CN215297893U - Light emission module, 3D imaging module and electronic equipment - Google Patents
Light emission module, 3D imaging module and electronic equipment Download PDFInfo
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- CN215297893U CN215297893U CN202120463186.XU CN202120463186U CN215297893U CN 215297893 U CN215297893 U CN 215297893U CN 202120463186 U CN202120463186 U CN 202120463186U CN 215297893 U CN215297893 U CN 215297893U
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Abstract
The embodiment of the application discloses optical transmission module, 3D formation of image module and electronic equipment. Wherein, the optical transmission module includes: a diffractive component; a light source located on one side of the diffractive component; and the glue material is positioned between the light source and the diffraction assembly so as to fix the light source on one side of the diffraction assembly, the glue material is an optical glue material with the refractive index smaller than the refractive index of the diffraction assembly by 0.2-0.4, the light source is used for emitting preset light, and the preset light can be emitted to an external object through the glue material and the diffraction assembly. The efficiency loss of light after penetrating through the diffraction assembly can be effectively reduced, and the efficiency of the 3D imaging module under the screen is improved.
Description
Technical Field
The application relates to the field of 3D sensing, especially, relate to a light emission module, 3D formation of image module and electronic equipment.
Background
This section provides background information related to the present disclosure only and is not necessarily prior art.
The mainstream technologies of three-dimensional sensing (3D sensing) are time of flight (TOF) and structured light (structured light) technologies. In the structured light technology, an infrared light source (IR source) is mainly used for irradiation or laser is projected to a diffraction element (DOE) to generate diffraction pattern light and irradiate the diffraction pattern light on an object, an optical imaging module is used for collecting reflected light of the object, and delay or phase difference occurs between the reflected light of different positions of the object, so that delay or phase difference information can be calculated according to the reflected light, and 3D sensing is achieved. However, in the prior art, the 3D imaging module is designed to be attached to a single layer, and the loss of the light source directly passing through the diffraction element is large, which may affect the performance of the 3D imaging module under the screen, and therefore, how to improve the light utilization rate in the 3D imaging module is an important problem in the industry.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a light emission module, 3D imaging module and electronic equipment, can effectively reduce the efficiency loss after the light penetrates the diffraction subassembly, improves the efficiency of 3D imaging module under the screen. The technical scheme is as follows:
in a first aspect, an embodiment of the present application provides an optical transmission module, including:
a diffractive component;
a light source located on one side of the diffractive component;
a glue material positioned between the light source and the diffraction element to fix the light source at one side of the diffraction element, the glue material being an optical glue material having a refractive index 0.2 to 0.4 smaller than that of the diffraction element,
the light source is used for emitting preset light, and the preset light can be emitted to an external object through the rubber material and the diffraction assembly.
In the light emission module of the embodiment of the application, the light source is fixedly arranged on one side of the diffraction assembly through the optical cement material, compared with the prior art that the optical cement material is not arranged between the diffraction assembly and the light source, the light source directly penetrates through the diffraction assembly, the light efficiency loss is overlarge, and the light source in the scheme changes the emission angle through the optical cement material before penetrating through the diffraction assembly, so that the loss of the light after penetrating through the diffraction assembly is less; compared with the common glue material, the optical glue material has smaller efficiency loss when light penetrates through the optical glue material, and the optical glue material can reduce the loss of the glue material to the optical efficiency and can reduce the loss of the light after the light penetrates through the optical diffraction component to a certain extent; the preset light can form a specified light spot shape and light intensity distribution after penetrating through the diffraction assembly, and meanwhile, the specific light intensity distribution in the preset light propagation direction can be realized through the diffraction assembly; in addition, the refractive index of gluing the material is less than the refractive index of diffraction subassembly 0.2 to 0.4, and the reliability of gluing the material can be guaranteed to the first aspect, can also reduce the light efficiency loss when the second aspect uses with the cooperation of diffraction subassembly for the penetration rate of light is preferred, further improvement 3D imaging module's efficiency.
In a second aspect, an embodiment of the present application provides a 3D imaging module, including:
the light emitting module of the above embodiment;
and the light receiving module is used for receiving reflected light generated after the preset light irradiates on the external object.
Based on the 3D imaging module in the embodiment of the application, the preset light irradiates an object, reflected light at different positions can have time delay or phase difference, and the light receiving module can acquire time delay or phase difference information and generate depth information of an external object, so that imaging is initially completed, and 3D sensing is realized; because the 3D imaging module comprises the light emitting module in the embodiment, the light penetration rate of the 3D imaging module is higher, and the efficiency of the 3D imaging module is better.
In a third aspect, an embodiment of the present application provides an electronic device, including the 3D imaging module according to the foregoing embodiment.
Based on this application embodiment electronic equipment, because have the 3D formation of image module of above-mentioned embodiment to, because the 3D formation of image module includes the light emission module of above-mentioned embodiment, make 3D formation of image module light penetration rate higher, the efficiency of 3D formation of image module is better.
In some of these embodiments, the electronic device further comprises:
the display screen, the display screen is fixed to be set up the diffraction subassembly is kept away from one side of light source, the light source the diffraction subassembly the light receiving module is located same one side of display screen, the display screen has the confession predetermine the first region that light pierces through, and with the second region that first region is connected, just the light source the diffraction subassembly all is located one side of first region, supply on the first region predetermine the pixel density ratio of the part that light pierces through 1% to 60% of pixel density in second region.
Based on the embodiment, the 3D imaging module is arranged on the display screen, and under the condition that the 3D imaging module can be normally used, the 3D imaging module is protected through the display screen, so that the damage of the 3D imaging module directly exposed outside is reduced; in addition, the pixel density of the part of the first area, through which the preset light penetrates, is set to be smaller than that of the second area, so that the efficiency loss of the preset light after penetrating through the first area can be reduced, the penetration rate of the preset light is guaranteed, the preset light is irradiated to an external object to the maximum extent, and 3D imaging is facilitated.
In some embodiments, the display screen has a third area through which the reflected light passes, the third area is connected to the second area, the light receiving module is located at one side of the third area, and the pixel density of the portion of the third area through which the reflected light passes is less than the pixel density of the second area.
Based on the above embodiment, the predetermined light penetrates through the display screen and then is incident on the external object to generate the reflected light, the reflected light penetrates through the third area to be received by the light receiving module, and the pixel density of the part of the third area, through which the reflected light penetrates, is set to be smaller than that of the second area, so that the efficiency loss of the reflected light after penetrating through the third area can be reduced, the penetration rate of the reflected light is ensured, the light receiving rate of the light receiving module is increased, and the efficiency of the 3D imaging module is further improved.
In some of these embodiments, an anti-reflective layer is disposed between the display screen and the diffractive component.
Based on the embodiment, the anti-reflection layer is arranged between the display screen and the diffraction assembly, and according to the anti-reflection formula, the anti-reflection layer can reduce the reflectivity, reduce the loss of light penetrating through the diffraction assembly and is beneficial to further improving the efficiency of the 3D imaging module.
In some embodiments, a stress matching layer is further disposed between the display screen and the diffraction assembly, and the stress matching layer is located between the diffraction assembly and the anti-reflection layer and connects and fixes the diffraction assembly and the anti-reflection layer, and/or the stress matching layer is located between the display screen and the anti-reflection layer and connects and fixes the display screen and the anti-reflection layer.
Based on the above embodiments, the stress matching layer is disposed between the anti-reflection layer and the diffraction component, and/or between the anti-reflection layer and the display screen to serve as a transition layer, so as to increase the bonding performance between the two and improve the anti-peeling capability of the anti-reflection layer.
In some of these embodiments, the antireflective layer is a coating containing one or more of Y2O3, TiO2, SiO2, ZnO.
In some of these embodiments, the antireflective layer is a coating having a thickness of 1um or less and a refractive index of 1.5 to 1.9.
Based on the embodiment, the thickness of the anti-reflection layer is less than or equal to 1um, so that the requirement of lightness and thinness of electronic equipment can be met, and the light effect loss is further reduced; the refractive index of the anti-reflection layer is controlled to be 1.5-1.9, so that the reflection of light can be reduced to the greatest extent, the passing rate of light penetrating through the anti-reflection layer is ensured, and the efficiency of the 3D imaging module can be improved to a certain extent.
In some of these embodiments, the display screen is an OLED display screen or a Micro LED display screen.
Based on the embodiment, the OLED display screen or the Micro LED display screen has better color performance and wider display angle, and can manufacture thinner and thinner display effect; meanwhile, the OLED display screen can be made into a curved surface and flexible display, and the application scene is wider.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a cross-sectional view of a light emitting module and a display panel connected to the light emitting module according to an embodiment of the present disclosure;
FIG. 2 is a block diagram of an electronic device provided by an embodiment of the present application;
FIG. 3 is a plan view of an electronic device provided by an embodiment of the present application;
FIG. 4 is a plan view of an electronic device provided by another embodiment of the present application;
FIG. 5 is a schematic diagram illustrating a connection relationship between an anti-reflection layer and a stress matching layer of an optical transmission module according to an embodiment of the present disclosure;
FIG. 6 is a schematic diagram illustrating a connection relationship between an anti-reflection layer and a stress matching layer of an optical transmission module according to another embodiment of the present disclosure;
FIG. 7 is a diagram illustrating a connection relationship between an anti-reflection layer and a stress matching layer of an optical transmission module according to still another embodiment of the present disclosure.
Reference numerals: 1. an electronic device; 10. a 3D imaging module; 100. a light emitting module; 110. a diffractive component; 120. a light source; 130. glue material; 200. a light receiving module; 20. a display screen; 21. a first region; 22. a second region; 23. a third region; 30. an anti-reflection layer; 40. a stress matching layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.
When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the application, as detailed in the appended claims.
Referring to fig. 1, in a first aspect, the embodiment of the present application provides a light emitting module 100, where the light emitting module 100 may be a part of a 3D imaging module 10 and may be disposed on a display screen 20 of an electronic device 1. Specifically, the light emitting module 100 may include:
a diffractive component 110;
a light source 120 located at one side of the diffraction element 110;
a glue material 130 positioned between the light source 120 and the diffraction element 110 to fix the light source 120 at one side of the diffraction element 110, the glue material 130 being an optical glue material having a refractive index 0.2 to 0.4 smaller than that of the diffraction element 110,
the light source 120 is configured to emit a predetermined light, and the predetermined light can be emitted to an external object through the adhesive 130 and the diffraction element 110.
In the light emitting module 100 of the embodiment of the application, the light source 120 is fixedly disposed at one side of the diffraction element 110 through the optical adhesive material, compared with the prior art that no optical adhesive material is disposed between the diffraction element 110 and the light source 120, the light source 120 directly penetrates through the diffraction element 110, and the light efficiency loss is too large, in the present scheme, the light source 120 changes its emitting angle through the optical adhesive material before penetrating through the diffraction element 110, so that the loss of light after penetrating through the diffraction element 110 is less; the optical adhesive material 130 is an optical adhesive material, and compared with a common adhesive material, the optical adhesive material has smaller performance loss when light penetrates through the optical adhesive material, so that the loss of the optical performance caused by the adhesive material itself can be reduced, and the loss of the light after penetrating through the optical diffraction element 110 can also be reduced to a certain extent; the preset light can form a specified light spot shape and light intensity distribution after penetrating through the diffraction component 110, and meanwhile, the specific light intensity distribution in the preset light propagation direction can be realized through the diffraction component 110; in addition, the refractive index of the glue material 130 is 0.2 to 0.4 smaller than that of the diffraction element 110, the first aspect can ensure the reliability of the glue material 130, the second aspect, the refractive index of the light source 120 is generally about 1.0, if the refractive index of the diffraction element 110 is 1.7, the refractive index of the optical glue material is between 1.3 and 1.5, the refractive index of the optical glue material is between the refractive index of the light source 120 and the refractive index of the diffraction element 110, and the refractive indexes of the three form a height difference, when the optical glue material with the refractive index smaller than that of the diffraction element by 0.2 to 0.4 is used in cooperation with the diffraction element 110, the optical efficiency loss can be effectively reduced, the light penetration rate is the best, and the efficiency of the 3D imaging module 10 is further improved.
In some embodiments, the glue 130 is an optical glue having a refractive index 0.2, 0.3, or 0.4 less than the refractive index of the diffractive component 110. The adhesive material 130 with the refractive index smaller than that of the diffraction element 110 by 0.2 or 0.4 is used, so that the light penetration rate can be improved to a certain extent, and the efficiency of the 3D imaging module 10 is further improved; the glue material 130 with a refractive index 0.3 less than that of the diffraction element 110 is used, so the light transmittance is the best, and the performance of the 3D imaging module 10 is the best.
The light source 120 is a vcsel (vertical Cavity Surface Emitting laser) point light source emitter, an eel (Emitting laser) laser emitter, or an LD laser emitter, and the light outlet of the light source 120 is disposed toward the diffraction module 110.
Specifically, the number of the light sources 120 may be multiple, and the light sources 120 are arranged in a predetermined arrangement, for example, may be arranged in a predetermined coding structure or distributed in a random structure array.
Referring to fig. 2, in a second aspect, the present application provides a 3D imaging module 10, including:
the light emitting module 100 in the above embodiment;
the light receiving module 200, the light receiving module 200 is used for receiving the reflected light generated after the preset light irradiates on the external object.
Based on the 3D imaging module 10 in the embodiment of the present application, it is preset that light irradiates an object, reflected light at different positions will have time delay or phase difference, and the light receiving module 200 can acquire time delay or phase difference information and generate depth information of an external object, thereby primarily completing imaging and implementing 3D sensing; since the 3D imaging module 10 includes the light emitting module 100 according to the above embodiment, the light transmittance is higher, and the performance of the 3D imaging module 10 is better.
Referring to fig. 1 and fig. 2, in a third aspect, an embodiment of the present application provides an electronic device 1, including the 3D imaging module 10 of the above embodiment, where the electronic device 1 may be a mobile phone, a tablet computer, a digital camera, and the like.
Based on the electronic device 1 in the embodiment of the present application, since the 3D imaging module 10 described in the above embodiment is provided, and the 3D imaging module 10 includes the light emitting module 100 described in the above embodiment, the light transmittance is higher, and the efficiency of the 3D imaging module 10 is better.
Referring to fig. 1 and 3, in some embodiments, the electronic device 1 further includes:
the display screen 20, the display screen 20 is fixedly disposed on a side of the diffraction element 110 away from the light source 120, the diffraction element 110, and the light receiving module 200 are disposed on a same side of the display screen 20, the display screen 20 has a first region 21 for penetrating the predetermined light and a second region 22 connected to the first region 21, the second region 22 is a display region, the light source 120 and the diffraction element 110 are disposed on a side of the first region 21, and a pixel density of a portion of the first region 21 for penetrating the predetermined light is 1% to 60% smaller than a pixel density of the second region 22.
Based on the above embodiment, the 3D imaging module 10 is disposed on the display screen 20, and under the condition that the 3D imaging module 10 can be used normally, the 3D imaging module 10 is protected by the display screen 20, so that damage to the 3D imaging module 10 when the 3D imaging module 10 is directly exposed to the outside is reduced; in addition, the pixel density of the part of the first region 21, through which the preset light penetrates, is set to be smaller than the pixel density of the second region 22, so that the efficiency loss of the preset light after penetrating through the first region 21 can be reduced, the penetration rate of the preset light is ensured, the preset light is irradiated on an external object to the greatest extent, and 3D imaging is facilitated.
In one embodiment, the pixel density of the portion of the first region 21 through which the predetermined light passes is less than 1% of the pixel density of the second region 22. Efficiency loss after the preset light penetrates through the first area 21 can be reduced to a certain extent, the penetration rate of the preset light is guaranteed, the preset light is irradiated onto an external object to the maximum extent, 3D imaging is facilitated, the pixel density of the first area 21 is only 1% smaller than that of the second area 22, and the requirement of the display screen 20 on high display effect requirements can be met.
In another embodiment, the pixel density of the portion of the first region 21 through which the predetermined light passes is 30% less than the pixel density of the second region 22. Can reduce the efficiency loss after presetting light and penetrating first region 21 to a certain extent, the penetration rate of light is predetermine in the guarantee, on presetting the biggest illumination of light to external object, the 3D formation of image of being convenient for, and the pixel density of first region 21 part is only 30% less than the pixel density of second region 22, can balance the requirement of display screen 20 to the display effect and the requirement of electronic equipment 1 to the effect of finding a view, neutralization display effect and the effect of finding a view, make electronic equipment 1 both have certain display effect and also have certain effect of finding a view.
In yet another embodiment, the pixel density of the portion of the first region 21 through which the predetermined light passes is 60% less than the pixel density of the second region 22. The efficiency loss after the preset light penetrates through the first area 21 can be reduced to a certain extent, the penetration rate of the preset light is guaranteed, the preset light is irradiated onto an external object to the maximum extent, 3D imaging is facilitated, the pixel density of the first area 21 is only 30% smaller than that of the second area 22, and the requirement of the electronic device 1 on high viewing effect can be met.
Specifically, the display panel 20 has a third region 23 through which the reflected light passes, the third region 23 is connected to the second region 22, the light receiving module 200 is located at one side of the third region 23, and the pixel density of the portion of the third region 23 through which the reflected light passes is less than that of the second region 22.
It can be understood that the predetermined light penetrates through the display screen 20 and then is incident on the external object to generate the reflected light, the reflected light penetrates through the third region 23 and is received by the light receiving module 200, and the pixel density of the portion of the third region 23 through which the reflected light penetrates is set to be smaller than the pixel density of the second region 22, so that the performance loss of the reflected light after penetrating through the third region 23 can be reduced, the transmittance of the reflected light is ensured, the light receiving rate of the light receiving module 200 is increased, and the performance of the 3D imaging module 10 is further improved.
Specifically, the pixel density of the portion of the third area 23 through which the reflected light passes is 1% to 60% lower than the pixel density of the second area 22, how much the pixel density of the portion of the third area 23 through which the reflected light passes is lower than the pixel density of the second area 22 may be configured according to the requirements of the actual electronic device 1 for the display effect and the view finding effect, and the pixel density of the portion of the third area 23 through which the reflected light passes may be the same as or different from the pixel density of the portion of the first area 21 through which the preset light passes, which is not described herein again.
Referring to fig. 3, in one embodiment, the first region 21 and the third region 23 are independent from each other, for example, the first region 21 and the third region 23 of the bang part of the mobile phone are independent from each other and a speaker is disposed therebetween.
Referring to fig. 4, in another embodiment, the first region 21 is connected with the third region 23.
In some embodiments, a film may be disposed on the display 20 to protect the display 20, and the film includes, but is not limited to, various plastic films, toughened films, water-condensation films, and the like (not shown).
Additionally, in some embodiments, an anti-reflective layer 30 may be disposed between the display screen 20 and the diffractive component 110.
It can be understood that the anti-reflection layer 30 disposed between the display screen 20 and the diffraction element 110, according to the anti-reflection formula, the anti-reflection layer 30 can reduce the reflectivity, thereby reducing the loss of light penetrating through the diffraction element 110, which is beneficial to further improving the performance of the 3D imaging module 10.
Referring to fig. 1 and 5, wherein fig. 5 can also be seen as an enlarged schematic view of the diffraction element 110 and the portion a of the display screen 20 shown in fig. 1, specifically, a stress matching layer 40 is further disposed between the display screen 20 and the diffraction element 110, the stress matching layer 40 is disposed between the diffraction element 110 and the anti-reflection layer 30 and connects and fixes the diffraction element 110 and the anti-reflection layer 30, and/or the stress matching layer 40 is disposed between the display screen 20 and the anti-reflection layer 30 and connects and fixes the display screen 20 and the anti-reflection layer 30.
Based on the above embodiment, the stress matching layer 40 is disposed between the anti-reflection layer 30 and the diffraction element 110, and/or between the anti-reflection layer 30 and the display screen 20 to serve as a transition layer, so as to increase the bonding performance between the two and improve the anti-peeling capability of the anti-reflection layer 30.
Referring to fig. 1 and 5, in one embodiment, the stress matching layer 40 is disposed only between the diffractive component 110 and the anti-reflective layer 30, to some extent, to reduce the likelihood of the anti-reflective layer 30 peeling off the diffractive component 110.
Referring to fig. 1 and 6, wherein fig. 6 can also be regarded as a partial enlarged schematic view of the diffraction element 110 and the display screen 20 provided by another embodiment, specifically, in another embodiment, the stress matching layer 40 is only arranged between the display screen 20 and the anti-reflection layer 30, so that the possibility of peeling off of the anti-reflection layer 30 from the display screen 20 can be reduced to some extent.
Referring to fig. 1 and 7, fig. 7 can also be regarded as a partial enlarged schematic view of the diffraction element 110 and the display screen 20 provided in another embodiment, in which the stress matching layer 40 is disposed between the display screen 20 and the anti-reflection layer 30 and between the diffraction element 110 and the anti-reflection layer 30, so as to reduce the possibility of the anti-reflection layer 30 peeling off from the diffraction element 110 and the display screen 20.
In the above embodiments, the antireflection layer 30 is a plating layer containing one or more of Y2O3, TiO2, SiO2, and ZnO.
Specifically, the anti-reflection layer 30 may be a metal oxide single layer or a stack, and when a metal oxide stack is used, the integrity between the stack layer structures is improved by depositing a metal oxide generating layer by internal pressure stress, so that each metal oxide stack is less likely to be delaminated or to be peeled off from adjacent layers, the metal oxides contained in each layer may be the same or different, and the energy band gap and the refractive index of the layer structure formed of different metal oxides are different.
Further, the antireflection layer 30 is a plating layer having a thickness of 1um or less and a refractive index of 1.5 to 1.9.
It can be understood that the thickness of the anti-reflection layer 30 is less than or equal to 1um, which not only can meet the requirement of lightness and thinness of the electronic device 1, but also further reduces the loss of light efficiency; the refractive index of the anti-reflection layer 30 is controlled to be 1.5 to 1.9, so that the reflection of light can be reduced to the greatest extent, the passing rate of light penetrating through the anti-reflection layer is ensured, and the efficiency of the 3D imaging module 10 can be improved to a certain extent.
In addition, the display screen 20 may be an OLED display screen or a Micro LED display screen.
The OLED display screen or the Micro LED display screen has better color performance and wider display angle, and can manufacture thinner and thinner display effect; meanwhile, the OLED display screen can be made into a curved surface and flexible display, and the application scene is wider.
In the description of the present application, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art. Further, in the description of the present application, "a plurality" means two or more unless otherwise specified. "and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present application and is not to be construed as limiting the scope of the present application, so that the present application is not limited thereto, and all equivalent variations and modifications can be made to the present application.
Claims (10)
1. An optical transmission module, comprising:
a diffractive component;
a light source located on one side of the diffractive component;
a glue material positioned between the light source and the diffraction element to fix the light source at one side of the diffraction element, the glue material being an optical glue material having a refractive index 0.2 to 0.4 smaller than that of the diffraction element,
the light source is used for emitting preset light, and the preset light can be emitted to an external object through the rubber material and the diffraction assembly.
2. A3D imaging module, comprising:
the optical transmit module of claim 1;
and the light receiving module is used for receiving reflected light generated after the preset light irradiates on the external object.
3. An electronic device, characterized in that it comprises a 3D imaging module according to claim 2.
4. The electronic device of claim 3, further comprising:
the display screen, the display screen is fixed to be set up the diffraction subassembly is kept away from one side of light source, the light source the diffraction subassembly the light receiving module is located same one side of display screen, the display screen has the confession predetermine the first region that light pierces through, and with the second region that first region is connected, just the light source the diffraction subassembly all is located one side of first region, supply on the first region predetermine the pixel density ratio of the part that light pierces through 1% to 60% of pixel density in second region.
5. The electronic device of claim 4, wherein the display screen has a third area through which the reflected light passes, the third area is connected to the second area, the light receiving module is located at one side of the third area, and a pixel density of a portion of the third area through which the reflected light passes is less than a pixel density of the second area.
6. The electronic device of claim 5, wherein an anti-reflection layer is disposed between the display screen and the diffractive component.
7. The electronic device according to claim 6, wherein a stress matching layer is further disposed between the display screen and the diffraction assembly, the stress matching layer is disposed between the diffraction assembly and the anti-reflection layer and connects and fixes the diffraction assembly and the anti-reflection layer, and/or the stress matching layer is disposed between the display screen and the anti-reflection layer and connects and fixes the display screen and the anti-reflection layer.
8. The electronic device of claim 6, wherein the anti-reflective layer is a coating comprising one of Y2O3, TiO2, SiO2, ZnO.
9. The electronic device of any of claims 6-8, wherein the anti-reflection layer is a plated layer having a thickness of 1um or less and a refractive index of 1.5 to 1.9.
10. The electronic device of any of claims 4-8, wherein the display screen is an OLED display screen or a Micro LED display screen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120463186.XU CN215297893U (en) | 2021-03-03 | 2021-03-03 | Light emission module, 3D imaging module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120463186.XU CN215297893U (en) | 2021-03-03 | 2021-03-03 | Light emission module, 3D imaging module and electronic equipment |
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| CN215297893U true CN215297893U (en) | 2021-12-24 |
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| CN202120463186.XU Active CN215297893U (en) | 2021-03-03 | 2021-03-03 | Light emission module, 3D imaging module and electronic equipment |
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2021
- 2021-03-03 CN CN202120463186.XU patent/CN215297893U/en active Active
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