CN215297875U - Backlight lamp strip, backlight module and display device - Google Patents
Backlight lamp strip, backlight module and display device Download PDFInfo
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- CN215297875U CN215297875U CN202121018393.0U CN202121018393U CN215297875U CN 215297875 U CN215297875 U CN 215297875U CN 202121018393 U CN202121018393 U CN 202121018393U CN 215297875 U CN215297875 U CN 215297875U
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Abstract
The application relates to the technical field of display, a backlight lamp strip, backlight unit and display device are provided, this backlight lamp strip includes: the circuit board comprises a first surface and a second surface which are oppositely arranged, the first surface is used for arranging a light source, and the second surface is used for being connected with the back plate; the concave surface structure is sunken from the second surface to one side close to the first surface, and the concave surface structure is used for at least partially covering a preset sealant point on the back plate. This application sets up concave surface structure through the one side that deviates from the light source at the circuit board to form the concave region of the sealed glue point of holding, when backlight lamp strip and backplate bonding cooperation, arrange in advance that the sealed glue point of predetermineeing on the backplate is at least partially covered by the concave surface structure on the backlight lamp strip, reduced the excessive volume of gluing at circuit board edge, be favorable to the lamp strip steadiness, can ensure simultaneously that the lamp strip fully contacts with the backplate, improve the lamp strip heat dissipation.
Description
Technical Field
The application relates to the technical field of display, in particular to a backlight lamp strip, a backlight module and a display device.
Background
Currently, the common backlights are classified into direct-type backlights and side-type backlights. Liquid crystal display devices with side-in backlights may be lighter and thinner, but are relatively expensive; the liquid crystal display device with the direct type backlight source has relatively simple process and low price, and is popular with some consumers.
Among the present straight following formula backlight module structure, backlight lamp strip is fixed to be glued fixedly by original artifical lock attaches the screw fixation to present automation point, effectively promotes production efficiency.
However, the inventors of the present application have found that, in order to control costs, the width of the backlight light bar is currently becoming smaller; along with the width reduction, although be favorable to control cost, sealed glue can spill over from the edge of backlight lamp strip circuit board when sealed glue is fixed backlight lamp strip, causes backlight lamp strip fixed viscidity variation, and the sealed glue that spills over simultaneously probably still can influence backlight lamp strip luminous efficacy.
SUMMERY OF THE UTILITY MODEL
This application provides a backlight lamp strip, backlight unit and display device to the shortcoming of current mode to cause sealed glue to spill over from the edge easily when solving lamp strip and backplate fixed in the present straight following formula backlight module.
In a first aspect, an embodiment of the present application provides a backlight light bar, including: the circuit board comprises a first surface and a second surface which are oppositely arranged, the first surface is used for arranging the light source, and the second surface is used for being connected with the back plate; the concave surface structure is sunken from the second surface to one side close to the first surface, and the concave surface structure is used for at least partially covering the sealant point preset on the back plate.
Optionally, the backlight light bar further comprises at least one light source, the light source is disposed on the first surface, and the concave structures correspond to the light sources one to one.
Optionally, the light source includes a light emitting diode bead and a lens, the light emitting diode bead is disposed on the first surface, and the lens is located on a side of the light emitting diode bead away from the circuit board; the axis of the concave structure coincides with the center of the lens.
Optionally, the backlight light bar further comprises at least one light source, the light source is disposed on the first surface, and the projection of the concave structure on the first surface is located between the projections of two adjacent light sources on the first surface.
Optionally, the concave structure is a cylindrical structure, and an axis of the cylindrical structure is perpendicular to the second surface.
Optionally, the concave structure is a hemispherical structure, and a spherical surface of the hemispherical structure is concave towards a direction close to the first surface.
In a second aspect, an embodiment of the present application provides a backlight module, including: a back plate and at least one backlight lamp bar of the first aspect; the circuit board of the backlight lamp strip is fixedly connected with the back plate through a sealant point, and the concave surface structure of the backlight lamp strip at least partially covers the sealant point.
Optionally, the ratio of the accommodating volume of the concave structure to the volume of the sealant point is 0.5-1.
Optionally, the concave surface structures and the sealant dots are arranged in a one-to-one correspondence manner.
In a third aspect, an embodiment of the present application provides a display device, including: the display panel is arranged on the light emitting side of the backlight module.
The beneficial technical effects brought by the technical scheme provided by the embodiment of the application at least comprise:
according to the backlight lamp strip, the backlight module and the display device, the concave surface structure is arranged on one side, away from the light source, of the circuit board, so that the concave area for accommodating the sealant points is formed, when the backlight lamp strip is in bonding fit with the back plate, the sealant points which are pre-arranged on the back plate are at least partially covered by the concave surface structure on the backlight lamp strip, and compared with the existing lamp strip with a plane structure, the light strip with the concave surface structure has the advantages that the sealant overflowing amount of the edge of the circuit board is reduced, and meanwhile, the stability of the lamp strip is facilitated; the structural design of the anti-overflow glue can ensure that the light bar is fully contacted with the back plate, improve the heat dissipation of the light bar and prolong the service life of the light bar; the production line assembly is facilitated, rework maintenance caused by glue overflow is avoided, the yield is improved, and the cost is saved.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic view illustrating a display structure of a backlight bar according to an embodiment of the present disclosure;
FIG. 2 is a top view of FIG. 1 provided in accordance with an embodiment of the present application;
FIG. 3 is a side view of FIG. 1 provided in accordance with an embodiment of the present application;
FIG. 4 is a bottom view of FIG. 1 provided with an embodiment of the present application;
fig. 5 is an assembly structure diagram of a backlight module according to an embodiment of the present disclosure.
Wherein:
1-a circuit board; 11-a first surface; 12-a second surface;
2-a light source; 21-a lens; 22-LED lamp beads;
3-a concave structure;
4-sealant point;
5-back plate.
Detailed Description
Reference will now be made in detail to the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar parts or parts having the same or similar functions throughout. In addition, if a detailed description of the known art is not necessary for illustrating the features of the present application, it is omitted. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes all or any element and all combinations of one or more of the associated listed items.
The following describes the technical solutions of the present application and how to solve the above technical problems with specific embodiments.
With reference to fig. 1 to 4, an embodiment of the present application provides a backlight light bar, including: a circuit board 1, at least one light source 2 and at least one concave structure 3. The circuit board 1 is provided with a power supply circuit for supplying power to the light source 2, the circuit board 1 specifically comprises a first surface 11 and a second surface 12 which are oppositely arranged, the first surface 11 is used for arranging the light source 2, and the second surface 12 is used for being connected with a back plate 5 included in the backlight module.
Specifically, the light source 2 is disposed on the first surface 11, and the light source 2 is electrically connected to the power supply circuit of the circuit board 1. The number of the light sources 2 may be multiple, and the multiple light sources 2 are arranged at intervals along the length extending direction of the circuit board 1.
Optionally, the light source 2 includes an LED lamp bead 22 and a lens 21, the LED lamp bead 22 is disposed on the first surface 11 of the circuit board 1, the lens 21 is disposed on a side of the LED lamp bead 22 away from the circuit board 1, and centers of the LED lamp bead 22 and the lens 21 are located on the same axis.
Further, the concave structure 3 is located on one side of the circuit board 1 far away from the light source 2, the concave structure 3 is specifically an anti-glue-overflow structure formed by the second surface 12 being recessed towards one side close to the first surface 11, the anti-glue-overflow structure at least partially covers the preset glue-sealing points 4 on the back plate 5, so that the glue-sealing points 4 are partially or completely covered by the concave structure 3, the amount of the glue-sealing points 4 located around the concave structure 3 is reduced, the white ink on the surfaces of the lens 21 and the circuit board 1 is not polluted, meanwhile, the second surface 12 of the circuit board 1 can be ensured to be in contact with the back plate 5 as far as possible, and the heat dissipation of the circuit board 1 is facilitated.
When the backlight lamp bar is fixed with the back plate 5, the sealant points 4 are used as an adhesive between the circuit board 1 of the backlight lamp bar and the back plate 5, and can play a role in connecting the backlight lamp bar and the back plate 5.
It should be noted that the sealant dots 4 are dot-shaped structures formed on the surface of the back plate 5 by corresponding dispensing equipment, and are generally hemispherical before the backlight light bar is bonded.
According to the backlight lamp strip provided by the embodiment, the concave surface structure 3 is arranged on one side of the circuit board 1, which is far away from the light source 2, so that a concave area for accommodating the sealant point 4 is formed, when the backlight lamp strip is in bonding fit with the back plate 5, the sealant point 4 which is pre-arranged on the back plate 5 is at least partially covered by the concave surface structure 3 on the backlight lamp strip, and compared with the existing lamp strip with a plane structure, the light strip with the planar structure not only reduces the glue overflow amount of the edge of the circuit board 1, but also is beneficial to the stability of the lamp strip; the concave surface structure 3 can ensure that the lamp strip is fully contacted with the back plate 5, thereby improving the heat dissipation of the lamp strip and prolonging the service life of the lamp strip; the production line assembly is facilitated, rework maintenance caused by glue overflow is avoided, the yield is improved, and the cost is saved.
In some embodiments, with continuing reference to fig. 3 and 4, the orthographic projection of the concave structures 3 on the plane of the first surface 11 is at least partially overlapped with the orthographic projection of the light sources 2 on the plane of the first surface 11, that is, the concave structures 3 and the light sources 2 are arranged in one-to-one correspondence, which is favorable for heat dissipation of the light sources 2, and is beautiful in design and easy in process manufacturing.
Optionally, the orthographic projection of the concave structure 3 on the plane of the first surface 11 is completely overlapped with the orthographic projection of the light source 2 on the plane of the first surface 11, and meanwhile, the axis of the concave structure 3 coincides with the center of the lens 21, so that the sealant overflow amount around the concave structure 3 is ensured to be as small as possible, the second surface 12 is attached to the back plate 5 as much as possible, and the heat dissipation of the light source 2 is facilitated.
In some embodiments, the orthographic projection of the concave structure 3 on the plane of the first surface 11 is located between the orthographic projections of the two adjacent light sources 2 on the plane of the first surface 11 (not shown in the figures), that is, the concave structure 3 and the light sources 2 can be arranged in a staggered manner, as long as it is ensured that the second plane of the circuit board 1 is attached to the back plate 5 as much as possible when the backlight light bar is connected with the back plate 5, thereby facilitating the heat dissipation of the light sources 2.
Alternatively, as shown in fig. 3 and 4, the concave structure 3 in the present embodiment is a cylindrical structure, and the axis of the cylindrical structure is perpendicular to the second surface 12.
Specifically, assuming that the radius of the cylindrical structure is d1, the depth of the cylindrical structure is h, the width of the circuit board 1 is d2, and the thickness of the circuit board 1 is d3, 2d1< d2, and h < d 3.
For a cylindrical structure, its volume V1 ═ hx pi × d13. Assuming that the sealant dot 4 has a hemispherical structure, the radius of the sealant dot 4 is r, and r ranges from 3 mm to 4 mm, the volume V of the hemispherical sealant dot 4 is 4/6 × pi × r3。
In order to achieve a better bonding effect and control the glue overflow amount, the following formula needs to be satisfied in this embodiment: v1 is more than or equal to 0.5V and less than or equal to V.
Alternatively, as shown in fig. 3 and 4, the concave structure 3 in the present embodiment is a semispherical structure, and the spherical surface of the semispherical structure is concave toward the first surface 11.
Specifically, assuming that the radius of the hemispherical structure is d1, the width of the circuit board 1 is d2, and the thickness of the circuit board 1 is d3, 2d1< d2, and d1< d 3.
For hemispherical structures, the volume V2 is 4/6 × pi × d13. Assuming that the sealant dot 4 has a hemispherical structure, the radius of the sealant dot 4 is r, and r ranges from 3 mm to 4 mm, the volume V of the hemispherical sealant dot 4 is 4/6 × pi × r3。
In order to achieve a better bonding effect and control the glue overflow amount, the following formula needs to be satisfied in this embodiment: v2 is more than or equal to 0.5V and less than or equal to V.
In some alternative embodiments, the concave structure 3 may also be a rectangular parallelepiped structure, a cubic structure or an inverted cylindrical structure (with the axis parallel to the second plane), which will not be described in detail herein.
In some embodiments, the preset distance between two adjacent concave structures 3 is equal to the preset distance between two adjacent sealant points 4 on the back plate 5, so as to ensure that each concave structure 3 can correspond to the corresponding sealant point 4, further reduce the amount of glue overflow, and improve the bonding effect between the circuit board 1 and the back plate 5.
Based on the same inventive concept, as shown in fig. 5, an embodiment of the present application further provides a backlight module, including: a back plate 5 and at least one backlight light bar of the previous embodiments.
The specific structure of the backlight light bar in this embodiment can refer to the content of the foregoing embodiments of the present application, and details are not repeated here.
Specifically, at least one sealant point 4 is arranged on the back plate 5 in advance, the number of the sealant points 4 is the same as that of the concave surface structures 3 of the backlight light bar, and the distance is kept consistent.
Further, the circuit board 1 of the backlight lamp strip is fixedly connected with the back plate 5 through the sealant points 4, each concave surface structure 3 corresponds to one sealant point 4, and the concave surface structure 3 at least partially covers the sealant point 4 at the corresponding position.
The backlight module provided by the embodiment comprises the backlight lamp strip in the embodiment, the concave surface structure 3 is arranged on one side of the circuit board 1, which is far away from the light source 2, so that a concave area for accommodating the sealant point 4 is formed, when the backlight lamp strip is in bonding fit with the back plate 5, the sealant point 4 which is pre-arranged on the back plate 5 is at least partially covered by the concave surface structure 3 on the backlight lamp strip, and compared with the existing lamp strip with a plane structure, the backlight module not only reduces the glue overflow amount of the edge of the circuit board 1, but also is beneficial to the stability of the lamp strip; the structural design of the anti-overflow glue can ensure that the light bar is fully contacted with the back plate 5, thereby improving the heat dissipation of the light bar and prolonging the service life of the light bar; the production line assembly is facilitated, rework maintenance caused by glue overflow is avoided, the yield is improved, and the cost is saved.
In some embodiments, in order to achieve a better bonding effect and control the glue overflow amount, the ratio of the accommodating volume of the concave structure 3 to the volume of the sealing glue dots 4 is controlled to be 0.5-1, and the end values are 0.5 and 1.
Specifically, when the ratio of the receiving volume of the concave structure 3 to the volume of the sealant dots 4 is 0.5, it is equivalent to that half of the sealant dots 4 can be covered by the concave structure 3, and the remaining half of the sealant dots 4 are distributed on the periphery of the concave structure 3 for adhesion between the second surface 12 and the back plate 5.
When the ratio of the accommodating volume of the concave structure 3 to the volume of the sealant dots 4 is 1, it is equivalent that the concave structure 3 can cover all the sealant dots 4, and theoretically, no sealant dots 4 are distributed on the periphery of the concave structure 3. However, considering the actual alignment bonding, a small number of sealant dots 4 may be located around the perimeter of the concave structure 3 for bonding between the second surface 12 and the back sheet 5.
It should be noted that the receiving volume of the concave structure 3 refers to the maximum dose of the sealant dots 4 that can be covered by the concave structure 3.
Further, in consideration of the bonding strength between the second surface 12 of the circuit board 1 and the back plate 5 and the problem of the glue overflow amount, the ratio of the accommodating volume of the concave structure 3 to the volume of the sealing glue dots 4 is controlled to be 0.8 in the present embodiment.
Specifically, for each sealant dot 4, the corresponding concave structure 3 covers the volume of 4/5, and only the sealant dot 4 1/5 is located at the periphery of the concave structure 3 and used for bonding between the second plane of the circuit board 1 and the back plate 5, so that the amount of the sealant dot 4 at the periphery of the concave structure 3 can be controlled within a small range, and the bonding strength between the backlight lamp bar and the back plate 5 can be ensured.
Alternatively, with continued reference to fig. 1 to 5, the concave structures 3 are arranged in a one-to-one correspondence with the sealant dots 4, i.e. each concave structure 3 is guaranteed to correspond to one sealant dot 4.
Optionally, the sealant point 4 is hemispherical, and when the concave structure 3 is aligned with the sealant point 4, an axis of the sealant point 4 coincides with an axis of the concave structure 3, so as to ensure that the sealant point 4 is covered by the concave structure 3 as much as possible.
Based on the same inventive concept, the embodiment of the present application further provides a display device, including: the display panel and the backlight module in the embodiment of the application are arranged on the light emergent side of the backlight module. The display device in this embodiment includes a liquid crystal display device such as a liquid crystal television or a liquid crystal display.
In summary, according to the backlight lamp strip, the backlight module and the display device provided by the embodiment of the application, the concave surface structure is arranged on one side of the circuit board away from the light source, so that the concave area for accommodating the sealant point is formed, when the backlight lamp strip is bonded and matched with the back plate, the sealant point which is pre-arranged on the back plate is at least partially covered by the concave surface structure on the backlight lamp strip, and compared with the existing lamp strip with a plane structure, the light strip with the planar structure not only reduces the glue overflow amount on the edge of the circuit board, but also is beneficial to the stability of the lamp strip; the structural design of the anti-overflow glue can ensure that the light bar is fully contacted with the back plate, improve the heat dissipation of the light bar and prolong the service life of the light bar; the production line assembly is facilitated, rework maintenance caused by glue overflow is avoided, the yield is improved, and the cost is saved.
In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present application.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is only a partial embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations should also be regarded as the protection scope of the present application.
Claims (10)
1. A backlight light bar, comprising:
the circuit board comprises a first surface and a second surface which are oppositely arranged, the first surface is used for arranging the light source, and the second surface is used for being connected with the back plate;
the concave surface structure is sunken from the second surface to one side close to the first surface, and the concave surface structure is used for at least partially covering a preset sealant point on the back plate.
2. The backlight light bar of claim 1, further comprising at least one light source disposed on the first surface, wherein the concave structures correspond to the light sources one-to-one.
3. The backlight light bar of claim 2, wherein the light source comprises a Light Emitting Diode (LED) light bead and a lens, the LED light bead is disposed on the first surface, and the lens is disposed on a side of the LED light bead away from the circuit board;
the axis of the concave structure coincides with the center of the lens.
4. The backlight light bar of claim 1, further comprising at least one light source disposed on the first surface, wherein an orthogonal projection of the concave structure on a plane of the first surface is located between orthogonal projections of two adjacent light sources on the plane of the first surface.
5. The backlight light bar of any one of claims 1 to 4, wherein the concave structure is a cylindrical structure, and an axis of the cylindrical structure is perpendicular to the second surface.
6. The backlight light bar of any one of claims 1 to 4, wherein the concave structure is a hemispherical structure, and a spherical surface of the hemispherical structure is concave towards a direction close to the first surface.
7. A backlight module, comprising: a back panel and at least one backlight light bar of any one of claims 1 to 6;
the circuit board is fixedly connected with the back plate through a sealant point, and the concave surface structure at least partially covers the sealant point.
8. The backlight module as claimed in claim 7, wherein a ratio of the volume of the concave structure to the volume of the sealant dots is 0.5-1.
9. The backlight module as claimed in claim 7 or 8, wherein the concave structures are disposed in one-to-one correspondence with the sealant dots.
10. A display device, comprising: a display panel and a backlight module as claimed in any one of claims 7 to 9, the display panel being arranged at a light exit side of the backlight module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121018393.0U CN215297875U (en) | 2021-05-12 | 2021-05-12 | Backlight lamp strip, backlight module and display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121018393.0U CN215297875U (en) | 2021-05-12 | 2021-05-12 | Backlight lamp strip, backlight module and display device |
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| Publication Number | Publication Date |
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| CN215297875U true CN215297875U (en) | 2021-12-24 |
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| CN202121018393.0U Active CN215297875U (en) | 2021-05-12 | 2021-05-12 | Backlight lamp strip, backlight module and display device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114779531A (en) * | 2022-05-23 | 2022-07-22 | 高创(苏州)电子有限公司 | Backlight lamp strip keysets, backlight unit and display device |
| CN115113436A (en) * | 2022-06-20 | 2022-09-27 | 深圳市群宇科技有限公司 | Separated backlight module with high production efficiency |
-
2021
- 2021-05-12 CN CN202121018393.0U patent/CN215297875U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114779531A (en) * | 2022-05-23 | 2022-07-22 | 高创(苏州)电子有限公司 | Backlight lamp strip keysets, backlight unit and display device |
| CN115113436A (en) * | 2022-06-20 | 2022-09-27 | 深圳市群宇科技有限公司 | Separated backlight module with high production efficiency |
| CN115113436B (en) * | 2022-06-20 | 2023-07-07 | 深圳市群宇科技有限公司 | High-production-efficiency separated backlight module |
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