CN215250447U - TFT glass device easy for single-layer cutting - Google Patents

Abstract

The utility model discloses a TFT glass device of easy individual layer cutting, including upper glass substrate, working line layer and the lower floor's glass substrate that from the top down set gradually, the working line layer sets up the upper surface of lower floor's glass substrate, upper glass substrate corresponds the superpose with lower floor's glass substrate, upper glass substrate is close to the face on working line layer coats and is stamped the reflection stratum. The utility model discloses a TFT glass device of easy individual layer cutting has avoided the circuit on the working line layer in the cutting laser damage glass substrate.

Description

TFT glass device easy for single-layer cutting

Technical Field

The utility model relates to a glass-cutting technical field, in particular to TFT glass device of easy individual layer cutting.

Background

In view of the process requirements and production efficiency, small-sized glass-based products are usually processed in full-page fashion by first fabricating circuits using larger glass substrates, attaching layers, and finally slitting into finished product sizes. However, this method is likely to cause a problem when the surface glass of the multi-layered glass of the TFT substrate is cut to expose the bonding area.

Common glass cutting methods include mechanical cutting, laser cutting, and the like. Mechanical cutting is performed by scoring a crack in the surface of the glass with a cutter wheel or the like, and the processing is generally adopted for glass with conventional thickness. However, when the glass is applied to ultra-thin glass, because the glass has low strength, the glass is very easy to break in the cutting and splitting processes, and the treatment of the slag generated in the cutting process needs an additional process. Laser cutting is carried out by focusing high-energy laser with specific wavelength to vaporize and ablate materials to form small holes, so that a stress concentration area is formed for subsequent chipping, the non-contact cutting is realized, the chipping rate is low, the edge effect is good, residues such as slag are less, high-energy laser is easy to damage a lower layer of a cutting line and nearby lines, and the laser cutting is only applied to cutting of a non-line area generally.

In PCB production, a scheme of using ink to absorb light energy to protect a substrate to adapt to laser cutting exists, but due to the problems of absorption peaks and laser intensity, the absorption capacity of the ink to laser applied to glass cutting cannot well protect internal circuits.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides a TFT glass device of easy individual layer cutting has avoided cutting laser to damage the circuit on the working line layer in the glass substrate.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a TFT glass device of easy individual layer cutting, includes upper glass substrate, working line layer and the lower floor's glass substrate that from the top down set gradually, the working line layer sets up the upper surface of lower floor's glass substrate, upper glass substrate corresponds the superpose with lower floor's glass substrate, upper glass substrate is close to the face on working line layer coats and is stamped the reflection stratum.

Optionally, a cutting line is disposed on the upper glass substrate, and a position of the upper glass substrate corresponding to the cutting line covers the reflective layer.

Optionally, the surface of the upper glass substrate for covering the reflective layer is an etched surface.

Optionally, the etched surface is plasma etched or laser etched.

Optionally, the etched surface has an etch depth of less than 80 microns.

Optionally, the reflective layer (4) is a metal layer.

Optionally, the thickness of the metal layer is 200nm-800 nm.

Optionally, the metal layer is made of copper, molybdenum or aluminum, or an alloy of the above elements.

Optionally, the metal layer is a metal plating layer formed by PVD.

Optionally, the metal layer is a metal plated layer formed in an electroplating manner.

According to the above technical scheme, the utility model provides a TFT glass device of easy individual layer cutting coats through the face that is close to the working line layer at upper glass substrate and is stamped the reflection stratum to reflect the cutting laser that passes upper glass substrate, thereby avoid cutting the circuit on the working line layer in the laser damage glass substrate, thereby make the laser cutting can directly be applied to the top layer cutting of TFT glass device's bonding district position, do not harm inside effective area simultaneously.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic top view structure diagram of a TFT glass device easy for single-layer cutting provided by an embodiment of the present invention before cutting;

fig. 2 is a schematic side view of a TFT glass device easy for single-layer cutting according to an embodiment of the present invention before cutting;

fig. 3 is a schematic top view of a TFT glass device easy for single-layer cutting according to an embodiment of the present invention;

fig. 4 is a schematic side view of the TFT glass device easy for single-layer cutting provided by the embodiment of the present invention after cutting.

Wherein:

1. upper glass substrate, 2, bonding region, 3, cutting line, 4, reflection stratum, 5, working line layer, 6, lower floor's glass substrate.

Detailed Description

The utility model discloses a TFT glass device of easy individual layer cutting has avoided cutting the circuit on the working line layer in the laser damage glass substrate.

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 to 4, the TFT glass device easy for single-layer cutting of the present invention includes an upper glass substrate 1, a working circuit layer 5 and a lower glass substrate 6 sequentially arranged from top to bottom. The working wiring layer 5 is provided on the upper surface of the lower glass substrate 6. The upper glass substrate 1 and the lower glass substrate 6 are correspondingly superposed and have corresponding sizes and shapes. The surface of the upper glass substrate 1 close to the working circuit layer 5 is covered with a reflecting layer 4.

The lower glass substrate 6 is a glass substrate. The circuit pattern of the working circuit layer 5 is manufactured by photoetching after plating a metal film on the upper surface of the lower glass substrate 6, or filling conductive paste for curing and stripping after photoetching to form the circuit pattern, or performing laser etching to form the pattern after plating a metal layer. The plating mode can be selected from electroplating, PVD, CVD and the like, and the plating metal can be copper or silver and the like, and is selected according to actual needs. The reflective layer 4 reflects the laser light passing through the upper glass substrate 1, thereby preventing the cutting laser light from damaging the wiring on the working wiring layer 5 within the glass substrate.

The utility model discloses a TFT glass device of easy individual layer cutting coats through the face that is close to working line layer 5 at upper glass substrate 1 and is stamped reflection stratum 4 to reflect the cutting laser that passes upper glass substrate 1, thereby avoid cutting the circuit on the working line layer 5 in the laser damage glass substrate, thereby make the top layer cutting that laser cutting can directly be applied to TFT glass device's bonding area 2 positions, do not harm inside effective area simultaneously.

Specifically, the upper glass substrate 1 is provided with a cutting line 3, and during laser cutting, cutting laser cuts along the cutting line 3. Correspondingly, the reflecting layer 4 is arranged at the position of the upper glass substrate 1 corresponding to the cutting line 3, and extends to the two sides of the cutting line 3 by a proper width to ensure the protection of the internal circuit.

In order to reduce the intensity of the reflected light, the surface of the upper glass substrate 1 covering the reflective layer 4 is an etched surface. By setting the surface covering the reflecting layer 4 to be the etching surface, the slight etching surface can destroy the flatness of the surface, the adhesion of the reflecting layer 4 is enhanced while the reflection is reduced, the mirror reflection at the position of the reflecting layer 4 is changed into diffuse reflection, the reflection intensity of laser is reduced, the damage of the processing equipment or device by the reflected laser is avoided, and the processing equipment and the device are protected.

Wherein the etched surface is processed by non-contact etching, such as plasma etching or laser etching. The etched surface has an etch depth of less than 80 microns.

In one embodiment, the reflective layer 4 is a metal layer. The thickness of the metal layer is 200nm-800 nm. The metal layer is made of copper, molybdenum or aluminum or an alloy of the above elements. The metal layer is a metal coating layer, and the metal coating layer is formed in a PVD mode or an electroplating mode.

PVD, i.e., physical vapor deposition, refers to the process of transferring atoms or molecules from a source onto the surface of a substrate by physical processes to effect mass transfer. It can make some particles with special properties (high strength, wear resistance, heat radiation, corrosion resistance, etc.) spray-coated on the parent body with lower property, so that the parent body has better property. The PVD basic method comprises vacuum evaporation, sputtering, and ion plating (hollow cathode ion plating, hot cathode ion plating, arc ion plating, active reactive ion plating, radio frequency ion plating or direct current discharge ion plating).

During electroplating, plating metal or other insoluble materials are used as an anode, a workpiece to be plated is used as a cathode, and cations of the plating metal are reduced on the surface of the workpiece to be plated to form a plating layer. In order to eliminate the interference of other cations and make the coating uniform and firm, a solution containing the metal cations of the coating is used as an electroplating solution to keep the concentration of the metal cations of the coating constant.

The specific processing process comprises the following steps: 1) cutting the raw material glass, cutting the raw material glass into an upper glass substrate 1 and a lower glass substrate 6 with proper sizes, and manufacturing a circuit pattern on the glass surface of the lower glass substrate 6. The cutting can be laser cutting or jet cutting, and the mechanical cutting is easy to generate fragments and slag due to edge stress to influence the yield. The circuit pattern can be manufactured by photoetching after plating a metal film on the lower glass substrate 6, or filling conductive paste to solidify and remove a film after photoetching to form a circuit pattern, or performing laser etching to form a pattern after plating a metal layer to form the working circuit layer 5. The plating metal can be copper, silver, etc., and is selected according to actual needs. 2) After the circuit pattern is manufactured, the circuit pattern is ready to be manufacturedThe lower surface of the cutting layer is covered with a reflecting layer 4. The reflective layer 4 should cover the upper glass substrate 1 at the cutting lines 3 and extend to both sides by a suitable width. The thickness of the reflecting layer 4 is several hundreds nanometers. 3) And after the layers are attached to form the whole part of the piece to be cut, cutting the whole plate into small grains. The cutting mode is preferably laser cutting or jet cutting to reduce the risk of chipping and pollution. The cutting laser energy and the cutting depth need to be adjusted relative to the cutting period. 4) And cutting the small granules by laser along the cutting line 3 on the upper glass substrate 1 to expose the circuit at the bonding area 2. Using CO₂The laser splits along the cutting line, reduces the broken risk of mechanical splitting.

In the processing method, the cutting laser energy is selected according to the material and the thickness of the glass, so that the lower layer circuit is not influenced while the cutting depth is enough. The cutting machine preferably has a device designed for surface reflection countermeasures to prevent damage to the cutting machine by the reflected laser light to the maximum.

The utility model discloses a TFT glass device of easy individual layer cutting at 3 peripheral cover metal reflection stratum 4 of top layer line of cut, utilizes 4 reflections of reflection stratum to avoid cutting laser damage inner line. The surface covered by the reflecting layer 4 of the upper glass substrate 1 is etched, so that the specular reflection of the reflecting layer 4 made of a metal material is converted into diffuse reflection, the reflection intensity is reduced, and cutting devices and equipment are protected.

In the description of the present solution, it is to be understood that the terms "upper", "lower", "vertical", "inside", "outside", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present solution.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. The utility model provides a TFT glass device of easy individual layer cutting, includes upper glass substrate (1), working line layer (5) and lower floor's glass substrate (6) that from the top down set gradually, working line layer (5) set up the upper surface of lower floor's glass substrate (6), its characterized in that, upper glass substrate (1) corresponds the superpose with lower floor's glass substrate (6), upper glass substrate (1) is close to the face of working line layer (5) coats and is stamped reflection stratum (4).

2. TFT glass device easy for single-layer cutting according to claim 1, characterized in that the upper glass substrate (1) is provided with a cutting line (3), and the position of the upper glass substrate (1) corresponding to the cutting line (3) covers the reflecting layer (4).

3. TFT glass device susceptible to single-layer cutting according to claim 1, characterized in that the surface of the upper glass substrate (1) covering the reflective layer (4) is an etched surface.

4. The TFT glass device easy for single layer cutting of claim 3, wherein the etched surface is plasma etched or laser etched.

5. A TFT glass device for facilitating single layer cutting according to claim 3, wherein the etched surface has an etch depth of less than 80 microns.

6. TFT glass device susceptible to single-layer cutting according to claim 1, characterized in that the reflective layer (4) is a metal layer.

7. The TFT glass device easy for single layer cutting of claim 6, wherein the metal layer has a thickness of 200nm-800 nm.

8. The TFT glass device easy for single-layer cutting according to claim 6, wherein the metal layer is made of copper, molybdenum or aluminum, or an alloy of the above elements.

9. The TFT glass device easy for single layer cutting of claim 6, wherein the metal layer is a metal coating formed by PVD.

10. The TFT glass device easy for single layer cutting of claim 6, wherein the metal layer is a plated metal layer.

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