CN211428153U - A computer chip water cooling device - Google Patents

Abstract

The utility model relates to the technical field of water-cooling devices, and discloses a water-cooling device for computer chips, which comprises a chassis, a heat dissipation plate is fixedly connected in the chassis through a bracket, a chip is fixedly installed on the lower surface of the heat dissipation plate, and the chassis is fixed on the outer side wall near the top A water tank is connected, a water pump is fixedly installed on the inner wall of the chassis, and the input end of the water pump is fixedly connected with the water tank, and the output end of the water pump is fixedly connected with a water-cooling pipe, and the water-cooling pipe is arranged in a multi-section zigzag, and the water-cooling pipe is attached to the cooling plate. The end of the water cooling pipe away from the water pump penetrates through the side wall of the case and is connected to the water tank. The upper surface of the case is fixedly installed with a motor, and the output end of the motor is fixedly connected with a rotating rod through a coupling. The utility model enables the computer chip water cooling device to cool the water inside the water tank during the water cooling and heat dissipation process, thereby increasing the cooling speed of the chip and ensuring the heat dissipation efficiency.

Description

A computer chip water cooling device

technical field

The utility model relates to the technical field of water cooling devices, in particular to a water cooling device for computer chips.

Background technique

At present, there are still some deficiencies in the existing computer chip water cooling device. The existing computer chip water cooling device cannot simultaneously cool the water inside the water tank during the cooling process, which weakens the control effect of the water temperature inside the water tank and slows down the temperature. The speed at which the chip cools will affect the heat dissipation efficiency.

Utility model content

The purpose of the utility model is to solve the problem that the computer chip water cooling device in the prior art cannot simultaneously cool the water in the water tank during the cooling process, and proposes a computer chip water cooling device.

In order to achieve the above-mentioned purpose, the utility model adopts the following technical solutions:

A water cooling device for a computer chip, comprising a chassis, a heat dissipation plate is fixedly connected in the chassis through a bracket, a chip is fixedly installed on the lower surface of the heat dissipation plate, a water tank is fixedly connected to the outer side wall of the chassis near the top, and the A water pump is fixedly installed on the inner wall of the chassis, and the input end of the water pump is fixedly connected with the water tank, and the output end of the water pump is fixedly connected with a water-cooling pipe, and the water-cooling pipe is arranged in a multi-section zigzag, and the water-cooling pipe is attached to the cooling plate. And the end of the water-cooling pipe away from the water pump runs through the side wall of the case and communicates with the water tank. The upper surface of the inside of the case is fixedly installed with a motor, and the output end of the motor is fixedly connected with a rotating rod through a coupling, and the rotating rod is close to the bottom end. A fan blade is fixedly sleeved at the position, and a linkage mechanism is installed between the rotating rod and the water tank, a plurality of heat dissipation fins are fixedly connected to the outer side wall of the water tank, an air outlet is opened on the top of the case, and the case is An air inlet is opened on the side wall near the bottom;

The linkage mechanism includes a stirring rod that is rotatably connected in the water tank through a bearing, a plurality of uniformly staggered stirring blades are welded on the outer rod wall of the stirring rod, and the rod walls of the rotating rod and stirring rod are fixed sleeves. A first bevel gear is connected, a transmission rod is rotatably connected to the side wall of the water tank and the case, and the transmission rod and the water tank are rotatably connected by a sealed bearing, and both ends of the transmission rod are fixedly connected with the first bevel gear. The second bevel gear meshes with the bevel gear.

Preferably, the heat dissipation fins are provided with a plurality of uniformly distributed heat dissipation grooves.

Preferably, a liquid inlet pipe is fixedly connected to the top of the water tank, and a matching sealing cover is threadedly connected to the nozzle position of the top of the liquid inlet pipe.

Preferably, both the air outlet and the air inlet are equipped with matching dustproof nets.

Preferably, the heat dissipation plate, the water tank, the water cooling tube and the heat dissipation fin are all made of metal copper.

Preferably, the stirring blade is provided with a plurality of through holes.

Compared with the prior art, the utility model provides a computer chip water cooling device, which has the following beneficial effects:

The computer chip water cooling device is provided with a chassis, a heat dissipation plate, a chip, a water tank, a water pump, a water cooling pipe, a motor, a rotating rod, a fan blade, a linkage mechanism, a heat dissipation fin, an air outlet and an air inlet, and the chip generates heat during operation. The plate conducts heat conduction and heat dissipation, starts the water pump and the motor, and the water pump transports the water in the water tank to the water cooling pipe, and the heat on the heat dissipation plate is easily absorbed through heat exchange. The fan blade on the rod rotates to form a negative pressure inside and outside the case, the outside air enters the case through the air inlet, and finally flows out through the air outlet to ensure the air flow inside the case and improve the heat dissipation effect. The heat-absorbing water in the water tank is stirred, so that the heat-absorbing water in the water tank can quickly dissipate the heat, and with the multiple cooling fins on the outer side wall of the water tank, the heat-absorbing water in the water tank can be further dissipated, so that the computer chip water cooling device In the process of water cooling and heat dissipation, the water inside the water tank can also be cooled, so as to improve the cooling speed of the chip and ensure the heat dissipation efficiency.

The parts not involved in the device are the same as the existing technology or can be realized by using the existing technology. The utility model enables the computer chip water cooling device to cool the water inside the water tank during the water cooling and heat dissipation process, thereby increasing the cooling speed of the chip. , to ensure heat dissipation efficiency.

Description of drawings

Fig. 1 is the structural representation of a kind of computer chip water cooling device proposed by the utility model;

FIG. 2 is a schematic top view of the structure of the connection part between the cooling plate and the water cooling pipe of a computer chip water cooling device proposed by the present invention.

In the picture: 1 chassis, 2 brackets, 3 cooling plates, 4 chips, 5 water tanks, 6 water pumps, 7 water cooling pipes, 8 motors, 9 rotating rods, 10 fan blades, 11 cooling fins, 12 air outlets, 13 air inlets, 14 stirring rod, 15 stirring blade, 16 first bevel gear, 17 transmission rod, 18 second bevel gear, 19 sealing cover, 20 dust filter.

Detailed ways

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the implementations. example.

In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inside", The orientation or positional relationship indicated by "outside" is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation , are constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

1-2, a computer chip water cooling device includes a chassis 1, a heat dissipation plate 3 is fixedly connected in the chassis 1 through a bracket 2, a chip 4 is fixedly installed on the lower surface of the heat dissipation plate 3, and the chassis 1 is on the outer side wall near the top. A water tank 5 is fixedly connected, a water pump 6 is fixedly installed on the inner wall of the case 1, and the input end of the water pump 6 is fixedly connected with the water tank 5, and the output end of the water pump 6 is fixedly connected with a water-cooling pipe 7, and the water-cooling pipe 7 is arranged in a multi-section zigzag, The water-cooling pipe 7 is attached to the heat dissipation plate 3, and the end of the water-cooling pipe 7 away from the water pump 6 penetrates the side wall of the case 1 and is connected to the water tank 5. The upper surface of the case 1 is fixedly installed with a motor 8, and the output end of the motor 8 passes through. The coupling is fixedly connected with a rotating rod 9, the position of the rotating rod 9 close to the bottom end is fixedly sleeved with a fan blade 10, and a linkage mechanism is installed between the rotating rod 9 and the water tank 5, and there are many fixed connections on the outer side wall of the water tank 5. radiating fins 11, the top of the chassis 1 is provided with an air outlet 12, and the side wall of the chassis 1 near the bottom is provided with an air inlet 13;

The linkage mechanism includes a stirring rod 14 that is rotatably connected in the water tank 5 through a bearing. The outer rod wall of the stirring rod 14 is welded with a plurality of uniformly staggered stirring blades 15, and the rod wall of the rotating rod 9 and the stirring rod 14 are fixed sleeves. A first bevel gear 16 is connected, a transmission rod 17 is rotatably connected to the side wall of the water tank 5 and the case 1, and the transmission rod 17 and the water tank 5 are rotatably connected by a sealed bearing, and both ends of the transmission rod 17 are fixedly connected with a The second bevel gear 18 meshing with the first bevel gear 16, the chip 4 generates heat through the heat dissipation plate 3 for heat conduction and heat dissipation, start the water pump 6 and the motor 8, and the water pump 6 transports the water in the water tank 5 to the water cooling pipe 7 Inside, the heat on the heat dissipation plate 3 is easily absorbed through heat exchange, the water after heat absorption will return to the water tank 5, and the motor 8 drives the fan blade 10 on the rotating rod 9 to rotate, so that a negative pressure is formed inside and outside the case 1, The outside air enters the chassis 1 through the air inlet 13, and finally flows out through the air outlet 12 to ensure the air flow inside the chassis 1 and improve the heat dissipation effect. During the rotation of the rotating rod 9, the first bevel gear 16 drives the transmission connected with the second bevel gear 18. The rod 17 rotates, the transmission rod 17 drives the stirring rod 14 connected with the first bevel gear 16 to rotate through the second bevel gear 18, and the stirring blade 15 on the stirring rod 14 facilitates stirring the water in the water tank 5, so that the water in the water tank 5 is stirred. The heat-absorbing water quickly dissipates the heat, and cooperates with the plurality of heat dissipation fins 11 on the outer side wall of the water tank 5 to further dissipate the heat-absorbing water in the water tank 5, so that the computer chip water cooling device is in the process of water cooling and heat dissipation. The water in the water tank 5 can also be cooled, so as to improve the cooling speed of the chip 4 and ensure the heat dissipation efficiency.

The heat dissipation fins 11 are provided with a plurality of evenly distributed heat dissipation grooves, so as to increase the heat dissipation area and improve the heat dissipation efficiency.

A liquid inlet pipe is fixedly connected to the top of the water tank 5, and a matching sealing cover 19 is threadedly connected to the nozzle position of the top of the liquid inlet pipe.

Both the air outlet 12 and the air inlet 13 are equipped with a matching dustproof net 20 , which plays a role in preventing dust from entering the inside of the chassis 1 .

The heat dissipation plate 3, the water tank 5, the water cooling tube 7 and the heat dissipation fins 11 are all made of metal copper, which have good heat absorption and heat conduction performance to ensure the heat dissipation effect.

The stirring blade 15 is provided with a plurality of through holes, so as to reduce the stress on the stirring blade 15 during the stirring process.

In the present invention, when the chip 4 works, the heat generated by the chip 4 conducts heat conduction and heat dissipation through the heat dissipation plate 3, and the water pump 6 and the motor 8 are started. The heat absorbed by the radiator is absorbed, and the water after absorbing heat will return to the water tank 5. The motor 8 drives the fan blades 10 on the rotating rod 9 to rotate, so that a negative pressure is formed inside and outside the case 1, and the outside air enters the case 1 through the air inlet 13. Finally, it flows out through the air outlet 12 to ensure the air flow inside the case 1 and improve the heat dissipation effect. During the rotation of the rotating rod 9, the first bevel gear 16 drives the transmission rod 17 connected with the second bevel gear 18 to rotate, and the transmission rod 17 passes through the second bevel gear 18. The bevel gear 18 drives the stirring rod 14 connected with the first bevel gear 16 to rotate, and the stirring blade 15 on the stirring rod 14 facilitates stirring the water in the water tank 5, so that the water in the water tank 5 absorbs heat to quickly dissipate the heat. , cooperate with the plurality of heat dissipation fins 11 on the outer side wall of the water tank 5, so as to further heat the water after the heat absorption in the water tank 5, so that the water cooling device of the computer chip can also cool the water inside the water tank 5 in the process of water cooling and heat dissipation. , thereby improving the cooling speed of the chip 4 and ensuring the heat dissipation efficiency.

The above description is only a preferred embodiment of the present invention, but the protection scope of the present invention is not limited to this. Equivalent replacement or modification of the new technical solution and its utility model concept shall be included within the protection scope of the present utility model.

Claims (6)

1. A water cooling device for a computer chip, comprising a case (1), characterized in that, a heat dissipation plate (3) is fixedly connected in the case (1) through a bracket (2), and the lower surface of the heat dissipation plate (3) is A chip (4) is fixedly installed, a water tank (5) is fixedly connected to an outer side wall of the case (1) near the top, a water pump (6) is fixedly installed on the inner wall of the case (1), and the water pump (6) The input end of the water pump (6) is fixedly connected with the water tank (5), and the output end of the water pump (6) is fixedly connected with a water cooling pipe (7), and the water cooling pipe (7) is arranged in a multi-section zigzag, and the water cooling pipe (7) is connected to the cooling plate. (3) are in contact with each other, and the end of the water-cooling pipe (7) away from the water pump (6) penetrates through the side wall of the case (1) and communicates with the water tank (5), and a motor ( 8), and the output end of the motor (8) is fixedly connected with a rotating rod (9) through a coupling, and the rotating rod (9) is fixedly sleeved with a fan blade (10) at a position close to the bottom end, and the rotating rod ( 9) A linkage mechanism is installed between the water tank (5), a plurality of cooling fins (11) are fixedly connected to the outer side wall of the water tank (5), and an air outlet (12) is opened on the top of the case (1). ), an air inlet (13) is provided on the side wall of the chassis (1) close to the bottom; The linkage mechanism comprises a stirring rod (14) rotatably connected in the water tank (5) through a bearing, and a plurality of stirring blades (15) evenly distributed in a staggered manner are welded on the outer rod wall of the stirring rod (14). A first bevel gear (16) is fixedly sleeved on the rod walls of the rotating rod (9) and the stirring rod (14), and a transmission rod ( 17), and the transmission rod (17) and the water tank (5) are rotatably connected by a sealed bearing, and both ends of the transmission rod (17) are fixedly connected with a second bevel gear (16). gear (18). 2 . The water cooling device for computer chips according to claim 1 , wherein a plurality of uniformly distributed heat dissipation grooves are formed on the heat dissipation fins ( 11 ). 3 . 3. A computer chip water cooling device according to claim 1, characterized in that, a liquid inlet pipe is fixedly communicated with the top of the water tank (5), and the nozzle position at the top of the liquid inlet pipe is threadedly connected with a matching Seal cap (19). 4. A computer chip water cooling device according to claim 1, characterized in that, a matching dustproof net (20) is installed in the air outlet (12) and the air inlet (13). 5. A computer chip water cooling device according to claim 1, characterized in that, the heat dissipation plate (3), the water tank (5), the water cooling pipe (7) and the heat dissipation fin (11) are all made of metal copper . 6 . The water cooling device for computer chips according to claim 1 , wherein the stirring blade ( 15 ) is provided with a plurality of through holes. 7 .

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