CN215262062U

CN215262062U - High temperature resistant optical sensor

Info

Publication number: CN215262062U
Application number: CN202121749382.XU
Authority: CN
Inventors: 顾汉玉; 徐刚; 黄旭超
Original assignee: Shenzhen Qunxin Microelectronics Co ltd
Current assignee: Shenzhen Qunxin Microelectronics Co ltd
Priority date: 2021-07-29
Filing date: 2021-07-29
Publication date: 2021-12-21
Anticipated expiration: 2031-07-29

Abstract

The utility model provides a high temperature resistance light sensor, include: the device comprises a mounting plate, a shell, a circuit board, a semiconductor refrigeration sheet, a radiating fin and a blowing mechanism, wherein supporting columns are symmetrically fixed on one side of the mounting plate, the shell is fixed on the tops of the four supporting columns, the circuit board is fixed in the shell, the semiconductor refrigerating sheets are embedded and fixed at the bottom of the shell, the refrigerating ends of the semiconductor refrigerating sheets are positioned on the inner wall of the shell, the heating end of the semiconductor refrigeration piece is positioned outside the shell, the middle part of the semiconductor refrigeration piece is provided with the first through hole, the semiconductor refrigeration piece of the utility model cools the inside of the shell, thereby greatly improving the heat dissipation efficiency, separating the inside and the outside of the shell, reducing the influence of the external temperature on the inside of the shell, improving the high temperature resistance strength, and the double-end motor can simultaneously carry out heat exchange on the cold end and the hot end of the semiconductor refrigeration sheet respectively, so that the production cost is greatly reduced, and the heat dissipation efficiency is improved.

Description

High temperature resistant optical sensor

Technical Field

The utility model relates to a light sensor technical field especially relates to a high temperature resistance light sensor.

Background

The optical sensor generally refers to a device which can sensitively sense light energy from ultraviolet light to infrared light and convert the light energy into an electrical signal, and when the optical sensor is used, the interference of a heat source is easy to occur, and in some high-temperature environments, the precision of the optical sensor can be greatly reduced.

Therefore, it is necessary to provide a high temperature resistant optical sensor to solve the above technical problems.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a high temperature resistant light sensor.

The utility model provides a pair of high temperature resistant light sensor, include: mounting panel, shell, circuit board, semiconductor refrigeration piece, fin and the mechanism of blowing, mounting panel one side symmetry is fixed with the support column, the shell is fixed four the support column top, the circuit board is fixed inside the shell, the semiconductor refrigeration piece is inlayed and is fixed in the shell bottom, the refrigeration end of semiconductor refrigeration piece is located the shell inner wall, and the end of just heating of semiconductor refrigeration piece is located the shell outside, first through-hole, two have been seted up at semiconductor refrigeration piece middle part the both sides at the semiconductor refrigeration piece are fixed to the fin symmetry, the mechanism of blowing is fixed at the shell inner wall.

Preferably, the middle part of the radiating fin is provided with a second through hole matched with the first through hole.

Preferably, the blowing mechanism includes: dead lever, drive shell and double-end motor, the dead lever passes through the screw fixation at the shell inner wall, the drive shell is fixed at the dead lever middle part, and the drive shell pegs graft with first through-hole and second through-hole, double-end motor fixes at drive shell inner wall, two outputs of double-end motor pass the drive shell and are fixed with the flabellum.

Preferably, a heat insulation block is fixed at one end of the driving shell close to the semiconductor refrigeration piece.

Preferably, the inner wall of the shell is provided with a heat insulation layer.

Preferably, a wire arranging cylinder is fixed on one side of the shell.

Preferably, the heat sink is made of a copper material.

Preferably, the inner wall of the shell is symmetrically fixed with fixing columns, the top of each fixing column is fixed with an internal thread cylinder, the four corners of the circuit board are symmetrically provided with mounting holes, the internal thread cylinders are connected with the mounting holes in an inserting mode, and the circuit board is fixedly connected with the internal thread cylinders through screws.

Compared with the prior art, the utility model provides a high temperature resistant light sensor has following beneficial effect:

the utility model provides a high temperature resistance light sensor:

1. when in use, the semiconductor refrigeration piece is used for refrigerating, so that the refrigerating end of the semiconductor refrigeration piece performs heat exchange on the radiating fins inside the shell, the hot end of the semiconductor refrigeration piece performs heat exchange through the radiating fins outside the shell, the two fan blades are driven to rotate through the rotation of the double-end motor, the fan blades inside the shell blow the air inside the shell, the cold quantity on the radiating fins inside the shell is exchanged with the air, thereby realizing the cooling inside the shell, the radiating fins outside the shell perform heat exchange with the outside air through the blowing of the other fan blade, the hot end of the semiconductor refrigeration piece is radiated, thereby improving the refrigeration efficiency, the device cools the inside of the shell through the semiconductor refrigeration piece, greatly improving the heat radiation efficiency, separating the inside and the outside of the shell, reducing the influence of the outside temperature on the inside of the shell, and improving the high temperature resistance, and the double-end motor can simultaneously carry out heat exchange on the cold end and the hot end of the semiconductor refrigeration sheet respectively, so that the production cost is greatly reduced, and the heat dissipation efficiency is improved.

Drawings

Fig. 1 is a schematic view of the overall structure provided by the present invention;

fig. 2 is a schematic diagram of a circuit board structure provided by the present invention;

fig. 3 is a schematic structural view of the blowing mechanism provided by the present invention;

fig. 4 is a schematic structural view of the semiconductor refrigeration sheet provided by the present invention;

FIG. 5 is a schematic view of a fan blade structure according to the present invention;

fig. 6 is a schematic view of the structure of the heat sink provided by the present invention;

fig. 7 is a schematic sectional view of the driving housing provided by the present invention.

Reference numbers in the figures: 1. mounting a plate; 2. a support pillar; 3. a housing; 4. a circuit board; 5. a semiconductor refrigeration sheet; 6. a first through hole; 7. a heat sink; 8. a blowing mechanism; 81. fixing the rod; 82. a drive case; 83. a double-headed motor; 84. a fan blade; 85. a heat insulation block; 9. a second through hole; 10. a wire arranging cylinder; 11. fixing a column; 12. an internally threaded barrel.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and embodiments.

In a specific implementation, as shown in fig. 1, fig. 2, fig. 4 and fig. 6, a high temperature resistant optical sensor includes: a mounting plate 1, a shell 3, a circuit board 4, a semiconductor refrigeration piece 5, a heat sink 7 and a blowing mechanism 8, supporting columns 2 are symmetrically fixed on one side of the mounting plate 1, the shell 3 is fixed on the tops of the four supporting columns 2, the circuit board 4 is fixed inside the shell 3, a winding displacement cylinder 10 is fixed on one side of the shell 3, the semiconductor refrigerating sheet 5 is embedded and fixed at the bottom of the shell 3, the refrigerating end of the semiconductor refrigerating sheet 5 is positioned on the inner wall of the shell 3, the heating end of the semiconductor refrigerating sheet 5 is positioned outside the shell 3, the middle part of the semiconductor refrigerating sheet 5 is provided with a first through hole 6, the two radiating fins 7 are symmetrically fixed at the two sides of the semiconductor refrigerating sheet 5, the heat radiating fin 7 is made of copper materials, the blowing mechanism 8 is fixed on the inner wall of the shell 3, and the middle part of the heat radiating fin 7 is provided with a second through hole 9 matched with the first through hole 6.

Referring to fig. 3, 5 and 7, the blowing mechanism 8 includes: dead lever 81, drive shell 82 and double-end motor 83, dead lever 81 passes through the screw fixation at shell 3 inner wall, drive shell 82 is fixed at dead lever 81 middle part, and drives shell 82 and peg graft with first through-hole 6 and second through-hole 9, double-end motor 83 fixes at drive shell 82 inner wall, two outputs of double-end motor 83 pass drive shell 82 and are fixed with flabellum 84, rotate through two flabellum 84 of double-end motor 83 drive, can dispel the heat to the cold and hot both sides of semiconductor refrigeration piece 5 simultaneously, improve refrigeration efficiency to reduce cost.

Referring to fig. 7, a heat insulation block 85 is fixed at one end of the driving shell 82 close to the semiconductor refrigerating sheet 5, wherein the driving shell 82 is made of an aluminum alloy material, so that heat dissipation of the double-head motor 83 is facilitated, and a heat insulation layer is arranged on the inner wall of the shell 3, so that heat exchange inside and outside the shell 3 is reduced.

Referring to fig. 3, fixing columns 11 are symmetrically fixed on the inner wall of the housing 3, an internal thread cylinder 12 is fixed on the top of each fixing column 11, mounting holes are symmetrically formed in four corners of the circuit board 4, the internal thread cylinder 12 is inserted into the mounting holes, the circuit board 4 is fixedly connected with the internal thread cylinder 12 through screws, and the mounting holes in the circuit board 4 are inserted into the internal thread cylinder 12, so that the circuit board 4 is conveniently positioned and mounted.

The working principle is as follows:

when in use, the semiconductor refrigerating sheet 5 is used for refrigerating, the refrigerating end of the semiconductor refrigerating sheet 5 exchanges heat with the radiating fins 7 inside the shell 3, the hot end of the semiconductor refrigerating sheet 5 exchanges heat with the radiating fins 7 outside the shell 3, the double-end motor 83 rotates to drive the two fan blades 84 to rotate, the fan blades 84 inside the shell 3 blow air inside the shell 3, the cold energy on the radiating fins 7 inside the shell 3 is exchanged with the air, so that the inside of the shell 3 is cooled, the radiating fins 7 outside the shell 3 exchange heat with the outside air through the air blown by the other fan blade 84, the hot end of the semiconductor refrigerating sheet 5 is radiated, the refrigerating efficiency is improved, the cold end and the hot end of the semiconductor refrigerating sheet 5 can be exchanged heat respectively through the double-end motor 83, and the production cost is greatly reduced, and the heat dissipation efficiency and the high-temperature resistance strength are improved.

The utility model discloses circuit and control that relate to are prior art, do not carry out too much repetition here.

The above only is the embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent processes of the present invention are used in the specification and the attached drawings, or directly or indirectly applied to other related technical fields, and the same principle is included in the protection scope of the present invention.

Claims

1. A high temperature resistant light sensor, comprising:

the mounting plate (1), the support columns (2) are symmetrically fixed on one side of the mounting plate (1);

the shell (3) is fixed at the tops of the four supporting columns (2);

the circuit board (4), the said circuit board (4) is fixed inside outer casing (3);

the semiconductor refrigeration piece (5) is embedded and fixed at the bottom of the shell (3), the refrigeration end of the semiconductor refrigeration piece (5) is positioned on the inner wall of the shell (3), the heating end of the semiconductor refrigeration piece (5) is positioned on the outer side of the shell (3), and the middle part of the semiconductor refrigeration piece (5) is provided with a first through hole (6);

the two radiating fins (7) are symmetrically fixed on two sides of the semiconductor refrigerating fin (5);

the blowing mechanism (8), the blowing mechanism (8) is fixed on the inner wall of the shell (3).

2. The high-temperature-resistant optical sensor according to claim 1, wherein the heat sink (7) has a second through hole (9) formed in the middle thereof for engaging with the first through hole (6).

3. The high-temperature-resistant optical sensor according to claim 1, wherein the blowing mechanism (8) comprises:

the fixing rod (81), the said fixing rod (81) is fixed on the inner wall of the outer casing (3) through the screw;

the driving shell (82) is fixed in the middle of the fixing rod (81), and the driving shell (82) is inserted into the first through hole (6) and the second through hole (9);

double-end motor (83), double-end motor (83) are fixed at drive shell (82) inner wall, two output of double-end motor (83) pass drive shell (82) and are fixed with flabellum (84).

4. The high-temperature-resistant optical sensor according to claim 3, wherein a heat insulation block (85) is fixed at one end of the driving shell (82) close to the semiconductor chilling plate (5).

5. The high-temperature-resistant optical sensor according to claim 1, wherein the inner wall of the housing (3) is provided with a heat insulating layer.

6. The high-temperature resistant optical sensor according to claim 1, wherein a wire arranging cylinder (10) is fixed on one side of the housing (3).

7. The high-temperature-resistant optical sensor according to claim 1, characterized in that the heat sink (7) is made of a copper material.

8. The high-temperature-resistant optical sensor according to claim 1, wherein fixing columns (11) are symmetrically fixed on the inner wall of the housing (3), internal thread cylinders (12) are fixed on the tops of the fixing columns (11), mounting holes are symmetrically formed in four corners of the circuit board (4), the internal thread cylinders (12) are inserted into the mounting holes, and the circuit board (4) is fixedly connected with the internal thread cylinders (12) through screws.