CN215320012U - Secondary vulcanization device for rubber air film of semiconductor polishing head - Google Patents
Secondary vulcanization device for rubber air film of semiconductor polishing head Download PDFInfo
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- CN215320012U CN215320012U CN202121305155.8U CN202121305155U CN215320012U CN 215320012 U CN215320012 U CN 215320012U CN 202121305155 U CN202121305155 U CN 202121305155U CN 215320012 U CN215320012 U CN 215320012U
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- box
- vulcanization
- rubber air
- air film
- placing
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Abstract
The utility model discloses a secondary vulcanization device for a rubber air film of a semiconductor polishing head, which comprises a vulcanization box, wherein a box door is installed on the side surface of the vulcanization box, a plurality of placing plates are installed inside the vulcanization box, the placing plates are all connected to the inner surface of the vulcanization box in a sliding mode through a limiting assembly, a placing box is fixedly connected to the top surface of the vulcanization box, the side surface of the vulcanization box is fixedly connected with an installation frame through two connecting rods, and a conveying belt is installed on the installation frame. The utility model replaces the traditional manual feeding mode, lightens the labor intensity of workers, improves the feeding efficiency of the rubber air film, can also improve the sealing performance of the joint of the box door and the vulcanizing box, prevents hot air from leaking from the joint of the box door and the vulcanizing box, and ensures the vulcanizing effect of the rubber air film.
Description
Technical Field
The utility model relates to the technical field of rubber vulcanization, in particular to a secondary vulcanization device for a rubber air film of a semiconductor polishing head.
Background
The vulcanizer is a machine for vulcanizing various rubber and plastics, and has the functions of timing mould locking, automatic pressure supplementing, automatic temperature control, automatic timing, time-up alarm and the like, and the vulcanizer adopts three modes of electric heating, steam heating and heat-conducting oil heating.
In the process of producing the rubber air film of the semiconductor polishing head, a vulcanizing machine is required to be used for carrying out secondary vulcanization on the rubber air film, the vulcanizing machine in the prior art needs workers to place the rubber air film on the vulcanizing machine in the using process, the time and physical strength of the workers are wasted in the mode, the feeding efficiency of the rubber air film is reduced, inconvenience is brought to the using process of the device, and therefore the secondary vulcanization device of the rubber air film of the semiconductor polishing head is required to be designed to solve the problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the defects in the prior art and provides a secondary vulcanization device for a rubber air film of a semiconductor polishing head.
In order to achieve the purpose, the utility model adopts the following technical scheme:
a secondary vulcanization device for a rubber air film of a semiconductor polishing head comprises a vulcanization box, wherein a box door is installed on the side surface of the vulcanization box, an ethane disinfection chamber is arranged inside the vulcanization box, a plurality of placing plates are installed inside the vulcanization box, the placing plates are all connected to the inner surface of the vulcanization box in a sliding mode through limiting assemblies, a placing box is fixedly connected to the top surface of the vulcanization box, a mounting frame is fixedly connected to the side surface of the vulcanization box through two connecting rods, and a conveying belt is installed on the mounting frame;
the bottom surface of the placing box is fixedly communicated with a corrugated pipe, and a valve is installed on the corrugated pipe.
Preferably, spacing subassembly includes two mounting panels, two spouts and two sliders, two the equal fixed connection of mounting panel is in the inner face of vulcanization case, two the top surface at two mounting panels is seted up respectively to the spout, two slider sliding connection respectively is in two spouts, and two sliders fixed connection respectively place the both ends of board bottom surface.
Preferably, a plurality of the cross-sections of spout and a plurality of slider all are T type structure, and a plurality of the side of slider all laminates with the inner face that corresponds the spout mutually.
Preferably, one end of the conveying belt and the bottom end of the vulcanizing box are located at the same height, and the other end of the conveying belt is located right above the placing box.
Preferably, a sealing ring is bonded to a side surface of the box door, and the sealing ring is made of a high-temperature-resistant rubber material.
The utility model has the following beneficial effects:
1. by arranging the conveying belt, a worker can start the conveying belt and place a rubber air film to be treated on the conveying belt, the rubber air film can be conveyed into the placing box under the action of the conveying belt, then the worker can pull open the placing plates in turn and move the corrugated pipe to enable the pipe orifice of the corrugated pipe to be aligned with the placing plate, then the valve is opened, the rubber air film in the placing box can fall on the placing plate through the corrugated pipe, the operation is repeated on the placing plates, the feeding of rubber products can be realized, the traditional manual feeding mode is replaced, the labor intensity of the worker is reduced, and the feeding efficiency of the rubber air film is improved;
2. through setting up the sealing washer, bond the sealing washer on the chamber door and can improve the sealing performance of chamber door and vulcanization case junction, prevent that the hot gas flow from taking place to reveal from chamber door and vulcanization case junction, guarantee the vulcanization effect to rubber gas film.
Drawings
FIG. 1 is a schematic structural diagram of a secondary vulcanization device for a rubber air film of a semiconductor polishing head according to the present invention;
FIG. 2 is a side view of a secondary vulcanization device for a rubber air film of a semiconductor polishing head according to the present invention;
FIG. 3 is an enlarged view of the structure at the position A of the secondary vulcanization device for the rubber air film of the semiconductor polishing head according to the present invention.
In the figure: 1 vulcanizing box, 2 placing plate, 3 placing box, 4 ethane sterilizing chamber, 5 mounting rack, 6 conveying belt, 7 box door, 8 sealing ring, 9 corrugated pipe, 10 valve, 11 limiting component, 111 mounting plate, 112 chute and 113 sliding block.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-3, a secondary vulcanization device for a rubber gas film of a semiconductor polishing head comprises a vulcanization box 1, a box door 7 is installed on the side surface of the vulcanization box 1, a sealing ring 8 is bonded on the side surface of the box door 7, the sealing performance of the joint of the box door 7 and the vulcanization box 1 can be improved, hot air flow is prevented from leaking from the joint of the box door 7 and the vulcanization box 1, the vulcanization effect on the rubber gas film is ensured, the sealing ring 8 is made of high-temperature-resistant rubber materials, the loss rate of high temperature in the vulcanization box 1 to the sealing ring 8 is reduced, the service life of the sealing ring 8 is prolonged, an ethane disinfection chamber 4 is arranged inside the vulcanization box 1, a worker can place the rubber gas film in the ethane disinfection chamber 4 for disinfection, a plurality of placing plates 2 are installed inside the vulcanization box 1, a plurality of through holes are formed in the placing plates 2, the placing plates 2 are all connected to the inner surface of the vulcanization box 1 in a sliding mode through a limiting component 11, the limiting component 11 comprises two mounting plates 111, two sliding chutes 112 and two sliding blocks 113, wherein the two mounting plates 111 are fixedly connected to the inner surface of the vulcanizing tank 1, the two sliding chutes 112 are respectively arranged on the top surfaces of the two mounting plates 111, the two sliding blocks 113 are respectively connected to the two sliding chutes 112 in a sliding manner, the cross sections of the sliding chutes 112 and the sliding blocks 113 are in a T-shaped structure, the sliding blocks 113 are placed to fall off from the corresponding sliding chutes 112, the side surfaces of the sliding blocks 113 are respectively attached to the inner surfaces of the corresponding sliding chutes 112, so as to ensure the stability of the sliding blocks 113 moving in the corresponding sliding chutes 112, the two sliding blocks 113 are respectively and fixedly connected to the two ends of the bottom surface of the placing plate 2, the top surface of the vulcanizing tank 1 is fixedly connected with the placing box 3, the side surface of the vulcanizing tank 1 is fixedly connected with a mounting frame 5 through two connecting rods, a conveying belt 6 is arranged on the mounting frame 5, and one end of the conveying belt 6 is at the same height as the bottom end of the vulcanizing tank 1, the other end of the conveying belt 6 is positioned right above the placing box 3;
the bottom surface of the placing box 3 is fixedly communicated with a corrugated pipe 9, a valve 10 is installed on the corrugated pipe 9, and the valve 10 is in a closed state in an initial state.
When the rubber product feeding device is used, a worker can place the rubber gas film in the ethane disinfection chamber 4 for disinfection, then the worker can start the conveying belt 6 and place the disinfected rubber gas film on the conveying belt 6, the rubber gas film can be conveyed into the placing box 3 under the action of the conveying belt 6, then the worker can pull the placing plates 2 open according to the above, move the corrugated pipe 9 to enable the pipe orifice of the corrugated pipe 9 to be aligned with the placing plate 2, then open the valve 10, the rubber gas film in the placing box 3 can fall on the placing plate 2 through the corrugated pipe 9, and the operation is repeated on the placing plates 2, so that feeding of rubber products can be achieved.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.
Claims (5)
1. The secondary vulcanization device for the rubber air film of the semiconductor polishing head comprises a vulcanization box (1), wherein a box door (7) is installed on the side face of the vulcanization box (1), and is characterized in that an ethane disinfection chamber (4) is arranged inside the vulcanization box (1), a plurality of placing plates (2) are installed inside the vulcanization box (1), the placing plates (2) are all connected to the inner face of the vulcanization box (1) in a sliding mode through a limiting assembly (11), a placing box (3) is fixedly connected to the top face of the vulcanization box (1), a mounting frame (5) is fixedly connected to the side face of the vulcanization box (1) through two connecting rods, and a conveying belt (6) is installed on the mounting frame (5);
the bottom surface of the placing box (3) is fixedly communicated with a corrugated pipe (9), and a valve (10) is installed on the corrugated pipe (9).
2. The secondary vulcanization device for rubber air films of semiconductor polishing heads according to claim 1, wherein the limiting assembly (11) comprises two mounting plates (111), two sliding grooves (112), and two sliding blocks (113), wherein the two mounting plates (111) are both fixedly connected to the inner surface of the vulcanization box (1), the two sliding grooves (112) are respectively formed on the top surfaces of the two mounting plates (111), the two sliding blocks (113) are respectively slidably connected in the two sliding grooves (112), and the two sliding blocks (113) are respectively fixedly connected to the two ends of the bottom surface of the placing plate (2).
3. The secondary vulcanization device for rubber air film of semiconductor polishing head according to claim 2, wherein the cross-sections of the plurality of sliding grooves (112) and the plurality of sliders (113) are T-shaped, and the side surfaces of the plurality of sliders (113) are attached to the inner surfaces of the corresponding sliding grooves (112).
4. The secondary vulcanization device for rubber air film of semiconductor polishing head according to claim 1, characterized in that one end of the conveyor belt (6) is located at the same height as the bottom end of the vulcanization box (1), and the other end of the conveyor belt (6) is located directly above the placing box (3).
5. The secondary vulcanization device for rubber air film of semiconductor polishing head according to claim 1, characterized in that a sealing ring (8) is bonded to a side surface of the chamber door (7), and the sealing ring (8) is made of high temperature resistant rubber material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121305155.8U CN215320012U (en) | 2021-06-10 | 2021-06-10 | Secondary vulcanization device for rubber air film of semiconductor polishing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121305155.8U CN215320012U (en) | 2021-06-10 | 2021-06-10 | Secondary vulcanization device for rubber air film of semiconductor polishing head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215320012U true CN215320012U (en) | 2021-12-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121305155.8U Active CN215320012U (en) | 2021-06-10 | 2021-06-10 | Secondary vulcanization device for rubber air film of semiconductor polishing head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215320012U (en) |
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2021
- 2021-06-10 CN CN202121305155.8U patent/CN215320012U/en active Active
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