CN215344986U - Bone voiceprint sensor - Google Patents
Bone voiceprint sensor Download PDFInfo
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- CN215344986U CN215344986U CN202121190622.7U CN202121190622U CN215344986U CN 215344986 U CN215344986 U CN 215344986U CN 202121190622 U CN202121190622 U CN 202121190622U CN 215344986 U CN215344986 U CN 215344986U
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- 210000000988 bone and bone Anatomy 0.000 title claims abstract description 38
- 238000004806 packaging method and process Methods 0.000 claims abstract description 6
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- 230000035945 sensitivity Effects 0.000 abstract description 8
- 230000001755 vocal effect Effects 0.000 abstract description 3
- 239000000306 component Substances 0.000 description 13
- 238000013016 damping Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
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- 238000000034 method Methods 0.000 description 2
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- 238000005476 soldering Methods 0.000 description 2
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- 230000008859 change Effects 0.000 description 1
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- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
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- 230000035939 shock Effects 0.000 description 1
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Abstract
The utility model provides a bone-vocal print sensor, which comprises a PCB and a shell fixed on the PCB, wherein the shell and the PCB form a packaging structure, a vibration component is erected inside the packaging structure, and a vibration front cavity is formed between the vibration component and the PCB; and a groove communicated with the vibration front cavity is hollowed on the PCB. Utilize above-mentioned utility model can solve the problem that traditional bone vocal print sensor sensitivity is low.
Description
Technical Field
The utility model relates to the field of sensor design, in particular to a bone voiceprint sensor.
Background
The bone voiceprint sensor is a sensor which utilizes the driving air flow when the sound membrane vibrates, and therefore, the flow signal is detected. A conventional bone voiceprint sensor generally includes a vibration component and a microphone component, wherein a vibration system is used for sensing an external vibration signal and converting an airflow change generated during vibration into an electrical signal through the microphone component, so as to express the vibration signal. The vibration assembly and the microphone assembly are core components of the bone voiceprint sensor.
However, in the conventional bone voiceprint sensor, since the front cavity of the vibration assembly is small, it is disadvantageous to reduce vibration damping; moreover, the back cavity is large, which also can seriously affect the air pressure conduction efficiency inside the bone vocal print sensor, and based on the two reasons, the traditional bone vocal print sensor product is often low in sensitivity.
Based on the above technical problems, a method capable of significantly improving the sensitivity of the conventional bone voiceprint sensor is needed.
SUMMERY OF THE UTILITY MODEL
In view of the above problems, an object of the present invention is to provide a bone voiceprint sensor to solve the problem of low sensitivity of the conventional bone voiceprint sensor.
The bone voiceprint sensor provided by the embodiment of the utility model comprises a PCB and a shell fixed on the PCB, wherein the shell and the PCB form a packaging structure, a vibration component is erected inside the packaging structure, and a vibration front cavity is formed between the vibration component and the PCB; and a groove communicated with the vibration front cavity is arranged on the PCB.
In addition, the preferable structure is that the vibration assembly comprises a vibration ring fixed on the PCB, a vibration diaphragm arranged at the top of the vibration ring, and a mass block arranged on the vibration diaphragm, a support connection sheet is arranged above the vibration ring, and a vibration back cavity is formed between the support connection sheet and the vibration diaphragm.
In addition, the preferable structure is that a supporting block is arranged in the groove; and the number of the first and second electrodes,
the groove and the supporting block form an island structure.
In addition, it is preferable that the mass is provided on the top of the diaphragm.
In addition, it is preferable that the mass is disposed at a bottom of the diaphragm.
In addition, it is preferable that a microphone assembly is provided above the support connection piece.
Further, it is preferable that the microphone assembly includes a MEMS chip and an ASIC chip disposed on top of the support pad.
In addition, preferably, the support connection piece is provided with a through hole corresponding to the upper and lower positions of the MEMS chip.
In addition, it is preferable that the housing is made of metal, and the vibration ring is electrically connected to the housing.
In addition, preferably, the housing is provided with an air vent.
According to the technical scheme, the bone voiceprint sensor provided by the utility model has the advantages that the PCB is hollowed to form the grooves corresponding to the upper position and the lower position of the vibration assembly, so that the vibration front cavity of the vibration assembly can be increased, the vibration damping is effectively reduced, and the sensitivity of the vibration assembly is increased. In addition, through set up the supporting shoe in order to carry out the island design with PCB in the recess, can play certain supporting role to the vibration subassembly in the vibration antechamber that increases the vibration subassembly to the structural robustness of reinforcing vibration subassembly avoids producing high displacement under high strength mechanical shock and leads to the vibrating diaphragm impaired. In addition, the mass block is arranged at the bottom of the vibrating diaphragm, so that the height of the vibrating rear cavity can be reduced, the volume of the vibrating rear cavity is reduced, and the transmission efficiency of air pressure during vibration is improved; and meanwhile, the PCB structure with the hollow design is matched, so that the overall height of the product can be reduced.
Drawings
Other objects and results of the present invention will become more apparent and more readily appreciated as the same becomes better understood by reference to the following description taken in conjunction with the accompanying drawings. In the drawings:
FIG. 1 is a front cross-sectional view of a bone voiceprint sensor in accordance with an embodiment of the utility model;
FIG. 2 is a front cross-sectional view of a second embodiment of a bone voiceprint sensor in accordance with the present invention;
FIG. 3 is a front cross-sectional view of a third bone voiceprint sensor in accordance with a third embodiment of the utility model;
wherein the reference numerals include: PCB11, groove 111, shell 12, air vent 121, MEMS chip 13, ASIC chip 131, vibrating diaphragm 14, mass block 141, support connecting sheet 15, vibrating ring 16, vibration front cavity 17, vibration back cavity 18 and support block 19.
The same reference numbers in all figures indicate similar or corresponding features or functions.
Detailed Description
To describe the structure of the bone voiceprint sensor of the present invention in detail, specific embodiments of the present invention will be described below with reference to the accompanying drawings.
Fig. 1 shows a front view cross-sectional structure of a bone acoustic ridge sensor according to an embodiment of the present invention, and according to fig. 1, the bone acoustic ridge sensor according to the embodiment of the present invention includes a PCB11 (which is called Printed Circuit Board in english and is a support for electronic components) for soldering an internal Circuit of the bone acoustic ridge sensor, and a housing 12 fixed on the PCB11 and functioning as a protection component, a package structure is formed between the housing 12 and the PCB11, a vibration component for sensing an external vibration signal is mounted inside the package structure, and a vibration front cavity 17 is formed between the vibration component and the PCB 11.
For the sensitivity that promotes the vibration subassembly, the fretwork has the recess 111 that is linked together with vibration front cavity 17 on PCB11, carries out fretwork to PCB11 and handles the recess 111 that corresponds with vibration subassembly upper and lower position, can increase vibration subassembly's vibration front cavity 17 to effectively reduce vibration damping, increase vibration subassembly's sensitivity.
Specifically, the vibration assembly comprises a vibration ring 16 fixed on the PCB11, a vibration diaphragm 14 arranged on the top of the vibration ring 16, and a mass 141 arranged on the vibration diaphragm 14, wherein the vibration ring 16 is a hollow structure so that a vibration front cavity 17 is formed between the vibration diaphragm 14 and the PCB11, and the vibration amplitude of the vibration diaphragm 14 can be increased by arranging the mass 141 on the vibration diaphragm 14, thereby increasing the sensitivity of the vibration assembly.
Furthermore, for the convenience of arranging the microphone assembly, the support connection piece 15 may be arranged above the diaphragm 16, and then the microphone assembly may be arranged directly on the support connection piece 15, and the vibration back cavity 18 is formed between the support connection piece 15 and the diaphragm 14.
In addition, fig. 2 shows a front cross-sectional structure of a second embodiment of the bone voiceprint sensor according to the present invention, and as can be seen from fig. 2, a supporting block 19 may be disposed in the groove 111, so that the groove 111 and the supporting block 19 form an island structure together; the PCB11 can be subjected to island design by arranging the supporting block 19 in the groove 111, and the vibration front cavity 17 of the vibration component can be increased while the vibration front cavity plays a certain supporting role on the vibration component, so that the structural robustness of the vibration component is enhanced, and the vibration membrane 14 is prevented from being damaged due to high displacement generated under high-strength mechanical impact.
Note that, in general, the mass 141 is disposed on the upper surface of the top of the diaphragm 14 and vibrates up and down with the diaphragm 14. In order to reduce the height of the whole device, fig. 3 shows the front sectional structure of a bone voiceprint sensor according to a third embodiment of the utility model, as can be seen from fig. 3, a mass block 141 can be arranged at the bottom of the vibrating diaphragm 14, and by arranging the mass block 141 at the bottom of the vibrating diaphragm 14, the height of the vibrating back cavity 18 can be reduced, so that the volume of the vibrating back cavity 18 is reduced, and the transmission efficiency of air pressure during vibration is improved; and meanwhile, the PCB11 structure with hollow design is matched, so that the overall height of the product can be reduced.
Specifically, the microphone assembly includes a MEMS chip 13(micro electro Mechanical Systems) and an ASIC chip 131(ASIC, i.e. application specific integrated circuit, which refers to an integrated circuit designed and manufactured according to the requirements of a specific user and the requirements of a specific electronic system) disposed on top of the supporting connection sheet 15, and the MEMS chip 13 and the ASIC chip 131 are electrically connected by a wire, and both the MEMS chip 13 and the ASIC chip 131 are electrically connected to the substrate 11 by a wire. The MEMS13 is configured to induce a vibrating airflow generated by the diaphragm and generate an electrical signal, and the ASIC chip 131 is configured to amplify the electrical signal converted from the vibrating signal by the MEMS 13.
In a specific embodiment of the present invention, in order to prevent the internal gas of the package structure from expanding due to heating during the processes of reflow soldering and high-temperature baking, the housing 12 may be provided with the gas vent 121, so that the balance between the internal pressure and the external pressure during the assembly of the bone acoustic pattern sensor can be effectively ensured through the gas vent 121, and the occurrence of the shell explosion phenomenon can be prevented.
Furthermore, due to the presence of the support connection pad 15, the support connection pad 15 will cover the diaphragm 14 and the mass 141, thereby reducing the effect of the microphone assembly to receive vibrating air flow. For this purpose, a through-hole (not shown) may be provided in the support connection piece 15, through which a vibrating air flow is transmitted to the microphone assembly.
In practical use, the mass block 141 cooperates with the vibrating diaphragm 14 to sense an external vibration signal, and the vibrating diaphragm vibrates therewith and generates a vibrating airflow. The MEMS chip 13 senses the vibrating airflow to generate a corresponding electrical signal, and then transmits the electrical signal to the microphone assembly for signal amplification, and the amplified electrical signal is transmitted to an external signal processing device for signal analysis.
Specifically, the mass block 141 may be adhered to the lower surface of the diaphragm 14 by glue.
In addition, in order to simplify the internal routing manner of the voiceprint sensor, the vibrating ring 16 and the housing 12 of the vibrating component may be both made of metal parts and directly contacted, and the housing 12 is connected to the ground terminal on the PCB11, by this way, the wire between the vibrating diaphragm 14 and the ground terminal can be omitted, the routing manner of the voiceprint sensor is simplified, and the cost is saved.
The proposed bone voiceprint sensor according to the present invention is described above by way of example with reference to the accompanying drawings. However, it will be appreciated by those skilled in the art that various modifications may be made to the bone voiceprint sensor proposed by the present invention without departing from the spirit of the utility model. Therefore, the scope of the present invention should be determined by the contents of the appended claims.
Claims (10)
1. A bone voiceprint sensor comprises a PCB and a shell fixed on the PCB, the shell and the PCB form a packaging structure, and the bone voiceprint sensor is characterized in that,
a vibration assembly is erected inside the packaging structure, and a vibration front cavity is formed between the vibration assembly and the PCB; and the number of the first and second electrodes,
and a groove communicated with the vibration front cavity is arranged on the PCB.
2. The bone voiceprint sensor of claim 1 wherein,
a supporting block is arranged in the groove; and the number of the first and second electrodes,
the groove and the supporting block form an island structure.
3. The bone voiceprint sensor of claim 1 wherein,
the vibration assembly comprises a vibration ring fixed on the PCB, a vibration diaphragm arranged at the top of the vibration ring and a mass block arranged on the vibration diaphragm, a support connecting sheet is arranged above the vibration ring, and a vibration rear cavity is formed between the support connecting sheet and the vibration diaphragm.
4. The bone voiceprint sensor of claim 3 wherein,
the mass block is arranged on the top of the diaphragm.
5. The bone voiceprint sensor of claim 3 wherein,
the mass block is arranged at the bottom of the diaphragm.
6. The bone voiceprint sensor of claim 3 wherein,
and a microphone assembly is arranged above the supporting connecting sheet.
7. The bone voiceprint sensor of claim 6 wherein,
the microphone assembly includes a MEMS chip and an ASIC chip disposed atop the support tab.
8. The bone voiceprint sensor of claim 7 wherein,
and through holes corresponding to the upper and lower positions of the MEMS chip are formed in the supporting connecting sheet.
9. The bone voiceprint sensor of claim 3 wherein,
the shell is a metal part, and the vibration ring is electrically connected with the shell.
10. The bone voiceprint sensor of any one of claims 1 to 9,
the shell is provided with an air guide hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121190622.7U CN215344986U (en) | 2021-05-31 | 2021-05-31 | Bone voiceprint sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121190622.7U CN215344986U (en) | 2021-05-31 | 2021-05-31 | Bone voiceprint sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215344986U true CN215344986U (en) | 2021-12-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121190622.7U Active CN215344986U (en) | 2021-05-31 | 2021-05-31 | Bone voiceprint sensor |
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| CN (1) | CN215344986U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114554327A (en) * | 2022-01-25 | 2022-05-27 | 上海感与执技术有限公司 | Bone voiceprint sensor and electronic equipment |
| WO2023000999A1 (en) * | 2021-07-20 | 2023-01-26 | 歌尔微电子股份有限公司 | Vibration sensor and electronic device |
-
2021
- 2021-05-31 CN CN202121190622.7U patent/CN215344986U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023000999A1 (en) * | 2021-07-20 | 2023-01-26 | 歌尔微电子股份有限公司 | Vibration sensor and electronic device |
| CN114554327A (en) * | 2022-01-25 | 2022-05-27 | 上海感与执技术有限公司 | Bone voiceprint sensor and electronic equipment |
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