CN215268264U - Radio frequency circuit board, radio frequency module and electronic equipment - Google Patents
Radio frequency circuit board, radio frequency module and electronic equipment Download PDFInfo
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- CN215268264U CN215268264U CN202120976878.4U CN202120976878U CN215268264U CN 215268264 U CN215268264 U CN 215268264U CN 202120976878 U CN202120976878 U CN 202120976878U CN 215268264 U CN215268264 U CN 215268264U
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- H04—ELECTRIC COMMUNICATION TECHNIQUE
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- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
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Abstract
The utility model discloses a radio frequency circuit board, radio frequency module and electronic equipment, radio frequency circuit board can compatible single-frequency radio frequency module and dual-frenquency radio frequency module, in practical application, can weld required components and parts on radio frequency circuit board according to the needs of single-frequency radio frequency module or dual-frenquency radio frequency module, just can obtain single-frequency radio frequency module or dual-frenquency radio frequency module, reduction in production cost.
Description
Technical Field
The utility model relates to a radio frequency communication technical field especially relates to a radio frequency circuit board, radio frequency module and electronic equipment.
Background
The radio frequency module is a basic part of wireless communication equipment and plays two important roles in wireless communication, namely playing a role in converting a binary signal into a high-frequency radio electromagnetic wave signal in a signal transmitting process; the received electromagnetic wave signal is converted into a binary digital signal in the process of receiving the signal.
Traditional single-frequency radio frequency module only supports the wireless signal transmission of 2.4 GHz's single frequency channel, and 2.4GHz frequency channel signal has transmission distance far, is difficult and characteristics such as barrier block, however, its transmission speed is slower, and it appears the network card easily, frequently falls the line scheduling problem. The dual-frequency radio frequency module provides radio frequency signals of two frequency bands of 2.4GHz and 5GHz simultaneously, can support a complete wireless network comprising 802.11a/b/g/n, and belongs to the fifth generation radio frequency transmission technology. The 5GHz frequency band signal has the advantages of strong anti-interference capability, wider bandwidth and high transmission speed.
With the development of electronic devices and communication technologies, users are pursuing the stability of signal transmission and are also paying more attention to the transmission speed of signals. Therefore, single-frequency rf modules supporting 2.4GHz band signals and dual-frequency rf modules supporting two 2.4GHz and 5GHz band signals appear on the market.
The radio frequency module usually comprises a circuit board and a component located on the circuit board, and the circuit board design of the single-frequency radio frequency module and the circuit board design of the double-frequency radio frequency module are different and are incompatible. Therefore, different circuit boards need to be designed for the single-frequency rf module and the dual-frequency rf module, which will undoubtedly increase the production cost.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a radio frequency circuit board, radio frequency module and electronic equipment, radio frequency circuit board can compatible single-frequency radio frequency module and dual-frenquency radio frequency module, reduction in production cost.
In a first aspect, an embodiment of the present invention provides a radio frequency circuit board, including a substrate and an antenna connection seat, where the antenna connection seat is disposed on the substrate and is used for externally connecting an antenna;
the surface of the substrate is provided with a plurality of wires and a plurality of bonding pads;
the first bonding pad and the second bonding pad are respectively used for welding a first frequency band signal pin and a second frequency band signal pin of the radio frequency chip;
the third bonding pad, the fourth bonding pad and the fifth bonding pad are respectively used for welding a first pin, a second pin and a third pin of the duplexer;
the sixth bonding pad and the seventh bonding pad and the eighth bonding pad form a connecting position respectively, the ninth bonding pad and the tenth bonding pad form a connecting position respectively, and the connecting positions are used for welding a connecting device;
the first bonding pad and the sixth bonding pad are connected through a first wire, the seventh bonding pad and the tenth bonding pad are connected through a second wire, and the ninth bonding pad is connected with the antenna connecting seat through a third wire;
the eighth bonding pad is connected with the third bonding pad through a fourth conducting wire, and the fifth bonding pad is connected with the eleventh bonding pad through a fifth conducting wire;
the second bonding pad and the fourth bonding pad are connected through a sixth wire.
Optionally, the surface of the substrate is further provided with a ground layer for grounding, and the ground layer is disposed on two sides of the conductive line and insulated and isolated from the conductive line.
Optionally, the surface of the substrate is further provided with a plurality of conductive holes penetrating through the substrate, one end of each conductive hole is connected with the ground layer, and the other end of each conductive hole is grounded.
Optionally, a twelfth pad and a thirteenth pad are further disposed on the first wire;
and the twelfth bonding pad and the thirteenth bonding pad form a matching position, and the matching position is used for welding a radio frequency matching device.
Optionally, a fourteenth pad and a fifteenth pad are further disposed on the third wire;
the fourteenth bonding pad and the fifteenth bonding pad form a matching bit, and the matching bit is used for welding a radio frequency matching device.
In a second aspect, an embodiment of the present invention provides a radio frequency module, based on the utility model discloses the radio frequency circuit board that the first aspect provided, include:
the first radio frequency chip is provided with a frequency band signal pin and is used for transmitting a frequency band signal, and the frequency band signal pin is welded on the first bonding pad;
a first pin of the first connector is welded on the sixth bonding pad, and a second pin of the first connector is welded on the seventh bonding pad;
and a first pin of the second connecting device is welded on the ninth bonding pad, and a second pin of the second connecting device is welded on the tenth bonding pad.
Optionally, the first connection device and the second connection device are zero ohm resistors.
The third aspect, the embodiment of the utility model provides a radio frequency module, based on the utility model discloses the radio frequency circuit board that the first aspect provided, include:
the second radio frequency chip is provided with a first frequency band signal pin and a second frequency band signal pin which are respectively used for transmitting a first frequency band signal and a second frequency band signal, the first frequency band signal pin is welded on the first bonding pad, and the second frequency band signal pin is welded on the second bonding pad;
a first pin of the third connecting device is welded on the sixth bonding pad, and a second pin of the third connecting device is welded on the eighth bonding pad;
a first pin of the fourth connecting device is welded on the ninth bonding pad, and a second pin of the fourth connecting device is welded on the eleventh bonding pad;
and a first pin, a second pin and a third pin of the duplexer are respectively welded on the third bonding pad, the fourth bonding pad and the fifth bonding pad.
Optionally, the third connection device and the fourth connection device are zero ohm resistors.
In a fourth aspect, an embodiment of the present invention provides an electronic device, including the radio frequency circuit board provided by the first aspect of the present invention.
The embodiment of the utility model provides a radio frequency circuit board, including base plate and antenna connection seat, the antenna connection seat sets up on the base plate, be used for external antenna, base plate surface is provided with a plurality of wires and a plurality of pad, first pad and second pad are used for welding the first frequency channel signal pin and the second frequency channel signal pin of radio frequency chip respectively, third pad, fourth pad and fifth pad are used for welding the first pin, second pin and the third pin of duplexer respectively, sixth pad constitutes the connection position with seventh pad and eighth pad respectively, ninth pad constitutes the connection position with tenth pad and eleventh pad respectively, the connection position is used for the welding connector, first pad and sixth pad are connected through first wire, seventh pad and tenth pad are connected through the second wire, ninth pad is connected with the antenna connection seat through the third wire, eighth pad and third pad are connected through the fourth wire, the fifth pad and the eleventh pad are connected by a fifth wire, and the second pad and the fourth pad are connected by a sixth wire. This radio frequency circuit board can compatible single-frequency radio frequency module and dual-frenquency radio frequency module, and in practical application, can be according to single-frequency radio frequency module or dual-frenquency radio frequency module's needs, required components and parts can be welded on radio frequency circuit board, just can obtain single-frequency radio frequency module or dual-frenquency radio frequency module, reduction in production cost.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings and examples.
Fig. 1 is a circuit layout diagram of a radio frequency circuit board according to an embodiment of the present invention;
fig. 2 is a top view of a single-frequency rf module according to an embodiment of the present invention;
FIG. 3 is a circuit diagram of a single frequency RF module;
fig. 4 is a top view of a dual-band rf module according to an embodiment of the present invention;
fig. 5 is a circuit diagram of a dual-band rf module.
Detailed Description
In order to make the technical problems, technical solutions and technical effects achieved by the present invention more clear, the embodiments of the present invention will be described in further detail with reference to the accompanying drawings, and obviously, the described embodiments are only some embodiments, not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature. Furthermore, the terms "first" and "second" are used merely for descriptive purposes and are not intended to have any special meaning.
The embodiment of the utility model provides a radio frequency circuit board, this radio frequency circuit board can be used to prepare the radio frequency module, can compatible single-frequency radio frequency module and dual-frenquency radio frequency module, reduction in production cost. Fig. 1 is a circuit layout diagram of a radio frequency circuit board according to an embodiment of the present invention, as shown in fig. 1, the radio frequency circuit board includes a substrate 110 and an antenna connecting seat 120, and the antenna connecting seat 120 is disposed on the substrate 110 and is used for external connection of an antenna.
The substrate 110 includes the insulation board and is located a plurality of wires and a plurality of pad of insulation board surface, and the insulation board can be phenolic aldehyde paper laminated board, epoxy paper laminated board, polyester glass felt laminated board, epoxy glass cloth laminated board etc. the embodiment of the utility model provides a do not limit here. The wires and the pads may be formed on the surface of the insulating plate by plating, printing, or the like. Specifically, as shown in fig. 1, the surface of the substrate 110 is provided with a first pad P1, a second pad P2, a third pad P3, a fourth pad P4, a fifth pad P5, a sixth pad P6, a seventh pad P7, an eighth pad P8, a ninth pad P9, a tenth pad P10, an eleventh pad P11, a first wire L1, a second wire L2, a third wire L3, a fourth wire L4, a fifth wire L5, and a sixth wire L6.
Illustratively, antenna pedestal 120 may be an IPEX antenna pedestal for connection to an IPEX antenna.
The first bonding pad P1 and the second bonding pad P2 are used for welding a first frequency band signal pin and a second frequency band signal pin of a radio frequency chip respectively. Specifically, the radio frequency chip may be a single frequency chip or a dual frequency chip, the so-called single frequency chip is a radio frequency chip with a working frequency band of 2.4GHz and has only one frequency band signal pin, and the so-called dual frequency chip is a radio frequency chip with a working frequency band including 2.4GHz and 5GHz and has a first frequency band signal pin and a second frequency band signal pin, which are respectively used for inputting and outputting a signal of the 2.4GHz frequency band and a signal of the 5GHz frequency band. When the radio frequency circuit board is used for a single-frequency radio frequency module, the first bonding pad P1 is used for welding a frequency band signal pin of a single-frequency chip, and the second bonding pad P2 is vacant or used for welding other pins of the single-frequency chip. When the radio frequency circuit board is used for a dual-frequency radio frequency module, the first bonding pad P1 is used for welding a first frequency band signal pin of a dual-frequency chip, and the second bonding pad P2 is used for welding a second frequency band signal pin of the dual-frequency chip. Specifically, the single-frequency chip and the dual-frequency chip may be PIN to PIN chips, and the PIN to PIN chips mean that functional PINs of the two chips are the same, so that a user can exchange the chips without changing a circuit.
The third pad P3, the fourth pad P4, and the fifth pad P5 are used to solder the first pin, the second pin, and the third pin of the duplexer, respectively. The duplexer is used for an antenna input/output section and has a function of classifying or mixing two different frequency signals during transmission and reception. When the radio frequency circuit board is used for a dual-frequency radio frequency module, the third pad P3, the fourth pad P4 and the fifth pad P5 are respectively used for welding the first pin, the second pin and the third pin of the duplexer.
The sixth pad P6 constitutes a connection site with the seventh pad P7 and the eighth pad P8, respectively, and the ninth pad P9 constitutes a connection site with the tenth pad P10 and the eleventh pad P11, respectively, the connection sites being used for soldering connection devices for connecting the adjacent two pads, which generally have a very small impedance. Illustratively, the connection device is a zero ohm resistor. A zero-ohm resistor is also called a bridge resistor, and is a special purpose resistor, and the zero-ohm resistor is not a true resistor with zero resistance, and is actually a resistor with a very small resistance value.
The first pad P1 and the sixth pad P6 are connected by a first wire L1, the seventh pad P7 and the tenth pad P10 are connected by a second wire L2, and the ninth pad P9 is connected to the antenna connection pad 120 by a third wire L3.
The eighth pad P8 and the third pad P3 are connected by a fourth wire L4, and the fifth pad P5 and the eleventh pad P11 are connected by a fifth wire L5.
The second pad P2 and the fourth pad P4 are connected by a sixth wire L6.
In practical application, the single-frequency radio frequency module or the dual-frequency radio frequency module can be obtained by welding required components (specifically, a patch mode can be adopted) on the radio frequency circuit board according to the requirements of the single-frequency radio frequency module or the dual-frequency radio frequency module.
Fig. 2 is the embodiment of the utility model provides a top view of single-frequency radio frequency module, fig. 3 is the circuit diagram of single-frequency radio frequency module, it is exemplary, as shown in fig. 2 and fig. 3, if required be single-frequency radio frequency module, single-frequency radio frequency chip U1 is pasted in the radio frequency chip position, this single-frequency radio frequency chip U1's model can be MT7638GU, single-frequency radio frequency chip U1's frequency channel signal pin welds on first pad P1, other pins of single-frequency radio frequency chip U1 weld on other corresponding pads of radio frequency chip position, the utility model discloses do not do the detailed description here.
A first connection device R1 is attached to a connection site formed by the sixth pad P6 and the seventh pad P7, a first end of the first connection device R1 is soldered to the sixth pad P6, and a second end of the first connection device R1 is soldered to the seventh pad P7. A second connection device R2 is attached to a connection site formed by the ninth pad P9 and the tenth pad P10, a first end of the second connection device R2 is soldered to the ninth pad P9, and a second end of the second connection device R2 is soldered to the tenth pad P10. Thereby realizing the connection between the frequency band signal pin of the single-frequency rf chip U1 and the first pin of the antenna base 120 (CN 1 in fig. 3). Wherein the first connection device R1 and the second connection device R2 are zero ohm resistors.
Fig. 4 is the top view of the dual-frenquency radio frequency module that the embodiment of the utility model provides, fig. 5 is the circuit diagram of dual-frenquency radio frequency module, it is exemplary, as shown in fig. 4 and fig. 5, if the required dual-frenquency radio frequency module, paste dual-frenquency radio frequency chip U2 in the radio frequency chip position, this dual-frenquency radio frequency chip U2's model can be MT766BU, the first frequency channel signal pin of dual-frenquency radio frequency chip U2 welds on first pad P1, the second frequency channel signal pin of dual-frenquency radio frequency chip U2 welds on second pad P2, other corresponding pads in radio frequency chip position of welding of other pins of dual-frenquency radio frequency chip U2, the utility model discloses do not do detailed description here.
The duplexer U3 is attached to the positions of the third pad P3, the fourth pad P4 and the fifth pad P5, wherein the first pin of the duplexer U3 is soldered to the third pad P3, the second pin of the duplexer U3 is soldered to the fourth pad P4, and the third pin of the duplexer U3 is soldered to the fifth pad P5.
A third connection device R3 is attached to a connection site formed by the sixth pad P6 and the eighth pad P8, a first end of the third connection device R3 is soldered to the sixth pad P6, and a second end of the third connection device R3 is soldered to the eighth pad P8. A fourth connection device R4 is attached to a connection site formed by the ninth pad P9 and the eleventh pad P11, a first end of the fourth connection device R4 is soldered to the ninth pad P9, and a second end of the fourth connection device R4 is soldered to the eleventh pad P11. And then, the first frequency band signal pin of the dual-band rf chip U2 is connected with the first pin of the duplexer U3, the second frequency band signal pin of the dual-band rf chip U2 is connected with the second pin of the duplexer U3, and the third pin of the duplexer U3 is connected with the first pin of the antenna base 120 (CN 1 in fig. 5). Wherein the third connecting device R3 and the fourth connecting device R4 are zero ohm resistors.
The embodiment of the utility model provides a radio frequency circuit board, including base plate and antenna connection seat, the antenna connection seat sets up on the base plate, be used for external antenna, base plate surface is provided with a plurality of wires and a plurality of pad, first pad and second pad are used for welding the first frequency channel signal pin and the second frequency channel signal pin of radio frequency chip respectively, third pad, fourth pad and fifth pad are used for welding the first pin, second pin and the third pin of duplexer respectively, sixth pad constitutes the connection position with seventh pad and eighth pad respectively, ninth pad constitutes the connection position with tenth pad and eleventh pad respectively, the connection position is used for the welding connector, first pad and sixth pad are connected through first wire, seventh pad and tenth pad are connected through the second wire, ninth pad is connected with the antenna connection seat through the third wire, eighth pad and third pad are connected through the fourth wire, the fifth pad and the eleventh pad are connected by a fifth wire, and the second pad and the fourth pad are connected by a sixth wire. This radio frequency circuit board can compatible single-frequency radio frequency module and dual-frenquency radio frequency module, and in practical application, can be according to single-frequency radio frequency module or dual-frenquency radio frequency module's needs, required components and parts can be welded on radio frequency circuit board, just can obtain single-frequency radio frequency module or dual-frenquency radio frequency module, reduction in production cost.
In some embodiments of the present invention, the surface of the substrate 110 is further provided with a ground layer for grounding, the ground layer is tiled on the surface of the substrate 110, wrapped on both sides of the wire and insulated and isolated from the wire, thereby forming a ground packet, and shielding the interference of the external signal to the signal transmitted in the wire.
The surface of the substrate 110 is further provided with a plurality of conductive holes H penetrating through the substrate, a conductive layer (e.g., a copper layer) is deposited on the inner walls of the conductive holes H, one end of each conductive hole H is connected to the ground layer, and the other end of each conductive hole H is grounded.
In some embodiments of the present invention, a twelfth pad P12 and a thirteenth pad P13 are further disposed on the first wire L1, the twelfth pad P12 and the thirteenth pad P13 form a matching bit, and the matching bit is used for welding the rf matching device C1. The radio frequency matching device C1 may be a capacitor, an inductor, or the like, and is used to adjust a specific matching relationship between load impedance and impedance in the signal source during signal transmission, so that all high frequency signals can be transmitted to a load point without being reflected back to the signal source, thereby improving transmission efficiency.
In some embodiments of the present invention, a fourteenth pad P14 and a fifteenth pad P15 are further disposed on the third wire L3, the fourteenth pad P14 and the fifteenth pad P15 form a matching position, and the matching position is used for welding the rf matching device C2. The radio frequency matching device C2 may be a capacitor, an inductor, or the like, and is used to adjust a specific matching relationship between load impedance and impedance in the signal source during signal transmission, so that all high frequency signals can be transmitted to a load point without being reflected back to the signal source, thereby improving transmission efficiency.
The embodiment of the utility model provides a still provide a radio frequency module, this radio frequency module is single-frequency radio frequency module, based on the utility model discloses the radio frequency circuit board that aforementioned embodiment provided, include:
the first radio frequency chip is a single-frequency radio frequency chip and supports a frequency band signal (2.4GHz), the first radio frequency chip is provided with a frequency band signal pin for transmitting a frequency band signal, and the frequency band signal pin is welded on the first bonding pad;
a first pin of the first connecting device is welded on the sixth bonding pad, and a second pin of the first connecting device is welded on the seventh bonding pad;
and a first pin of the second connecting device is welded on the ninth bonding pad, and a second pin of the second connecting device is welded on the tenth bonding pad.
Illustratively, the first connection device and the second connection device are zero ohm resistors.
Specifically, the specific structure and circuit of the rf module have been recorded in detail in the foregoing embodiments, and refer to fig. 2 and fig. 3, which are not repeated herein.
The embodiment of the utility model provides a still provide a radio frequency module, this radio frequency module is dual-frenquency radio frequency module, is based on the utility model discloses the radio frequency circuit board that aforementioned embodiment provided, include:
the first radio frequency chip is a dual-frequency radio frequency chip and supports two frequency band signals (2.4GHz and 5GHz), the second radio frequency chip is provided with a first frequency band signal pin and a second frequency band signal pin which are respectively used for transmitting the first frequency band signal and the second frequency band signal, the first frequency band signal pin is welded on the first bonding pad, and the second frequency band signal pin is welded on the second bonding pad;
a first pin of the third connecting device is welded on the sixth bonding pad, and a second pin of the third connecting device is welded on the eighth bonding pad;
a first pin of the fourth connecting device is welded on the ninth bonding pad, and a second pin of the fourth connecting device is welded on the eleventh bonding pad;
and a first pin, a second pin and a third pin of the duplexer are respectively welded on the third bonding pad, the fourth bonding pad and the fifth bonding pad.
Illustratively, the third connection device and the fourth connection device are zero ohm resistors.
Specifically, the specific structure and circuit of the rf module have been recorded in detail in the foregoing embodiments, and refer to fig. 4 and 5, which are not repeated herein.
In the above embodiment, the first rf chip and the second rf chip are PIN to PIN chips.
The embodiment of the utility model provides an embodiment still provides an electronic equipment, including the radio frequency circuit board that the novel aforementioned arbitrary embodiment of faithful use provided, electronic equipment can be the hardware equipment that router, STB, gateway etc. are used for connecting two or more networks, also can be terminal equipment, for example, smart mobile phone, panel computer, smart television etc. the utility model discloses do not limit here.
In the description herein, it is to be understood that the terms "upper," "lower," "left," "right," and the like are used in a descriptive sense and with reference to the illustrated orientation or positional relationship for purposes of descriptive convenience and simplicity of operation, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present invention.
In the description herein, references to the description of "an embodiment," "an example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be appropriately combined to form other embodiments as will be appreciated by those skilled in the art.
The technical principle of the present invention is described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without any inventive effort, which would fall within the scope of the present invention.
Claims (10)
1. A radio frequency circuit board is characterized by comprising a substrate and an antenna connecting seat, wherein the antenna connecting seat is arranged on the substrate and is used for being externally connected with an antenna;
the surface of the substrate is provided with a plurality of wires and a plurality of bonding pads;
the first bonding pad and the second bonding pad are respectively used for welding a first frequency band signal pin and a second frequency band signal pin of the radio frequency chip;
the third bonding pad, the fourth bonding pad and the fifth bonding pad are respectively used for welding a first pin, a second pin and a third pin of the duplexer;
the sixth bonding pad and the seventh bonding pad and the eighth bonding pad form a connecting position respectively, the ninth bonding pad and the tenth bonding pad form a connecting position respectively, and the connecting positions are used for welding a connecting device;
the first bonding pad and the sixth bonding pad are connected through a first wire, the seventh bonding pad and the tenth bonding pad are connected through a second wire, and the ninth bonding pad is connected with the antenna connecting seat through a third wire;
the eighth bonding pad is connected with the third bonding pad through a fourth conducting wire, and the fifth bonding pad is connected with the eleventh bonding pad through a fifth conducting wire;
the second bonding pad and the fourth bonding pad are connected through a sixth wire.
2. The RF circuit board of claim 1, wherein the substrate surface is further provided with a ground layer for grounding, the ground layer being disposed on both sides of the conductive line and isolated from the conductive line.
3. The rf circuit board of claim 2, wherein the substrate surface further has a plurality of conductive holes penetrating through the substrate, one end of each conductive hole is connected to the ground plane, and the other end of each conductive hole is grounded.
4. The radio frequency circuit board according to any one of claims 1 to 3, wherein a twelfth pad and a thirteenth pad are further provided on the first wire;
and the twelfth bonding pad and the thirteenth bonding pad form a matching position, and the matching position is used for welding a radio frequency matching device.
5. The radio frequency circuit board according to any one of claims 1 to 3, wherein a fourteenth pad and a fifteenth pad are further disposed on the third wire;
the fourteenth bonding pad and the fifteenth bonding pad form a matching bit, and the matching bit is used for welding a radio frequency matching device.
6. A radio frequency module, based on the radio frequency circuit board of any one of claims 1-5, comprising:
the first radio frequency chip is provided with a frequency band signal pin and is used for transmitting a frequency band signal, and the frequency band signal pin is welded on the first bonding pad;
a first pin of the first connector is welded on the sixth bonding pad, and a second pin of the first connector is welded on the seventh bonding pad;
and a first pin of the second connecting device is welded on the ninth bonding pad, and a second pin of the second connecting device is welded on the tenth bonding pad.
7. The RF module of claim 6, wherein the first and second connecting devices are zero ohm resistors.
8. A radio frequency module, based on the radio frequency circuit board of any one of claims 1-5, comprising:
the second radio frequency chip is provided with a first frequency band signal pin and a second frequency band signal pin which are respectively used for transmitting a first frequency band signal and a second frequency band signal, the first frequency band signal pin is welded on the first bonding pad, and the second frequency band signal pin is welded on the second bonding pad;
a first pin of the third connecting device is welded on the sixth bonding pad, and a second pin of the third connecting device is welded on the eighth bonding pad;
a first pin of the fourth connecting device is welded on the ninth bonding pad, and a second pin of the fourth connecting device is welded on the eleventh bonding pad;
and a first pin, a second pin and a third pin of the duplexer are respectively welded on the third bonding pad, the fourth bonding pad and the fifth bonding pad.
9. The radio frequency module of claim 8, wherein the third and fourth connecting devices are zero ohm resistors.
10. An electronic device comprising a radio frequency circuit board according to any one of claims 1 to 5.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120976878.4U CN215268264U (en) | 2021-05-08 | 2021-05-08 | Radio frequency circuit board, radio frequency module and electronic equipment |
| PCT/CN2022/091584 WO2022237703A1 (en) | 2021-05-08 | 2022-05-08 | Radio frequency circuit board, radio-frequency module, and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120976878.4U CN215268264U (en) | 2021-05-08 | 2021-05-08 | Radio frequency circuit board, radio frequency module and electronic equipment |
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| CN215268264U true CN215268264U (en) | 2021-12-21 |
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| CN202120976878.4U Active CN215268264U (en) | 2021-05-08 | 2021-05-08 | Radio frequency circuit board, radio frequency module and electronic equipment |
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| WO (1) | WO2022237703A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022237703A1 (en) * | 2021-05-08 | 2022-11-17 | 广州视源电子科技股份有限公司 | Radio frequency circuit board, radio-frequency module, and electronic device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109525270B (en) * | 2018-11-23 | 2023-08-08 | 上海庆科信息技术有限公司 | Circuit board and wireless communication module |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7508261B2 (en) * | 2005-01-19 | 2009-03-24 | Micro-Mobio, Inc. | Systems of miniaturized compatible radio frequency wireless devices |
| CN201403251Y (en) * | 2009-03-24 | 2010-02-10 | 青岛海信移动通信技术股份有限公司 | Printed wiring board, printed circuit board and electronic product with printed circuit board |
| CN105680899B (en) * | 2016-03-09 | 2018-08-24 | 宁波萨瑞通讯有限公司 | The realization system and method for frequency range compatibility |
| CN108259058B (en) * | 2016-12-27 | 2020-10-30 | 珠海全志科技股份有限公司 | Radio frequency front-end circuit |
| CN215268264U (en) * | 2021-05-08 | 2021-12-21 | 广州视源电子科技股份有限公司 | Radio frequency circuit board, radio frequency module and electronic equipment |
-
2021
- 2021-05-08 CN CN202120976878.4U patent/CN215268264U/en active Active
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2022
- 2022-05-08 WO PCT/CN2022/091584 patent/WO2022237703A1/en active Application Filing
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022237703A1 (en) * | 2021-05-08 | 2022-11-17 | 广州视源电子科技股份有限公司 | Radio frequency circuit board, radio-frequency module, and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022237703A1 (en) | 2022-11-17 |
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