CN214693972U - Novel high temperature resistant adhesive tape structure - Google Patents

Novel high temperature resistant adhesive tape structure Download PDF

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Publication number
CN214693972U
CN214693972U CN202022803229.2U CN202022803229U CN214693972U CN 214693972 U CN214693972 U CN 214693972U CN 202022803229 U CN202022803229 U CN 202022803229U CN 214693972 U CN214693972 U CN 214693972U
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China
Prior art keywords
layer
high temperature
temperature resistant
adhesive tape
pressure sensitive
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CN202022803229.2U
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Chinese (zh)
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高威
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Shenzhen Weiwei Adhesive Products Co ltd
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Shenzhen Weiwei Adhesive Products Co ltd
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Abstract

The utility model discloses a novel high temperature resistant adhesive tape structure, which comprises a pressure sensitive adhesive layer body, a tensile layer at the upper end of the pressure sensitive adhesive layer body, wherein a high temperature resistant layer is arranged on the surface of the tensile layer, which is far away from the pressure sensitive adhesive layer body, the tensile layer comprises an adhesive solidified body layer and a plurality of fiber layers, and the fiber layers are arranged in the adhesive solidified body layer, the fiber layers are arranged in a net shape, and the high temperature resistant layer comprises a solid composition layer, a silicide fiber layer and a liquid adhesive layer. Meanwhile, the surface is not stained with water and oil, the solution is not easy to be stained during production operation, and if a small amount of dirt is adhered, the cleaning can be realized by simply wiping.

Description

Novel high temperature resistant adhesive tape structure
Technical Field
The utility model relates to an sticky tape technical field especially relates to a novel high temperature resistant sticky tape structure.
Background
The adhesive tape is composed of a substrate and an adhesive, two or more unconnected objects are connected together by adhesion, a layer of adhesive is coated on the surface of the adhesive, the earliest adhesive is from animals and plants, in the nineteenth century, rubber is the main component of the adhesive, and various polymers are widely applied in modern times.
The existing adhesive tape is widely applied and has a complex use environment, so that the old adhesive tape cannot be normally used at high temperature and low temperature due to simple structural components, and particularly, the old adhesive tape is easy to melt under the high-temperature environment, so that the old adhesive tape needs to be better used by a novel high-temperature-resistant adhesive tape to achieve the required application.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving following shortcoming among the prior art, old formula sticky tape is because structural component is comparatively simple to reach the use that can normally under high temperature low temperature, under high temperature environment very much, old formula sticky tape does not melt easily, and the novel high temperature resistant sticky tape structure who proposes.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a novel high temperature resistant adhesive tape structure, includes pressure sensitive adhesive layer body 1, its characterized in that, 1 upper end tensile layer 2 of pressure sensitive adhesive layer body, tensile layer 2 deviates from 1 one side of pressure sensitive adhesive layer body and is equipped with high temperature resistant layer 3.
Preferably, the tensile layer comprises an adhesive cured body layer and a plurality of fibers, the plurality of fiber layers are arranged in the adhesive cured body layer, and the fiber layers are arranged in the solid composition layer in a net shape.
Preferably, the high temperature resistant layer comprises a solid composition layer, silicide fiber layers and a liquid binder layer, and the silicide fiber layers are arranged in a staggered mode to form a square net structure.
Preferably, the solid composition layer comprises an inorganic light fiber layer and an organic light fiber layer.
Preferably, Teflon is arranged on the surface, away from the heat insulation layer, of the high-temperature resistant layer.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the Teflon is arranged on the outermost surface, so that the adhesive tape bodies can be wound with each other, when the pressure-sensitive adhesive layer body is attached to the high-temperature-resistant layer, the Teflon has the advantages of high temperature resistance, corrosion resistance, non-stick property and self-lubrication, so that the viscosity of the pressure-sensitive adhesive layer body can be effectively preserved, the surface is not stained with water and oil, the Teflon is not easy to be stained with a solution during production operation, and if a small amount of dirt is stained, the Teflon can be removed by simply wiping;
2. meanwhile, the adhered material is usually heated to form a thermal expansion and cold contraction effect, so that the adhered material is enlarged, the adhesive tape is enlarged, the original adhesion is easily pulled out and scattered, and simultaneously, the two adhered materials are easily staggered due to array capacity, so that the internal fibers are arranged in the adhesive solidified layer and are arranged in a net shape, the effective tensile strength of the tensile layer is achieved, the two adhered materials are tightly attached, and the two adhered materials can be effectively adhered;
3. through placing in proper order of pressure sensitive adhesive layer body, tensile layer, high temperature resistant layer for can be through having stronger adhesion on the pressure sensitive adhesive layer body 1 of bottommost layer, can reach better connection and be glued the thing.
Drawings
Fig. 1 is a schematic view of an exploded structure of a novel high temperature resistant adhesive tape structure provided by the present invention;
fig. 2 is a schematic front structural view of the novel high temperature resistant adhesive tape structure provided by the utility model.
In the figure: the pressure sensitive adhesive comprises a pressure sensitive adhesive layer body 1, a tensile layer 2, a high temperature resistant layer 3, a cured adhesive layer 21, a fiber 22, Teflon 31, a silicide fiber layer 32, a solid composition layer 33 and a liquid adhesive layer 34.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
In the present invention, the terms "upper", "lower", "left", "right", "middle" and "one" are used for clarity of description, but not for limiting the range of the present invention, and the relative relationship changes or adjustments without substantial technical changes should be regarded as the scope of the present invention.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Referring to fig. 1-2, a novel high temperature resistant adhesive tape structure, including pressure sensitive adhesive layer body 1, the pressure sensitive adhesive layer body 1 is attached with stronger adhesiveness, can reach better connection and be bound the thing, pressure sensitive adhesive layer body 1 upper end tensile layer 2, because it can form the expend with heat and contract with cold effect to be bound the thing to be heated usually, thereby lead to being bound the thing grow, consequently, the adhesive tape can be drawn big thereupon, easily lead to originally gluing out and draw apart, simultaneously because it also easily leads to two adherends dislocation to receive the array capacity, thereby it can effectively bond two adherends to add the tensile, adhesive solidified layer 21 and a plurality of fibre constitute 22, a plurality of fibre 22 set up in adhesive solidified layer 21, fibre 22 is netted setting, because fibre 22 is netted setting, can reach resistance to compression, tensile layer 2 deviates from pressure sensitive adhesive layer body 1 one side and is equipped with high temperature resistant layer 3, because the high temperature can make the ordinary adhesive tape contract, so need to add inorganic light fibrous layer, organic light fibrous layer and silicide fibrous layer 32 and liquid binder layer 34 to reach and can resist high temperature, through the inorganic fiber, especially the inorganic fiber used for making composite material, their most important performance is superstrong, intensity and lower density, so reach heat resistance, acid and alkali resistance, ageing resistance, antibacterial characteristic, liquid binder layer 34 besides sizing material, also include auxiliary ingredients such as solvent, curing agent, flexibilizer, anticorrosive, colorant, antifoamer, can reach better protection to the body of the adhesive tape, isolate the influence of various external environments, reach better serviceability, therefore protect the internal structure of the adhesive tape, reach better result of use, 32 kinds of fibrous layer of silicide utilize the excellent high temperature resistant characteristic of the fibrous layer of silicide, make high temperature resistant layer 3 have good high temperature resistance ability, high temperature resistant layer 3 keeps away from the insulating layer one side and is equipped with teflon 31, because the surface is with teflon 31, because teflon 31 has heat resistance, slidability and resistance to wears etc. consequently places the nexine in the surface can be protected in the surface, because the slidability can reach the level and smooth of sticky tape winding, repeated winding can reach protection pressure sensitive adhesive layer body 1.
In the utility model, through the sequential placement of the pressure-sensitive adhesive layer body 1, the tensile layer 2 and the high temperature resistant layer 3, the better connection of the adhered object can be achieved through the strong adhesiveness on the pressure-sensitive adhesive layer body 1, and the adhered object is generally heated to form the effect of thermal expansion and cold contraction, thereby leading to the enlargement of the adhered object, so that the adhesive tape can be enlarged, the original adhesion is easily led out and is pulled away, meanwhile, because the array capacity also easily leads to the dislocation of two adhered objects, thereby leading the internal fiber 22 to be arranged in the adhesive solidified body layer 21, and the fiber 22 is in the net shape, thereby achieving the effective tensile strength of the tensile layer 2, achieving the clinging of the two adhered objects, thereby effectively bonding the two adhered objects, because the high temperature resistant layer 3 is arranged at the upper end, the high temperature resistant effect of the outside can be achieved, the heat insulation of the inside of the adhesive tape can be achieved, and simultaneously, because the Teflon 31 is arranged on the surface, consequently, can reach sticky tape body intertwine, when laminating on resistant high temperature layer 3 through pressure sensitive adhesive layer body 1, because teflon 31 has high temperature resistant, corrosion-resistant, on-stick, self-lubricating, consequently can guarantee that the viscidity of pressure sensitive adhesive layer body 1 reaches effectual saving.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims (5)

1. The utility model provides a novel high temperature resistant adhesive tape structure, includes pressure sensitive adhesive layer body (1), its characterized in that, tensile layer (2) in pressure sensitive adhesive layer body (1), tensile layer (2) deviate from pressure sensitive adhesive layer body (1) one side and are equipped with high temperature resistant layer (3).
2. The novel high-temperature-resistant adhesive tape structure is characterized in that the tensile layer (2) comprises an adhesive curing layer (21) and a plurality of fiber layers (22), the fiber layers (22) are arranged in the adhesive curing layer (21), and the fiber layers (22) are arranged in a net shape.
3. The novel high temperature resistant adhesive tape structure according to claim 1, wherein the high temperature resistant layer (3) comprises a solid composition layer (33), a silicide fiber layer (32) and a liquid adhesive layer (34), and the silicide fiber layer (32) is arranged in the solid composition layer (33) in a staggered manner to form a square net structure.
4. The novel high temperature resistant adhesive tape structure of claim 3, wherein said solid composition layer (33) comprises inorganic light fiber layer and organic light fiber layer.
5. The novel high temperature resistant adhesive tape structure according to claim 1, wherein a Teflon (31) is arranged on one side of the high temperature resistant layer (3) far away from the heat insulation layer.
CN202022803229.2U 2020-11-28 2020-11-28 Novel high temperature resistant adhesive tape structure Active CN214693972U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022803229.2U CN214693972U (en) 2020-11-28 2020-11-28 Novel high temperature resistant adhesive tape structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022803229.2U CN214693972U (en) 2020-11-28 2020-11-28 Novel high temperature resistant adhesive tape structure

Publications (1)

Publication Number Publication Date
CN214693972U true CN214693972U (en) 2021-11-12

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CN202022803229.2U Active CN214693972U (en) 2020-11-28 2020-11-28 Novel high temperature resistant adhesive tape structure

Country Status (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115975531A (en) * 2023-01-04 2023-04-18 极天羽技术股份有限公司 High-viscosity double-sided adhesive tape

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115975531A (en) * 2023-01-04 2023-04-18 极天羽技术股份有限公司 High-viscosity double-sided adhesive tape
CN115975531B (en) * 2023-01-04 2023-08-08 极天羽技术股份有限公司 High-viscosity double-sided adhesive tape

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