CN215266657U - Millimeter wave dielectric resonator antenna module and communication equipment - Google Patents
Millimeter wave dielectric resonator antenna module and communication equipment Download PDFInfo
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- CN215266657U CN215266657U CN202120610869.3U CN202120610869U CN215266657U CN 215266657 U CN215266657 U CN 215266657U CN 202120610869 U CN202120610869 U CN 202120610869U CN 215266657 U CN215266657 U CN 215266657U
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Abstract
The utility model discloses a millimeter wave dielectric resonator antenna module and communication equipment, first dielectric block through piling up the setting in proper order, second dielectric block and third dielectric block constitute dielectric resonator 'S antenna, it sets up antenna TE111 mode resonant frequency to 28GHz and N257 frequency channels to correspond to set up first dielectric block, TE113 mode resonant frequency sets up to 45GHz and corresponds with Q-LINKPAN-S frequency channel, it shifts antenna TE113 mode resonant frequency to 39GHz from 45GHz to set up the second dielectric block, make resonant frequency after the skew correspond with N260 frequency channel, set up antenna TE311 mode resonant frequency to 45GHz and Q-LINKPAN-S frequency channel through setting up the third dielectric block and correspond, thereby make antenna furthest' S the multiple frequency channels that cover, and the pile up height of three dielectric block is no more than two millimeters, realize that dielectric resonator antenna module can cover N257 simultaneously, And the N260 frequency band and the Q-LINKPAN-S frequency band improve the frequency band coverage rate of the antenna module and reduce the size of the antenna.
Description
Technical Field
The utility model relates to an antenna technology field especially relates to a millimeter wave dielectric resonator antenna module and communication equipment.
Background
With the development of modern communication technology, communication devices have higher and higher requirements on the performance of antennas. According to the technical specifications of 3GPP TS 38.101-25G device radio frequency and the technical report of TR38.817 device radio frequency, 5G millimeter microwave antennas are required to cover N257(26.5-29.5GHz), N258(24.25-27.25GHz), N260(37-40GHz), N261(27.5-28.35GHz) and N259(40-43.5GHz) frequency bands. Wherein N257, N258 and N260 will be preferentially put into the setting of the 5G network. And according to the standard 802.11aj of 45GHz millimeter wave communication protocol, the antenna also meets the ultra-high-speed near-remote millimeter wave wireless transmission standard Q-LINKPAN-S. Therefore, in 5G communication equipment, multiple millimeter wave antenna modules are usually designed to cover the frequency bands, or multiband antenna modules are designed to cover the N257, N258, N260, and Q-LINKPAN-S frequency bands simultaneously as much as possible.
However, the thickness of the PCB increases as the bandwidth to be covered increases, regardless of the patch antenna (Patchantenna), the dipole antenna (dipole antenna) or the slot antenna (Slot antenna) of the conventional millimeter wave broadband antenna based on the PCB. For the antenna PCB applied to millimeter wave bands, along with the increase of the number of layers of the PCB, the precision requirements of the multilayer PCB on holes, line width and line distance are increased, the processing difficulty is increased, and the millimeter wave antenna module is difficult to cover a plurality of frequency bands.
At present, the dielectric resonator antenna has the advantages of high radiation efficiency, small size, low cost and wide bandwidth, and has great advantages compared with the conventional millimeter wave broadband antenna based on the PCB. The millimeter wave bandwidth antenna designed by adopting the dielectric resonator antenna is more favorable for covering the requirement of multiple frequency bands. And the existing designed dielectric resonator antenna is difficult to cover the frequency band, especially the Q-LINKPAN-S frequency band. Therefore, there is an urgent need for a small-sized dielectric resonator antenna capable of covering multiple frequency bands.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: a millimeter wave dielectric resonator antenna module improves frequency band coverage rate of the antenna module and reduces size of an antenna.
In order to solve the technical problem, the utility model discloses a technical scheme be:
a millimeter wave dielectric resonator antenna module comprises an antenna and a first metal layer;
the antenna is of a ceramic body structure and comprises a first dielectric block, a second dielectric block and a third dielectric block which are sequentially stacked;
a slot corresponding to the first dielectric block is arranged on the first metal layer;
one side of the first dielectric block, which is far away from the second dielectric block, is connected with a position corresponding to the first metal layer slot;
one side, far away from the first dielectric block, of the second dielectric block is connected with the third dielectric block;
the first dielectric block, the second dielectric block and the third dielectric block are the same in height, and the formed stacking height is smaller than two millimeters.
Further, the first dielectric block, the second dielectric block and the third dielectric block are regular quadrangular prisms with different bottom surface side lengths; and the volumes of the first dielectric block, the second dielectric block and the third dielectric block are sequentially increased.
Further, the ceramic body has a dielectric constant of 10 to 20.
Furthermore, an I-shaped slot corresponding to the first dielectric block is formed in the first metal layer.
Further, the antenna comprises a plurality of groups;
the multiple groups of antennas are arranged on one side of the first metal layer at equal intervals in a straight line along the direction parallel to the first metal layer.
Further, the circuit also comprises a feeder line, a first low-frequency circuit area and a second low-frequency circuit area;
the feeder line is arranged on one side, away from the antenna, of the first metal layer;
one end of the feeder line is coupled with the first dielectric block through the slot, and the other end of the feeder line is used for being connected with the radio frequency chip;
the first low-frequency circuit region is arranged on one side, far away from the first metal layer, of the feeder line;
the second low-frequency circuit region is arranged on one side, far away from the feeder line, of the first low-frequency circuit region;
and avoidance holes for avoiding the feeder line are formed in the first low-frequency circuit region and the second low-frequency circuit region.
Further, the chip interconnection line is also included;
the chip interconnection line is arranged on one side of the second low-frequency circuit region, which is far away from the first low-frequency circuit region, and is used for connecting the radio-frequency chip with other chips.
Further, the device also comprises a metal column;
the metal column is arranged on the first low-frequency circuit area and arranged around the feeder line;
the metal columns close to the avoiding holes penetrate through the first low-frequency circuit region and the second low-frequency circuit region in sequence.
Further, the device also comprises BGA solder balls;
one end of the BGA welding ball is connected with the feeder line, and the other end of the BGA welding ball is connected with the radio frequency chip.
In order to solve the technical problem, the utility model discloses an another kind of technical scheme:
a communication device comprises the millimeter wave dielectric resonator antenna module.
The beneficial effects of the utility model reside in that: the first dielectric block is arranged to set the TE111 mode resonant frequency of the antenna to be 28GHz corresponding to the N257 frequency band, the TE113 mode resonant frequency is set to be 45GHz corresponding to the Q-LINKPAN-S frequency band, the second dielectric block is arranged to shift the TE113 mode resonant frequency of the antenna from 45GHz to 39GHz, so that the shifted resonant frequency corresponds to the N260 frequency band, the mode resonant frequency of the TE311 antenna is set to be 45GHz corresponding to the Q-LINKPAN-S frequency band by setting the third dielectric block, therefore, the antenna can cover a plurality of frequency bands to the maximum extent, the stacking height of the three dielectric blocks is not more than two millimeters, the dielectric resonator antenna module can cover three frequency bands of N257, N260 and Q-LINKPAN-S at the same time, the frequency band coverage rate of the antenna module is improved, and the size of the antenna is reduced.
Drawings
Fig. 1 is a front view of an internal structure of an antenna module of a millimeter wave dielectric resonator according to an embodiment of the present invention;
fig. 2 is a side view of an internal structure of an antenna module of a millimeter wave dielectric resonator according to an embodiment of the present invention;
fig. 3 is a schematic diagram of an internal structure of an antenna module of a millimeter wave dielectric resonator according to an embodiment of the present invention;
fig. 4 is a schematic diagram of an internal structure of an antenna module of a millimeter wave dielectric resonator according to an embodiment of the present invention;
fig. 5 is a diagram showing the result of the S parameter of the millimeter wave dielectric resonator antenna module according to the embodiment of the present invention;
fig. 6 is a cross-sectional distribution diagram of magnetic lines of force of a millimeter wave dielectric resonator antenna module according to an embodiment of the present invention in the TE111 mode;
fig. 7 is a cross-sectional distribution diagram of magnetic lines of force of a millimeter wave dielectric resonator antenna module according to an embodiment of the present invention in the TE112 mode;
fig. 8 is a cross-sectional distribution diagram of magnetic lines of force of a millimeter wave dielectric resonator antenna module according to an embodiment of the present invention in the TE113 mode;
fig. 9 is a 3D directional diagram of the millimeter wave dielectric resonator antenna module according to the embodiment of the present invention at 28 GHz;
fig. 10 is a 3D directional diagram of a millimeter wave dielectric resonator antenna module according to an embodiment of the present invention at 39 GHz;
fig. 11 is a 3D directional diagram of the millimeter wave dielectric resonator antenna module according to the embodiment of the present invention at 45 GHz;
description of reference numerals:
1. a first dielectric block; 2. a second dielectric block; 3. a third dielectric block; 4. a first metal layer; 5. grooving; 6. a feed line; 61. a coupling portion; 62. a vertical portion; 63. a belt-like portion; 7. a first low frequency circuit region; 8. a second low frequency circuit region; 9. a chip interconnection line; 10. a metal post; 11. BGA solder balls.
Detailed Description
In order to explain the technical content, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1, a millimeter wave dielectric resonator antenna module includes an antenna and a first metal layer;
the antenna is of a ceramic body structure and comprises a first dielectric block, a second dielectric block and a third dielectric block which are sequentially stacked;
a slot corresponding to the first dielectric block is arranged on the first metal layer;
one side of the first dielectric block, which is far away from the second dielectric block, is connected with a position corresponding to the first metal layer slot;
one side, far away from the first dielectric block, of the second dielectric block is connected with the third dielectric block;
the first dielectric block, the second dielectric block and the third dielectric block are the same in height, and the formed stacking height is smaller than two millimeters.
From the above description, the beneficial effects of the present invention are: the first dielectric block is arranged to set the TE111 mode resonant frequency of the antenna to be 28GHz corresponding to the N257 frequency band, the TE113 mode resonant frequency is set to be 45GHz corresponding to the Q-LINKPAN-S frequency band, the second dielectric block is arranged to shift the TE113 mode resonant frequency of the antenna from 45GHz to 39GHz, so that the shifted resonant frequency corresponds to the N260 frequency band, the mode resonant frequency of the TE311 antenna is set to be 45GHz corresponding to the Q-LINKPAN-S frequency band by setting the third dielectric block, therefore, the antenna can cover a plurality of frequency bands to the maximum extent, the stacking height of the three dielectric blocks is not more than two millimeters, the dielectric resonator antenna module can cover three frequency bands of N257, N260 and Q-LINKPAN-S at the same time, the frequency band coverage rate of the antenna module is improved, and the size of the antenna is reduced.
Further, the first dielectric block, the second dielectric block and the third dielectric block are regular quadrangular prisms with different bottom surface side lengths; and the volumes of the first dielectric block, the second dielectric block and the third dielectric block are sequentially increased.
As can be seen from the above description, the volumes of the first dielectric block, the second dielectric block and the third dielectric block are sequentially increased, the first dielectric block is used as a base mode, the volumes of the second dielectric block and the third dielectric block are increased to shift the mode resonant frequency of the TE113 antenna to 39GHz, and the mode resonant frequency of the TE311 antenna to 45GHz, so as to improve the frequency band coverage of the antenna module.
Further, the ceramic body has a dielectric constant of 10 to 20.
As can be seen from the above description, by using a ceramic body having a dielectric constant of 10 to 20 as an antenna for a dielectric resonator, the size of the dielectric required for the antenna is small under the condition that the dielectric resonator generates a resonance frequency of 28GHz in the TE111 mode and a resonance frequency of 45GHz in the TE113 mode, thereby reducing the size of the antenna module.
Furthermore, an I-shaped slot corresponding to the first dielectric block is formed in the first metal layer.
As can be seen from the above description, by providing the "i" shaped slot corresponding to the first dielectric block on the first metal layer, when the antenna size condition of the dielectric resonator is determined, the performance such as the bandwidth and the gain of the antenna can be finely adjusted, so that the antenna performance is optimal.
Further, the antenna comprises a plurality of groups;
the multiple groups of antennas are arranged on one side of the first metal layer at equal intervals in a straight line along the direction parallel to the first metal layer.
From the above description, it can be known that, by configuring the antenna module by arranging a plurality of groups of antennas, the gain of the antennas can be increased as much as possible and the radiation intensity of the antenna module can be improved under the condition of satisfying the small size.
Further, the circuit also comprises a feeder line, a first low-frequency circuit area and a second low-frequency circuit area;
the feeder line is arranged on one side, away from the antenna, of the first metal layer;
one end of the feeder line is coupled with the first dielectric block through the slot, and the other end of the feeder line is used for being connected with the radio frequency chip;
the first low-frequency circuit region is arranged on one side, far away from the first metal layer, of the feeder line;
the second low-frequency circuit region is arranged on one side, far away from the feeder line, of the first low-frequency circuit region;
and avoidance holes for avoiding the feeder line are formed in the first low-frequency circuit region and the second low-frequency circuit region.
According to the description, the low-frequency circuit region is arranged to supply power to the circuit, prevent static electricity, filter and the like, the low-frequency circuit region is provided with the avoiding hole, so that the radio frequency chip is connected with the feeder line through the avoiding hole, the control signal is transmitted to the feeder line, the signal is transmitted to the antenna, and the antenna module works more stably.
Further, the chip interconnection line is also included;
the chip interconnection line is arranged on one side of the second low-frequency circuit region, which is far away from the first low-frequency circuit region, and is used for connecting the radio-frequency chip with other chips.
As can be seen from the above description, the radio frequency chip is connected to other chips through the interconnection line, so that the antenna module can be connected to more chips, thereby improving the performance of the antenna in various aspects.
Further, the device also comprises a metal column;
the metal column is arranged on the first low-frequency circuit area and arranged around the feeder line;
the metal columns close to the avoiding holes penetrate through the first low-frequency circuit region and the second low-frequency circuit region in sequence.
As can be seen from the above description, by providing the metal post on the side of the power feeding line away from the first metal layer and disposing the metal post around the power feeding line, the signal is not easily interfered by the external signal when being transmitted in the power feeding line, and the stability of signal transmission is improved.
Further, the device also comprises BGA solder balls;
one end of the BGA welding ball is connected with the feeder line, and the other end of the BGA welding ball is connected with the radio frequency chip.
As can be seen from the above description, the antenna module is connected to external chips such as a radio frequency chip through the BGA solder balls, which facilitates assembly and connection between the antenna module and the chip.
Another embodiment of the present invention provides a communication device, including the above millimeter wave dielectric resonator antenna module.
The antenna module can be applied to devices of a 5G millimeter wave communication system, such as handheld mobile devices, and the following description is made by way of specific embodiments:
example one
Referring to fig. 1 and fig. 2, a millimeter wave dielectric resonator antenna module includes an antenna and a first metal layer 4; the first metal layer 4 is a reference ground of the antenna module;
the antenna is of a ceramic body structure and comprises a first dielectric block 1, a second dielectric block 2 and a third dielectric block 3 which are sequentially stacked; by adopting the ceramic body structure, the processing cost and the raw material cost are both lower than those of a PCB antenna, and the processing precision of a multilayer PCB antenna is avoided;
referring to fig. 3, a slot 5 corresponding to the first dielectric block 1 is formed on the first metal layer 4;
specifically, an i-shaped slot 5 corresponding to the first dielectric block 1 is arranged on the first metal layer 4;
one side of the first dielectric block 1, which is far away from the second dielectric block 2, is connected with a position corresponding to the slot 5 of the first metal layer 4; one side of the second dielectric block 2, which is far away from the first dielectric block 1, is connected with the third dielectric block 3; the first dielectric block 1, the second dielectric block 2 and the third dielectric block 3 are the same in height, and the formed stacking height is less than two millimeters;
the antenna comprises a plurality of groups which are arranged on one side of the first metal layer 4 at equal intervals in a straight line along the direction parallel to the first metal layer 4; as shown in fig. 1 and fig. 2, the antennas are 4 groups, and are arranged at intervals on one side of the first metal layer 4;
also includes a feed line 6, a first low-frequency circuit region 7 and a second low-frequency circuit region 8;
the feed line 6 is arranged on one side of the first metal layer 4 away from the antenna; one end of the feeder line 6 is coupled with the first dielectric block 1 through the slot 5, and the other end of the feeder line 6 is used for being connected with a radio frequency chip;
specifically, referring to fig. 4, the feeder line 6 includes a coupling portion 61, a vertical portion 62, and a strip portion 63; one end of the coupling part 61 corresponds to the position of the I-shaped slot 5, and the other end is connected with one end of the vertical part 62; the other end of the vertical part 62 is connected with one end of the belt-shaped part 63, and the other end is connected with a radio frequency chip; the number of the feeder lines 6 and the number of the antennas are also 4 groups;
the first low-frequency circuit region 7 is arranged on one side, away from the first metal layer 4, of the feeder line 6; the second low-frequency circuit region 8 is arranged on one side, far away from the feeder line 6, of the first low-frequency circuit region 7; avoidance holes for avoiding the feeder line 6 are formed in the first low-frequency circuit region 7 and the second low-frequency circuit region 8;
the chip interconnection line 9, the metal column 10 and the BGA solder ball 11 are also included;
the chip interconnection line 9 is arranged on one side of the second low-frequency circuit region 8, which is far away from the first low-frequency circuit region 7, and is used for connecting a radio-frequency chip with other chips;
the metal posts 10 are arranged on the first low-frequency circuit region 7 and arranged around the feeder line 6; specifically, the metal posts 10 are disposed around the band portion 63; the metal columns 10 close to the avoidance holes sequentially penetrate through the first low-frequency circuit region 7 and the second low-frequency circuit region 8;
one end of the BGA solder ball 11 is connected with the feeder line 6, and the other end of the BGA solder ball is connected with a radio frequency chip; specifically, the above structures are all integrated on a PCB, and the integrated structure is connected with an external radio frequency chip through the BGA solder ball 11; the antenna module also comprises a chip part which comprises a control chip, a radio frequency chip and a power chip, wherein the control chip controls the radio frequency chip, the power chip provides power for the radio frequency chip, and the radio frequency chip provides signals for the antenna; the radio frequency chip comprises a phase shifter and an amplifier, wherein the phase shifter is used for providing phase difference between units to realize the capability of beam scanning, and the amplifier is used for compensating the loss of the phase shifter.
Example two
This embodiment differs from the first embodiment in that the shape of the ceramic body is defined;
the first dielectric block 1, the second dielectric block 2 and the third dielectric block 3 are regular quadrangular prisms with different bottom surface side lengths; the volumes of the first dielectric block 1, the second dielectric block 2 and the third dielectric block 3 are sequentially increased;
the dielectric constant of the ceramic matrix is 10-20, and the coupling performance of the dielectric resonator antenna is deteriorated under the influence of the volume of the ceramic matrix when the dielectric constant of the ceramic matrix is less than 10; when the dielectric constant of the ceramic substrate exceeds 20, the resonant frequency of the dielectric resonator antenna cannot cover the frequency band of N260(37-40 GHz);
preferably, the simulation is performed based on a ceramic matrix with a dielectric constant of 14;
setting the resonant frequency of the TE111 mode of the antenna at 28GHz, setting the resonant frequency of the TE113 mode of the antenna at 45GHz, and obtaining the size of the ceramic dielectric at the moment according to an antenna calculation formula as follows: 1.8 by 1.8 in mm;
equally dividing the cubic ceramic dielectric into three parts along the direction vertical to the first metal layer 4; the first dielectric block 1, the second dielectric block 2 and the third dielectric block 3 are sequentially arranged, and the volume of the first dielectric block 1 is kept unchanged; simultaneously changing the length of the bottom edges of the second dielectric block 2 and the third dielectric block 3 to obtain that the resonant frequency of the high-order mode TE113 mode is 39GHz when the length is 2.4 mm; keeping the volume of the second dielectric block 2 unchanged, and changing the length of the bottom edge of the third dielectric block 3 to obtain 45GHz of higher mode TE311 resonant frequency when the length is 3.1 mm; finally, the size of the first dielectric block 1 is 1.8 × 0.6, the size of the second dielectric block 2 is 2.4 × 0.6, and the size of the third dielectric block 3 is 3.1 × 0.6;
and the obtained model is simulated to obtain an antenna module S parameter diagram as shown in fig. 5, and it can be seen that three frequency bands of N257(26.5-29.5GHz), N260(37-40GHz) and Q-LINKPAN-S (45GHz) are covered below an antenna of-10 db.
Fig. 6 is a cross-sectional distribution diagram of magnetic lines of force of the millimeter wave dielectric resonator antenna module according to the embodiment of the present invention in the TE111 mode, where the resonant frequency is 28 GHz.
Fig. 7 is a cross-sectional distribution diagram of magnetic lines of force of the millimeter wave dielectric resonator antenna module according to the embodiment of the present invention in the TE112 mode, and the resonant frequency of the millimeter wave dielectric resonator antenna module is 39 GHz.
Fig. 8 is a cross-sectional distribution diagram of magnetic lines of force of the millimeter wave dielectric resonator antenna module according to the embodiment of the present invention in the TE113 mode, where the resonant frequency is 45 GHz.
Fig. 9 is a 3D directional diagram of the millimeter wave dielectric resonator antenna module according to the embodiment of the present invention at 28GHz, from which it can be seen that the beam is normal and not deformed, and has a beam scanning capability.
Fig. 10 is a 3D directional diagram of the millimeter wave dielectric resonator antenna module according to the embodiment of the present invention at 39GHz, and it can be seen from the diagram that the beam is normal and not deformed, and has a beam scanning capability.
Fig. 11 is a 3D directional diagram of the millimeter wave dielectric resonator antenna module according to the embodiment of the present invention at 45GHz, from which it can be seen that the beam is normal and not deformed, and has a beam scanning capability.
EXAMPLE III
A communication device comprises a millimeter wave dielectric resonator antenna module according to the first embodiment or the second embodiment;
the shell of the communication equipment can be made of one of plastic, metal and ceramic, and in specific operation, the frame of the communication equipment needs to be provided with corresponding notches so as to embed the millimeter wave dielectric resonator antenna module into the communication equipment.
The millimeter wave dielectric resonator antenna module adopts the PCB integrated chip, controls the radio frequency chip through the control chip, and avoids the problem that a large external Butler coupler or a Rotman lens is required when a passive wave beam rotates, so that the design difficulty, the test difficulty and the complexity of wave beam management are simplified, the size is reduced, the control is flexible, and the millimeter wave dielectric resonator antenna module is suitable for 5G millimeter wave communication equipment.
To sum up, the utility model provides a pair of millimeter wave dielectric resonator antenna module and communication equipment, first dielectric block through piling up the setting in proper order, second dielectric block and third dielectric block constitute dielectric resonator 'S antenna, it corresponds to set up first dielectric block with antenna TE111 mode resonant frequency to 28GHz and N257 frequency channels, TE113 mode resonant frequency sets up to 45GHz and Q-LINKPAN-S frequency channel and corresponds, set up second dielectric block and squint antenna TE113 mode resonant frequency from 45GHz to 39GHz, make resonant frequency after the skew correspond with N260 frequency channel, set up antenna TE311 mode resonant frequency to 45GHz and Q-LINKPAN-S frequency channel and correspond through setting up the third dielectric block, thereby make antenna furthest' S the multiple frequency channels that cover, and the pile height of three dielectric block is no more than two millimeters, realize that dielectric resonator antenna module can cover N257 simultaneously, The antenna module comprises N260 frequency bands and Q-LINKPAN-S frequency bands, so that the frequency band coverage rate of the antenna module is improved, and the size of the antenna is reduced; the PCB integrated chip and the ceramic structure are adopted, so that the design difficulty, the test difficulty and the complexity of beam management are simplified, and the volume and the cost are reduced.
The above mentioned is only the embodiment of the present invention, and not the limitation of the patent scope of the present invention, all the equivalent transformations made by the contents of the specification and the drawings, or the direct or indirect application in the related technical field, are included in the patent protection scope of the present invention.
Claims (10)
1. A millimeter wave dielectric resonator antenna module is characterized by comprising an antenna and a first metal layer;
the antenna is of a ceramic body structure and comprises a first dielectric block, a second dielectric block and a third dielectric block which are sequentially stacked;
a slot corresponding to the first dielectric block is arranged on the first metal layer;
one side of the first dielectric block, which is far away from the second dielectric block, is connected with a position corresponding to the first metal layer slot;
one side, far away from the first dielectric block, of the second dielectric block is connected with the third dielectric block;
the first dielectric block, the second dielectric block and the third dielectric block are the same in height, and the formed stacking height is smaller than two millimeters.
2. The millimeter wave dielectric resonator antenna module according to claim 1, wherein the first dielectric block, the second dielectric block and the third dielectric block are regular quadrangular prisms with different bottom surface side lengths; and the volumes of the first dielectric block, the second dielectric block and the third dielectric block are sequentially increased.
3. The millimeter wave dielectric resonator antenna module of claim 1, wherein the dielectric constant of the ceramic body is 10-20.
4. The millimeter wave dielectric resonator antenna module of claim 1, wherein the first metal layer is provided with an "i" shaped slot corresponding to the first dielectric block.
5. The millimeter wave dielectric resonator antenna module of claim 1, wherein the antenna comprises a plurality of groups;
the multiple groups of antennas are arranged on one side of the first metal layer at equal intervals in a straight line along the direction parallel to the first metal layer.
6. The millimeter wave dielectric resonator antenna module of claim 1, further comprising a feed line, a first low frequency circuit region and a second low frequency circuit region;
the feeder line is arranged on one side, away from the antenna, of the first metal layer;
one end of the feeder line is coupled with the first dielectric block through the slot, and the other end of the feeder line is used for being connected with the radio frequency chip;
the first low-frequency circuit region is arranged on one side, far away from the first metal layer, of the feeder line;
the second low-frequency circuit region is arranged on one side, far away from the feeder line, of the first low-frequency circuit region;
and avoidance holes for avoiding the feeder line are formed in the first low-frequency circuit region and the second low-frequency circuit region.
7. The millimeter wave dielectric resonator antenna module of claim 6, further comprising a chip interconnection line;
the chip interconnection line is arranged on one side of the second low-frequency circuit region, which is far away from the first low-frequency circuit region, and is used for connecting the radio-frequency chip with other chips.
8. The millimeter wave dielectric resonator antenna module of claim 6, further comprising a metal post;
the metal column is arranged on the first low-frequency circuit area and arranged around the feeder line;
the metal columns close to the avoiding holes penetrate through the first low-frequency circuit region and the second low-frequency circuit region in sequence.
9. The millimeter wave dielectric resonator antenna module of claim 6, further comprising BGA solder balls;
one end of the BGA welding ball is connected with the feeder line, and the other end of the BGA welding ball is connected with the radio frequency chip.
10. A communication device comprising the millimeter wave dielectric resonator antenna module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120610869.3U CN215266657U (en) | 2021-03-25 | 2021-03-25 | Millimeter wave dielectric resonator antenna module and communication equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202120610869.3U CN215266657U (en) | 2021-03-25 | 2021-03-25 | Millimeter wave dielectric resonator antenna module and communication equipment |
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| CN215266657U true CN215266657U (en) | 2021-12-21 |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |