CN215276930U - Preparation facilities of nickel silver corrosive liquid for semiconductor chip - Google Patents

Abstract

The utility model discloses a preparation device of nickel-silver corrosive liquid for a semiconductor chip, which comprises a tank body; the top of the tank body is equidistantly provided with a proportioning tank, and the outer side of the bottom of the tank body is provided with a liquid storage mechanism; the utility model discloses an install automatic ratio mechanism in the outside of ratio tank bottoms portion, when flowing out the internal portion of jar along with the solution, level sensor can monitor the solution of stock solution mechanism inside, monitor when the liquid level is lower when level sensor, through conveying the instruction to the control box, then open through control box control solenoid, make the solution of ratio jar inside flow out in time to carry out the ratio to supply to solution, install clearance mechanism through the internal top at the jar, motor element through the telescopic link inside drives lead screw structure drive nut and removes, it is flexible to make the flexible end of telescopic link, and then drive the connecting plate and remove, can drive the brush in the outside when the connecting plate removes and clear up the remaining solution of the internal portion of jar.

Description

Preparation facilities of nickel silver corrosive liquid for semiconductor chip

Technical Field

The utility model relates to a nickel silver corrosive liquid preparation technical field specifically is a preparation facilities of nickel silver corrosive liquid for semiconductor chip.

Background

After a nickel layer and a silver layer are continuously plated on a semiconductor crystalline silicon material, photoresist with a certain specification and size is coated on the silver layer for protection, a groove coating formed between the photoresist and the photoresist needs to be corroded and removed by using special corrosive liquid so as to meet customer requirements, then a semiconductor chip is manufactured, nickel and silver metals in the chip can be efficiently removed, meanwhile, products of the products are easy to clean completely by subsequent processes through dispersing, complexing and other methods, and the problem that the products are difficult to clean after general liquid medicine is corroded so as to cause the process risks of micro short circuit, electric leakage and the like is solved.

The prior preparation device of the nickel-silver corrosive liquid for the semiconductor chip has the following defects:

1. the existing preparation device of the nickel-silver corrosive liquid for the semiconductor chip generally needs manual proportioning by people, and people cannot know the use degree of the solution to proportion the solution at the first time in the using process, so that the use of people is influenced;

2. when the existing preparation device of the nickel-silver corrosive liquid for the semiconductor chip generally carries out solution proportioning for a long time, a certain amount of solution can be remained in the device, and the quality of the solution which is proportioned next time by people can be influenced by the remained solution.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a preparation facilities of nickel silver corrosive liquid for semiconductor chip to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a preparation device of nickel-silver corrosive liquid for a semiconductor chip comprises a tank body; the top of the tank body is equidistantly provided with a proportioning tank, the outer side of the bottom of the proportioning tank is provided with an automatic proportioning mechanism, the inner top of the tank body is provided with a cleaning mechanism, and the outer side of the bottom of the tank body is provided with a liquid storage mechanism;

the automatic proportioning mechanism comprises a liquid level sensor, a flowmeter and an electromagnetic valve, the flowmeter is mounted on the outer side of the bottom of the proportioning tank, the electromagnetic valve is mounted at the bottom of the flowmeter, and the liquid level sensor is mounted in the liquid storage mechanism;

the cleaning mechanism comprises a telescopic rod, a connecting plate and a brush, the telescopic rod is installed at the top of the tank body, the connecting plate is installed at the bottom of the telescopic rod, and the brush is installed on the outer side of the connecting plate.

Preferably, the front surface of the outer side of the tank body is provided with a control box, and the bottom of the control box is provided with an electric wire.

Preferably, the front of control box is installed the pilot lamp, and the switch is installed to the bottom of pilot lamp.

Preferably, the bottom equidistance of the jar body is equipped with the supporting leg, and the supporting leg is kept away from the one end of the jar body and is installed the base.

Preferably, the motor is installed at the central position of the top of the tank body, and the sleeve is installed on one side, close to the motor, of the top in the tank body.

Preferably, a connecting rod is installed inside the sleeve, and a screw rod is installed outside the connecting rod.

Preferably, the liquid storage mechanism comprises a connecting seat and a storage pipe, the connecting seat is installed on the outer side of the bottom of the tank body, and the storage pipe is installed inside the connecting seat.

Preferably, a water inlet is formed in one side of the tank body, and a solution outlet is formed in the inner bottom of the tank body, which is far away from the water inlet.

Preferably, a waste water outlet is arranged at the center of the bottom of the tank body, and a plug is arranged in the waste water outlet.

Preferably, the control box is electrically connected with the motor and the telescopic rod, and the control box is electrically connected with the liquid level sensor, the flowmeter and the electromagnetic valve.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses an install automatic ratio mechanism in the outside of ratio tank bottoms portion, when flowing out jar internal portion along with solution, level sensor can monitor the solution of stock solution mechanism inside, when level sensor monitors the liquid level lower, through conveying the instruction to the control box, then opens through control box control solenoid valve, makes the solution of ratio jar inside flow in time carry out the ratio to solution and supply, and then can not influence people's use.

2. The utility model discloses an install clearance mechanism at the internal top of jar body, drive lead screw structure drive nut through the inside motor element of telescopic link and remove, make the flexible end of telescopic link flexible, and then drive the connecting plate and remove, can drive the brush in the outside when the connecting plate removes and clear up the remaining solution of jar internal portion, and then can not influence the solution quality that people's ratio came out next time.

Drawings

Fig. 1 is a schematic front internal structure diagram of the present invention;

fig. 2 is a schematic view of the back structure of the present invention;

fig. 3 is a schematic front structural view of the present invention;

fig. 4 is a schematic top view of the present invention.

In the figure: 1. a tank body; 101. supporting legs; 102. a base; 103. a water inlet; 104. a solution outlet; 105. a waste water discharge port; 106. a plug; 2. a control box; 201. an indicator light; 202. a switch; 203. an electric wire; 3. a motor; 301. a sleeve; 302. a connecting rod; 303. a screw rod; 4. a cleaning mechanism; 401. a telescopic rod; 402. a connecting plate; 403. a brush; 5. a proportioning tank; 6. an automatic proportioning mechanism; 601. a liquid level sensor; 602. a flow meter; 603. an electromagnetic valve; 7. a liquid storage mechanism; 701. a connecting seat; 702. and (4) storing the tube.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-4, the present invention provides an embodiment: a preparation device of nickel-silver corrosive liquid for a semiconductor chip comprises a tank body 1; the top of the tank body 1 is equidistantly provided with a proportioning tank 5, the outer side of the bottom of the proportioning tank 5 is provided with an automatic proportioning mechanism 6, the inner top of the tank body 1 is provided with a cleaning mechanism 4, and the outer side of the bottom of the tank body 1 is provided with a liquid storage mechanism 7;

the automatic proportioning mechanism 6 comprises a liquid level sensor 601, a flow meter 602 and an electromagnetic valve 603, the flow meter 602 is installed on the outer side of the bottom of the proportioning tank 5, the electromagnetic valve 603 is installed on the bottom of the flow meter 602, and the liquid level sensor 601 is installed inside the liquid storage mechanism 7;

the cleaning mechanism 4 comprises an expansion link 401, a connecting plate 402 and a hairbrush 403, the expansion link 401 is mounted at the inner top of the tank body 1, the connecting plate 402 is mounted at the bottom of the expansion link 401, and the hairbrush 403 is mounted on the outer side of the connecting plate 402;

specifically, as shown in fig. 1, fig. 2, fig. 3 and fig. 4, before use, a person connects the apparatus to an external power source through an electric wire 203, and then the apparatus is transported to each solution to be used through the interior of the proportioning tank 5, and simultaneously, the volume of the liquid flowing out of the interior of the proportioning tank 5 can be monitored through a flow meter 602, when the liquid flowing out of the interior of the proportioning tank 5 reaches a certain value, the flow meter 602 transmits an instruction to the control box 2, the control box 2 transmits the instruction to the electromagnetic valve 603, so that the electromagnetic valve 603 closes the proportioning tank 5, thereby avoiding the liquid flowing out of the interior of the proportioning tank 5, when the liquid is injected into the interior of the tank body 1, a part of the liquid flows into the interior of the liquid storage mechanism 7, then the motor 3 drives the screw rod 303 outside the connecting rod 302 to rotate, thereby rapidly and sufficiently fusing the liquid in the interior of the tank body 1, when the nickel-silver corrosive liquid is configured in the interior of the tank body 1, by installing a transport pipe inside the solution outlet 104, then the solution in the tank body 1 is conveyed out through the conveying pipe, when the solution flows out of the tank body 1, the solution in the liquid storage mechanism 7 can be monitored by the liquid level sensor 601, when the liquid level is monitored by the liquid level sensor 601 to be lower, an instruction is transmitted to the control box 2, then the electromagnetic valve 603 is controlled to be opened by the control box 2, so that the solution in the proportioning tank 5 flows out to carry out proportioning supplement on the solution in time, and further the use of people is not influenced, when the device is used for a long time, the motor component in the telescopic rod 401 drives the screw rod structure transmission nut to move, so that the telescopic end of the telescopic rod 401 stretches and retracts, and further the connecting plate 402 is driven to move, when the connecting plate 402 moves, the outer side brush 403 can be driven to clean the solution remained in the tank body 1, and the cleaned solution can be discharged from the waste water outlet 105 at the bottom of the tank body 1, and further the quality of the solution prepared by people next time can not be influenced.

Further, a control box 2 is arranged on the front surface of the outer side of the tank body 1, and an electric wire 203 is arranged at the bottom of the control box 2;

specifically, as shown in fig. 3, before use, a person connects the device to an external power source through a wire 203, and when the device is connected to the power source, the person can control the device to start operating by operating a switch 202 on one side of the control box 2, and the control box 2 can hold internal control components.

Further, the front surface of the control box 2 is provided with an indicator lamp 201, and the bottom of the indicator lamp 201 is provided with a switch 202;

specifically, as shown in fig. 3, when the internal components of the device start to work, the corresponding indicator light 201 will light up, so that the operator can know the operation condition of the device conveniently, and the switch 202 can operate the device conveniently to start working.

Furthermore, the bottom of the tank body 1 is equidistantly provided with supporting legs 101, and one end of each supporting leg 101, which is far away from the tank body 1, is provided with a base 102;

specifically, as shown in fig. 3, the bottom of the tank body 1 is welded with a support leg 101, the support leg 101 can support the tank body 1 at the top, and the base 102 can increase the contact area between the support leg 101 and the ground, thereby improving the stability of the tank body 1.

Further, a motor 3 is arranged at the center of the top of the tank body 1, and a sleeve 301 is arranged on one side, close to the motor 3, of the top in the tank body 1;

specifically, as shown in fig. 1, a connecting rod 302 is installed inside the sleeve 301, and the output end of the motor 3 penetrates through the sleeve 301 to be connected to the connecting rod 302, so that when the motor 3 works, one end of the connecting rod 302 can be driven to rotate inside the sleeve 301.

Further, a connecting rod 302 is arranged inside the sleeve 301, and a screw rod 303 is arranged outside the connecting rod 302;

specifically, as shown in fig. 1, when motor 3 works and drives connecting rod 302 to rotate, connecting rod 302 can drive the hob 303 in the outside and rotate, and the solution in tank 1 can be fully fused fast through hob 303 rotation, and then the use in personnel's later stage is convenient for.

Further, the liquid storage mechanism 7 comprises a connecting seat 701 and a storage pipe 702, the connecting seat 701 is installed on the outer side of the bottom of the tank body 1, and the storage pipe 702 is installed inside the connecting seat 701;

specifically, as shown in fig. 2, when the solution is configured inside the tank body 1, the corresponding solution flows into the storage pipe 702 through the connection seat 701, the liquid level sensor 601 is installed inside the storage pipe 702, and the liquid level sensor 601 can monitor the solution inside the tank body 1 in real time by detecting the level of the solution inside the storage pipe 702.

Further, a water inlet 103 is arranged in one side of the tank body 1, and a solution outlet 104 is arranged at the bottom of the tank body 1 far away from the water inlet 103;

specifically, as shown in fig. 1, connect the outside pipeline through water inlet 103, can carry outside water to the inside of jar body 1, when jar internal portion disposes the nickel silver corrosive liquid, through the internally mounted conveyer pipe at solution outlet 104, then convey away the inside solution of jar body 1 through the conveyer pipe, and then be convenient for personnel's use.

Further, a waste water outlet 105 is arranged at the central position of the bottom of the tank body 1, and a plug 106 is arranged in the waste water outlet 105;

specifically, as shown in fig. 1, when the cleaning mechanism 4 is used by a person to clean the inside of the tank 1, the plug 106 inside the waste water discharge port 105 is pulled out, so that the waste water inside the tank 1 can be discharged through the waste water discharge port 105.

Further, the control box 2 is electrically connected with the motor 3 and the telescopic rod 401, and the control box 2 is electrically connected with the liquid level sensor 601, the flowmeter 602 and the electromagnetic valve 603;

specifically, as shown in fig. 1, 2 and 3, a person can connect the motor 3, the telescopic rod 401, the liquid level sensor 601, the flow meter 602 and the electromagnetic valve 603 to start working by operating the switch 202 on the front surface of the control box 2.

The working principle is as follows: before use, a person connects the device with an external power supply through an electric wire 203, when the device is connected with the power supply, the person can control the device to start working by operating a switch 202 on one side of a control box 2, then the device is conveyed to each solution to be used by the device to the inside of a proportioning tank 5, the volume of the liquid flowing out of the inside of the proportioning tank 5 can be monitored through a flow meter 602, when the liquid flowing out of the inside of the proportioning tank 5 reaches a certain value, the flow meter 602 can transmit an instruction to the control box 2, the control box 2 transmits the instruction to an electromagnetic valve 603, the electromagnetic valve 603 closes the proportioning tank 5, then a motor 3 drives a screw rod 303 on the outer side of a connecting rod 302 to rotate, the solution in the tank body 1 is quickly and sufficiently fused, when the nickel-silver corrosive liquid is configured in the tank body 1, the solution is conveyed through a conveying pipe arranged in a solution outlet 104, and flows out of the tank body 1 along with the solution, level sensor 601 can monitor the solution of stock solution mechanism 7 inside, when level sensor 601 monitors the liquid level lower, through conveying the instruction to control box 2, then open through control box 2 control solenoid valve 603, make the inside solution of ratio jar 5 flow out in time carry out the ratio replenishment to solution, when the device live time is too long, drive screw rod structure drive nut through the inside motor element of telescopic link 401 and remove, and then make telescopic end of telescopic link 401 flexible, and then drive connecting plate 402 and remove, can drive the brush 403 in the outside when connecting plate 402 removes and clear up the remaining solution of jar internal portion 1, and the solution after the clearance can be followed jar waste water discharge port 105 of body 1 bottom and discharged.

The details of the present invention are well known to those skilled in the art.

Finally, it is to be noted that: the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the examples, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified and replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the scope of the claims of the present invention.

Claims (10)

1. A preparation device of nickel-silver corrosive liquid for a semiconductor chip comprises a tank body (1); the method is characterized in that: the proportioning tank (5) is installed on the top of the tank body (1) at equal intervals, the automatic proportioning mechanism (6) is installed on the outer side of the bottom of the proportioning tank (5), the cleaning mechanism (4) is installed on the inner top of the tank body (1), and the liquid storage mechanism (7) is installed on the outer side of the bottom of the tank body (1);

the automatic proportioning mechanism (6) comprises a liquid level sensor (601), a flow meter (602) and an electromagnetic valve (603), the flow meter (602) is installed on the outer side of the bottom of the proportioning tank (5), the electromagnetic valve (603) is installed on the bottom of the flow meter (602), and the liquid level sensor (601) is installed inside the liquid storage mechanism (7);

clearance mechanism (4) include telescopic link (401), connecting plate (402) and brush (403), and telescopic link (401) are installed at the interior top of jar body (1), connecting plate (402) are installed to the bottom of telescopic link (401), brush (403) are installed in the outside of connecting plate (402).

2. The apparatus for preparing nickel silver etchant for semiconductor chip according to claim 1, wherein: the front of the outer side of the tank body (1) is provided with a control box (2), and the bottom of the control box (2) is provided with an electric wire (203).

3. The apparatus for preparing nickel silver etchant for semiconductor chip according to claim 2, wherein: the front of control box (2) is installed pilot lamp (201), and switch (202) are installed to the bottom of pilot lamp (201).

4. The apparatus for preparing nickel silver etchant for semiconductor chip according to claim 1, wherein: the bottom equidistance of the tank body (1) is equipped with supporting leg (101), and base (102) are installed to the one end that the tank body (1) was kept away from to supporting leg (101).

5. The apparatus for preparing nickel silver etchant for semiconductor chip according to claim 1, wherein: the central point department at the jar body (1) top installs motor (3), and one side that the top is close to motor (3) in jar body (1) installs sleeve (301).

6. The apparatus for preparing nickel silver etchant for semiconductor chip according to claim 5, wherein: the connecting rod (302) is installed in the sleeve (301), and the screw rod (303) is installed on the outer side of the connecting rod (302).

7. The apparatus for preparing nickel silver etchant for semiconductor chip according to claim 1, wherein: the liquid storage mechanism (7) comprises a connecting seat (701) and a storage pipe (702), the connecting seat (701) is installed on the outer side of the bottom of the tank body (1), and the storage pipe (702) is installed inside the connecting seat (701).

8. The apparatus for preparing nickel silver etchant for semiconductor chip according to claim 1, wherein: a water inlet (103) is formed in one side of the tank body (1), and a solution outlet (104) is formed in the inner bottom of one side, far away from the water inlet (103), of the tank body (1).

9. The apparatus for preparing nickel silver etchant for semiconductor chip according to claim 1, wherein: a waste water outlet (105) is arranged at the central position of the bottom of the tank body (1), and a plug (106) is arranged in the waste water outlet (105).

10. The apparatus for preparing nickel silver etchant for semiconductor chip according to claim 2, wherein: the control box (2) is electrically connected with the motor (3) and the telescopic rod (401), and the control box (2) is electrically connected with the liquid level sensor (601), the flowmeter (602) and the electromagnetic valve (603).

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