CN215330640U - Buffer connecting device and data center - Google Patents

Abstract

The embodiment of the application provides a buffer connecting device and a data center. Wherein, buffering connecting device includes: a cushioning member and a connecting member; the buffer component is a three-dimensional structure made of elastic materials and comprises a bottom surface and a top surface which are arranged in parallel; the connecting part comprises a bottom plate, a top plate and a connecting plate, wherein the bottom plate and the top plate are arranged at intervals up and down and are parallel to each other; the connecting plate is arranged between the bottom plate and the top plate; one end of the connecting plate is connected with the bottom plate, and the other end of the connecting plate is connected with the top plate; when the buffer component is not deformed under stress, the height between the bottom surface and the top surface is larger than the height between the bottom plate and the top plate. When the upper module of the data center is hoisted and falls, the upper module is firstly contacted with the buffer component, so that the buffer component can absorb the impact generated in the descending process of the upper module, the vibration of the lower module is reduced, and the connecting component can limit the positions of the upper module and the lower module after being installed.

Description

Buffer connecting device and data center

Technical Field

The application relates to the technical field of vibration reduction, in particular to a buffer connecting device and a data center.

Background

The prefabricated modular data center is a data center which is divided into a plurality of modules by adopting a modular implementation mode, the assembly and combination of infrastructure units in each module are completed in a factory, and each module can be put into use after being stacked and assembled again on an installation site. Wherein each module is a basic unit forming a prefabricated modular data center and can support independent transportation.

Because the requirement on the stability of the environment when equipment such as a server installed in a data center runs is high, and the modules of the prefabricated modular data center can generate some impact on the installed modules when the modules are hoisted and stacked, so that large vibration is caused, under the condition, if the installed modules have the servers running, the server can not work normally due to the impact and the vibration, so that the conventional prefabricated modular data center does not support online capacity expansion, only offline capacity expansion can be realized, namely the server is closed, and the service provided by the server is interrupted during the capacity expansion.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a buffer connection device and a data center to reduce the vibration of the module of the prefabricated modular data center when the module is hoisted and stacked, and realize the online capacity expansion of the prefabricated modular data center.

In a first aspect, an embodiment of the present application provides a buffer connection device, including: a cushioning member and a connecting member; the buffer component is a three-dimensional structure made of elastic materials and comprises a bottom surface and a top surface which are arranged in parallel; the connecting part comprises a bottom plate, a top plate and a connecting plate, wherein the bottom plate and the top plate are arranged at intervals up and down and are parallel to each other; the connecting plate is arranged between the bottom plate and the top plate; one end of the connecting plate is connected with the bottom plate, and the other end of the connecting plate is connected with the top plate; when the buffer component is not deformed under stress, the height between the bottom surface and the top surface is larger than the height between the bottom plate and the top plate.

The buffering connecting device that this application embodiment provided can set up and pile up between the upper module and the lower floor's module that set up from top to bottom wantonly, and when upper module hoist and mount whereabouts, upper module at first contacts with the buffering part, and like this, the buffering part can absorb the impact that upper module produced at the decline in-process, alleviates the vibration of lower floor's module, and adapting unit then can realize prescribing a limit to the position after upper module and lower floor's module installation. Therefore, when the technical scheme of the embodiment of the application is applied to the capacity expansion scene of the prefabricated modular data center, the vibration generated when the modules of the prefabricated modular data center are hoisted and stacked can be reduced, and the online capacity expansion of the prefabricated modular data center is realized.

In an alternative implementation, at least one internal opening is provided between the bottom surface and the top surface.

In an alternative implementation, the at least one internal opening extends from the bottom surface to the top surface.

In an alternative implementation, a portion of the at least one interior opening extends a depth from the bottom surface toward the top surface and terminates within the cushioning component; another portion of the at least one interior opening extends a depth from the top surface toward a direction proximate the bottom surface and terminates within the cushioning component.

In an alternative implementation, the sum of the open area of all internal openings is 20% to 80% of the area of the bottom or top surface.

In an alternative implementation manner, the bottom plate is provided with at least one first through hole, when the number of the first through holes is multiple, the multiple first through holes are distributed on the bottom plate at intervals, and the first through holes are used for realizing the threaded connection between the connecting part and the connected lower module.

In an alternative implementation, the top plate is provided with at least one stud, the at least one stud is arranged on the side opposite to the bottom plate, when the number of the studs is multiple, the studs are distributed on the bottom plate at intervals, and the studs are used for realizing the threaded connection between the connecting part and the connected upper-layer module.

In an alternative implementation manner, the bottom plate is provided with at least one first guide piece, the at least one first guide piece is arranged on the side opposite to the top plate, one end of the at least one first guide piece is connected with the bottom plate, the other end of the at least one first guide piece extends in the direction away from the bottom plate, and the first guide piece is used for realizing embedded connection with the lower module.

In an alternative implementation manner, the top plate is provided with at least one second guide piece, the at least one second guide piece is arranged on the side opposite to the bottom plate, one end of the at least one second guide piece is connected with the top plate, the other end of the at least one second guide piece extends in the direction away from the top plate, and the second guide piece is used for realizing embedded connection with the upper module.

In an alternative implementation, the connection plates include outer connection plates and inner connection plates; the outer connecting plates are arranged at the edges of the bottom plate and the top plate and are arranged around the edges of the bottom plate and the top plate; the connecting plate sets up the inboard at outer connecting plate.

In an alternative implementation, the outer connecting plate forms an opening in at least one side edge of the bottom and top plates.

In a second aspect, an embodiment of the present application provides a data center, including: an upper layer module, a lower layer module and at least one buffer connecting device provided by the first aspect and any implementation manner thereof; the upper module and the lower module are stacked up and down, and the buffer connecting device is arranged between the upper module and the lower module.

Drawings

FIG. 1 is a schematic structural diagram of a cushioning component provided in an embodiment of the present application;

FIG. 2 is a schematic cross-sectional view of a cushioning component according to an embodiment of the present disclosure;

FIG. 3 is a schematic cross-sectional view of another cushioning component provided in accordance with an embodiment of the present application;

fig. 4 is a schematic structural view of a connecting member provided in an embodiment of the present application;

FIG. 5 is an exploded view of a connecting member according to an embodiment of the present disclosure;

FIG. 6 is a schematic view of an installation of a lower module and a buffer connecting device according to an embodiment of the present application;

FIG. 7 is an enlarged partial cross-sectional view of a lower module and a cushioned connection arrangement provided by an embodiment of the present application;

FIG. 8 is a schematic illustration of a hoist for an upper module provided by an embodiment of the present application;

FIG. 9 is a schematic diagram of an upper module provided in an embodiment of the present application after hoisting;

figure 10 is a partial schematic view of the upper module, the lower module and the buffer connection device after installation.

Wherein: 100-cushioning part, 110-bottom surface, 120-top surface, 130-internal opening, 200-connecting part, 210-bottom plate, 220-top plate, 230-connecting plate, 231-external connecting plate, 232-internal connecting plate, 240-first through hole, 250-stud, 260-first guide piece, 270-second guide piece, 280-first sub-region, 290-second sub-region, 300-upper module, 310-bottom shell surface, 320-third through hole, 330-second guide groove, 400-lower module, 410-top shell surface, 420-second through hole, 430-bolt, 440-nut, 450-gasket, 460-first guide groove.

Detailed Description

With the vigorous development of the industries such as the internet, big data, cloud computing, the internet of things, artificial intelligence and the like, the construction requirement of a data center shows explosive growth, and the traditional data center construction mode can not meet the requirement of the era gradually due to the characteristics of long construction period, poor flexibility, high cost, inconvenient maintenance and management and the like, so that the prefabricated modular data center is produced at the discretion of the user.

The prefabricated modular data center is a data center which is divided into a plurality of modules by adopting a modular implementation mode, the assembly and combination of infrastructure units in each module are completed in a factory, and each module can be put into use after being stacked and assembled again on an installation site. Wherein each module is a basic unit forming a prefabricated modular data center and can support independent transportation.

The prefabricated modular data center is used as a new mode for data center construction, adopts a modular design concept, overcomes various physical scenes and business scenes which cannot be met by the traditional civil engineering mode data center, can be directly applied outdoors, and has the remarkable advantages of rapid deployment and flexible capacity expansion.

However, because the requirement on the stability of the environment when equipment such as a server installed in the data center operates is high, and the modules of the prefabricated modular data center can generate some impact on the installed modules when being hoisted and stacked, so that large vibration is caused, in this case, if a server in the installed modules operates, the server cannot normally operate due to the impact and the vibration, and therefore, the existing prefabricated modular data center does not support online capacity expansion and can only realize offline capacity expansion.

The online capacity expansion means that other modules are newly installed when a server of the installed modules is in an operating state, so that capacity expansion of the data center is realized. The offline capacity expansion refers to that other modules are newly installed when the servers of the installed modules are in a closed state, so that the capacity expansion of the data center is realized.

It can be understood that, since the current prefabricated modular data center can only implement offline capacity expansion, that is, the server is turned off, the service provided by the server is interrupted during the capacity expansion.

In order to reduce the vibration that produces when the module of prefabricated modular data center hoists and piles up, realize prefabricated modular data center's online dilatation, this application embodiment provides a buffering connecting device.

The buffer connecting device provided by the embodiment of the application comprises a buffer part 100 and a connecting part 200.

Fig. 1 is a schematic structural diagram of a cushioning component 100 according to an embodiment of the present application. As shown in fig. 1, the cushioning member 100 has a three-dimensional structure, such as a cubic structure, a cylindrical structure, a landing structure, and the like, which is not limited in the embodiments of the present application.

The cushioning member 100 may be made of any elastic material, which enables the cushioning member 100 to elastically deform when being subjected to an external pressure, and the elastic material may be, for example, rubber, silicone, resin, liquid metal, and the like, which is not limited in this embodiment.

Cushioning component 100 may include a bottom surface 110 and a top surface 120 disposed parallel to each other, with at least one interior opening 130 also disposed between bottom surface 110 and top surface 120 of cushioning component 100.

Fig. 2 is a schematic cross-sectional view of a cushioning component 100 according to an embodiment of the present application. As shown in fig. 2, in one implementation, a plurality of internal openings 130 are provided between the bottom surface 110 and the top surface 120 of the cushioning component 100, and the plurality of internal openings 130 extend from the bottom surface 110 of the cushioning component 100 all the way to the top surface 120 of the cushioning component 100, thereby penetrating the cushioning component 100. The axial direction of interior opening 130 is preferably perpendicular to the direction of bottom surface 110 and top surface 120 of cushioning component 100. Also, the plurality of inner openings 130 are spaced apart from each other at a predetermined distance.

Fig. 3 is a schematic cross-sectional view of another cushioning component 100 according to an embodiment of the present application. As shown in FIG. 3, in one implementation, a plurality of interior openings 130 are provided between bottom surface 110 and top surface 120 of cushioning component 100. Wherein a portion of the internal opening 130 is disposed on the bottom surface 110 of the cushioning member 100, and has a certain depth from the bottom surface 110 of the cushioning member 100 toward the top surface 120 of the cushioning member 100, and the bottom of the portion of the internal opening 130 terminates inside the cushioning member 100; another portion of the internal opening 130 is disposed at the top surface 120 of the cushioning member 100, and has a depth from the top surface 120 of the cushioning member 100 toward the bottom surface 110 of the cushioning member 100, and the bottom of the portion of the internal opening 130 terminates inside the cushioning member 100. The axial direction of interior opening 130 is preferably perpendicular to the direction of bottom surface 110 and top surface 120 of cushioning component 100. Also, the plurality of inner openings 130 are spaced apart from each other at a predetermined distance.

Further, in an alternative implementation, interior opening 130 disposed in bottom surface 110 of cushioning component 100 and interior opening 130 disposed in top surface 120 of cushioning component 100 may terminate in the same plane 140 within cushioning component 100. So as to optimize the internal stress distribution of the cushioning component 100 when being subjected to the external pressure, and to make it deform uniformly.

In the embodiment of the present invention, the aperture of each internal opening 130 may be, for example, 10 to 100mm, and the sum of the opening areas of all the internal openings 130 may account for 20% to 80% of the area of the bottom surface 110 or the top surface 120 of the cushioning member 100, which is not particularly limited in the embodiment of the present invention.

In the embodiment of the present application, when the internal opening 130 adopts the scheme shown in fig. 3, the depth and the layout of the internal opening 130 provided in the bottom surface 110 of the cushioning member 100 and the internal opening 130 provided in the top surface 120 of the cushioning member 100 may be different, so that an upper and lower asymmetrical structure is formed.

It should be added that the shape of the internal opening 130 is not limited in the embodiments of the present application, and the internal opening 130 may be, for example, a circular hole, a square hole, a hexagonal hole, and/or other regular or irregular shaped holes.

Fig. 4 is a schematic structural diagram of a connecting member 200 provided in an embodiment of the present application. As shown in fig. 4, the connecting member 200 includes a bottom plate 210, a top plate 220, and a connecting plate 230, wherein the bottom plate 210 and the top plate 220 are spaced apart from each other and parallel to each other. The connection plate 230 is disposed between the bottom plate 210 and the top plate 220, and has one end connected to the bottom plate 210 and the other end connected to the top plate 220. The bottom plate 210, the top plate 220, and the connecting plate 230 may be connected by welding or the like, or may be manufactured as an integral structure, which is not limited in the embodiment of the present application.

It should be noted that, in the embodiment of the present application, the plate surface shapes of the bottom plate 210 and the top plate 220 are not particularly limited, and the bottom plate 210 and the top plate 220 may be, for example, rectangular plate surfaces, circular plate surfaces, or other regular or irregular plate surfaces.

The base plate 210 of the connection member 200 is provided with at least one first through hole 240, and when the number of the first through holes 240 is plural, the plural first through holes 240 are spaced apart on the base plate 210. The plurality of first through holes 240 are used to penetrate bolts, and thus the distance between two adjacent first through holes 240 is preferably greater than the distance of a wrench space required when the bolts penetrated therethrough are fastened.

In the embodiment of the present application, the number of the first through holes 240 may be related to the area of the bottom plate 210. Generally, the larger the area of the bottom plate 210, the larger the number of the first through holes 240; the smaller the area of the bottom plate 210 is, the smaller the number of the first through holes 240 is.

In an alternative implementation, when the number of the first through holes 240 is plural, the plural first through holes 240 may be arranged in plural rows and/or plural columns on the base plate 210.

The top plate 220 of the connecting member 200 is further provided with at least one stud 250, the at least one stud 250 being provided at a side opposite to the bottom plate 210, and the at least one stud 250 being preferably perpendicular to the top plate 220. When the number of the studs 250 is plural, the plural studs 250 are spaced apart on the bottom plate 210. The plurality of studs 250 are adapted to mate with nuts, and thus the distance between two adjacent studs 250 is preferably greater than the wrench space required for the nuts to mate with.

In the present embodiment, the number of studs 250 may be related to the area of the top plate 220. Generally, the larger the area of the top plate 220, the greater the number of studs 250; the smaller the area of the top plate 220, the fewer the number of studs 250.

In an alternative implementation, when the number of studs 250 is multiple, the multiple studs 250 may be arranged in multiple rows and/or columns on the top plate 220.

In an alternative implementation, the bottom plate 210 of the connecting member 200 is further provided with at least one first guiding piece 260, the at least one first guiding piece 260 is arranged at a side opposite to the top plate 220, one end of the at least one first guiding piece 260 is connected with the bottom plate 210, and the other end of the at least one first guiding piece extends away from the bottom plate 210. The at least one first guide tab 260 is preferably perpendicular to the base plate 210. When the number of the first guide tabs 260 is plural, the plural first guide tabs 260 are spaced apart on the base plate 210.

In an alternative implementation, the first guide tab 260 has a minimum width at an end away from the base plate 210 and a maximum width at an end near the base plate 210, and includes a portion with a gradually decreasing width in a direction away from the base plate 210, forming a guide cone type structure.

In an alternative implementation, the first guide piece 260 and the first through hole 240 may be disposed at different regions on the base plate 210, so that the first guide piece 260 does not cause positional interference with a bolt or the like penetrated through the first through hole 240.

In an alternative implementation, the top plate 220 of the connecting member 200 is further provided with at least one second guiding piece 270, and the at least one second guiding piece 270 is arranged at a side opposite to the bottom plate 210, and has one end connected with the top plate 220 and the other end extending away from the top plate 220. The at least one second guide piece 270 is preferably perpendicular to the top plate 220. When the number of the second guide pieces 270 is plural, the plural second guide pieces 270 are spaced apart on the top plate 220.

In an alternative implementation, the second guide piece 270 has a minimum width at an end away from the top plate 220 and a maximum width at an end near the top plate 220, and includes a portion with a gradually decreasing width in a direction away from the top plate 220, forming a guide cone type structure.

In an alternative implementation, the second guide plate 270 and the stud 250 may be disposed at different regions on the base plate 210, so that the second guide plate 270 does not interfere with the position of a bolt or the like inserted into the first through hole 240.

Fig. 5 is an exploded view of the connection member 200 according to the embodiment of the present application. As shown in FIG. 5, in an alternative implementation, the connection plate 230 may include an outer connection plate 231 and an inner connection plate 232.

Among them, the outer connection plate 231 may be disposed at edges of the bottom plate 210 and the top plate 220, and may be disposed around the edges of the bottom plate 210 and the top plate 220. The outer connecting plate 231 may form an opening at least one side edge of the bottom plate 210 and the top plate 220 so that a wrench may enter the area between the bottom plate 210 and the top plate 220 from the opening. For example, when the bottom plate 210 and the top plate 220 are rectangular plate surfaces, the outer connection plates 231 may be disposed at three sides of the bottom plate 210 and the top plate 220, and an opening may be formed at the remaining one side.

In addition, the inner connection plate 232 may be disposed inside the outer connection plate 231, for example, at a central region of the bottom plate 210 and the top plate 220, for improving rigidity of the central region of the bottom plate 210 and the top plate 220.

In an alternative implementation, the inner connecting plate 232 divides the area between the bottom plate 210 and the top plate 220 into a first sub-area 280 and a second sub-area 290. Wherein the first through hole 240 may be disposed at the bottom plate 210 below the first sub-region 280, the stud 250 may be disposed at the top plate 220 above the first sub-region 280, the first guide tab 260 may be disposed at the bottom plate 210 below the second sub-region 290, and the second guide tab 270 may be disposed at the top plate 220 above the second sub-region 290.

The buffering connecting device provided by the embodiment of the application can be arranged between the modules of two prefabricated modular data centers stacked up and down, and is used for reducing the vibration generated when the modules are hoisted and stacked. However, it should be added that, in addition to the modules of the prefabricated modular data center, the buffer connection device of the embodiment of the present application may be disposed between other devices, modules and product packages stacked up and down, which have requirements for vibration and impact, for example: precision instruments, fragile equipment, heavy equipment, etc., which are not particularly limited in this application.

The installation manner of the buffer connection device according to the embodiment of the present application will be specifically described below by taking the modules of two prefabricated modular data centers stacked up and down as an example, and for convenience of description, the lower module of the two modules stacked up and down will be referred to as a lower module 400, and the upper module will be referred to as an upper module 300.

Fig. 6 is a schematic view of the installation of the lower module 400 and the buffer connecting device according to the embodiment of the present application. As shown in fig. 6, before the upper module 300 is hung, at least one buffer connecting means may be first installed on the top case 410 of the lower module 400, wherein the bottom surface 110 of the buffer member 100 is in contact with the top case 410 and the bottom plate 210 of the connection member 200 is in contact with the top case 410. For example, when the lower module 400 and the upper module 300 are each a rectangular box structure, one buffer connection device may be installed at each corner of the top case surface 410. Cushioning members 100 and connecting members 200 of each cushioning connection arrangement may be adjacently juxtaposed on top lateral surface 410 of lower module 400. In addition, the buffering connection devices can be installed at other positions of the top shell surface 410, which is not limited in the embodiment of the present application, so that at least four buffering connection devices can be used.

Fig. 7 is an enlarged partial cross-sectional view of a lower module 400 and a buffer connecting device according to an embodiment of the present application. As shown in fig. 7, the top case surface 410 of the lower module 400 is provided with at least one second through-hole 420 corresponding to the position and size of the at least one first through-hole 240 of the link member 200, such that the relative position of the lower module 400 and the link member 200 can be defined by using at least one bolt 430 to pass through each corresponding first through-hole 240 and second through-hole 420, respectively, and then screwing a nut 440 into each bolt 430 to fix the link member 200 to the top case surface 410 through a screw coupling. Optionally, a washer 450 may be disposed between the nut 440 and the bottom plate 210 to improve the tightness of the threaded connection.

As further shown in fig. 7, the top case surface 410 of the lower module 400 may be further provided with at least one first guide groove 460 corresponding to the position and size of the at least one first guide tab 260 of the connection member 200, such that the first guide tab 260 of the connection member 200 may be inserted into the first guide groove 460 of the top case surface 410 to guide and position the connection member 200 on the top case surface 410.

As further shown in FIG. 7, when cushioning member 100 is not deformed by a force, the height between bottom surface 110 and top surface 120 of cushioning member 100 is greater than the height between bottom plate 210 and top plate 220 of connecting member 200. Specifically, a height H1 between bottom surface 110 and top surface 120 of cushioning member 100 is greater than a height H2 between a lower surface of bottom plate 210 and an upper surface of top plate 220 of connecting member 200.

In an alternative implementation, height H1 is preferably 10-300 mm higher than height H2.

Fig. 8 is a schematic diagram of hoisting an upper module 300 according to an embodiment of the present application. Referring to fig. 7 and 8, after the lower module 400 is installed with the buffer connecting device according to the embodiment of the present application, the upper module 300 can be lifted above the lower module 400. Since the height H1 between the bottom surface 110 and the top surface 120 of the shock-absorbing member 100 is greater than the height H2 between the lower surface of the bottom plate 210 and the upper surface of the top plate 220 of the link member 200, the bottom case surface 310 of the upper module 300 is first brought into contact with the top surface 120 of the shock-absorbing member 100 during the falling of the upper module 300. The buffer member 100 can absorb the impact generated during the descending process of the upper module 300, and is compressed by the force to deform until the bottom shell surface 310 of the upper module 300 is seated on the top plate 220 of the connecting device, resulting in the state shown in fig. 9.

In an alternative implementation, top surface 120 of cushioning member 100 is preferably flush with the upper surface of top plate 220 of connecting member 200 when cushioning member 100 is subjected to 30% -80% of the weight of upper module 300.

Figure 10 is a partial schematic view of the upper module 300, the lower module 400 and the buffer connection device after installation. As shown in fig. 10, the bottom case surface 310 of the upper module 300 is provided with at least one third through hole 320 corresponding to the position and size of at least one stud 250 of the link 200, such that the relative positions of the upper module 300 and the link 200 can be defined by respectively passing at least one stud 250 through each corresponding third through hole 320, and then screwing a nut 440 into each stud 250 to fix the link 200 to the bottom case surface 310 by means of screw coupling. Optionally, a washer 450 may be disposed between the nut 440 and the bottom shell 310 to improve the tightness of the threaded connection.

As further shown in fig. 10, the bottom case surface 310 of the upper module 300 may further be provided with at least one second guide groove 330 corresponding to the position and size of the at least one second guide tab 270 of the connection part 200, so that the second guide tab 270 of the connection part 200 may be inserted into the second guide groove 330 of the bottom case surface 310 to guide and position the connection part 200 on the bottom case surface 310.

As further shown in fig. 10, after the upper module 300, the lower module 400 and the buffer connection device are installed, the connection member 200 of the buffer connection device is used for bearing the weight of the upper module 300, and the buffer member 100 of the buffer connection device is used for flexibly supporting the upper module 300 and the lower module 400 by using the elasticity of the buffer member itself, so as to buffer the vibration and impact between the upper module 300 and the lower module 400 at any time in the following period.

It can be known from the above technical solutions that the buffer connection device provided in the embodiment of the present application may be disposed between any upper module 300 and any lower module 400 stacked up and down, and when the upper module 300 is hoisted and dropped, the bottom shell surface 310 of the upper module 300 first contacts with the top surface 120 of the buffer component 100, so that the buffer component 100 can absorb the impact generated during the dropping process of the upper module 300, and reduce the vibration of the lower module 400, and the connection component 200 can realize the position limitation after the upper module 300 and the lower module 400 are mounted. Therefore, when the technical scheme of the embodiment of the application is applied to the capacity expansion scene of the prefabricated modular data center, the vibration generated when the modules of the prefabricated modular data center are hoisted and stacked can be reduced, and the online capacity expansion of the prefabricated modular data center is realized.

In another embodiment, the present application further provides a data center, which may be, for example, a prefabricated modular data center, and may include at least two case modules stacked up and down, where at least one buffer connection device provided in an embodiment of the present application is disposed between any two case modules stacked up and down.

The above description is only an embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions within the technical scope of the present disclosure should be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (12)

1. A cushioned connection arrangement, comprising: a cushioning member (100) and a connecting member (200);

the buffer component (100) is a three-dimensional structure made of elastic materials and comprises a bottom surface (110) and a top surface (120) which are arranged in parallel;

the connecting part (200) comprises a bottom plate (210), a top plate (220) and a connecting plate (230), wherein the bottom plate (210) and the top plate (220) are arranged at intervals up and down and are parallel to each other; the connecting plate (230) is disposed between the bottom plate (210) and the top plate (220); one end of the connecting plate (230) is connected with the bottom plate (210), and the other end of the connecting plate is connected with the top plate (220);

wherein, when the buffer component (100) is not deformed by force, the height between the bottom surface (110) and the top surface (120) is larger than the height between the bottom plate (210) and the top plate (220).

2. Cushioned connection arrangement according to claim 1, characterized in that at least one internal opening (130) is provided between said bottom surface (110) and said top surface (120).

3. Cushioned connection arrangement according to claim 2, characterized in that said at least one internal opening (130) extends from said bottom surface (110) to said top surface (120).

4. The cushioned connection arrangement of claim 2, wherein a portion of said at least one interior opening (130) extends from said bottom surface (110) in a direction toward said top surface (120) and terminates within said cushioning component (100); another portion of the at least one interior opening (130) extends from the top surface (120) toward the bottom surface (110) and terminates within the cushioning component (100).

5. The cushioned connection arrangement of claim 2, wherein the sum of the open areas of all of said interior openings (130) is from 20% to 80% of the area of said bottom surface (110) or said top surface (120).

6. Buffer connection device according to any of claims 1 to 5, characterized in that said base plate (210) is provided with at least one first through hole (240), when said first through hole (240) is plural in number, said plural first through holes (240) are spaced apart on said base plate (210), said first through holes (240) being used to effect a threaded connection between said connection member (200) and the connected lower module (400).

7. The buffer connecting device as claimed in any one of claims 1 to 5, wherein the top plate (220) is provided with at least one stud (250), the at least one stud (250) is provided on a side opposite to the bottom plate (210), when the number of studs (250) is plural, the plural studs (250) are spaced on the bottom plate (210), and the studs (250) are used for realizing the threaded connection between the connecting part (200) and the connected upper module (300).

8. A bump-connecting device according to claim 6, characterised in that the bottom plate (210) is provided with at least one first guide tab (260), the at least one first guide tab (260) being provided on the side facing away from the top plate (220), one end being connected to the bottom plate (210) and the other end extending away from the bottom plate (210), the first guide tab (260) being adapted to make a snap-in connection with the lower module (400).

9. A cushioned connection arrangement according to claim 7, wherein said top plate (220) is provided with at least one second guide tab (270), said at least one second guide tab (270) being provided on a side facing away from said bottom plate (210), one end being connected to said top plate (220) and the other end extending away from said top plate (220), said second guide tab (270) being adapted to provide a snap-in connection with said upper module (300).

10. A cushioned connection arrangement according to any of claims 1-5, wherein said connection plate (230) comprises an outer connection plate (231) and an inner connection plate (232); the outer connection plate (231) is disposed at edges of the bottom plate (210) and the top plate (220) and is disposed around edges of the bottom plate (210) and the top plate (220); the inner connection plate (232) is disposed inside the outer connection plate (231).

11. The cushioned connection arrangement of claim 10, wherein said outer attachment panel (231) forms an opening in at least one side edge of said bottom panel (210) and said top panel (220).

12. A data center, comprising: -an upper module (300), a lower module (400) and at least one cushioned connection arrangement as claimed in any one of claims 1 to 11; the upper layer module (300) and the lower layer module (400) are stacked up and down, and the buffer connecting device is arranged between the upper layer module (300) and the lower layer module (400).

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