural view of a moisturizing trough in an embodiment of the utility model.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The embodiment of the utility model provides a reusable chemical mechanical polishing grinding pad assembly which is used for detachably fixing a polishing pad on a polishing disk so as to flexibly and conveniently replace the polishing pad. Specifically, referring to fig. 1-2 of the specification, the cmp polishing pad assembly includes a polishing pad 500, a polishing disc 600, a carrier plate 100 and a retainer ring 200, wherein the polishing pad 500 is bonded to the carrier plate 100, the carrier plate 100 is sleeved on an upper opening of the retainer ring 200, and a lower opening of the retainer ring 200 is sleeved on the polishing disc 600.

Specifically, the thickness of the bearing plate 100 is 3-7mm, and the thickness of the fixing ring 200 is 3-10mm, which are all made of metal materials, such as but not limited to stainless steel, aluminum alloy, copper, titanium alloy or common steel. The diameter of the flat carrier plate 100 is determined according to the size of the polishing disk 600, and the outer diameter of the fixing ring 200 is 0.3-1.1mm larger than the outer diameter of the flat carrier plate 100.

As shown in fig. 2, in the present embodiment, four first fixing holes are uniformly distributed along the axial direction of the fixing ring 200 at the lower opening peripheral wall, a second fixing hole corresponding to the first fixing hole is provided at the peripheral wall of the polishing disk 600, and after the fixing ring 200 is sleeved on the polishing disk 600, the polishing disk 600 can be tightly locked by four first fastening screws 210 which pass through the first fixing holes and are inserted into the second fixing holes. Thereby, the fixing ring 200 is detachably coupled to the polishing platter 600. When the polishing pad 500 needs to be replaced, the polishing pad 500 can be removed from the polishing disc 600 along with the fixing ring 200 by loosening the four first fastening screws 210.

As shown in fig. 2, in the present embodiment, four third fixing holes are uniformly distributed along the axial direction of the fixing ring 200 at the upper opening peripheral wall, and a fourth fixing hole corresponding to the third fixing hole is provided at the peripheral wall of the edge peripheral wall setting tray of the bearing plate 100, so that after the bearing plate 100 is clamped on the fixing ring 200, the bearing plate can be tightly locked on the fixing ring 200 by four second fastening screws 220 passing through the third fixing holes and inserted into the fourth fixing holes. Therefore, the polishing pad 500 can be taken out of the polishing disk 600 along with the carrier plate 100 by loosening the four second fastening screws 220, thereby further improving the convenience of replacing the polishing pad 500.

In other embodiments, the flat carrier plate 100 and the retaining ring 200 may be non-detachably connected together, such as by gluing, integrally stamping, or casting. Thus, when the polishing pad 500 needs to be replaced, the fixing ring 200 needs to be detached from the polishing disk 600.

In this embodiment, the CMP pad assembly further includes a moisture retention tank 300, wherein the moisture retention tank 300 has an inner diameter 3-10mm larger than the carrier plate and a depth of about 4-10 mm. The inner peripheral wall of the moisturizing tub 300 is provided with a baffle 310 for supporting the carrier plate 100, and the opening of the baffle is provided with a cover 320 capable of opening and closing. The moisturizing water tank 300 is also communicated with an external fluid infusion device 400 through a pipeline.

Therefore, after the polishing pad 500 is detached from the polishing disc 600 along with the carrier plate 100 or the retainer ring 200, the polishing pad 500 is placed on the baffle 310 of the moisturizing water tank 300 with the surface facing downward, water is added to the moisturizing water tank 300 by the liquid replenishing device 400, and the polishing pad 500 is moisturized without passing through the polishing pad 500, so that the drying failure of the polishing pad 500 is prevented, and the service life of the polishing pad 500 is prolonged. At the same time, the cover plate 320 is closed to close the water tank, preventing evaporation of moisture and contamination of dust.

Before the polishing pad 500 is placed in the moisture-retaining water tank 300, a protective film may be coated on the surface of the polishing pad 500 to prevent the polishing pad 500 from being damaged when contacting the baffle 310.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a chemical mechanical polishing grinding pad subassembly that can used repeatedly, includes polishing pad and polishing dish, its characterized in that still includes bear dull and stereotyped and retainer plate, polishing pad bonding with bear on the dull and stereotyped, bear the dull and stereotyped cup joint in the upside opening of retainer plate, the downside opening of retainer plate cup joints on the polishing dish.

2. The reusable chemical mechanical polishing pad assembly of claim 1 wherein the carrier plate and retainer ring are fabricated from metallic materials.

3. The reusable chemical mechanical polishing pad assembly of claim 2 wherein the carrier plate and retainer ring are fabricated from stainless steel, aluminum alloy, copper, titanium alloy or plain steel.

4. The reusable chemical mechanical polishing pad assembly of claim 3 wherein the lower opening of the retainer ring is secured to the polishing disk by a first plurality of fastening screws.

5. The reusable chemical mechanical polishing pad assembly of claim 3 wherein the edge of the carrier plate is secured to the retaining ring by a plurality of second fastening screws.

6. The reusable chemical mechanical polishing pad assembly of claim 3 wherein the carrier plate and retainer ring are stamped and formed integrally or cast.

7. The reusable chemical mechanical polishing pad assembly of claim 3 wherein the carrier plate has a thickness of 3-7mm and the retainer ring has a thickness of 3-10 mm.

8. The reusable chemical mechanical polishing pad assembly of claim 3 wherein the outer diameter of the retainer ring is 0.3-1.1mm greater than the outer diameter of the carrier plate.

9. The reusable chemical mechanical polishing pad assembly of any of claims 1-8 further comprising a moisture retaining basin having a baffle on the inner peripheral wall for supporting the carrier plate, the opening of the basin having a cover plate; the moisturizing water tank is also communicated with an external liquid supplementing device through a pipeline.