CN215250592U - Glue for bonding camera module - Google Patents
Glue for bonding camera module Download PDFInfo
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- CN215250592U CN215250592U CN202120178275.XU CN202120178275U CN215250592U CN 215250592 U CN215250592 U CN 215250592U CN 202120178275 U CN202120178275 U CN 202120178275U CN 215250592 U CN215250592 U CN 215250592U
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- glue
- camera module
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- rubber tube
- glue body
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Abstract
The utility model relates to an adhesive technical field specifically is a glue for camera module bonds, including rubber tube, pipe cap and glue body, the upper end of rubber tube is provided with the pipe cap, the inside of rubber tube is provided with the glue body, the principal ingredients of glue body is added 20 parts silica filler and 20 parts amine modifier allotment by 30 parts bisphenol A epoxy and 30 parts modified resin and is made. The utility model discloses optimized the curing time of camera module bonding glue, make it have the fast curing, bonding strength is high, can show assembly efficiency and the yields that promotes electronic product and camera module, still can be applicable to the cylinder point and glue or printing technology, and this camera module bonding glue has still increased the function of low temperature curing, to the not high temperature resistant characteristics of camera module, minimum heating 60 degrees centigrade just can solidify, make the camera module can not cause the damage because of the high temperature when the assembly, it is convenient to provide for the assembly of camera module.
Description
Technical Field
The utility model relates to an adhesive technical field specifically is a glue for camera module bonds.
Background
The adhesive can be used for connecting same or two or more than two same or heterogeneous products (or materials) together, and after being cured, the organic or inorganic, natural or synthetic substances with enough strength are generally called adhesive or bonding agent, adhesive, conventionally called glue for short, and are divided into natural high molecular compounds (starch, animal skin glue, bone glue, natural rubber, etc.), synthetic high molecular compounds (epoxy resin, phenolic resin, urea-formaldehyde resin, polyurethane, etc. thermosetting resin, polyvinyl acetal, perchloroethylene resin, etc. thermoplastic resin, chloroprene rubber, nitrile rubber, etc.), or inorganic compounds (silicate, phosphate, etc.), according to the use requirements, curing agent, accelerator, reinforcing agent, olefinic release agent, filler, etc. are often added into the adhesive, and according to the use requirements, the adhesive can be classified according to the use, warm glue, sealant, structural glue, etc. can also be separated, and according to the use process, room temperature curing glue, natural or synthetic high molecular compound, inorganic compound, etc. are classified according to the use process, room temperature curing glue, inorganic compound, etc. are added into inorganic compound, etc. are added into the inorganic compound, pressure sensitive adhesive, etc. the adhesive may be used in connecting different material and sheet material, and the stress distribution in the adhered part is homogeneous, and epoxy resin, chloroprene rubber, sealing glue, etc. are used in making and repairing container.
Present camera module equipment is joined in marriage and is mostly assembly line production, but present camera module bonding glue mostly does not have the efficiency of rapid solidification, thereby lead to the assembly efficiency and the yields of influence camera module, increase the degree of difficulty for the assembly production of camera module, influence production efficiency, it is very inconvenient, and present camera module is most not high temperature resistant, so have the too high camera module that can receive the damage of strict requirement curing temperature to the curing temperature of glue, bring unnecessary economic loss for the user, be unfavorable for the assembly of camera module to produce.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a glue for camera module bonds to the unable rapid solidification that proposes in solving above-mentioned background art and the too high problem of curing temperature.
In order to achieve the above object, the utility model provides a following technical scheme: the glue for bonding the camera module comprises a rubber tube, a tube cap and a glue body, wherein the tube cap is arranged at the upper end of the rubber tube, the glue body is arranged in the rubber tube, and the main component of the glue body is prepared by adding 20 parts of silicon dioxide filler and 20 parts of amine modifier into 30 parts of bisphenol A epoxy resin and 30 parts of modified resin.
Preferably, the bisphenol A epoxy resin has an average molecular weight of 3100-7000 and a relative density of 1.16.
Preferably, the modified resin is prepared from normal metabolites or secretions of plant tissues and volatile oil, and all properties of the modified resin are improved through filling, blending and enhanced processing modification.
Preferably, the silica filler may be prepared by hydrolysis of silicon tetrachloride, which is a colourless or pale yellow fuming liquid and has a relative density of 1.48.
Preferably, the viscosity of the glue body is 6-8 ten thousand cps, and the specific gravity of the glue body is 1.35.
Preferably, the surface resistance of the glue body is 2.8 multiplied by 1016Omega, and the dielectric strength of the glue body is 25 KV/mm.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses optimized the curing time of camera module bonding glue, make it have the fast curing, bonding strength is high, can show assembly efficiency and the yields that promotes electronic product and camera module, still can be applicable to cylinder point and glue or printing process, use with camera module assembly production line cooperation, and this camera module bonding glue has still increased the function of low temperature solidification, can the fast curing under the heating of 80 degrees centigrade to 90 degrees centigrade, to the characteristics that camera module can not resist high temperature, minimum heating 60 degrees centigrade just can solidify, make camera module can not cause the damage because of the high temperature when assembling, it is convenient to provide for the assembly of camera module;
1. by arranging the bisphenol A epoxy resin and the silicon dioxide filler, the glue body can be quickly cured, and has good bonding strength and low shrinkage rate, so that the time cost can be saved during the assembly of the camera module, the production line of the camera module can operate efficiently, and convenience is provided for subsequent production plans;
2. through setting up modified resin and amine modification thing to can make the glue body have the function of low temperature curing, and still have excellent high low temperature impact resistance, hot strength, thermal ageing resistance, make camera module can not cause the damage because of the high temperature of glue curing when assembling, increase the yields of camera assembly, reduce unnecessary economic loss for the user.
Drawings
FIG. 1 is a schematic front view of the structure of the present invention;
fig. 2 is a schematic bottom sectional view of the structure of the present invention.
In the figure: 1. a hose; 2. a pipe cap; 3. glue body.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides an embodiment:
a glue for camera module bonding comprises a rubber tube 1, a tube cap 2 and a glue body 3, wherein the tube cap 2 is arranged at the upper end of the rubber tube 1, the glue body 3 is arranged inside the rubber tube 1, and the main components of the glue body 3 are prepared by adding 20 parts of silica filler and 20 parts of amine modifier into 30 parts of bisphenol A epoxy resin and 30 parts of modified resin;
further, the average molecular weight of the bisphenol A epoxy resin is 3100-7000, and the relative density of the bisphenol A epoxy resin is 1.16;
furthermore, the modified resin is prepared from normal metabolites or secretions of plant tissues and volatile oil, and all properties of the modified resin are improved through filling, blending and enhanced processing modification;
further, the silicon dioxide filler can be prepared by hydrolyzing silicon tetrachloride, the silicon tetrachloride is colorless or faint yellow fuming liquid, and the relative density of the silicon tetrachloride is 1.48;
furthermore, the viscosity of the glue body 3 is 6-8 cps, the specific gravity of the glue body 3 is 1.35, and the viscosity of the glue body 3 is 6-8 cps, so that the camera module bonding glue has good bonding strength, and convenience is provided for assembling the camera module;
further, the surface resistance of the glue body 3 is 2.8 multiplied by 1016Omega, and the dielectric strength of the glue body 3 is 25 KV/mm.
The working principle is as follows: when a user uses the camera module to bond glue, according to the graph shown in the graph 1 and the graph 2, the storage condition of the glue is-20 ℃, the room temperature needs 4-6 hours to return to the room temperature, the rubber cap 2 is not opened before the room temperature is recovered, the glue quality is prevented from being influenced by the condensation of water in the air, the use environment condition is that the temperature is 25 ℃, the relative humidity is less than 60 percent, the use time is 14 days, the number of times of returning to the temperature is less than 3 times, the product is not used up and needs to be sealed, the rubber cap 2 is opened, the glue body is extruded to the surface of the camera module after the rubber cap 2 is opened, then the other camera module is tightly attached to the camera module coated with the glue body 3, the bonding position of the other camera module is heated to more than 60 ℃ by using equipment, the temperature is heated to 80 ℃ to realize the curing within 5 minutes, the temperature is heated to 90 ℃ to realize the curing within 4 minutes, and then the camera module can be bonded, it is worth to be noted that the camera module bonding glue can also be used in cooperation with a syringe dispensing and printing process in the prior art.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. The utility model provides a glue for camera module bonds, includes rubber tube (1), pipe cap (2) and glue body (3), its characterized in that: the rubber tube is characterized in that a tube cap (2) is arranged at the upper end of the rubber tube (1), a glue body (3) is arranged inside the rubber tube (1), and the main component of the glue body (3) is prepared by adding 20 parts of silicon dioxide filler and 20 parts of amine modifier into 30 parts of bisphenol A epoxy resin and 30 parts of modified resin.
2. The glue for camera module bonding according to claim 1, characterized in that: the average molecular weight of the bisphenol A epoxy resin is 3100-7000, and the relative density of the bisphenol A epoxy resin is 1.16.
3. The glue for camera module bonding according to claim 1, characterized in that: the modified resin is prepared from normal metabolites or secretions of plant tissues and volatile oil, and all properties of the modified resin are improved through filling, blending and enhanced processing modification.
4. The glue for camera module bonding according to claim 1, characterized in that: the silica filler may be prepared by hydrolysis of silicon tetrachloride, which is a colourless or pale yellow fuming liquid and has a relative density of 1.48.
5. The glue for camera module bonding according to claim 1, characterized in that: the viscosity of the glue body (3) is 6-8 cps, and the specific gravity of the glue body (3) is 1.35.
6. The glue for camera module bonding according to claim 1, characterized in that: the surface resistance of the glue body (3) is 2.8 multiplied by 1016Omega and glue body(3) The dielectric strength of (2) is 25 KV/mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120178275.XU CN215250592U (en) | 2021-01-22 | 2021-01-22 | Glue for bonding camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120178275.XU CN215250592U (en) | 2021-01-22 | 2021-01-22 | Glue for bonding camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215250592U true CN215250592U (en) | 2021-12-21 |
Family
ID=79499312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120178275.XU Active CN215250592U (en) | 2021-01-22 | 2021-01-22 | Glue for bonding camera module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215250592U (en) |
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2021
- 2021-01-22 CN CN202120178275.XU patent/CN215250592U/en active Active
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