CN215328344U - Film thickness correction plate and optical direct monitoring coating equipment - Google Patents
Film thickness correction plate and optical direct monitoring coating equipment Download PDFInfo
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- CN215328344U CN215328344U CN202121209496.5U CN202121209496U CN215328344U CN 215328344 U CN215328344 U CN 215328344U CN 202121209496 U CN202121209496 U CN 202121209496U CN 215328344 U CN215328344 U CN 215328344U
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Abstract
The utility model discloses a film thickness correction plate, which is provided with at least one exposure hole for exposing the edge part of a glass substrate, wherein the non-exposure hole part of the film thickness correction plate can completely shield the glass substrate in the radial direction of the glass substrate, and the exposed edge part can be directly monitored in the center to reduce the change of the central wavelength of an optical thin film filter. Meanwhile, the utility model provides optical direct monitoring coating equipment comprising the film thickness correction plate, and the optical direct monitoring coating equipment has the characteristics of direct center monitoring and direct edge monitoring on the same glass substrate by arranging the rotating shaft at a position deviated from the central axis of the vacuum chamber, setting an optical direct monitoring point at the central axis of the vacuum chamber and assisting the film thickness correction plate with an exposure hole, thereby ensuring the high yield of the thin film optical filter, reducing the production cost, ensuring the consistency of the central wavelength distribution of the optical thin film optical filter and having strong practicability.
Description
Technical Field
The utility model belongs to the technical field of optical thin film filters, relates to production equipment of optical thin film filters, and particularly relates to a film thickness correction plate and optical direct monitoring coating equipment.
Background
The optical thin film filter has wide application fields, such as new technical fields of life science fluorescence detection, optical fiber communication wavelength division multiplexing systems, laser radars, human face three-dimensional identification and the like, is a core device and is used for extracting information and improving the signal-to-noise ratio of the system. The optical thin film filter is produced by alternately combining materials with different thicknesses and high and low refractive indexes in a vacuum environment by means of electron beam heating, ion beam sputtering or magnetron sputtering, and has a transmission or reflection effect on a certain section of optical wavelength by the principle of optical interference. The production equipment for producing the optical film sheet is an optical vacuum coating machine, which mainly comprises the following parts: firstly, a vacuum generating and maintaining system; heating and evaporating or sputtering the material; a film layer uniformity correction system; and fourthly, the ion beam auxiliary system for improving the quality of the film.
The high-end thin-film optical filter is produced by imported equipment at present, and optical direct monitoring is the only method for producing the high-end narrow-band optical filter, namely, collimated monitoring light is directly projected onto a glass substrate, is received by a photoelectric detector through the glass substrate, is converted into an electric signal related to the thickness of a thin film, and can achieve accurate film thickness control after being processed by a computer. The technical problem in the field is to improve the consistency of the central wavelength distribution of the optical thin film filter in the glass substrate area. The optical direct monitoring in the current conventional equipment for producing optical thin film filters mainly comprises the following two methods:
(1) edge transmission direct monitoring mode:
as shown in figure 1, a glass substrate is placed on a workpiece frame 1, the workpiece frame 1 rotates around a rotating shaft 9 positioned on a central shaft of the device, electron guns 2 and 3 work alternately, materials with high refractive index and low refractive index are deposited on the glass substrate through evaporation, an ion source 4 works to generate ion beams, film materials deposited on the glass substrate are bombarded, and the film forming quality is improved. The film thickness correction plates 5 and 6 are arranged below the workpiece rack 1; the bracket for mounting the correction plate is generally placed on the side wall of the vacuum chamber 7, and has two types of fixing and moving, and the moving type has good correction effect; the monitoring light source 8 (which can be a bulb or a light source led from the outside) is arranged on the back of a certain film thickness correction plate, is electrified to emit light, is received by the optical fiber probe 10 through the glass substrate, can perform information processing through a photoelectric conversion mode, converts an optical signal into an electric signal related to the film thickness, and is automatically judged by equipment after being calculated by software so as to achieve the aim of accurate control. A representative device of this structure is an OTFC-1300 device with direct control of the japanese optical relaxation.
When the glass substrate is large, film formation is carried out by using electron beam evaporation or direct monitoring of ion beam sputtering edge transmission, as shown in the forms shown in FIGS. 2 and 3. As shown in fig. 3, the ion beam sputtering is performed by bombarding the surface of the target 11 with high-energy ions or atoms generated by an ion source 4, sputtering the target material in the form of single atom or multi-atom group, depositing the target material on the glass substrate 12, and performing correction with a film thickness correction plate 5, 6 disposed below the glass substrate 12 to achieve uniform wavelength in a certain region of the monitoring point. In fig. 3, laser passes through the fiber probe 10 and is projected onto the glass substrate 12, then passes through the vacuum chamber 7, is reflected by the reflector 13 and then is received by the detector 14, and is converted into an electrical signal related to the optical film thickness, and the purpose of monitoring the film thickness can be achieved through the change of the electrical signal.
As can be seen from the above, the current edge transmission direct monitoring method has the following characteristics:
1. the rotation axis 9 of the glass substrate 12 coincides with the geometric central axis of the apparatus;
2. the glass substrate 12 is rotated about the geometric center axis of the apparatus;
3. because the positions of the high-refractive-index material and the low-refractive-index material at different moments are different, the thicknesses of the films deposited at different moments are different, and the uniformity of the thickness distribution of the film needs to be corrected by a film thickness correction plate;
4. the film thickness correction plate is generally of a sheet type, different positions have different sizes, and the uniformity of the film is calibrated by adjusting the size of the correction plate, so that the film thickness correction plate is not easy to adjust and is easy to change;
5. the film formation is large-area deposition;
6. the optical monitoring position, i.e. the fiber probe 10 is not at the geometric center of the device, but at the edge, is called edge direct monitoring.
(2) The center direct monitoring mode:
as shown in fig. 4, the center of the glass substrate 12 substantially coincides with the center of rotation of the apparatus, the electron guns (or ion beam sputtering) 2, 3 deposit film atoms/molecules onto the glass substrate 12, and the ion source 4 is used to promote fine correction of film quality and film thickness. In the optical monitoring system, light emitted by a light source is coupled into an optical fiber, becomes collimated light after passing through an optical fiber collimator 15, is projected onto a glass substrate 12, then penetrates out of a vacuum chamber 7, is received by a detector 14 after being reflected by a reflector 13, is converted into an electric signal related to the thickness of an optical film, and the purpose of monitoring the thickness of the film can be achieved through the change of the electric signal.
In the monitoring mode, the optical monitoring position (namely the optical fiber probe 10) and the glass substrate 12 are both positioned at the center, and the advantages that after the two materials are rotated and averaged, the distribution with small central wavelength change and high film thickness uniformity of the thin film optical filter is easily obtained at the middle part; but the effective area of the formed film is small, the characteristic of the optical filter far away from the central area is quickly degraded, the yield is low, and the cost is high. At present, DWDM diaphragms for optical communication, which have high requirements on wavelength uniformity, are generally produced by adopting the structure.
By comparing the two direct monitoring modes, the edge direct control mode has the advantages of large film forming area, high production efficiency, large central wavelength change, poor stability and correction of film thickness uniformity by a correction plate; the center direct control mode has small film forming area, low production efficiency, small central wavelength change, good stability, no correction plate and fine adjustment of film thickness uniformity by an ion source. Therefore, the advantages and disadvantages of the conventional edge direct control method and the central direct control method are mutually opposite and incompatible, and how to provide a scheme that can ensure high yield and large film formation area of the thin film optical filter and also can give consideration to better wavelength uniformity is a difficult problem to be solved in the field at present.
SUMMERY OF THE UTILITY MODEL
An object of the present invention is to provide a film thickness correcting plate for reducing a central wavelength variation of an optical thin film filter.
In order to achieve the purpose, the utility model provides the following scheme:
the utility model provides a film thickness correcting plate which is used for being installed in front of a glass substrate, wherein the film thickness correcting plate and the glass substrate are arranged at intervals; the film thickness correction plate is provided with at least one exposure hole, and the exposure hole is used for exposing the edge part of the glass substrate so as to enable the exposed edge part to be directly monitored in the center; the non-exposed hole portion of the film thickness correction plate can shield the entire glass substrate in the radial direction of the glass substrate.
Optionally, any of the exposure holes is a fan-shaped exposure hole with an opening angle of 0-360 °. And any exposed hole is not a notch, namely the outer ring of the film thickness correction plate is continuous, so that the strength of the correction plate can be ensured, and the correction plate is ensured not to deform in the using process.
Optionally, the film thickness correction plate is a circular correction plate, and the circle center of the circular correction plate and the vertex of any sector exposure hole are both located on a straight line where the rotation axis of the glass substrate is located.
Optionally, both side edges of the fan-shaped exposure hole are curved in an arbitrary shape.
The utility model also aims to provide optical direct monitoring coating equipment to solve the problem that the central wavelength uniformity and the effective film forming area of the existing thin film optical filter cannot be considered at the same time. The specific scheme is as follows:
an optical direct monitoring coating equipment comprising the film thickness correction plate comprises a vacuum chamber and an optical monitoring system, wherein a rotating shaft of the glass substrate is arranged by deviating from a central shaft of the vacuum chamber; the film thickness correction plate is installed in front of the glass substrate, and the exposure hole exposes the edge part of the glass substrate; collimated light formed in the optical monitoring system passes through the exposure hole and is coincident with the central axis, so that the edge part of the glass substrate exposed to the exposure hole is directly monitored by the optical monitoring system; the glass substrate shielded by the film thickness correction plate deviates from the collimated light to be directly monitored at the edge by the optical monitoring system.
Optionally, the film thickness correction plate is mounted on an inner top wall or an inner side wall of the vacuum chamber through a bracket.
Optionally, the glass substrate rotates around the rotating shaft at a rotating speed of 10-1200 rpm.
Optionally, the optical monitoring system includes a light source, an optical fiber, and an optical fiber collimator and a detector connected to the optical fiber; the light source and the detector are respectively positioned at two ends of the axial direction of the vacuum chamber, and light emitted by the light source is coupled into the optical fiber, is changed into collimated light through the optical fiber collimator, and sequentially penetrates through the glass substrate and the vacuum chamber; the detector is used for receiving collimated light penetrating out of the vacuum chamber.
Optionally, the collimated light emitting direction of the optical fiber collimator is perpendicular to the collimated light receiving direction of the detector, and a reflecting mirror for changing the collimated light emitting path is disposed in front of the detector. The light emitted by the light source is coupled into the optical fiber, becomes collimated light after passing through the optical fiber collimator, is projected onto the glass substrate and then penetrates out of the vacuum chamber; the collimation light penetrating out of the vacuum chamber is reflected by the reflecting mirror and then received by the detector.
Optionally, a collimated light emitting direction of the optical fiber collimator coincides with a collimated light receiving direction of the detector, light emitted by the light source is coupled into the optical fiber, and is changed into collimated light after passing through the optical fiber collimator, and the collimated light is projected onto the glass substrate and then penetrates out of the vacuum chamber; collimated light that penetrates out of the vacuum chamber is received directly by the detector.
Compared with the prior art, the utility model has the following technical effects:
according to the film thickness correction plate provided by the utility model, the exposure holes are arranged to expose partial edge parts of the glass substrate, so that the exposed edge parts can be directly monitored in the center, the change of the center wavelength of the optical thin film filter is reduced, and the integral center wavelength distribution uniformity of the optical thin film filter is favorably improved.
The optical direct monitoring coating equipment provided by the utility model has reasonable structural arrangement, can simultaneously carry out center direct monitoring and edge direct monitoring on the same glass substrate by arranging the rotating shaft at the position deviating from the central axis of the vacuum chamber, setting the optical direct monitoring point at the position of the central axis of the vacuum chamber or the position close to the central axis of the vacuum chamber and assisting the film thickness correction plate with the exposure hole, finally achieves the purposes of small central wavelength change and larger film forming area of the thin film filter in a monitored area, can ensure the high yield of the thin film optical filter, reduce the production cost, can ensure the consistency of the central wavelength distribution of the optical thin film filter, effectively overcomes the industrial pain point of poor central wavelength uniformity and small effective film forming area of the existing narrow-band optical filter, and can meet the requirement of higher wavelength uniformity of the existing optical system on the optical thin film filter, the practicability is strong.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic diagram of an optical direct monitoring coating apparatus using edge transmission direct monitoring in the prior art;
FIG. 2 is a schematic view of another optical direct monitoring coating apparatus using edge transmission direct monitoring in the prior art;
FIG. 3 is a schematic view of another optical direct-monitoring coating apparatus using edge transmission direct monitoring in the prior art;
FIG. 4 is a schematic view of an optical direct monitoring coating apparatus using a central direct monitoring method in the prior art;
FIG. 5 is a front view of an optical direct monitoring coating apparatus according to an embodiment of the present invention;
FIG. 6 is a top view of an optical direct monitor coating apparatus according to an embodiment of the present invention;
FIG. 7 is an assembled top view of a circular corrector plate as disclosed in an embodiment of the present invention;
FIG. 8 is an assembled bottom view of a circular corrector plate as disclosed in an embodiment of the present invention;
wherein the reference numerals are:
1-a workpiece holder; 2. 3-an electron gun; 4-an ion source; 5. 6-film thickness correction plate; 7-vacuum chamber; 8-a light source; 9-a rotating shaft; 10-a fiber optic probe; 11-a target material; 12-a glass substrate; 13-a mirror; 14-a detector; 15-a fiber collimator;
16-round correction plates; 17-sector exposure holes; 18-a monitoring point; 19-a fixation hole; 20-collimated light; 21-central axis.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
An object of the present invention is to provide a film thickness correcting plate for reducing a central wavelength variation of an optical thin film filter.
Another objective of the present invention is to provide an optical direct monitoring coating apparatus including the above-mentioned film thickness correction plate, so as to thoroughly overcome the problem that the central wavelength uniformity and the effective film forming area of the existing thin film optical filter cannot be considered at the same time.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
Example one
As shown in fig. 7 to 8, the present embodiment provides a film thickness correction plate, which may be a regular shape including a circle, a square, or the like, or an irregular polygon or other shape. The film thickness correction plate is used for being installed in front of the glass substrate 12, and the film thickness correction plate and the glass substrate 12 are arranged at intervals; the film thickness correction plate is provided with at least one exposure hole, and the exposure hole is used for exposing the edge part of the glass substrate 12, so that the exposed edge part and collimated light emitted by an optical monitoring system in the optical direct monitoring coating equipment form a similar coaxial line, and the exposed edge part is directly monitored in the center. The central direct monitoring mode can reduce the central wavelength change of the edge part of the optical thin film filter and is beneficial to improving the integral central wavelength distribution uniformity of the optical thin film filter. The non-exposed hole part of the film thickness correction plate can completely shield the glass substrate 12 in the radial direction of the glass substrate 12, so as to avoid causing uneven central wavelength distribution of the edge part of the optical thin film filter. The "front" means that the film thickness correction plate is provided between the glass substrate 12 and the electron gun (or ion source).
In this embodiment, the exposure holes may be in the shape of a fan or other shapes including a long strip. As shown in fig. 7 to 8, in the present embodiment, it is preferable that any of the exposure holes is a fan-shaped exposure hole 17 having an opening angle of 0 ° to 360 °. Wherein the opening angle lambda can be changed within the range of 0-360 degrees. Moreover, any exposed hole is not a notch, that is, as shown in fig. 7-8, the outer ring of the film thickness correction plate is continuous, so that the strength of the correction plate can be ensured, and the correction plate is ensured not to deform in the using process.
In this embodiment, as shown in fig. 7 to 8, as a preferred mode, the glass substrate 12 is a circular glass substrate, the film thickness correction plate is a circular correction plate 16, at least one fan-shaped exposure hole 17 is formed in the circular correction plate 16, a center of the circular correction plate 16 and a vertex of any fan-shaped exposure hole 17 are located on a straight line where the rotating shaft 9 of the glass substrate 12 is located, and a circular arc line of any fan-shaped exposure hole 17 is located in an edge of the circular correction plate 16, so as to ensure that the edge of the circular correction plate 16 is continuous. Of course, the center of the circle of the circular correction plate 16 may be located away from the straight line on which the rotation shaft 9 is located, and the apex of any of the fan-shaped exposure holes 17 may be located away from the center of the circle of the circular correction plate 16. In practical operation, when only one fan-shaped exposing hole 17 is formed on the circular correcting plate 16, the opening angle thereof can be set larger; when the circular correction plate 16 is provided with more than two fan-shaped exposing holes 17, the opening angle of any fan-shaped exposing hole 17 can be relatively smaller, the opening angles of any two fan-shaped exposing holes 17 can be the same or different, and the more than two fan-shaped exposing holes 17 can be uniformly or non-uniformly arranged in the circumferential direction. In the present embodiment, as a preferable mode, when the circular correction plate 16 is provided with two or more fan-shaped exposure holes 17, the central wavelength distribution of the filter can be finely adjusted; and the opening angles of any two fan-shaped exposing holes 17 are the same and are uniformly distributed on the circular correcting plate 16 in the circumferential direction. In addition, when the exposure holes are in shapes other than fan-shaped, the number, the positions, and the distribution of the plurality of exposure holes on the circular correction plate 16 can be referred to, but not limited to, the fan-shaped exposure holes 17.
In this embodiment, as shown in fig. 7 to 8, both side edges of the fan-shaped exposure holes 17 may be curved in any shape, such as a straight line, a zigzag line, or a wavy line. By setting both sides of the fan-shaped exposure hole 17 to be curved, the purpose of correcting the film thickness can be sufficiently achieved, the change of the center wavelength of the thin film filter is small, and the center wavelength uniformity is high.
The present invention further provides an optical direct monitoring coating apparatus including the above-mentioned film thickness correction plate, wherein:
as shown in fig. 6, the rotation axis 9 of the glass substrate 12 is disposed offset from the central axis 21 of the vacuum chamber 7; the central axis 21 is not limited to an axis which is the most central position of the vacuum chamber 7 in a strict sense, and may be deviated from the most central position of the vacuum chamber 7, and the "center" in the central axis 21 is a relative term, not an absolute position; the film thickness correction plate is installed in front of the glass substrate 12, and the exposure hole exposes the edge part of the glass substrate 12;
the "front" means that the film thickness correction plate is disposed between the glass substrate 12 and the electron gun (or ion source), and when the optical direct monitoring coating apparatus is in a vertical structure as shown in fig. 5, the film thickness correction plate is disposed below the glass substrate 12; when the optical direct monitoring coating device rotates 90 degrees counterclockwise from the vertical structure shown in fig. 5 to the horizontal structure, the film thickness correction plate can be called as a film thickness correction plate disposed on the right side of the glass substrate 12;
the collimated light 20 formed in the optical monitoring system, i.e. the monitoring point 18, coincides with the central axis 21 and allows deviations.
In this embodiment, the film thickness correction plate is mounted on the inner side wall of the vacuum chamber 7 through a bracket, or suspended from the inner ceiling wall of the vacuum chamber 7. The film thickness correction plate is provided with a fixing hole 19 for fixedly connecting with the bracket through a bolt or a screw. The film thickness correction plate may be movably mounted on the inner wall or the inner ceiling of the vacuum chamber 7.
In the present embodiment, the edge portion of the glass substrate 12 exposed by the exposure hole is passed through by the collimated light 20 of the optical monitoring system to form a coaxial-like structure for the optical monitoring system to perform relative center direct monitoring of the exposed portion; the non-exposed hole part of the film thickness correction plate reserves the normal film thickness correction function of the existing film thickness correction plate, the glass substrate 12 shielded by the film thickness correction plate is arranged to deviate from the optical monitoring system, namely the glass substrate 12 shielded by the film thickness correction plate is not penetrated by collimated light 20, the part of the glass substrate shielded by the film thickness correction plate is arranged eccentrically to the optical monitoring system, the optical monitoring system is used for directly monitoring the relative edge of the shielded part, and the film thickness correction plate is used for correcting the film forming thickness of the part.
In this embodiment, the glass substrate 12 is preferably rotated around the rotation axis 9 at a rotation speed of 10 to 1200 rpm.
In this embodiment, light emitted from the light source 8 of the optical monitoring system is coupled into an optical fiber, passes through the optical fiber collimator 15, becomes collimated light 20, is projected onto the glass substrate 12, and then penetrates out of the bottom plate of the vacuum chamber 7; the collimated light 20 that has penetrated out of the vacuum chamber 7 is reflected by the mirror 13 and received by the detector 14. As an optimized and simplified arrangement it is also possible to omit the mirror 13 and move the detector 14 to a coaxial arrangement with the collimated light 20 so that the detector 14 directly receives the collimated light 20 penetrating out of the vacuum chamber 7.
In fig. 5, "20 (21)" means that the portion of the lead line is the collimated light 20 or the central axis 21, and the collimated light 20 and the central axis 21 are superimposed on each other, and therefore, they are the same straight line in the view of the figure. Similarly, "21 (18)" in fig. 6 indicates that the portion indicated by the lead is the central axis 21 or the monitor point 18, and since the monitor point 18 is shown as being provided on the central axis 21, the two points are the same as each other in the drawing.
In the film thickness correction plate provided in this embodiment, the exposure hole is disposed to expose a part of the edge portion of the glass substrate, so that the exposed edge portion can be directly monitored in the center, thereby reducing the change of the center wavelength of the optical thin film filter and facilitating the improvement of the uniformity of the distribution of the center wavelength of the whole optical thin film filter.
Meanwhile, the optical direct monitoring coating equipment provided by the embodiment has reasonable structural arrangement, can simultaneously carry out center direct monitoring and edge direct monitoring on the same glass substrate by arranging the rotating shaft at the position deviating from the central axis of the vacuum chamber, setting the optical direct monitoring point at the position of the central axis of the vacuum chamber or the position close to the central axis of the vacuum chamber and assisting the film thickness correction plate with the exposure hole, finally achieves the purposes of small central wavelength change and larger film forming area of the thin film filter in a monitored area, can ensure the high yield of the thin film optical filter, reduce the production cost, can ensure the consistency of the central wavelength distribution of the optical thin film filter, effectively overcomes the industrial pain points of poor central wavelength uniformity and small effective film forming area of the existing narrow-band filter, and can meet the requirement of the existing optical system on higher wavelength uniformity of the optical thin film filter, the practicability is strong.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein, and any reference signs in the claims are not intended to be construed as limiting the claim concerned.
The principle and the implementation mode of the utility model are explained by applying a specific example, and the description of the embodiment is only used for helping to understand the method and the core idea of the utility model; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed. In view of the above, the present disclosure should not be construed as limiting the utility model.
Claims (10)
1. A film thickness correction plate is used for being installed in front of a glass substrate and is characterized in that the film thickness correction plate and the glass substrate are arranged at intervals; the film thickness correction plate is provided with at least one exposure hole, and the exposure hole is used for exposing the edge part of the glass substrate so as to enable the exposed edge part to be directly monitored in the center; the non-exposed hole portion of the film thickness correction plate can shield the entire glass substrate in the radial direction of the glass substrate.
2. The film thickness correction plate according to claim 1, wherein any of the exposure holes is a fan-shaped exposure hole having an opening angle of 0 ° to 360 °.
3. The film-thickness correction plate according to claim 2, wherein the film-thickness correction plate is a circular correction plate, and a center of the circular correction plate and a vertex of any of the fan-shaped exposure holes are located on a straight line on which a rotation axis of the glass substrate is located.
4. The film-thickness correction plate according to claim 2, wherein both side edges of the fan-shaped exposure hole are curved in an arbitrary shape.
5. An optical direct-monitoring coating apparatus including the film-thickness correction plate according to any one of claims 1 to 4, comprising a vacuum chamber and an optical monitoring system, wherein:
the rotating shaft of the glass substrate is arranged to deviate from the central shaft of the vacuum chamber;
the film thickness correction plate is installed in front of the glass substrate, and the exposure hole exposes the edge part of the glass substrate;
collimated light formed in the optical monitoring system passes through the exposure hole and is coincident with the central axis, so that the edge part of the glass substrate exposed to the exposure hole is directly monitored by the optical monitoring system; the glass substrate shielded by the film thickness correction plate deviates from the collimated light to be directly monitored at the edge by the optical monitoring system.
6. The optical direct-monitoring coating device according to claim 5, wherein the film thickness correction plate is mounted on the inner top wall or the inner side wall of the vacuum chamber through a bracket.
7. The optical direct-monitoring coating device according to claim 5, wherein the glass substrate is rotated around the rotation axis at a rotation speed of 10 to 1200 rpm.
8. The optical direct monitoring coating device of claim 5, wherein the optical monitoring system comprises a light source, an optical fiber, a fiber collimator connected to the optical fiber, and a detector; the light source and the detector are respectively positioned at two ends of the axial direction of the vacuum chamber, and light emitted by the light source is coupled into the optical fiber, is changed into collimated light through the optical fiber collimator, and sequentially penetrates through the glass substrate and the vacuum chamber; the detector is used for receiving collimated light penetrating out of the vacuum chamber.
9. The optical direct monitoring coating equipment according to claim 8, wherein the collimated light emission direction of the optical fiber collimator is perpendicular to the collimated light receiving direction of the detector, and a reflector for changing the collimated light emission path is arranged in front of the detector.
10. The optical direct-monitoring coating device of claim 8, wherein the emission direction of the collimated light of the optical fiber collimator coincides with the receiving direction of the collimated light of the detector, and the detector can directly receive the collimated light penetrating out of the vacuum chamber.
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