CN215264308U

CN215264308U - Light-emitting element unit and direct type backlight structure

Info

Publication number: CN215264308U
Application number: CN202121000378.3U
Authority: CN
Inventors: 张小齐; 庄世强; 彭益; 李燕
Original assignee: Shenzhen Longli Technology Co Ltd
Current assignee: Shenzhen Longli Technology Co Ltd
Priority date: 2021-05-11
Filing date: 2021-05-11
Publication date: 2021-12-21
Anticipated expiration: 2031-05-11

Abstract

The utility model discloses a light-emitting element unit and a direct type backlight structure, wherein the light-emitting element unit comprises a connecting substrate and a chip arranged on the connecting substrate; the connection substrate comprises a circuit layer, a base layer and a connection layer, wherein the circuit layer is electrically connected with the connection layer through a wire penetrating through the base layer, a plurality of plug holes and a plurality of second wires are arranged on the circuit layer, and a chip is plugged in the plug holes to form a passage with the second wires. The chip is inserted in the circuit layer, and the basic layer is used as a frame for fixing the chip, so that the independent light-emitting element units are formed, and then a plurality of light-emitting element units can be welded on the circuit board, thereby improving the structural stability after the chip is connected and preventing the chip from being separated from the circuit board easily due to collision; by adopting the small-size light-emitting element units, the manufacturing difficulty of the large-size lamp panel is reduced, other light-emitting element units on the large-size lamp panel are prevented from being damaged in the repair process, the loss is avoided, and the production cost is reduced.

Description

Light-emitting element unit and direct type backlight structure

Technical Field

The utility model relates to a backlight unit field especially relates to a light emitting component unit and straight following formula backlight structure.

Background

BackLight module (BackLight) is a device for providing light source behind a Liquid Crystal Display (LCD), and its light emitting effect directly affects the visual effect of the liquid crystal display module (LCM). The liquid crystal itself does not emit light and it displays graphics or characters as a result of its modulation of the light produced by the backlight module.

The key point of the direct type backlight module is to control the uniformity of light emission and improve the luminous efficiency. In order to realize better subarea display effect in the direct type backlight module, a reflection dividing mechanism is adopted as a reflection mechanism of the direct type backlight module, so that the direct type backlight module is isolated into independent display subareas. The bowl comprises a plurality of reflection cups, is equipped with a hole or a plurality of holes in the reflection cup to hold one or a plurality of LED light sources, with the straight following formula lamp plate structure that is applicable to between different LED PITCH value size, like TV, on-vehicle, TV etc.. At present, the larger the chip, the better the light emitting effect, but the higher the cost. For controlling the cost of the chip, the size of the lamp wick of the LED is smaller and smaller, the thickness of the lamp wick is thinner and thinner, but the difficulty of welding the lamp wick with the smaller and smaller area on the circuit board is high, the structural stability after welding is poor, and the thickness of the lamp wick can cause the light-emitting surface to be blocked by the reflector to a certain extent, so that the optical effect is influenced.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the present invention provides a light emitting device unit and a direct-type backlight structure.

The utility model discloses a solve the technical scheme that its problem adopted and be:

a light-emitting element unit comprises a connecting substrate and a chip, wherein a lamp wick is arranged on the connecting substrate;

the connection substrate comprises a circuit layer, a base layer and a connection layer, wherein the circuit layer is electrically connected with the connection layer through a first wire penetrating through the base layer, the circuit layer is provided with a plurality of plug holes and a plurality of second wires, and the chip is plugged in the plug holes to form a passage with the second wires.

The chip is inserted in the circuit layer, and the basic layer is used as a frame for fixing the chip, so that the independent light-emitting element units are formed, and then a plurality of light-emitting element units can be welded on the circuit board, thereby improving the structural stability after the chip is connected and preventing the chip from being separated from the circuit board easily due to collision; by adopting the small-size light-emitting element units, the manufacturing difficulty of the large-size lamp panel is reduced, other light-emitting element units on the large-size lamp panel are prevented from being damaged in the repair process, the loss is avoided, and the production cost is reduced.

Further, the circuit layer is further provided with positive and negative contacts, and the positive and negative contacts are arranged on the second lead and connected with the first lead in the base layer.

Further, a solder foot in a point-to-point structure or a block structure is arranged on the connecting layer, and the solder foot is connected with the first conducting wire in the basic layer.

Further, the upper surface of the circuit layer is set as a reflecting surface.

Further, the chip packaging structure further comprises a protective layer, and the protective layer covers the chip.

Further, the protective layer is made of optical cement.

The utility model also provides a direct type backlight structure, which comprises a circuit board, a reflecting cover, a diffusion plate, an optical diaphragm and a light-emitting element unit according to any one of the technical schemes;

the circuit board, the reflecting cover, the diffusion plate and the optical film are sequentially arranged, and the light-emitting element unit is connected to the circuit board and is positioned in the light outlet hole in the reflecting cover.

The utility model provides a straight following formula structure in a poor light through making light emitting component the light emitting component unit, the welding of being convenient for improves light emitting component and connects back structural stability on the circuit board, can not break away from the circuit board because of the collision easily.

Further, the thickness of the connection substrate is greater than or equal to that of the reflection cover.

Further, the optical film comprises a diffusion film, a fluorescent film, a lower brightness enhancement film and an upper brightness enhancement film, wherein the diffusion film, the fluorescent film, the lower brightness enhancement film and the upper brightness enhancement film are sequentially connected, and the diffusion film is connected with the diffusion plate.

To sum up, the utility model discloses a light emitting component unit and straight following formula structure in a poor light have following technological effect:

the utility model provides a light-emitting component unit, through pegging graft the chip in the circuit layer to regard as the fixed frame of chip with the basic unit, form independent light-emitting component unit with this, can weld a plurality of light-emitting component units on the circuit board afterwards, improve the structural stability after the chip is connected, can not break away from the circuit board because of the collision easily; by adopting the small-size light-emitting element units, the manufacturing difficulty of the large-size lamp panel is reduced, other light-emitting element units on the large-size lamp panel are prevented from being damaged in the repair process, the loss is avoided, and the production cost is reduced.

The utility model provides a straight following formula structure in a poor light through making light emitting component the light emitting component unit, the welding of being convenient for improves light emitting component unit and connects back structural stability on the circuit board, can not break away from the circuit board because of the collision easily.

Other technical effects of the utility model point out in the specification in combination with specific structure.

Drawings

Fig. 1 is a schematic structural diagram of a light emitting device unit according to the present invention;

fig. 2 is a schematic structural cross-sectional view of a light emitting device unit according to the present invention;

fig. 3 is a top view of the light-emitting device of the present invention with one chip;

fig. 4 is a top view of the light-emitting device unit of the present invention with two chips;

fig. 5 is a top view of the light-emitting device unit with four chips;

fig. 6 is a top view of the light-emitting device unit with six chips according to the present invention;

fig. 7 is a schematic sectional view of a partial structure of a direct-type backlight structure according to the present invention;

fig. 8 is a top view of a partial structure of a direct-type backlight structure according to the present invention.

Description of reference numerals:

10. a light emitting element unit; 1. connecting the substrates; 11. a circuit layer; 111. inserting holes; 112. a second conductive line; 113. positive and negative electrode contact points; 12. a base layer; 121. a first conductive line; 13. a connecting layer; 2. a chip; 3. a protective layer; 4. a circuit board; 5. a reflector; 6. a diffusion plate; 7. an optical film.

Detailed Description

For better understanding and implementation, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

As shown in fig. 1 to 6, the present invention provides a light emitting element unit 10, which includes a connection substrate 1 and a chip 2 disposed on the connection substrate 1; the connection substrate 1 includes a circuit layer 11, a base layer 12 and a connection layer 13, the circuit layer 11 and the connection layer 13 are electrically connected by a first wire 121 penetrating through the base layer 12, the circuit layer 11 is provided with a plurality of insertion holes 111 and a plurality of second wires 112, and the chip 2 is inserted in the insertion holes 111 to form a passage with the second wires 112. The chip 2 is inserted into the circuit layer 11, and the base layer 12 is used as a frame for fixing the chip 2, so that the independent light-emitting element units 10 are formed, and then a plurality of light-emitting element units 10 can be welded on the circuit board 4, so that the structural stability of the connected chip 2 is improved, and the chip 2 cannot be easily separated from the circuit board 4 due to collision; the small-size light-emitting element units 10 are adopted, so that the manufacturing difficulty of the large-size lamp panel is reduced, other light-emitting element units 10 on the large-size lamp panel are prevented from being damaged in the repair process, the loss is avoided, and the production cost is reduced.

In this embodiment, the circuit layer 11 is further provided with positive and negative contacts 113, and the positive and negative contacts 13 are provided on the second conductive line 112 and connected to the first conductive line 121 in the base layer 12. The connecting layer 11 is provided with a solder fillet in a dot structure or a block structure, and the solder fillet is connected with the first wire 121 in the base layer 12. The welding leg with the dot structure can be directionally and accurately welded, but the welding requirement is high; the welding leg with the block structure has low welding requirement, but the welding position is not accurate enough. The number of the chips 2 is one, two, four or six, different numbers of chips 2 are arranged on the same unit, cost and application scene setting need to be combined, and when the liquid crystal display is used for a general liquid crystal display, the light emitting element unit 10 with a small number of chips is adopted, and light emitting display is basically met; when used in a high-demand liquid crystal display, a light-emitting element unit 10 having a large number of chips 2 is used, and excellent light-emitting display can be obtained. The upper surface of the circuit layer 11 is a reflecting surface, so that light emitted by the chip 2 can be reflected by the surface of the circuit layer 11, and the brightness is prevented from being reduced after the light is absorbed.

In this embodiment, the chip module further includes a protection layer 3, and the protection layer 3 covers the chip 2, so as to prevent the chip 2 inserted into the connection substrate 1 from being detached. The protective layer 3 is made of optical cement, and can increase the brightness of light emitted by the light-emitting element.

As shown in fig. 7, the direct type backlight structure including the light emitting device unit 10 further includes a circuit board 4, a reflective cover 5, a diffuser plate 6, and an optical film 7; the circuit board 4, the reflector 5, the diffuser 6 and the optical film 7 are sequentially arranged, and the light emitting element unit is connected to the circuit board 4 and positioned in the light outlet hole of the reflector 5. By manufacturing the light emitting element into the light emitting element unit 10, the light emitting element unit is convenient to be welded on a circuit board, the structural stability of the light emitting element after connection is improved, and the light emitting element unit cannot be easily separated from the circuit board due to collision.

As shown in fig. 8, in the present embodiment, a plurality of light emitting element units 10 are accommodated in the light exit hole. When there is a problem with the occurrence of individual light emitting elements in the backlight structure, only the light emitting element unit 10 needs to be replaced individually. The taken-off light-emitting element unit 10 can be repaired independently without affecting the assembly and manufacturing progress of products, and other light-emitting elements in the backlight structure are prevented from being damaged in the repairing process.

As shown in fig. 7, in the present embodiment, the thickness of the connection substrate 1 is greater than or equal to the thickness of the reflection cover 5, so that the light emitting surface of the light emitting element is not blocked by the reflection cover, and the light emitting area is enlarged.

In a further specific structure, the optical film 7 includes a diffusion film, a fluorescent film, a lower brightness enhancement film and an upper brightness enhancement film, the diffusion film, the fluorescent film, the lower brightness enhancement film and the upper brightness enhancement film are sequentially connected, and the diffusion film is connected with the diffusion plate 6.

The technical means disclosed by the scheme of the present invention is not limited to the technical means disclosed by the above embodiments, but also includes the technical scheme formed by the arbitrary combination of the above technical features. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, several improvements and modifications can be made, and these improvements and modifications are also considered as the protection scope of the present invention.

Claims

1. A light-emitting element unit comprising a connection substrate (1) and a chip (2) provided on the connection substrate (1), wherein:

the connection substrate (1) comprises a circuit layer (11), a base layer (12) and a connection layer (13), the circuit layer (11) and the connection layer (13) are electrically connected through a first lead (121) penetrating through the base layer (12), the circuit layer (11) is provided with a plurality of plug holes (111) and a plurality of second leads (112), and the chip (2) is plugged in the plug holes (111) to form a passage with the second leads (112).

2. The light-emitting element unit according to claim 1, wherein positive and negative electrode contacts (113) are further provided on the wiring layer (11), and the positive and negative electrode contacts (113) are provided on the second wire (112) and connected to the first wire (121) in the base layer (12).

3. The light-emitting element unit according to claim 2, wherein a fillet is provided on the connection layer (13) in a point-to-point structure or a block structure, and the fillet is connected to the first wire (121) in the base layer (12).

4. The light-emitting element unit according to claim 3, wherein an upper surface of the wiring layer (11) is provided as a reflective surface.

5. The light-emitting element unit according to any one of claims 1 to 4, further comprising a protective layer (3), the protective layer (3) covering the chip (2).

6. The light-emitting element unit according to claim 5, wherein the protective layer (3) is made of an optical glue.

7. A direct type backlight structure comprising a wiring board (4), a reflection cover (5), a diffusion plate (6), an optical film (7), characterized by further comprising a light emitting element unit according to any one of claims 1 to 6;

the circuit board (4), the reflecting cover (5), the diffusion plate (6) and the optical film (7) are sequentially arranged, and the light-emitting element unit is connected to the circuit board (4) and located in the light-emitting hole in the reflecting cover (5).

8. A direct type backlight structure according to claim 7, characterized in that the thickness of the connection substrate (1) is greater than or equal to the thickness of the reflection cover (5).

9. A direct type backlight structure according to claim 8, wherein the optical film (7) comprises a diffusion film, a fluorescent film, a lower brightness enhancement film and an upper brightness enhancement film, the diffusion film, the fluorescent film, the lower brightness enhancement film and the upper brightness enhancement film are sequentially connected in sequence, and the diffusion film is connected with the diffusion plate (6).