CN215265786U

CN215265786U - Resistor with low resistance and high power

Info

Publication number: CN215265786U
Application number: CN202121383663.8U
Authority: CN
Inventors: 汪晓伟
Original assignee: Ralec Electronic Corp
Current assignee: Ralec Technology Kunshan Co Ltd; Ralec Electronic Corp
Priority date: 2021-06-22
Filing date: 2021-06-22
Publication date: 2021-12-21
Anticipated expiration: 2031-06-22

Abstract

The utility model relates to an electronic component field, concretely relates to resistance of low resistance high power, including base plate, back electrode, positive electrode, resistance layer, side electrode and protective layer, the front of base plate is equipped with the positive electrode along length direction's both sides, the base plate back with the place that the positive electrode is relative is equipped with the back electrode, be equipped with between the positive electrode the resistance layer, the side electrode is located the side of base plate, and the upper end with the positive electrode contact, the lower extreme with the back electrode contact, the positive electrode includes the connection point, follows two that base plate width direction is relative be equipped with between the connection point the resistance layer is followed be equipped with the fault zone between the adjacent connection point of base plate length direction. The utility model discloses a resistance of low resistance high power, through a plurality of resistances that connect in parallel at the substrate surface, greatly reduced whole resistance, improved the power of whole resistance simultaneously, increased the life of resistance.

Description

Resistor with low resistance and high power

Technical Field

The utility model relates to an electronic component field, concretely relates to resistance of low resistance high power.

Background

When the electric charge moves in the conductor, the electric charge is collided and rubbed by other particles such as molecules and atoms, and the collision and the rubbing result to form the obstruction of the current by the conductor, and the most obvious characteristic of the obstruction is that the conductor consumes electric energy to generate heat (or emit light). This resistance of the object to the current is referred to as the resistance of the object. Resistors (resistors) are commonly and directly referred to as resistances in daily life. Is a current limiting element, and after a resistor is connected in a circuit, the resistance value of the resistor is fixed, generally two pins, and the resistor can limit the current passing through a branch connected with the resistor. The resistance value that cannot be changed is called a fixed resistor. Variable resistance is called a potentiometer or a variable resistor. Ideally the resistor is linear, i.e. the instantaneous current through the resistor is proportional to the applied instantaneous voltage. A variable resistor for voltage division. On the exposed resistor body, one to two movable metal contacts are pressed. The contact location determines the resistance between either end of the resistor and the contact.

At present, since manufacturers specify resistors and limit the resistance and power of the resistors, when the resistance material and the coating thickness of the resistors are not changed, the resistance of the resistors prepared by one-time integral printing is low, and the maximum power borne by the electronic lock is relatively low. In addition, because the resistor is a whole, no current passes through the resistor at the position where the trimming cut point exists due to the trimming cut point, the heat dissipation of the resistor is concentrated at the middle position of the resistor layer, the heat dissipation effect of the resistor is poor, and the requirement of a customer cannot be met.

Disclosure of Invention

For solving the not enough of prior art existence, the utility model provides a resistance of low resistance high power, this resistance is through setting up a plurality of connection points, with on the base plate the parallelly connected setting of resistance layer has reduced the resistance of resistance, has improved the power of resistance, has increased the heat dispersion of resistance.

The technical scheme of the utility model is that:

the utility model provides a resistance of low resistance high power, including base plate, back electrode, positive electrode, resistance layer, side electrode and protective layer, the front of base plate is equipped with the positive electrode along length direction's both sides, the base plate back is equipped with the place relative with the positive electrode the back electrode, be equipped with between the positive electrode the resistance layer, the side electrode is located the side of base plate, and the upper end with the positive electrode contact, the lower extreme with the back electrode contact, the positive electrode includes the connection point, follows two relative connection points of base plate width direction are equipped with the resistance layer, follow be equipped with the broken string between the adjacent connection point of base plate length direction, the protective layer coating is on the surface of whole resistance layer, the protective layer includes first heat dissipation layer, second heat dissipation layer and waterproof layer, first heat dissipation layer coating is in the resistance layer surface, the second heat dissipation layer is located on the surface of the first heat dissipation layer, and the waterproof layer is located on the surface of the second heat dissipation layer.

Preferably, there are 4-8 connecting points, the spacing distance between adjacent connecting points is equal, and the resistance values of the resistance layers between corresponding connecting points are also equal.

Preferably, there are 4 of said attachment sites.

Preferably, there are 8 of the attachment sites.

Preferably, each of the attachment sites is flanked by a trimming cut.

Preferably, the solar cell further comprises a nickel plating layer and a tin plating layer, wherein the nickel plating layer is positioned on the surface of the side electrode, and the tin plating layer is positioned on the surface of the nickel plating layer.

The utility model discloses the beneficial effect who reaches does:

by arranging the connecting sites, the resistance layers on the substrate are connected in parallel to be connected in a circuit, and the resistance value of the whole electric group is reduced;

through setting up a plurality of resistive layer that connect in parallel, can evenly obtain the heat dispersion that produces whole resistance to whole resistance surface, improved resistance load ability, improved the load power of resistance.

Drawings

Fig. 1 is a schematic view of the overall cross-sectional structure of the present invention.

Fig. 2 is a top view of the resistive layer and the substrate showing the break and the connection sites.

FIG. 3 is a graph showing the change in heat flux density with the number of connection sites.

In the figure, 1, a substrate; 2. a back electrode; 3. a positive electrode; 4. a resistive layer; 5. a first heat dissipation layer; 6. a second heat dissipation layer; 7. a waterproof layer; 8. repairing a resistance cutting point; 9. a side electrode; 11. a nickel plating layer; 12. tin plating; 31. a ligation site; 32. and (5) breaking the belt.

Detailed Description

To facilitate understanding of the present invention for those skilled in the art, embodiments of the present invention will be described below with reference to the accompanying drawings.

As shown in fig. 1 to 3, the present invention provides a low-resistance high-power resistor, which includes a substrate 1, a back electrode 2, a positive electrode 3, a resistance layer 4, a side electrode 9 and a protection layer, wherein the positive electrode 3 is disposed on both sides of the front surface of the substrate 1 along the length direction, the substrate 1 is used for loading the positive electrode 3 and the back electrode 2, and becomes a main skeleton of the whole electron, and provides a carrier for the subsequent coating of the resistance layer 4, the back electrode 2 is disposed on the back surface of the substrate 1 opposite to the positive electrode 3, the resistance layer 4 is disposed between the positive electrodes 3, the side electrode 9 is disposed on the side surface of the substrate 1, the upper end of the side electrode contacts the positive electrode 3, the lower end of the side electrode contacts the back electrode 2, the positive electrode 3 includes a connection site 31, and the connection sites 31 are disposed, so as to connect both ends of the resistance layer 4, so as to connect the resistor in the circuit, the resistor layer 4 is arranged between two opposite connection points 31 along the width direction of the substrate 1, the broken belt 32 is arranged between the adjacent connection points 31 along the length direction of the substrate 1, the original resistor layer 4 is divided into a plurality of broken belts 32 and connected in parallel in the circuit, thereby reducing the resistance of the whole resistor, greatly reducing the resistance of the whole resistor in the circuit, the protective layer is coated on the surface of the whole resistor layer 4, the protective layer comprises a first heat dissipation layer 5, a second heat dissipation layer 6 and a waterproof layer 7, the first heat dissipation layer 5 is coated on the surface of the resistor layer 4, the second heat dissipation layer 6 is positioned on the surface of the first heat dissipation layer 5, the waterproof layer 7 is positioned on the surface of the second heat dissipation layer 6, and the first heat dissipation layer 5 and the second heat dissipation layer 6 are used for assisting the resistor layer 4 to dissipate heat, the waterproof layer 7 is used for insulating the resistive layer 4 from air, and plays a role in protecting the resistive layer 4. The first heat dissipation layer 5 is made of pure glass and coated on the surface of the resistance layer 4 after the resistance layer is coated, the second heat dissipation layer 6 is made of glass and lead powder, the mass fraction of the lead powder is controlled to be 3-5%, and the second heat dissipation layer 6 can dissipate heat quickly by adding the lead powder. The mass fraction of the applicable lead powder is preferably controlled within 5%. The heat flux density and the insulation properties of the second heat sink layer 6 are optimized at this time, as shown in Table 1, wherein the heat flux density is measured with reference to 360 encyclopedia (https:// baike. so. com/doc/591329-625970.html), and the insulation properties are measured with reference to the national standard GB/T10064-2006 test method for measuring the insulation resistance of solid insulation materials.

TABLE 1 relationship between the heat flux density and the insulating property of the second heat dissipation layer with the addition of lead powder

Lead powder content (%)	Density of heat flow	Insulating property
				0	0.9321	Is that
1	0.9543	Is that
			2	0.9817	Is that
3	1.0012	Is that
			4	1.1157	Is that
5	1.2498	Is that
			6	1.3472	Whether or not
7	1.4451	Whether or not
			8	1.7216	Whether or not
9	1.9317	Whether or not
			10	2.0015	Whether or not

It can be seen that the heat flux density of the second heat dissipation layer 6 increases with the heating of the lead powder, which means that the heat dissipation performance of the second heat dissipation layer 6 increases, and when the content of the lead powder is higher than 5%, although the heat flux performance increases, the second heat dissipation layer 6 is no longer insulated and is not suitable for being used as a protective layer of a resistor. Therefore, the optimum amount of lead powder added is 5%.

In this embodiment, there are 4 to 8 connection points 31, the distance between adjacent connection points 31 is equal, the resistance values of the resistive layer 4 between the corresponding connection points 31 are also equal, the more the connection points 31 are, the more the resistors connected in parallel are, and the lower the resistance value of the whole resistor is. The heat dissipation coefficient of the prepared resistor element is simulated by using CFD computer software, and the specific relationship between the heat dissipation coefficient and the number of the connecting sites is shown in figure 3, wherein the abscissa represents the number of the connecting sites, and the ordinate represents the heat flow density (W/cm) of the resistor under rated voltage²). Wherein, when the heat flow density is lower than 0.8W/cm²The resistive element then cannot solve its own cooling problem by natural cooling. For the purpose of natural cooling of the track resistance as much as possible, the heat flow density of the resistance must be reduced.

In this example, there are 4 of the attachment sites 31.

In this example, there are 8 of the attachment sites 31.

In this embodiment, each of the attachment sites 31 is flanked by a trimming cut 8. By setting the resistance trimming tangent point 8, the resistance of the single resistance layer 4 is corrected, and the accuracy of the resistance is ensured. The trimming and cutting point 8 can be in a shape of a straight line, an L shape or other shapes.

In the present embodiment, the device further includes a nickel plating layer 11 and a tin plating layer 12, wherein the nickel plating layer 11 is located on the surface of the side electrode 9, and the tin plating layer 12 is located on the surface of the nickel plating layer 11. The nickel plating layer 11 and the tin plating layer 12 are arranged to coat the side surface of the substrate 1, and the back electrode 2 can be coated, so that the back electrode 2 can be conveniently connected to a circuit.

The utility model discloses the beneficial effect who reaches does:

by arranging the connecting sites 31, the resistance layers 4 on the substrate 1 are connected in parallel to be connected in a circuit, so that the resistance value of the whole electric group is reduced;

by arranging the resistance layers 4 connected in parallel, the heat generated by the whole resistor can be uniformly dispersed on the surface of the whole resistor, the resistor is prevented from being concentrated at one point for heat dissipation, the resistance load capacity is improved, and the load power of the resistor is improved.

The above-mentioned embodiments of the present invention do not limit the scope of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A low-resistance high-power resistor is characterized in that: including base plate (1), back electrode (2), positive electrode (3), resistive layer (4), side electrode (9) and protective layer, the front of base plate (1) is equipped with positive electrode (3) along length direction's both sides, base plate (1) the back with the place that positive electrode (3) are relative is equipped with back electrode (2), be equipped with between positive electrode (3) resistive layer (4), side electrode (9) are located the side of base plate (1), and upper end with positive electrode (3) contact, the lower extreme with back electrode (2) contact, positive electrode (3) are including connection point (31), follow base plate (1) width direction relative two be equipped with between connection point (31) resistive layer (4), follow be equipped with disconnected area (32) between base plate (1) length direction adjacent connection point (31), the protective layer coating is on the surface of whole resistive layer (4), the protective layer includes first heat dissipation layer (5), second heat dissipation layer (6) and waterproof layer (7), first heat dissipation layer (5) coating is in resistive layer (4) surface, second heat dissipation layer (6) are located first heat dissipation layer (5) surface, waterproof layer (7) are located second heat dissipation layer (6) surface.

2. The low resistance, high power resistor of claim 1, wherein: the number of the connecting points (31) is 4-8, the spacing distance between every two adjacent connecting points (31) is equal, and the resistance values of the resistance layers (4) between the corresponding connecting points (31) are also equal.

3. The low resistance high power resistor of claim 2, wherein: there are 4 of said attachment sites (31).

4. The low resistance high power resistor of claim 2, wherein: there are 8 of said attachment sites (31).

5. The low resistance high power resistor of claim 2, wherein: and both sides of each connecting site (31) are provided with trimming and cutting points (8).

6. The low resistance high power resistor of claim 2, wherein: the solar cell further comprises a nickel plating layer (11) and a tin plating layer (12), wherein the nickel plating layer (11) is located on the surface of the side electrode (9), and the tin plating layer (12) is located on the surface of the nickel plating layer (11).