CN215268714U - Bone voiceprint sensing mechanism and electronic terminal equipment - Google Patents

Abstract

The application provides a bone voiceprint sensing mechanism and an electronic terminal device. The bone voiceprint sensing mechanism comprises a substrate and a vibration pickup piezoelectric component, wherein the vibration pickup piezoelectric component is installed on the substrate. The vibration pickup piezoelectric assembly comprises a piezoelectric sensing unit and a mass block, wherein the piezoelectric sensing unit is made of piezoelectric materials, the mass block is in contact with the piezoelectric sensing unit from one side or two sides and is used for picking up external vibration to apply corresponding pressure to the piezoelectric sensing unit, and the piezoelectric sensing unit converts the pressure into an electric signal. In this way, the bone voiceprint sensing mechanism utilizes the mass block to pick up bone vibration and convert the bone vibration into pressure to the piezoelectric sensing unit, and further converts the pressure into an electrical signal through the piezoelectric sensing unit. The utility model provides a bone voiceprint sensing mechanism's consumption is little and be difficult for receiving the foreign matter and disturb, and very clear sound signal can be gathered to this bone voiceprint sensing mechanism moreover. In addition, the electronic terminal equipment comprising the bone voiceprint sensing mechanism has the same advantages.

Description

Bone voiceprint sensing mechanism and electronic terminal equipment

Technical Field

The present application relates to a bone voiceprint sensing technology, and in particular, to a bone voiceprint sensing mechanism and an electronic terminal device including the same.

Background

In the prior art, the bone voiceprint sensing technology is a technology for collecting a sound signal by using slight vibration of a bone caused when a living body (e.g., a human) utters. Since this technique is different from the conventional technique of collecting a sound signal through air conduction, a very clear sound signal can be collected also in a noisy environment. Due to the unique functions of uplink noise reduction, voice awakening, bone voiceprint ID and the like, the bone voiceprint sensing technology can be applied to various electronic terminal devices (such as wireless earphones, smart watches, bracelets and the like), and the application field is more and more extensive.

In the existing bone voiceprint sensor using the bone voiceprint sensing technology, an acceleration sensor or a MEMS diaphragm is generally used to pick up vibration to finally output an analog signal or a digital signal. However, the existing acceleration sensor has the problem of large power consumption, and the MEMS diaphragm is easily interfered by foreign matters and even stuck.

SUMMERY OF THE UTILITY MODEL

In view of the above, an object of the present invention is to provide a novel bone voiceprint sensing mechanism, which has the advantages of low power consumption and being not easily interfered by foreign objects, and can collect a very clear sound signal. Another object of the present application is to provide an electronic terminal device including the above bone voiceprint sensing mechanism, which has the same effect.

Therefore, the following technical scheme is adopted in the application.

Scheme 1 of the present application provides a bone voiceprint sensing mechanism comprising a substrate and a vibration pickup piezoelectric assembly mounted on the substrate,

the vibration pickup piezoelectric assembly comprises a piezoelectric sensing unit and a mass block, wherein the piezoelectric sensing unit is made of piezoelectric materials, the mass block is in contact with the piezoelectric sensing unit from one side or two sides and is used for picking up external vibration to apply corresponding pressure to the piezoelectric sensing unit, and the piezoelectric sensing unit converts the pressure into an electric signal.

Through adopting above-mentioned technical scheme, utilize the piezoelectricity sensing element that piezoelectric material made according to the bone voiceprint sensing mechanism of this application, compare with the current bone voiceprint sensing mechanism that utilizes acceleration sensor and have the advantage that the consumption is little, compare with the bone voiceprint sensing mechanism that utilizes the MEMS vibrating diaphragm and have the advantage that is difficult for receiving the foreign matter and disturb. On the basis of having the advantage above-mentioned, the bone voiceprint sensing mechanism according to the present application can gather very clear sound signals.

According to the bone voiceprint sensing mechanism of claim 1 of the present application, claim 2 of the present application provides a bone voiceprint sensing mechanism in which the piezoelectric sensing unit includes a plurality of layers of the piezoelectric material, the plurality of layers of the piezoelectric material being laminated together in a thickness direction.

By adopting the technical scheme, the piezoelectric sensing unit can be ensured to convert the pressure of the mass block into a high-frequency current signal with high resolution.

According to the bone voiceprint sensing mechanism of claim 1 or claim 2 of the present application, claim 3 of the present application provides a bone voiceprint sensing mechanism, wherein the piezoelectric material is a piezoelectric crystal material, a ceramic piezoelectric material or a polyvinylidene fluoride piezoelectric film.

By adopting the technical scheme, the piezoelectric material of the piezoelectric sensing unit has wide selection range, and the appropriate piezoelectric material can be selected according to different factors such as cost, use environment and the like.

According to the bone voiceprint sensing mechanism of any one of aspects 1 to 3 of the present application, aspect 4 of the present application provides a bone voiceprint sensing mechanism in which the piezoelectric sensing unit is fixed on the substrate, and the mass is pressed against the piezoelectric sensing unit from the side opposite to the side on which the substrate is located.

By adopting the above technical solution, in the case of a piezoelectric sensing unit made of a piezoelectric material, a solution is proposed in which a mass block can efficiently transmit pressure to the piezoelectric sensing unit based on vibration.

According to the bone voiceprint sensing mechanism of claim 4 of the present application, the claim 5 of the present application provides a bone voiceprint sensing mechanism, the vibration pickup piezoelectric assembly includes a first housing and an elastic member, the first housing is fixed on the piezoelectric sensing unit, the mass block and the elastic member are accommodated in the first housing, the elastic member is interposed between the first housing and the mass block, and is used for applying a spring force towards the piezoelectric sensing unit to the mass block.

By adopting the technical scheme, the protection function of the mass block and the piezoelectric sensing unit is realized by using a simple structure, and the mass block is pressed against the piezoelectric sensing unit by the structure, so that the mass block can effectively apply pressure to the piezoelectric sensing unit.

According to the bone voiceprint sensing mechanism of claim 5 of the present application, claim 6 of the present application provides a bone voiceprint sensing mechanism in which the first housing is formed with a first pressure equalizing hole that allows the inside and outside of the first housing to communicate.

Through adopting above-mentioned technical scheme, can make the interior gas that is heated expanding of first casing follow first pressure-equalizing hole and discharge at the in-process that first casing was installed on the base plate.

According to the bone voiceprint sensing mechanism of any one of aspects 1 to 3 of the present application, aspect 7 of the present application provides a bone voiceprint sensing mechanism in which the piezoelectric sensing unit includes a peripheral portion at least a portion of which is fixed relative to the substrate and a central portion which is suspended relative to the substrate, the mass being fixed to the central portion from one or both sides of the piezoelectric sensing unit.

By adopting the above technical solution, in the case of a piezoelectric sensing unit made of a piezoelectric material, another solution is proposed in which a mass can effectively transmit pressure to the piezoelectric sensing unit based on vibration.

According to the bone voiceprint sensing mechanism of claim 7 of the present application, claim 8 of the present application provides a bone voiceprint sensing mechanism in which the masses are fixed to the central portion from both sides of the piezoelectric sensing unit, the mass of one side of the piezoelectric sensing unit being the same as the mass of the other side of the piezoelectric sensing unit.

By adopting the technical scheme, the vibration picked up by the mass block is favorably converted into the pressure on the piezoelectric sensing unit and is smoothly transmitted to the piezoelectric sensing unit.

According to the bone voiceprint sensing mechanism of claim 8 of the present application, claim 9 of the present application provides a bone voiceprint sensing mechanism in which the number of masses on one side of the piezoelectric sensing unit is the same as the number of masses on the other side of the piezoelectric sensing unit.

By adopting the technical scheme, the vibration picked up by the mass block is favorably converted into the pressure on the piezoelectric sensing unit and is smoothly transmitted to the piezoelectric sensing unit.

According to the bone voiceprint sensing mechanism of claim 8 or 9 of the present application, the solution 10 of the present application provides a bone voiceprint sensing mechanism in which the mounting position of the mass on one side of the piezoelectric sensing unit is the same as the mounting position of the mass on the other side of the piezoelectric sensing unit.

By adopting the technical scheme, the vibration picked up by the mass block is favorably converted into the pressure on the piezoelectric sensing unit and is smoothly transmitted to the piezoelectric sensing unit.

The bone voiceprint sensing mechanism according to any one of aspects 7 to 10 of the present application, aspect 11 of the present application provides a bone voiceprint sensing mechanism in which the vibration pickup piezoelectric assembly includes a first housing fixed to the substrate, the piezoelectric sensing unit and the mass block are housed in the first housing, and the peripheral portion is fixed to the first housing.

Through adopting above-mentioned technical scheme, utilize simple structure to realize the protect function to quality piece and piezoelectricity sensing element to this structure can also make the unsettled setting of piezoelectricity sensing element, realizes utilizing the vibration to make the quality piece exert pressure smoothly to piezoelectricity sensing element under the fixed quality piece's of the both sides of piezoelectricity sensing element the condition.

According to the bone voiceprint sensing mechanism of claim 11 of the present application, claim 12 of the present application provides a bone voiceprint sensing mechanism in which the first housing is formed with a first pressure equalizing hole that allows the inside and outside of the first housing to communicate.

Through adopting above-mentioned technical scheme, can make the interior gas that is heated expanding of first casing follow first pressure-equalizing hole and discharge at the in-process that first casing was installed on the base plate.

According to the bone voiceprint sensing mechanism of any one of aspects 1 to 12 of the present application, aspect 13 of the present application provides a bone voiceprint sensing mechanism further comprising an application specific integrated circuit chip mounted on the substrate, the application specific integrated circuit chip being connected to the piezoelectric sensing unit via a conductive circuit.

By adopting the above technical solution, the asic chip can integrate various required circuits such as an anti-RF circuit, a filter circuit, and an amplifier circuit, thereby converting the current signal from the piezoelectric sensing unit into a digital signal with high resolution.

According to the bone voiceprint sensing mechanism of any one of aspects 1 to 13 of the present application, aspect 14 of the present application provides a bone voiceprint sensing mechanism, wherein the substrate is a printed circuit board, the asic chip and the vibration pickup piezoelectric component are located on one side of the substrate, and a positive terminal, a negative terminal and a ground terminal are provided on the surface of the other side of the substrate.

Through adopting above-mentioned technical scheme, realized reasonable structural layout, can not influence under the smooth condition of working of bone voiceprint sensing mechanism with power transmission to bone voiceprint sensing mechanism.

According to the bone voiceprint sensing mechanism of any one of aspects 1 to 14 of the present application, aspect 15 of the present application provides a bone voiceprint sensing mechanism further comprising a second housing, the second housing being fixed to the substrate, the vibration pickup piezoelectric assembly and the asic chip being housed in the second housing.

By adopting the technical scheme, effective protection can be provided for the vibration pickup piezoelectric component and the special integrated circuit chip.

According to the bone voiceprint sensing mechanism of claim 15 of the present application, claim 16 of the present application provides a bone voiceprint sensing mechanism in which the second housing is formed with a second pressure equalizing hole that allows the interior and exterior of the second housing to communicate.

Through adopting above-mentioned technical scheme, can make the interior gas that is heated expanding of second casing discharge from second pressure-equalizing hole in the in-process of second casing installation on the base plate.

An aspect 17 of the present application provides an electronic terminal device including the bone voiceprint sensing mechanism according to any one of the above aspects.

This aspect provides an electronic terminal device comprising a bone voiceprint sensing mechanism according to the present application, which accordingly has the advantages of a bone voiceprint sensing mechanism according to the present application.

According to the electronic terminal device of claim 17, the electronic terminal device of claim 18 is an earphone, a watch, a bracelet, or a stethoscope.

By adopting the technical scheme, the types of various electronic terminal devices capable of using the bone voiceprint sensing mechanism according to the application are further determined.

These and other aspects of the present application will be more readily apparent from the following description of the embodiment(s).

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate exemplary embodiments, features, and aspects of the application and, together with the description, serve to explain the principles of the application.

FIG. 1 is a block diagram illustrating the workflow of a bone voiceprint sensing mechanism according to the present application.

Fig. 2A is a perspective schematic view showing the structure of a bone voiceprint sensing mechanism according to a first embodiment of the present application.

Fig. 2B is a schematic bottom view illustrating the bone voiceprint sensing mechanism of fig. 2A.

Fig. 3 is a perspective schematic view showing the structure of a bone voiceprint sensing mechanism according to a second embodiment of the present application.

Fig. 4 is a perspective schematic view showing the structure of a bone voiceprint sensing mechanism according to a third embodiment of the present application.

Description of the reference numerals

1 substrate 11 ground terminal 12 positive terminal 13 negative terminal 2, 2 ', 2 "vibration pickup piezoelectric assembly 21, 21 ', 21" piezoelectric sensing unit 22, 22 ', 22 " mass 23, 23 ', 23" first case 23h, 23 ' h, 23 "h first voltage equalizing hole 24 elastomer 3 second case 4h second voltage equalizing hole L wire.

Detailed Description

Various exemplary embodiments, features and aspects of the present application will be described in detail below with reference to the accompanying drawings. In the drawings, like reference numbers can indicate functionally identical or similar elements. While the various aspects of the embodiments are presented in drawings, the drawings are not necessarily drawn to scale unless specifically indicated.

The word "exemplary" is used exclusively herein to mean "serving as an example, embodiment, or illustration. Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments.

In addition, in the following detailed description, numerous specific details are set forth in order to provide a better understanding of the present application. It will be understood by those skilled in the art that the present application may be practiced without some of these specific details. In some instances, methods, means, elements well known to those skilled in the art have not been described in detail so as not to obscure the present application.

The working principle of the bone voiceprint sensing mechanism according to the present application is first explained below.

As shown in fig. 1, when a living body (e.g., a human) produces a sound, cartilage of the body is vibrated, thereby generating a vibration signal. The vibration signal would be input into the bone voiceprint sensing mechanism according to the present application and picked up by the pickup piezoelectric assembly. The mass of the pickup piezoelectric assembly dynamically applies pressure to the piezoelectric sensing unit (i.e., signal generation in fig. 1) according to the frequency of the vibration signal. In this way, as the pressure applied by the mass to the piezoelectric sensing unit is different, the piezoelectric sensing unit converts the pressure applied by the mass to currents of different magnitudes (i.e., energy conversion in fig. 1) by using the principle of the positive piezoelectric effect of the piezoelectric material. The current is fed into an Application Specific Integrated Circuit (ASIC) chip, processed via anti-RF interference (anti-radio frequency interference), amplification and filtering (i.e., signal processing in fig. 1), thereby generating a corresponding proportion of electrical signals for output to the exterior of the bone voiceprint sensing mechanism.

The structure of a bone voiceprint sensing mechanism according to a first embodiment of the present application is described below with reference to the accompanying drawings of the specification.

(Structure of bone voiceprint sensing mechanism according to the first embodiment of the present application)

As shown in fig. 2A and 2B, the bone voiceprint sensing mechanism according to the first embodiment of the present application includes a substrate 1, a vibration pickup piezoelectric assembly 2, an application specific integrated circuit chip 3, and a second housing 4. The vibration pickup piezoelectric element 2, the application specific integrated circuit chip 3, and the second case 4 are mounted on the substrate 1.

In the present embodiment, as shown in fig. 2A and 2B, the substrate 1 is a printed circuit board, and the printed circuit board is provided with necessary traces. The vibration pickup piezoelectric component 2, the application specific integrated circuit chip 3, and the second case 4 are located on one side (upper side in fig. 2A) of the substrate 1, and the surface of the other side (lower side in fig. 2A) of the substrate 1 is provided with a positive terminal 12, a negative terminal 13, and a ground terminal 11 which are electrically connected to the outside. As shown in fig. 2B, the ground terminal 11 is disposed on the left side in the drawing, and the positive terminal 12 and the negative terminal 13 are disposed side by side on the right side in the drawing. These three terminals protrude slightly from the surface of the other side of the substrate 1, via which the power supply can supply power to the entire bone voiceprint sensing mechanism.

In the present embodiment, as shown in fig. 2A, the vibration pickup piezoelectric assembly 2 includes a piezoelectric sensing unit 21, a mass 22, a first housing 23, and an elastic member 24 assembled together.

Specifically, the piezoelectric sensing unit 21 is fixed on the substrate 1 and made of a piezoelectric material, and the piezoelectric sensing unit 21 includes a plurality of layers of piezoelectric materials, which are laminated together in the thickness direction. In this way, the piezoelectric sensing unit 21 can convert the pressure from the mass 22 into a current signal, and the response of the piezoelectric sensing unit 21 to the pressure from the mass 22 is more sensitive and accurate. Further, the piezoelectric material may be a piezoelectric crystal material, a ceramic piezoelectric material, or a polyvinylidene fluoride piezoelectric film, or may be other piezoelectric materials.

Further, under the action of the elastic member 24, the mass 22 abuts against the piezoelectric sensing unit 21 from one side (upper side in fig. 2A), so that the mass 22 is pressed against the piezoelectric sensing unit 21 from the opposite side to the side on which the substrate 1 is located. The mass 22 is used to pick up external vibrations and apply corresponding pressure to the piezoelectric sensing unit 21 based on the picked-up vibrations.

Further, a first case 23 is fixed on the piezoelectric sensing unit 21, and the mass 22 and the elastic member 24 are housed in the first case 23. The top of the first housing 23 is formed with a first pressure equalizing hole 23h, and the first pressure equalizing hole 23h allows the inside and the outside of the first housing 23 to communicate with each other, so that in the process of fixing the first housing 23 to the piezoelectric sensing unit 21 by means of heat fusion or the like, the gas expanded by heat inside the first housing 23 can overflow from the first pressure equalizing hole 23 h.

Further, the elastic member 24 is a cylindrical coil spring. The elastic member 24 is interposed between the first housing 23 and the mass 22 for always applying a spring force to the first mass 22 toward the piezoelectric sensing unit 21. It will be appreciated that the resilient member 24 may also be or include one or more resilient tabs, or other resilient members.

In the present embodiment, as shown in fig. 2A, the application specific integrated circuit chip 3 is mounted on the substrate 1. The application specific integrated circuit chip 3 and the piezoelectric sensing unit 21 are connected via a wire L. The asic chip 3 may integrate an anti-RF circuit (anti-RF circuit), a filter circuit, an amplifier circuit, an analog-to-digital converter circuit, and the like, so as to convert the current signal output from the piezoelectric sensing unit 21 into a digital signal and output the digital signal to the outside of the bone voiceprint sensing mechanism. In an alternative, the asic chip 3 may omit the analog-to-digital conversion circuit and directly output the analog signal. In another alternative, the asic chip 3 and the piezoelectric sensing unit 21 may be connected via other conductive traces such as traces provided on the substrate 1.

In the present embodiment, as shown in fig. 2A, the second housing 4 is mounted on the substrate 1. The vibration pickup piezoelectric component 2 and the application specific integrated circuit chip 3 are housed in the second case 4, so that the second case 4 can protect the vibration pickup piezoelectric component 2 and the application specific integrated circuit chip 3 and serve to shield interference of an external signal. The top of second casing 4 is formed with second pressure equalizing hole 4h, and second pressure equalizing hole 4h makes the inside and the outside intercommunication of second casing 4 to make and fix the in-process at piezoelectric sensing unit 21 through the means of hot melt at second casing 4, the gas that is heated expansion in the second casing 4 can be followed second pressure equalizing hole 4h and is overflowed.

By adopting the above-described structure, the bone voiceprint sensing mechanism according to the first embodiment of the present application can achieve the function as in fig. 1. Moreover, compared with the existing bone voiceprint sensing mechanism using an acceleration sensor, the bone voiceprint sensing mechanism according to the first embodiment of the present application has the advantage of low power consumption because the piezoelectric sensing unit 21 does not need an external power supply and can generate current according to pressure only by the characteristics of the piezoelectric material itself; in addition, compared with the bone voiceprint sensing mechanism using the MEMS diaphragm, since the piezoelectric sensing unit 21 does not have a fine hole structure like the MEMS diaphragm, the bone voiceprint sensing mechanism according to the first embodiment of the present application is not easily invaded by foreign objects to cause an abnormality in operation, and further has an advantage of being not easily interfered by foreign objects, and the sound signal collected by the bone voiceprint sensing mechanism is very clear.

The structure of a bone voiceprint sensing mechanism according to a second embodiment of the present application is described below with reference to the accompanying drawings of the specification.

(Structure of bone voiceprint sensing mechanism according to second embodiment of the present application)

The principle of the bone voiceprint sensing mechanism according to the second embodiment of the present application is the same as that of the bone voiceprint sensing mechanism according to the first embodiment of the present application, and the difference in structure between the two will be mainly explained below.

In the present embodiment, as shown in fig. 3, the vibration pickup piezoelectric assembly 2 'includes a piezoelectric sensing unit 21', two masses 22 ', and a first housing 23', but the elastic member is omitted as compared with the first embodiment.

Specifically, the piezoelectric sensing unit 21' includes a peripheral portion and a central portion surrounded by the peripheral portion. The peripheral portion is integrally fixed in the side wall of the first housing 23' such that the peripheral portion is fixed with respect to the substrate 1 and the central portion is suspended with respect to the substrate 1. Of course, a part of the peripheral edge portion may be fixed in the side wall of the first housing 23'. In an alternative, when the piezoelectric sensing unit 21 ' has a rectangular shape, a plurality of corners of the piezoelectric sensing unit 21 ' are fixed in the side wall of the first housing 23 ', and the above structure can also be achieved. Further, in another alternative, one side portion of the piezoelectric sensing unit 21 ' is fixed in the sidewall of the first case 23 ', so that the piezoelectric sensing unit 21 ' is formed in a cantilever structure.

Further, two masses 22 ' are fixed to the central portion of the piezoelectric sensing unit 21 ' from both sides of the piezoelectric sensing unit 21 '. The masses of the two masses 22' are identical. The two masses 22 ' are respectively installed at the same positions on both side surfaces of the piezoelectric sensing unit 21 ', i.e., at the central positions on both side surfaces of the piezoelectric sensing unit 21 ', so that the vibration picked up by the two masses 22 ' can be effectively converted into pressure and transmitted to the piezoelectric sensing unit 21 '.

Further, the first housing 23' is fixed on the substrate. In order to facilitate the peripheral edge portion to be fixed to the first housing 23 ', the thickness of the first housing 23' may be increased. As shown in fig. 3, a support wall portion may be added to the inside of the side wall of the first housing 23', and the peripheral edge portion can be protruded into and supported by the support wall portion. The top of the first casing 23 'forms a first pressure equalizing hole 23' h as in the first embodiment.

By adopting the above-described structure, the bone voiceprint sensing mechanism according to the second embodiment of the present application can achieve the same effects as the bone voiceprint sensing mechanism according to the first embodiment of the present application.

The structure of a bone voiceprint sensing mechanism according to a third embodiment of the present application is described below with reference to the accompanying drawings of the specification.

(Structure of bone voiceprint sensing mechanism according to third embodiment of the present application)

The structure of the bone voiceprint sensing mechanism according to the third embodiment of the present application is substantially the same as that of the bone voiceprint sensing mechanism according to the second embodiment of the present application, and the differences therebetween will be mainly described below.

In the present embodiment, as shown in FIG. 4, the vibration pickup piezoelectric assembly 2 "includes a large number of masses 22", and these masses 22 "are fixed to the piezoelectric sensing unit 21" in an array from both sides of the piezoelectric sensing unit 21 ". In the present embodiment, the total mass of the mass 22 "on one side of the piezoelectric sensing unit 21" is the same as the total mass of the mass 22 "on the other side of the piezoelectric sensing unit 21". The number of masses 22 "on one side of the piezoelectric sensing unit 21" is the same as the number of masses 22 "on the other side of the piezoelectric sensing unit 21". The mounting position of the mass 22 "on one side of the piezoelectric sensing unit 21" is the same as that of the mass 22 "on the other side of the piezoelectric sensing unit 21". In this way, it is facilitated to convert the picked-up vibration into pressure at the mass 22 "to be transmitted to the piezoelectric sensing unit 21". In addition, the piezoelectric sensing unit 21 "is fixed to the first case 23" as in the second embodiment, and the top of the first case 23 "forms the same first pressure equalizing hole 23" h as in the first embodiment.

By adopting the above-described structure, the bone voiceprint sensing mechanism according to the third embodiment of the present application can achieve the same effects as the bone voiceprint sensing mechanism according to the second embodiment of the present application.

The foregoing has outlined exemplary embodiments of the present application and additional description that follows.

i. Although it is explained in the above second and third embodiments that the mass of one side of the piezoelectric sensing unit is the same as the mass of the other side of the piezoelectric sensing unit, the number of the masses of one side of the piezoelectric sensing unit is the same as the number of the masses of the other side of the piezoelectric sensing unit, and the mounting position of the mass of one side of the piezoelectric sensing unit is the same as the mounting position of the mass of the other side of the piezoelectric sensing unit, the present application is not limited thereto. Under the condition of ensuring that the mass block can pick up bone vibration and convert the vibration into pressure to be transmitted to the piezoelectric sensing unit, the mass blocks with different numbers and/or masses can be arranged on two sides of the piezoelectric sensing unit, and the mounting positions of the mass blocks on the two side surfaces of the piezoelectric sensing unit can also be different. It is also possible to provide one or more masses on only one side of the piezoelectric sensing unit.

The arrangement of the masses on either side of the piezoelectric sensing unit is not specifically described in the above third embodiment, and the plurality of masses may be arranged in a matrix array or a circular array.

The present application further provides an electronic terminal device comprising a bone voiceprint sensing mechanism according to the present application. Such electronic terminal devices may be earphones, watches, bracelets, etc.

The bone voiceprint sensing mechanism can be used for achieving voice pickup scenes such as voice awakening, a call function and a recording function and has the advantages of being waterproof, dustproof, anti-interference, noise-reducing, good in reliability and the like. To better achieve the above advantages, the first and second pressure equalizing holes may be closed after the first and second casings are mounted in place.

v. although not explicitly described in the above specific embodiments, it should be understood that the bone voiceprint sensing mechanism according to the present application may be mounted to a housing of an electronic terminal device to pick up bone vibrations generated during biogenesis via the housing. In an alternative, the bone voiceprint sensing mechanism according to the present application can be in direct contact with the living being to pick up the bone vibrations.

While the present application has been described in connection with various embodiments, other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed application, from a review of the drawings, the disclosure, and the appended claims. In the claims, the word "comprising" does not exclude other elements or steps, and the word "a" or "an" does not exclude a plurality. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.

Having described embodiments of the present application, the foregoing description is intended to be exemplary, not exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen in order to best explain the principles of the embodiments, the practical application, or improvements made to the technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.

Claims (18)

1. A bone voiceprint sensing mechanism, characterized in that the bone voiceprint sensing mechanism comprises a substrate and a vibration pickup piezoelectric component, the vibration pickup piezoelectric component is mounted on the substrate,

the vibration pickup piezoelectric assembly comprises a piezoelectric sensing unit and a mass block, wherein the piezoelectric sensing unit is made of piezoelectric materials, the mass block is in contact with the piezoelectric sensing unit from one side or two sides and is used for picking up external vibration to apply corresponding pressure to the piezoelectric sensing unit, and the piezoelectric sensing unit converts the pressure into an electric signal.

2. The bone voiceprint sensing mechanism of claim 1 wherein said piezoelectric sensing unit comprises a plurality of layers of said piezoelectric material laminated together in a thickness direction.

3. The bone voiceprint sensing mechanism of claim 2 wherein said piezoelectric material is a piezoelectric crystal material, a ceramic piezoelectric material or a polyvinylidene fluoride piezoelectric film.

4. The bone voiceprint sensing mechanism of any one of claims 1 to 3 wherein said piezoelectric sensing unit is fixed on said substrate, said mass pressing against said piezoelectric sensing unit from the opposite side to that of said substrate.

5. The bone voiceprint sensing mechanism of claim 4 wherein the vibration pickup piezoelectric assembly comprises a first housing and a spring, the first housing being fixed to the piezoelectric sensing unit, the mass and the spring being received within the first housing, the spring being interposed between the first housing and the mass for exerting a spring force on the mass toward the piezoelectric sensing unit.

6. The bone voiceprint sensing mechanism of claim 5 wherein said first housing is formed with a first pressure equalizing aperture that communicates between the interior and exterior of the first housing.

7. The bone voiceprint sensing mechanism of any one of claims 1 to 3 wherein the piezoelectric sensing unit comprises a peripheral portion at least a portion of which is fixed relative to the substrate and a central portion which is suspended relative to the substrate, the mass being fixed to the central portion from one or both sides of the piezoelectric sensing unit.

8. The bone voiceprint sensing mechanism of claim 7 wherein said masses are fixed to said central portion from both sides of said piezoelectric sensing unit, the mass of the mass on one side of said piezoelectric sensing unit being the same as the mass of the mass on the other side of said piezoelectric sensing unit.

9. The bone voiceprint sensing mechanism of claim 8 wherein the number of masses on one side of the piezoelectric sensing unit is the same as the number of masses on the other side of the piezoelectric sensing unit.

10. The bone voiceprint sensing mechanism of claim 9 wherein the mounting location of the mass on one side of the piezoelectric sensing unit is the same as the mounting location of the mass on the other side of the piezoelectric sensing unit.

11. The bone voiceprint sensing mechanism of claim 7 wherein said vibration pickup piezoelectric assembly includes a first housing, said first housing being fixed to said substrate, said piezoelectric sensing unit and said mass being received within said first housing, said peripheral portion being fixed to said first housing.

12. The bone voiceprint sensing mechanism of claim 11 wherein said first housing is formed with a first pressure equalizing aperture that communicates between the interior and exterior of said first housing.

13. The bone voiceprint sensing mechanism of any one of claims 1 to 3 further comprising an application specific integrated circuit chip mounted on said substrate, said application specific integrated circuit chip being connected to said piezoelectric sensing unit via conductive traces.

14. The bone voiceprint sensing mechanism of claim 13 wherein said substrate is a printed circuit board, said asic chip and said vibration pickup piezoelectric assembly are located on one side of said substrate, and a surface of the other side of said substrate is provided with a positive terminal, a negative terminal and a ground terminal.

15. The bone voiceprint sensing mechanism of claim 14 further comprising a second housing, said second housing being fixed to said substrate, said vibration pickup piezoelectric assembly and said application specific integrated circuit chip being housed within said second housing.

16. The bone voiceprint sensing mechanism of claim 15 wherein said second housing is formed with a second pressure equalizing aperture, said second pressure equalizing aperture communicating the interior and exterior of said second housing.

17. An electronic terminal device, characterized in that it comprises a bone voiceprint sensing mechanism according to any one of claims 1 to 16.

18. The electronic terminal device of claim 17, wherein the electronic terminal device is an earphone, a watch, a bracelet, or a stethoscope.

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