CN215266274U

CN215266274U - Silicon carbide power device TO-247 package with replaceable lead frame pins

Info

Publication number: CN215266274U
Application number: CN202121830658.7U
Authority: CN
Inventors: 尹其言; 张旭文
Original assignee: Hunan Titanium Core Electronic Technology Co ltd
Current assignee: Hunan Titanium Core Electronic Technology Co ltd
Priority date: 2021-08-06
Filing date: 2021-08-06
Publication date: 2021-12-21
Anticipated expiration: 2031-08-06

Abstract

The utility model discloses a silicon carbide power device TO-247 package with replaceable lead frame pins, which comprises a package substrate and a power device arranged above the package substrate, the upper side of the power device is provided with a first metal layer, the lower side of the power device is provided with a heat dissipation plate, the heat dissipation plate and the first metal layer are detachably provided with lead frame pins, the heat dissipation plate and the outer side surface of the first metal layer are both provided with a heat dissipation layer for heat conduction, and the outer sides of the heat dissipation layers at the upper side and the lower side are provided with heat dissipation structures, the utility model is designed according to the needs of the existing products, utilizes active air blowing to dissipate heat, improves the heat dissipation effect, and the heat dissipation layer and the heat dissipation shell are clamped and fixed without arranging an adhesive layer, so that the heat conduction effect is ensured, in addition, the air temperature is reduced by guiding the air to do work outwards and evaporating and absorbing the heat of the water mist, and the heat dissipation effect of the product is further improved.

Description

Silicon carbide power device TO-247 package with replaceable lead frame pins

Technical Field

The utility model relates TO the technical field of semiconductors, specifically a carborundum power device TO-247 encapsulates with displaceable lead frame pin.

Background

Since the performance of Si-based power devices has approached or even reached the intrinsic limit of their materials, researchers have turned their eyes to wide bandgap semiconductor devices, such as SiC, GaN, etc., since the 80 s of the 19 th century. Conventional silicon-based power devices have encountered insurmountable difficulties in high frequency, high power applications due to the limitations of the inherent physical properties of silicon materials. Under the condition, the power device based on the silicon carbide is free from the details, and the energy loss and the volume weight of power conversion devices such as an inverter and a frequency converter can be greatly reduced by virtue of the characteristics of high breakdown electric field intensity, good thermal stability, high saturated drift velocity of current carriers, high thermal conductivity and the like of the silicon carbide material.

The existing packaging structure of the silicon carbide power device determines the heat dissipation efficiency of the product, the existing conventional heat dissipation is heat transfer, and the heat dissipation efficiency is not very good due TO the passive heat dissipation mode, so that the TO-247 packaging structure of the silicon carbide power device with replaceable lead frame pins is provided.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is TO provide a carborundum power device TO-247 package with displaceable lead frame pin TO solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

a silicon carbide power device TO-247 package with replaceable lead frame pins comprises a package substrate and a power device arranged above the package substrate, wherein a first metal layer is arranged on the upper side of the power device, a heat dissipation plate is arranged on the lower side of the power device, the lead frame pins are detachably arranged on the heat dissipation plate and the first metal layer, heat dissipation layers for heat conduction are arranged on the outer side surfaces of the heat dissipation plate and the first metal layer, and heat dissipation structures are arranged on the outer sides of the heat dissipation layers on the upper side and the lower side;

the heat dissipation structure comprises a heat dissipation shell attached to a heat dissipation layer, a fixed clamping groove fixedly clamped with the surface of the heat dissipation layer is formed in the end portion of the heat dissipation shell, a heat dissipation channel for ventilation is formed in the heat dissipation shell, and an exhaust port for exhausting air is formed in the end face of the heat dissipation channel;

the right end of the heat dissipation shell is provided with an air inlet, and the air inlet is connected with an expansion cooling structure for air inlet.

As a further aspect of the present invention: a plurality of radiating fins are distributed on the surface of the radiating layer, and the end parts of the radiating fins extend into the radiating channel.

As a further aspect of the present invention: the heat dissipation channel adopts a sheet structure.

As a further aspect of the present invention: the expansion cooling structure comprises a first buffer tank communicated with an air inlet, a second buffer tank is arranged on the right side of the first buffer tank, a plurality of exhaust ports are formed in the left end of the second buffer tank, a conical cover is arranged at each exhaust port, each conical cover is communicated with the left end of each conical cover, an air blowing pipe is arranged at the left end of each air blowing pipe in an extending mode and enters the first buffer tank, and an air inlet pipe used for being connected with an air blowing structure is arranged at the right port of the second buffer tank.

As a further aspect of the present invention: the air blowing pipe and the air inlet pipe are made of metal materials.

As a further aspect of the present invention: the second buffer tank is internally provided with an atomizer used for spraying water mist, and the air outlet is provided with an air guide pipe used for guiding exhaust.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses the needs to current product design, utilize the initiative heat dissipation of blowing, improved the radiating effect to here through fixed with heat dissipation layer and heat dissipation shell joint, need not to set up the tie coat, guaranteed heat conduction effect, still reduce air temperature through guide gas external acting and water smoke evaporation heat absorption in addition, further improved the radiating effect of product.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a schematic view of the internal structure of the present invention.

Fig. 3 is a schematic structural view of the airflow trend inside the middle conical cover of the present invention.

Wherein: package substrate 100, heat dissipation plate 200, power device 300, first metal layer 400, heat dissipation layer 500, heat dissipation housing 600, heat dissipation channel 601, fixing clamp groove 602, air outlet 603, air inlet 604, expansion cooling structure 700, first buffer tank 701, air blow pipe 702, conical cover 703, second buffer tank 704, and air inlet pipe 705.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example 1

Referring TO fig. 1-3, in an embodiment of the present invention, a silicon carbide power device TO-247 package with replaceable lead frame pins includes a package substrate 100 and a power device 300 disposed above the package substrate, a first metal layer 400 is disposed on an upper side of the power device 300, a heat sink 200 is disposed on a lower side of the power device 300, the lead frame pins are detachably disposed on the heat sink 200 and the first metal layer 400, heat dissipation layers 500 for heat conduction are disposed on outer sides of the heat sink 200 and the first metal layer 400, and heat dissipation structures are disposed on outer sides of the heat dissipation layers 500 on upper and lower sides, so as TO cool the upper and lower sides of the power device 300, thereby effectively improving heat dissipation effect;

the heat dissipation structure comprises a heat dissipation shell 600 attached to a heat dissipation layer 500, a fixing clamping groove 602 fixed to the surface of the heat dissipation layer 500 in a clamped mode is formed in the end portion of the heat dissipation shell 600, a heat dissipation channel 601 used for ventilation is arranged inside the heat dissipation shell 600, an exhaust port 603 used for exhaust is formed in the end face of the heat dissipation channel 601, a plurality of heat dissipation fins are distributed on the surface of the heat dissipation layer 500, the end portions of the heat dissipation fins extend into the heat dissipation channel 601, and the heat dissipation channel 601 is of a sheet structure, so that the heat dissipation area is effectively increased;

the right end of the heat dissipation shell 600 is provided with an air inlet 604, the air inlet 604 is connected with an expansion cooling structure 700 for air inlet, the expansion cooling structure 700 comprises a first buffer tank 701 communicated with the air inlet 604, the right side of the first buffer tank 701 is provided with a second buffer tank 704, the left end of the second buffer tank 704 is provided with a plurality of exhaust ports, each exhaust port is provided with a conical cover 703, the left end of each conical cover 703 is communicated with an air blow pipe 702, the left end of the air blow pipe 702 extends into the first buffer tank 701, the right end of the second buffer tank 704 is provided with an air inlet pipe 705 for connecting with an air blowing structure, when the expansion cooling structure is actually used, air is delivered to the air inlet pipe 705 through the air blowing structure, enters the second buffer tank 704, flows along the conical cover 703, is compressed when flowing along a conical channel, and expands after being discharged along the left end of the air blow pipe 702, the expansion gas can reduce the temperature of the expansion gas by doing work externally, and the heat on the surface of the radiating fin can be taken away when the low-temperature air enters the radiating channel 601 along the air inlet 604, so that the product is cooled, and the working quality of the product is effectively guaranteed.

Example 2

The difference from example 1 is: the inside atomizer that is used for spouting water smoke that is equipped with of second baffle-box 704, gas vent 603 department is equipped with and is used for the air duct with the exhaust guide, avoids humid air to electronic component's influence, when ordinary cooling and when not reaching the cooling, can produce water smoke through the atomizer, and water smoke can evaporate under the effect of air current, and a large amount of heats can be absorbed to the evaporating water droplet to the radiating effect has further been improved.

The utility model discloses a theory of operation is: during the in-service use, defeated gas to intake pipe 705 through the structure of blowing, in gaseous entering second buffer tank 704, it flows along conical cover 703 to be gaseous, gaseous can be compressed when flowing along the tapered passage, gaseous behind the compression can expand along gas blow pipe 702 left end discharge back, expanding gas can make self temperature reduce to do work externally, microthermal air gets into radiating channel 601 along air inlet 604, can take away the heat on radiating fin surface, thereby cool down the product, produce water smoke through the atomizer, water smoke can evaporate under the effect of air current, a large amount of heats can be absorbed to the water droplet that evaporates, thereby further improved the radiating effect.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention.

Claims

1. A silicon carbide power device TO-247 package with replaceable lead frame pins comprises a package substrate (100) and a power device (300) arranged above the package substrate, and is characterized in that a first metal layer (400) is arranged on the upper side of the power device (300), a heat dissipation plate (200) is arranged on the lower side of the power device (300), the lead frame pins are detachably arranged on the heat dissipation plate (200) and the first metal layer (400), heat dissipation layers (500) for heat conduction are arranged on the outer side surfaces of the heat dissipation plate (200) and the first metal layer (400), and heat dissipation structures are arranged on the outer sides of the heat dissipation layers (500) on the upper side and the lower side;

the heat dissipation structure comprises a heat dissipation shell (600) attached to a heat dissipation layer (500), a fixed clamping groove (602) fixed with the surface of the heat dissipation layer (500) in a clamping mode is formed in the end portion of the heat dissipation shell (600), a heat dissipation channel (601) used for ventilation is arranged inside the heat dissipation shell (600), and an exhaust port (603) used for exhausting is formed in the end face of the heat dissipation channel (601);

an air inlet (604) is formed in the right end of the heat dissipation shell (600), and the air inlet (604) is connected with an expansion cooling structure (700) for air inlet.

2. The silicon carbide power device TO-247 package with replaceable lead frame pins of claim 1, wherein a plurality of heat dissipation fins are distributed on the surface of the heat dissipation layer (500), and the ends of the heat dissipation fins extend TO the inside of the heat dissipation channel (601).

3. The silicon carbide power device TO-247 package with replaceable lead frame pin of claim 2, wherein the heat dissipation channel (601) is in a sheet like structure.

4. The silicon carbide power device TO-247 package with replaceable lead frame pins according TO claim 1, wherein the expansion cooling structure (700) comprises a first buffer tank (701) communicated with an air inlet (604), a second buffer tank (704) is arranged on the right side of the first buffer tank (701), a plurality of air exhaust ports are arranged at the left end of the second buffer tank (704), each air exhaust port is provided with a conical cover (703), the left end of each conical cover (703) is communicated with an air blowing pipe (702), the left end of each air blowing pipe (702) extends into the first buffer tank (701), and the right end of the second buffer tank (704) is provided with an air inlet pipe (705) for connecting an air blowing structure.

5. The TO-247 package with replaceable lead frame pins of claim 4, wherein the air blowing tube (702) and the air inlet tube (705) are made of metal material.

6. The silicon carbide power device TO-247 package with replaceable lead frame pins according TO any one of claims 4 TO 5, wherein an atomizer for spraying water mist is arranged inside the second buffer box (704), and an air duct for guiding exhaust air is arranged at the exhaust port (603).