CN215264685U - Heat dissipation mechanism of special dustproof industrial computer for laser cutting - Google Patents
Heat dissipation mechanism of special dustproof industrial computer for laser cutting Download PDFInfo
- Publication number
- CN215264685U CN215264685U CN202121328674.6U CN202121328674U CN215264685U CN 215264685 U CN215264685 U CN 215264685U CN 202121328674 U CN202121328674 U CN 202121328674U CN 215264685 U CN215264685 U CN 215264685U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- dustproof
- mainboard
- laser cutting
- industrial computer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a special dustproof industrial computer's of laser cutting heat dissipation mechanism belongs to quick-witted case heat dissipation technical field. The dustproof case comprises a case body, wherein a dustproof cavity is arranged in the case body in a sealed mode, two mainboard heat dissipation structures connected with a mainboard are arranged in the dustproof cavity, and the two mainboard heat dissipation structures are arranged on two sides of the mainboard respectively and are arranged in a staggered mode. The dust-proof chamber that the machine incasement seals the setting can prevent that the dust that laser cutting machine work produced from getting into inside the computer, mainboard heat radiation structure can absorb the heat that mainboard work produced through the radiating fluid, the radiating fluid after the absorption heat flows into the radiating fluid incasement through the pipeline, radiating fluid circulation mechanism in the radiating fluid incasement can export the radiating fluid on quick-witted case outside's radiator grille and shift the heat to the external world through the radiator grille through the pipeline, the radiating fluid after the cooling through the radiator grille gets back to mainboard heat radiation structure department through the pipeline and accomplishes sustainable liquid cooling circulation.
Description
Technical Field
The utility model belongs to the technical field of quick-witted case heat dissipation, a special dustproof industrial computer's of laser cutting heat dissipation mechanism is related to.
Background
The laser cutting machine is poor in working environment and large in dust, a large amount of dust is easily accumulated after a general computer is used for a long time, if the sealing performance of the computer is poor, a large amount of dust can enter the computer, the heat dissipation effect of the computer with a good sealing effect is poor, and the performance of the computer is greatly influenced.
In order to overcome the defects of the prior art, people continuously explore and propose various solutions, for example, a chinese patent discloses a chassis heat dissipation mechanism [ application number: 201510355431.4], comprising a water-cooling heat dissipation component and an air intake fan, wherein the water-cooling heat dissipation component and the air intake fan are both arranged in the case; the water-cooling radiating assembly comprises a radiating cavity, a water-cooling radiating pipeline and a water-cooling radiating water pump; the water-cooling heat dissipation pipelines are uniformly distributed in the heat dissipation cavity, and the water-cooling heat dissipation water pump is communicated in a loop of the water-cooling heat dissipation pipeline so as to perform water-cooling heat dissipation; the air inlet fan is arranged at the air inlet of the heat dissipation cavity, and the heat dissipation cavity is also provided with an air outlet to take the heat of the water-cooling heat dissipation pipeline away by the air inlet. The computer case heat dissipation mechanism independently discharges air and performs water cooling heat dissipation, does not cause dust accumulation of accessories in the case, and has good heat dissipation effect.
SUMMERY OF THE UTILITY MODEL
The utility model aims at the above-mentioned problem, a dustproof industrial computer's of special laser cutting heat dissipation mechanism is provided.
In order to achieve the above purpose, the utility model adopts the following technical proposal:
the utility model provides a special dustproof industrial computer's of laser cutting heat dissipation mechanism, includes quick-witted case, quick-witted incasement be equipped with the dustproof chamber of sealed setting, dustproof intracavity be equipped with two mainboard heat radiation structure that link to each other with the mainboard, two mainboard heat radiation structure set up respectively in mainboard both sides and two mainboard heat radiation structure dislocation set, dustproof intracavity still be equipped with the cooling liquid case, the cooling liquid case pass through the pipeline and link to each other with two mainboard heat radiation structure respectively, the cooling liquid incasement still be equipped with cooling liquid circulation mechanism, machine case outside be equipped with the cooling grid, the cooling grid link to each other with two mainboard heat radiation structure and cooling liquid case through the pipeline respectively.
In the heat dissipation mechanism of the dustproof industrial computer special for laser cutting, the heat dissipation liquid circulation mechanism comprises a silent water pump arranged in a heat dissipation liquid box, and the silent water pump is connected with a heat dissipation grating through a pipeline.
In the heat dissipation mechanism of the dustproof industrial computer special for laser cutting, the mainboard heat dissipation structure comprises a processor heat dissipation head and a bridge core heat dissipation head, a heat dissipation liquid cavity is further arranged in the processor heat dissipation head and the bridge core heat dissipation head, and the two processor heat dissipation heads are connected with the bridge core heat dissipation head through a pipeline.
In the heat dissipation mechanism of the special dustproof industrial computer for laser cutting, two supports are further arranged on two sides of the main board, and two support plates which are respectively connected with the bottoms of the processor heat dissipation head and the bridge core heat dissipation head are horizontally arranged on the supports.
In the heat dissipation mechanism of the dustproof industrial computer special for laser cutting, a temperature sensor is further arranged in the dustproof cavity, and an auxiliary heat dissipation mechanism connected with the temperature sensor is further arranged in the case.
In the above-mentioned heat dissipation mechanism of the special dustproof industrial computer for laser cutting, the auxiliary heat dissipation mechanism includes a plurality of heat dissipation holes arranged on one side of the case away from the heat dissipation grid, the heat dissipation holes are internally provided with openable sealed dust-proof plates, and the dust-proof cavity is provided with a heat dissipation fan on one side away from the heat dissipation holes.
In the heat dissipation mechanism of the special dust-proof industrial computer for laser cutting, a driving mechanism capable of synchronously driving the opening or closing of the sealing dust-proof plates in the plurality of heat dissipation holes is further arranged in the dust-proof cavity.
In the heat dissipation mechanism of the special dustproof industrial computer for laser cutting, the upper side of the sealed dustproof plate is rotatably connected with the heat dissipation holes through a rotating shaft, the driving mechanism comprises a vertically arranged driving rod, the top of the driving rod is connected with a lifting driver, and a plurality of connecting rod assemblies connected with the sealed dustproof plate are arranged on the driving rod.
In the heat dissipation mechanism of foretell special dustproof industrial computer of laser cutting, link assembly including fixing the hinge No. one on the actuating lever, sealed dust guard downside link firmly the hinge No. two, hinge No. one and No. two between the hinge articulated have the push rod.
In the heat dissipation mechanism of the dustproof industrial computer special for laser cutting, the case is further provided with a connecting hole, the inner end of the connecting hole is connected with the dustproof cavity, and the outer end of the connecting hole is connected with the positive pressure system through a hose.
Compared with the prior art, the utility model has the advantages of:
1. the dust-proof chamber that the machine incasement seals the setting can prevent that the dust that laser cutting machine work produced from getting into inside the computer, mainboard heat radiation structure can absorb the heat that mainboard work produced through the radiating fluid, the radiating fluid after the absorption heat flows into the radiating fluid incasement through the pipeline, radiating fluid circulation mechanism in the radiating fluid incasement can export the radiating fluid on quick-witted case outside's radiator grille and shift the heat to the external world through the radiator grille through the pipeline, the radiating fluid after the cooling through the radiator grille gets back to mainboard heat radiation structure department through the pipeline and accomplishes sustainable liquid cooling circulation.
2. The silent water pump can output the cooling liquid in the cooling liquid box to the cooling grid for cooling, and the silent water pump can provide kinetic energy for cooling liquid circulation.
3. When the temperature in the machine case is too high, the sealing dust guard is opened, the cooling fan blows air to the main board to cool and discharges hot air through the radiating holes, and when the temperature in the machine case is normal, the sealing dust guard is closed to prevent dust from entering the machine case.
4. When carrying out the forced air cooling heat dissipation, malleation system can make dustproof intracavity form the malleation to dustproof intracavity ventilation through hose and connecting hole to the dust gets into quick-witted incasement when preventing louvre and external intercommunication.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.
Drawings
Fig. 1 is a schematic diagram of the overall structure provided by the present invention;
FIG. 2 is an enlarged schematic view at A in FIG. 1;
fig. 3 is an enlarged schematic view at B in fig. 1.
In the figure: the heat dissipation device comprises a case 1, a dustproof cavity 2, a mainboard 3, a mainboard heat dissipation structure 4, a heat dissipation liquid tank 5, a heat dissipation liquid circulation mechanism 6, a heat dissipation grid 7, a silent water pump 8, a processor heat dissipation head 9, a bridge core heat dissipation head 10, a heat dissipation liquid cavity 11, a support 12, a support plate 13, a temperature sensor 14, an auxiliary heat dissipation mechanism 15, a heat dissipation hole 16, a sealing dustproof plate 17, a heat dissipation fan 18, a driving mechanism 19, a driving rod 20, a lifting driver 21, a connecting rod assembly 22, a first hinge joint 23, a second hinge joint 24, a push rod 25, a connecting hole 26 and a hose 27.
Detailed Description
As shown in fig. 1 and 2, a heat dissipation mechanism of special dustproof industrial computer for laser cutting comprises a case 1, the case 1 is internally provided with a dustproof cavity 2 which is hermetically arranged, the dustproof cavity 2 is internally provided with two mainboard heat dissipation structures 4 connected with a mainboard 3, the two mainboard heat dissipation structures 4 are respectively arranged on two sides of the mainboard 3 and are arranged in a staggered manner, the dustproof cavity 2 is internally provided with a heat dissipation liquid tank 5, the heat dissipation liquid tank 5 is respectively connected with the two mainboard heat dissipation structures 4 through pipelines, the heat dissipation liquid tank 5 is internally provided with a heat dissipation liquid circulation mechanism 6, the case 1 is externally provided with a heat dissipation grating 7, and the heat dissipation grating 7 is respectively connected with the two mainboard heat dissipation structures 4 and the heat dissipation liquid tank 5 through pipelines.
In this embodiment, the dust proof chamber that the machine incasement seals and sets up can prevent that the dust that laser cutting machine work produced from getting into inside the computer, mainboard heat radiation structure can absorb the heat that mainboard work produced through the radiating fluid, the radiating fluid after the absorption heat flows into the radiating fluid incasement through the pipeline, radiating fluid circulation mechanism 6 in the radiating fluid incasement 5 can export the radiating fluid on quick-witted case outside's radiator grille 7 and shift the heat to the external world through radiator grille through the pipeline, the radiating fluid after the cooling through radiator grille gets back to mainboard heat radiation structure 4 through the pipeline and locates to accomplish sustainable liquid cooling circulation.
Set up two mainboard heat radiation structure 4 and dislocation set can improve the radiating effect in mainboard both sides.
Specifically, as shown in fig. 1 and 2, the coolant circulation mechanism 6 includes a silent water pump 8 disposed in the coolant tank 5, and the silent water pump 8 is connected to the radiator grill 7 through a pipe. The silent water pump can output the cooling liquid in the cooling liquid box to the cooling grid for cooling, and the silent water pump can provide kinetic energy for cooling liquid circulation.
It will be appreciated by those skilled in the art that the silent water pump may be a product of the prior art.
Specifically, as shown in fig. 1, the motherboard heat dissipation structure 4 includes a processor heat dissipation head 9 and a bridge core heat dissipation head 10, the processor heat dissipation head 9 and the bridge core heat dissipation head 10 are respectively disposed at the processor and the bridge core of the motherboard, a heat dissipation liquid cavity 11 is further disposed in the processor heat dissipation head 9 and the bridge core heat dissipation head 10, the heat generated by the operation of the motherboard can be absorbed by the heat dissipation liquid in the heat dissipation liquid cavity 11 and discharged through a heat dissipation grid during the circulation of the heat dissipation liquid, and the two processor heat dissipation heads 9 and the bridge core heat dissipation head 10 are connected through a pipeline.
Specifically, as shown in fig. 1, two brackets 12 are further disposed on two sides of the main board 3, and two support plates 13 are horizontally disposed on the brackets 12 and respectively connected to the bottoms of the processor thermal head 9 and the bridge core thermal head 10. A support plate on bracket 12 can hold processor thermal head 9 and bridge die thermal head 10.
Preferably, as shown in fig. 1-3, a temperature sensor 14 is further disposed in the dustproof cavity 2, and an auxiliary heat dissipation mechanism 15 connected to the temperature sensor 14 is further disposed in the chassis 1. The temperature sensor 14 can monitor the temperature in the case in real time, and when the temperature is too high, the auxiliary heat dissipation mechanism 15 is started to dissipate heat of the case.
Specifically, as shown in fig. 1-3, the auxiliary heat dissipation mechanism 15 includes a plurality of heat dissipation holes 16 disposed on a side of the chassis 1 away from the heat dissipation grid 7, an openable sealed dust-proof plate 17 is disposed in each heat dissipation hole 16, and a heat dissipation fan 18 is disposed on a side of the dust-proof cavity 2 away from the heat dissipation holes 16. When the temperature in the machine case is too high, the sealing dust guard is opened, the cooling fan blows air to the main board to cool and discharges hot air through the radiating holes, and when the temperature in the machine case is normal, the sealing dust guard is closed to prevent dust from entering the machine case.
Preferably, as shown in fig. 1 and 3, a driving mechanism 19 for synchronously driving the opening or closing of the sealed dust-proof plate 17 in the plurality of heat dissipation holes 16 is further provided in the dust-proof chamber 2. The auxiliary heat dissipation mechanism 15 can synchronously drive the opening or closing of the sealing dust-proof boards 17 in the plurality of heat dissipation holes 16.
Specifically, as shown in fig. 1 and 3, the upper side of the sealing dust-proof plate 17 is rotatably connected to the heat dissipation hole 16 through a rotation shaft, the driving mechanism 19 includes a driving rod 20 vertically disposed, the top of the driving rod 20 is connected to a lifting driver 21, and the driving rod 20 is provided with a plurality of connecting rod assemblies 22 connected to the sealing dust-proof plate 17. The connecting rod assembly 22 comprises a first hinge head 23 fixed on the driving rod 20, a second hinge head 24 is fixedly connected to the lower side of the sealing dustproof plate 17, and a push rod 25 is hinged between the first hinge head 23 and the second hinge head 24. The lifting driver 21 can drive the driving rod to lift along the vertical direction, the driving rod can push the lower side of the sealed dustproof plate to rotate and open when moving downwards, and the driving rod can pull the sealed dustproof plate to close when moving upwards.
It will be appreciated by those skilled in the art that the lift drive may be a ram. A cylinder or a linear motor, etc.
Preferably, as shown in fig. 1, a connection hole 26 is further formed in the chassis 1, an inner end of the connection hole 26 is connected to the dust-proof chamber 2, and an outer end of the connection hole 26 is connected to the positive pressure system through a hose 27. When air-cooled heat dissipation is carried out, the positive pressure system (not shown in the figure) can ventilate the dustproof cavity through the hose and the connecting hole to enable the dustproof cavity to form positive pressure, so that dust is prevented from entering the case when the heat dissipation holes are communicated with the outside.
It will be appreciated by those skilled in the art that positive pressure systems may be known in the art.
The utility model discloses a theory of operation is: the dust-proof cavity arranged in the case in a sealing manner can prevent dust generated by the work of the laser cutting machine from entering the computer, the heat dissipation structure of the mainboard can absorb heat generated by the work of the mainboard through heat dissipation liquid, the heat dissipation liquid after absorbing the heat flows into the heat dissipation liquid box through a pipeline, the heat dissipation liquid circulation mechanism 6 in the heat dissipation liquid box 5 can output the heat dissipation liquid onto the heat dissipation grating 7 outside the case through the pipeline and transfer the heat to the outside through the heat dissipation grating, and the heat dissipation liquid cooled by the heat dissipation grating returns to the heat dissipation structure 4 of the mainboard through the pipeline to complete sustainable liquid cooling circulation;
the two main board heat dissipation structures 4 are arranged on the two sides of the main board in a staggered mode, so that the heat dissipation effect can be improved, the silent water pump can output the heat dissipation liquid in the heat dissipation liquid box to the heat dissipation grating for heat dissipation, and the silent water pump can provide kinetic energy for circulation of the heat dissipation liquid;
the temperature sensor 14 can monitor the temperature in the case in real time, when the temperature is too high, the auxiliary heat dissipation mechanism 15 is started and dissipates heat to the case, when the temperature in the case is too high, the sealing dust guard is opened, the heat dissipation fan blows air to the main board for air cooling and discharges hot air through the heat dissipation holes, when the temperature in the case is normal, the sealing dust guard is closed to prevent dust from entering the case, the auxiliary heat dissipation mechanism 15 can synchronously drive the sealing dust guard 17 in the plurality of heat dissipation holes 16 to be opened or closed, the lifting driver 21 can drive the driving rod to lift along the vertical direction, the driving rod can push the lower side of the sealing dust guard to rotate and open when moving downwards, the driving rod can pull the sealing dust guard to be closed through the push rod when moving upwards to dissipate heat in an air cooling mode, the positive pressure system can ventilate the dust guard into the dust guard through the hose and the connecting holes to form positive pressure in the dust guard, thereby preventing dust from entering the case when the heat dissipation holes are communicated with the outside.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions for the specific embodiments described herein may be made by those skilled in the art without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.
Although the case 1, the dustproof chamber 2, the motherboard 3, the motherboard heat dissipation structure 4, the coolant tank 5, the coolant circulation mechanism 6, the heat dissipation grid 7, the silent water pump 8, the processor heat dissipation head 9, the bridge core heat dissipation head 10, the coolant chamber 11, the bracket 12, the support plate 13, the temperature sensor 14, the auxiliary heat dissipation mechanism 15, the heat dissipation hole 16, the sealing dustproof plate 17, the cooling fan 18, the driving mechanism 19, the driving rod 20, the lifting driver 21, the connecting rod assembly 22, the first hinge 23, the second hinge 24, the push rod 25, the connecting hole 26, the hose 27, etc. are used more frequently herein, these terms are used only for the purpose of more conveniently describing and explaining the essence of the present invention; they are to be construed in a manner that is inconsistent with the spirit of the invention.
Claims (10)
1. A heat dissipation mechanism of a dustproof industrial computer special for laser cutting comprises a case (1), it is characterized in that a dustproof cavity (2) which is arranged in a sealing way is arranged in the case (1), two mainboard heat dissipation structures (4) connected with the mainboard (3) are arranged in the dustproof cavity (2), the two mainboard heat dissipation structures (4) are respectively arranged at two sides of the mainboard (3), and the two mainboard heat dissipation structures (4) are arranged in a staggered way, a heat dissipation liquid box (5) is also arranged in the dustproof cavity (2), the heat dissipation liquid box (5) is respectively connected with the two mainboard heat dissipation structures (4) through pipelines, a heat-dissipating liquid circulating mechanism (6) is also arranged in the heat-dissipating liquid box (5), the heat dissipation structure is characterized in that a heat dissipation grid (7) is arranged outside the case (1), and the heat dissipation grid (7) is connected with the two main board heat dissipation structures (4) and the heat dissipation liquid tank (5) through pipelines respectively.
2. The heat dissipation mechanism of the dustproof industrial computer for laser cutting according to claim 1, wherein the heat dissipation liquid circulation mechanism (6) comprises a silent water pump (8) disposed in the heat dissipation liquid tank (5), and the silent water pump (8) is connected to the heat dissipation grid (7) through a pipeline.
3. The heat dissipation mechanism of the special dustproof industrial computer for laser cutting according to claim 1 or 2, wherein the main board heat dissipation structure (4) comprises a processor heat dissipation head (9) and a bridge core heat dissipation head (10), a heat dissipation liquid cavity (11) is further arranged in the processor heat dissipation head (9) and the bridge core heat dissipation head (10), and the two processor heat dissipation heads (9) and the bridge core heat dissipation head (10) are connected through a pipeline.
4. The heat dissipation mechanism of the dustproof industrial computer special for laser cutting according to claim 3, wherein two brackets (12) are further arranged on two sides of the main board (3), and two support plates (13) respectively connected with the processor heat dissipation head (9) and the bottom of the bridge core heat dissipation head (10) are horizontally arranged on the brackets (12).
5. The heat dissipation mechanism of the laser cutting special dust-proof industrial computer according to claim 1 or 2, wherein a temperature sensor (14) is further arranged in the dust-proof cavity (2), and an auxiliary heat dissipation mechanism (15) connected with the temperature sensor (14) is further arranged in the case (1).
6. The heat dissipation mechanism of the laser cutting special dust-proof industrial computer according to claim 5, wherein the auxiliary heat dissipation mechanism (15) comprises a plurality of heat dissipation holes (16) disposed on one side of the case (1) away from the heat dissipation grid (7), an openable sealing dust-proof plate (17) is disposed in each heat dissipation hole (16), and a heat dissipation fan (18) is disposed on one side of the dust-proof cavity (2) away from each heat dissipation hole (16).
7. The heat dissipation mechanism of the laser cutting special-purpose dustproof industrial computer according to claim 6, wherein a driving mechanism (19) capable of synchronously driving the opening or closing of the sealing dustproof plate (17) in the plurality of heat dissipation holes (16) is further arranged in the dustproof cavity (2).
8. The heat dissipation mechanism of the laser cutting special-purpose dustproof industrial computer according to claim 7, wherein the upper side of the sealed dustproof plate (17) is rotatably connected with the heat dissipation hole (16) through a rotating shaft, the driving mechanism (19) comprises a driving rod (20) which is vertically arranged, the top of the driving rod (20) is connected with a lifting driver (21), and a plurality of connecting rod assemblies (22) which are connected with the sealed dustproof plate (17) are arranged on the driving rod (20).
9. The heat dissipation mechanism of the special dust-proof industrial computer for laser cutting as claimed in claim 8, wherein the link assembly (22) comprises a first hinge head (23) fixed on the driving rod (20), a second hinge head (24) is fixedly connected to the lower side of the sealing dust-proof plate (17), and a push rod (25) is hinged between the first hinge head (23) and the second hinge head (24).
10. The heat dissipation mechanism of the special dustproof industrial computer for laser cutting according to claim 5 is characterized in that a connecting hole (26) is further formed in the case (1), the inner end of the connecting hole (26) is connected with the dustproof cavity (2), and the outer end of the connecting hole (26) is connected with the positive pressure system through a hose (27).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121328674.6U CN215264685U (en) | 2021-06-15 | 2021-06-15 | Heat dissipation mechanism of special dustproof industrial computer for laser cutting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121328674.6U CN215264685U (en) | 2021-06-15 | 2021-06-15 | Heat dissipation mechanism of special dustproof industrial computer for laser cutting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215264685U true CN215264685U (en) | 2021-12-21 |
Family
ID=79479593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121328674.6U Active CN215264685U (en) | 2021-06-15 | 2021-06-15 | Heat dissipation mechanism of special dustproof industrial computer for laser cutting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215264685U (en) |
-
2021
- 2021-06-15 CN CN202121328674.6U patent/CN215264685U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN211428153U (en) | Computer chip water cooling plant | |
| CN216118652U (en) | Computer machine case that heat dispersion is good | |
| CN215264685U (en) | Heat dissipation mechanism of special dustproof industrial computer for laser cutting | |
| CN211831622U (en) | Diversion type heat pipe heat dissipation cabinet | |
| CN210721332U (en) | Heat abstractor of big data cloud calculates all-in-one | |
| CN211628186U (en) | Non-screen recording type fort machine with self-exhaust structure | |
| CN214998108U (en) | Air compressor machine with high-efficient heat dissipation function | |
| CN111651022A (en) | Heat radiator for computer machine case | |
| CN220874324U (en) | Heat abstractor of water pump motor | |
| CN218042209U (en) | Industrial automatic control instrument system | |
| CN214025739U (en) | Intelligent robot for teaching children | |
| CN220570398U (en) | Air cooler with good heat dissipation performance | |
| CN217201779U (en) | Engineering machinery | |
| CN217025081U (en) | Engineering machinery | |
| CN215775186U (en) | Moon cake cooling device | |
| CN215500162U (en) | A high-efficient heat abstractor for rack | |
| CN214708417U (en) | Remote control device of mechanical equipment | |
| CN218298952U (en) | BIM component generation device | |
| CN218414182U (en) | Cooling structure of dry-type power transformer | |
| CN212563938U (en) | Gas turbine hydraulic oil air-cooled cooling system | |
| CN218244074U (en) | Wall-mounted energy storage power supply with heat radiation structure | |
| CN212494320U (en) | 5G integrated access equipment with dustproof mechanism | |
| CN215379633U (en) | Modular structure storehouse | |
| CN217545719U (en) | High efficiency heat dissipation type motor for bag sealer | |
| CN220515427U (en) | Headstock structure in vertical and horizontal machining center |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |