CN215297561U

CN215297561U - Sample introduction device of semiconductor detection equipment

Info

Publication number: CN215297561U
Application number: CN202121555238.2U
Authority: CN
Inventors: 李云峰
Original assignee: Suzhou Yiyun Electronic Technology Co ltd
Current assignee: Suzhou Yiyun Electronic Technology Co ltd
Priority date: 2021-07-09
Filing date: 2021-07-09
Publication date: 2021-12-24
Anticipated expiration: 2031-07-09

Abstract

The utility model discloses a sample feeding device of semiconductor detection equipment, which comprises a support plate, a limiting component and a material pushing component; carrying out a carrier plate: the upper surface of the groove is provided with a groove, the bottom surface of the groove is provided with a vortex-shaped partition plate, the bottom surface of the groove is provided with an avoiding groove, and the avoiding groove is matched with the partition plate; a limiting component: set up in the right-hand member of support plate, the V type shell fragment cooperation installation that spacing subassembly and support plate upper surface left end symmetry set up, spacing subassembly holds the box and sets up in the right flank of support plate including holding box, pivot, elastic plastic film and draw runner, holds to rotate between the wall of the front and back both sides of box and is connected with the pivot, and the winding has elastic plastic film, pushes away the material subassembly in the extrados middle part of pivot: set up in the lower surface of support plate, this semiconductor detection equipment's sampling device avoids the semiconductor to appear in disorder phenomenon because the shake appears at the in-process that the transport was advanced, has improved work efficiency, and the practicality is strong.

Description

Sample introduction device of semiconductor detection equipment

Technical Field

The utility model relates to a semiconductor detection equipment technical field specifically is a semiconductor detection equipment's sampling device.

Background

The semiconductor device has conductivity between good conductor and insulator, and utilizes the special electrical characteristics of semiconductor material

Electronic devices performing specific functions can be used to generate, control, receive, transform, amplify signals, and perform energy conversion. The semiconductor material of the semiconductor device is silicon, germanium or gallium arsenide, which can be used as equipment such as a rectifier, an oscillator, a light emitter, an amplifier, a light detector and the like, the semiconductor device often needs to be conducted and tested in the production process to verify the qualification of products, the existing detection process usually places the semiconductor to be detected on the upper surface of a sample-injection carrier plate, and carries the semiconductor to the interior of detection equipment for detection after the placement is completed, however, the semiconductor scattering phenomenon caused by shaking in the sample-injection carrying process is easy to occur in the mode, the arrangement needs to be rearranged by personnel, the workload is increased, in addition, the existing sample-injection device needs to manually use tools to remove the semiconductor to be detected one by one, the workload is large, and the use is inconvenient, so the sample-injection device of the semiconductor detection equipment is provided.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is to overcome current defect, provide a semiconductor check out test set's sampling device, avoid the semiconductor in the in-process of carrying the appearance and because the in disorder phenomenon appears in the shake, improved work efficiency, the practicality is strong, can effectively solve the problem in the background art.

In order to achieve the above object, the utility model provides a following technical scheme: a sample introduction device of semiconductor detection equipment comprises a support plate, a limiting assembly and a material pushing assembly;

carrying out a carrier plate: the upper surface of the groove is provided with a groove, the bottom surface of the groove is provided with a vortex-shaped partition plate, the bottom surface of the groove is provided with an avoiding groove, and the avoiding groove is matched with the partition plate;

a limiting component: the limiting component is arranged at the right end of the carrier plate and is matched and installed with the V-shaped elastic sheets which are symmetrically arranged at the left end of the upper surface of the carrier plate;

material pushing assembly: set up in the lower surface of support plate, the upper end that pushes away the material subassembly passes and dodges the groove and with the interior cambered surface sliding connection of division board, the orderly putting of the semiconductor of being convenient for avoids its in-process of carrying the appearance because the shake appears in disorder phenomenon, has improved work efficiency, automatic orderly ejection of compact moreover, the practicality is strong.

Further, spacing subassembly is including holding box, pivot, elastic plastic film and draw runner, hold the box and set up in the right flank of support plate, hold and rotate between the wall of the front and back both sides of box and be connected with the pivot, the winding has elastic plastic film in the middle part of the extrados of pivot, draw runner sliding connection is in the upper surface of support plate, and elastic plastic film's outside end passes the through-hole that holds the box upper surface and set up and with the right flank lower extreme fixed connection of draw runner, and the draw runner is installed with the cooperation of V type shell fragment, covers the semiconductor of putting, avoids leading to the confusion because the shake at the in-process of transport.

Further, spacing subassembly still includes the clockwork spring, both ends around the extrados of pivot are connected to clockwork spring symmetry fixed connection, and the outside end of clockwork spring all with the inner wall fixed connection who holds the box, makes the draw runner can withdraw automatically, subtracts change manual operation step.

Furthermore, the limiting strip is arranged at the left end of the upper surface of the carrier plate, the distance between the limiting strip and the V-shaped elastic sheet is larger than the width of the sliding strip, the sliding strip is limited, and the elastic plastic film is prevented from being stretched excessively.

Further, the pushing assembly comprises a motor, a groove-shaped batten and a pushing block, the motor is arranged on the inner wall of the mounting groove on the lower surface of the support plate, the groove-shaped batten is arranged at the lower end of the output shaft of the motor, the pushing block is connected to the inner wall of the groove-shaped batten in a sliding mode, the upper end of the pushing block penetrates through the avoiding groove and is connected with the inner arc surface of the partition plate in a sliding mode, the input end of the motor is electrically connected with the output end of a single chip microcomputer arranged on the left side face of the support plate, an external power supply is electrically connected to the input end of the single chip microcomputer, and the semiconductor is sequentially pushed out to the outside.

The novel motor support plate is characterized by further comprising a sliding block and an annular groove, wherein the annular groove is formed in the outer edge of the lower surface of the support plate, the sliding block is rotatably connected to the end head of the outer side of the groove-shaped batten, the sliding block is in sliding connection with the inner wall of the annular groove, the level of the groove-shaped batten is kept, and stress of an output shaft of a motor is reduced.

Furthermore, the lower surface of the carrier plate is provided with symmetrically distributed support legs for supporting.

Compared with the prior art, the beneficial effects of the utility model are that: this sampling device of semiconductor check out test set has following benefit:

when the elastic plastic film needs to be removed, two V-shaped elastic sheets are pressed by two hands respectively to enable the V-shaped elastic sheets to remove the limitation on the sliding strip, the clockwork spring drives the rotating shaft to rotate under the action of self elastic force, make the pivot to the rolling of elastic plastic film, when needing to detect the semiconductor of accomplishing to take out, rotate through singlechip starter motor, the output shaft of motor drives the flute profile slat rotation, the flute profile slat drives the ejector pad and removes, the ejector pad is moving to the outside along the inner wall of division board under the limiting displacement who dodges the groove, thereby release the semiconductor to the outside, this semiconductor test equipment's sampling device, the orderly putting of the semiconductor of being convenient for, avoid its in-process of advancing the appearance because the shake appears in disorder phenomenon, the work efficiency is improved, and automatic orderly ejection of compact, therefore, the clothes hanger is strong in practicability.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic view of the bottom view of the present invention.

In the figure: the device comprises a support plate 1, a groove 2, a partition plate 3, an avoidance groove 4, a limiting component 5, a containing box 51, a rotating shaft 52, an elastic plastic film 53, a slide bar 54, a clockwork spring 55, a pushing component 6, a motor 61, a groove-shaped slat 62, a pushing block 63, a spring plate 7V, a limiting strip 8, a sliding block 9, an annular groove 10, a supporting leg 11 and a singlechip 12.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-2, the present embodiment provides a technical solution: a sample introduction device of semiconductor detection equipment comprises a carrier plate 1, a limiting assembly 5 and a material pushing assembly 6;

a carrier plate 1: the upper surface of the carrier plate is provided with a groove 2, the bottom surface of the groove 2 is provided with a vortex-shaped partition plate 3, the bottom surface of the groove 2 is provided with an avoiding groove 4, the avoiding groove 4 is matched with the partition plate 3, and the lower surface of the carrier plate 1 is provided with symmetrically distributed support legs 11 for supporting;

and a limiting component 5: the limiting component 5 is arranged at the right end of the carrier plate 1, and is matched and installed with a V-shaped elastic sheet 7 symmetrically arranged at the left end of the upper surface of the carrier plate 1, the limiting component 5 comprises a containing box 51, a rotating shaft 52, an elastic plastic film 53 and a sliding strip 54, the containing box 51 is arranged at the right side surface of the carrier plate 1, the rotating shaft 52 is rotatably connected between the front side wall and the rear side wall of the containing box 51, the elastic plastic film 53 is wound in the middle of the outer arc surface of the rotating shaft 52, the sliding strip 54 is slidably connected to the upper surface of the carrier plate 1, the outer end of the elastic plastic film 53 passes through a through hole formed in the upper surface of the containing box 51 and is fixedly connected with the lower end of the right side surface of the sliding strip 54, the sliding strip 54 is matched and installed with the V-shaped elastic sheet 7, the sliding strip 54 is pulled to the left side to slide on the upper surface of the carrier plate 1, the sliding strip 54 drives the outer end of the elastic plastic film 53 to move to the left side, the elastic plastic film 53 drives the rotating shaft 52 to rotate, and the elastic plastic film 53 covers the semiconductor, the V-shaped elastic sheet 7 is compressed when the sliding strip 54 moves to the left side, when the sliding strip 54 moves to the left side of the V-shaped elastic sheet 7, the V-shaped elastic sheet 7 resets under the action of the elasticity of the V-shaped elastic sheet 7, the sliding strip 54 is limited, confusion caused by shaking in the carrying process is avoided, the limiting assembly 5 further comprises a clockwork spring 55, the clockwork spring 55 is symmetrically and fixedly connected to the front end and the rear end of the outer arc surface of the rotating shaft 52, the outer end of the clockwork spring 55 is fixedly connected with the inner wall of the accommodating box 51, two hands press the two V-shaped elastic sheets 7 respectively, the limit on the sliding strip 54 is relieved by the V-shaped elastic sheets 7, the rotating shaft 52 is driven to rotate reversely under the action of the elasticity of the clockwork spring 55, the rotating shaft 52 rolls the elastic plastic film 53, the sliding strip 54 can be automatically retracted, and manual operation steps are reduced;

wherein: the elastic plastic film support is characterized by further comprising a limiting strip 8, wherein the limiting strip 8 is arranged at the left end of the upper surface of the support plate 1, the distance between the limiting strip 8 and the V-shaped elastic sheet 7 is larger than the width of the sliding strip 54, the sliding strip 54 is limited, and the elastic plastic film 53 is prevented from being stretched excessively.

And (3) pushing the material assembly 6: the pushing assembly 6 comprises a motor 61, a groove-shaped slat 62 and a pushing block 63, the motor 61 is arranged on the inner wall of a mounting groove on the lower surface of the support plate 1, the groove-shaped slat 62 is arranged at the lower end of an output shaft of the motor 61, the pushing block 63 is connected to the inner wall of the groove-shaped slat 62 in a sliding manner, the upper end of the pushing block 63 passes through the avoiding groove 4 and is connected with the inner arc surface of the partition plate 3 in a sliding manner, the input end of the motor 61 is electrically connected with the output end of the single chip microcomputer 12 arranged on the left side surface of the support plate 1, the input end of the single chip microcomputer 12 is electrically connected with an external power supply, the motor 61 is started to rotate by the single chip microcomputer 12, the output shaft of the motor 61 drives the groove-shaped slat 62 to rotate, the groove-shaped slat 62 drives the pushing block 63 to move, and the pushing block 63 moves outwards along the inner wall of the partition plate 3 under the limiting action of the avoiding groove 4, thereby pushing the semiconductor outward.

Wherein: the carrier plate is characterized by further comprising a sliding block 9 and an annular groove 10, the annular groove 10 is formed in the outer edge of the lower surface of the carrier plate 1, the sliding block 9 is rotatably connected to the outer end of the groove-shaped batten 62, the sliding block 9 is in sliding connection with the inner wall of the annular groove 10, the groove-shaped batten 62 is kept horizontal, and stress of an output shaft of the motor 61 is reduced.

The utility model provides a pair of semiconductor check out test set's sampling device's theory of operation as follows:

the semiconductor is pushed into the groove 2 from the feed inlet of the groove 2 in sequence, the semiconductor is arranged in sequence under the guiding action of the partition board 3, then the slide bar 54 is pulled to the left side to slide on the upper surface of the carrier plate 1, the slide bar 54 drives the outer end of the elastic plastic film 53 to move to the left side, the elastic plastic film 53 drives the rotating shaft 52 to rotate, the spring 55 is wound under the torsion of the rotating shaft 52 at the moment, the elastic plastic film 53 covers the semiconductor, the V-shaped elastic sheet 7 is compressed when the slide bar 54 moves to the left side, the V-shaped elastic sheet 7 is reset under the self elastic force when the slide bar 54 moves to the left side of the V-shaped elastic sheet 7, the slide bar 54 is limited to avoid automatic reset, the carrier plate 1 is conveyed into the detection equipment at the moment, and the orderly arranged semiconductor is effectively prevented from scattering again due to shaking in the conveying process because the elastic plastic film 53 covers the semiconductor, the work efficiency is improved, when the elastic plastic film 53 needs to be removed, two V-shaped elastic sheets 7 are pressed by two hands respectively, the limitation on the slide bar 54 is removed by the V-shaped elastic sheets 7, the spiral spring 55 drives the rotating shaft 52 to rotate reversely under the action of self elasticity, the rotating shaft 52 winds the elastic plastic film 53, when a detected semiconductor needs to be taken out, the motor 61 is started to rotate through the single chip microcomputer 12, the output shaft of the motor 61 drives the groove-shaped strip plate 62 to rotate, the groove-shaped strip plate 62 drives the push block 63 to move, the push block 63 moves outwards along the inner wall of the partition plate 3 under the limiting action of the avoiding groove 4, and therefore the semiconductor is pushed outwards.

It should be noted that the motor 61 disclosed in the above embodiments can be freely configured according to practical application scenarios, and it is recommended to select 28 series stepping motors, and the method commonly used in the prior art is adopted for the single chip microcomputer 12 to control the motor 61 to work.

The above is only the embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent processes of the present invention can be used in other related technical fields, directly or indirectly, or in the same way as the present invention.

Claims

1. The utility model provides a sampling device of semiconductor test equipment which characterized in that: comprises a carrier plate (1), a limiting component (5) and a material pushing component (6);

carrier plate (1): the upper surface of the groove is provided with a groove (2), the bottom surface of the groove (2) is provided with a vortex-shaped partition plate (3), the bottom surface of the groove (2) is provided with an avoiding groove (4), and the avoiding groove (4) is matched with the partition plate (3);

limiting component (5): the limiting component (5) is arranged at the right end of the carrier plate (1) and is matched with a V-shaped elastic sheet (7) which is symmetrically arranged at the left end of the upper surface of the carrier plate (1);

pusher assembly (6): is arranged on the lower surface of the carrier plate (1), and the upper end of the pushing component (6) passes through the avoiding groove (4) and is connected with the inner arc surface of the partition plate (3) in a sliding way.

2. The sample introduction device of the semiconductor detection equipment according to claim 1, wherein: spacing subassembly (5) including holding box (51), pivot (52), elastic plastic film (53) and draw runner (54), hold box (51) and set up in the right flank of support plate (1), hold and rotate between the front and back both sides wall of box (51) and be connected with pivot (52), the extrados middle part of pivot (52) twines elastic plastic film (53), draw runner (54) sliding connection is in the upper surface of support plate (1), and the outside end of elastic plastic film (53) passes the through-hole that holds box (51) upper surface and set up and right flank lower extreme fixed connection with draw runner (54), and draw runner (54) and V type shell fragment (7) cooperation are installed.

3. The sample introduction device of the semiconductor detection equipment according to claim 2, wherein: spacing subassembly (5) still include clockwork spring (55), clockwork spring (55) symmetry fixed connection is in the front and back both ends of the extrados of pivot (52), and the outside end of clockwork spring (55) all with hold the inner wall fixed connection of box (51).

4. The sample introduction device of the semiconductor detection equipment according to claim 2, wherein: the novel support plate is characterized by further comprising a limiting strip (8), wherein the limiting strip (8) is arranged at the left end of the upper surface of the support plate (1), and the distance between the limiting strip (8) and the V-shaped elastic sheet (7) is larger than the width of the sliding strip (54).

5. The sample introduction device of the semiconductor detection equipment according to claim 1, wherein: the material pushing component (6) comprises a motor (61), a groove-shaped batten (62) and a pushing block (63), the motor (61) is arranged on the inner wall of a mounting groove on the lower surface of the support plate (1), the groove-shaped batten (62) is arranged at the lower end of an output shaft of the motor (61), the pushing block (63) is connected to the inner wall of the groove-shaped batten (62) in a sliding mode, the upper end of the pushing block (63) penetrates through the inner arc surface sliding connection which is used for avoiding the groove (4) and is connected with the partition plate (3), the input end of the motor (61) is electrically connected with the output end of the single chip microcomputer (12) arranged on the left side surface of the support plate (1), and an external power supply is electrically connected with the input end of the single chip microcomputer (12).

6. The sample introduction device of the semiconductor detection equipment according to claim 5, wherein: the novel carrier plate is characterized by further comprising a sliding block (9) and an annular groove (10), wherein the annular groove (10) is formed in the outer edge of the lower surface of the carrier plate (1), the sliding block (9) is rotatably connected to the outer end of the groove-shaped batten (62), and the sliding block (9) is in sliding connection with the inner wall of the annular groove (10).

7. The sample introduction device of the semiconductor detection equipment according to claim 1, wherein: the lower surface of the carrier plate (1) is provided with symmetrically distributed support legs (11).