CN215240084U - Burnishing device is used in electronic ceramic processing - Google Patents

Burnishing device is used in electronic ceramic processing Download PDF

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Publication number
CN215240084U
CN215240084U CN202121153426.2U CN202121153426U CN215240084U CN 215240084 U CN215240084 U CN 215240084U CN 202121153426 U CN202121153426 U CN 202121153426U CN 215240084 U CN215240084 U CN 215240084U
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China
Prior art keywords
polishing
electronic ceramic
air inlet
cylinder
chip collecting
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CN202121153426.2U
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Chinese (zh)
Inventor
张晓云
方豪杰
贺亦文
李明晓
方美玲
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Hunan Chengxiang New Material Technology Co ltd
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Hunan Chengxiang New Material Technology Co ltd
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Abstract

The utility model discloses a burnishing device is used in electronic ceramic processing, including the burnishing machine organism, polishing mechanism, polishing solution case and polishing solution shower nozzle, electronic ceramic processing mechanism and piece collection mechanism, the crossbeam lower wall of burnishing machine organism is equipped with and drives actuating cylinder one, and it is equipped with the polishing dish to drive actuating cylinder one below, and motor ceramic processing mechanism has 2, is located the both sides of burnishing machine organism respectively, and motor ceramic processing mechanism plays centre gripping and the effect of rotatory tubulose electronic ceramics, and piece collection mechanism is located the holding tank that burnishing machine organism below was seted up, can be used to collect the electronic ceramic piece. The utility model provides a pair of burnishing device is used in electronic ceramic processing can realize the even, complete polishing of tubulose electronic ceramic, can collect as far as possible including clastic gaseous, also prevents the piece jam in the collection process.

Description

Burnishing device is used in electronic ceramic processing
Technical Field
The utility model relates to an electron ceramic product technical field especially relates to an electron is burnishing device for ceramic machining.
Background
The polishing of electronic ceramics is to use soft elastic or viscoelastic tools and micro powder abrasive to make the surface of a workpiece reach the finish of a mirror surface after the grinding of the electronic ceramics, the polishing mechanism is mechanical micro removal, the surface unevenness is removed by the micro cutting action at the front end of the abrasive, the existing polishing device polishes the electronic ceramics soaked in polishing solution by rotating a charging basket, the electronic ceramics also can generate fragments in the polishing process, the fragments are easy to fly to the external environment, and the fragments cannot be collected well and intensively, which is a problem to be solved.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides a burnishing device is used in electronic ceramic processing.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a polishing device for electronic ceramic processing, comprising:
the polishing machine body comprises a body base, a pillar arranged on the body base and a cross beam arranged on the pillar, wherein a containing groove is formed below the middle part of the body base, a plurality of chip through holes with communicated upper ends and lower ends are formed above the middle part of the body base, the upper end surface of the middle part of the body base is V-shaped, and pipeline through holes are formed in the pillars on two sides of the body base respectively;
the polishing mechanism is composed of a first driving cylinder fixedly arranged on the lower wall of the cross beam and a polishing disc connected with a cylinder shaft of the first driving cylinder;
the polishing solution box is fixedly arranged on the lower wall of the cross beam and positioned on one side of the driving air cylinder, and the polishing solution box is connected with the polishing solution spray head through a solution pipeline;
the electronic ceramic processing mechanism comprises 2 motor ceramic processing mechanisms, each motor ceramic processing mechanism consists of a driving cylinder II fixedly arranged on a polishing machine body, a flared air inlet cavity connected with the cylinder shaft of the driving cylinder II, a motor connected with the flared air inlet cavity, a clamping cylinder connected with the motor shaft of the motor, springs arranged on two sides of the inner wall of the clamping cylinder and opposite to each other, and clamping jaws fixedly connected with the springs, wherein the flared direction of the flared air inlet cavity faces to the outside, the flared air inlet cavity is of a hollow structure, an air inlet and a plurality of air outlets are respectively formed in the upper end surface and the inner side end surface of the flared air inlet cavity, the air inlet is connected with an air inlet flexible rubber pipe, the air inlet flexible rubber pipe penetrates through a pipeline through hole and is connected with an external air supply source, and branch air pipes obliquely arranged towards the upper part are respectively connected with air outlets in the plurality of the air outlets, the lower part of the gas outlets are respectively connected with a branch gas pipe which is obliquely arranged downwards, each branch gas pipe is connected with a gas nozzle, when the spring is in a natural state, the distance between the two clamping jaws is greater than 1/2 of the inner diameter of the clamping cylinder, the two clamping cylinders are respectively positioned at two sides of the fragment through hole, when the spring is in a stretching state, the tubular electronic ceramic is arranged at the central position of the clamping cylinder, the upper part and the lower part of the side end port of the tubular electronic ceramic are respectively clamped and inserted into the clamping jaws and are fixed by elastic force, and a polishing disc and a polishing liquid spray head are arranged above the tubular electronic ceramic;
the chip collecting mechanism comprises a chip collecting box, the upper wall of the chip collecting box is provided with a plurality of chip collecting holes, the plurality of chip collecting holes are communicated with the inside of the chip collecting box, the chip collecting box is arranged in the accommodating groove in a sliding mode, the plurality of chip collecting holes are communicated with the plurality of chip through holes respectively, and the front end of the chip collecting box is provided with a gas port which is communicated with the inside of the chip collecting box.
Preferably, still include the piece and divide the mechanism of dialling, the piece divides the mechanism to include the spring, divide the mobile jib, divide the branch pole, the elastic ball, and the spring is fixed to be located through dividing the seat on the bottom inner wall of piece through-hole, the spring upper end is connected with the mobile jib of dividing, divide the mobile jib to be equipped with the branch pole that divides that the downward setting of a plurality of slope from top to bottom, and each divides the end that divides the pole to be connected with the elastic ball, the elastic ball with piece through-hole inner wall just in time contacts.
Preferably, the elastic ball is a sponge ball.
Preferably, a cylinder shaft of the first driving cylinder is connected with the polishing disc through a connecting block.
Preferably, the flared air inlet cavity is connected with the motor through a connecting block.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) the tubular electronic ceramic can be uniformly and completely polished;
(2) the debris-containing gas can be collected as much as possible and debris clogging is prevented during the collection process.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is an enlarged view of portion A of FIG. 1;
FIG. 3 is an enlarged view of portion B of FIG. 1;
fig. 4 is a schematic view of the overall structure of the present invention;
fig. 5 is an enlarged view of a portion C in fig. 4.
In the figure: 1. a body mount; 2. a pillar; 3. a cross beam; 4. a debris through-hole; 5. a conduit through hole; 6. driving a first air cylinder; 7. a polishing disk; 8. a polishing solution tank; 9. a polishing solution spray head; 10. a second driving cylinder; 11. a flared air inlet cavity; 12. an air inlet soft rubber pipe; 13. clamping the cylinder; 14. a spring; 15. clamping jaws; 16. a tubular electronic ceramic; 17. a debris collection bin; 18. a debris collection aperture; 19. a gas port; 20. a main distribution rod; 21. a distributing and distributing rod; 22. an elastic sponge ball; 23. a distribution seat; 24. an electric motor.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example (b):
referring to fig. 1-5, a polishing device for electronic ceramic processing comprises a polishing machine body, a polishing mechanism, a polishing solution tank 8, a polishing solution nozzle 9, an electronic ceramic processing mechanism, a debris collecting mechanism and a debris distributing mechanism.
This burnishing machine organism comprises organism seat 1, pillar 2 of locating on organism seat 1, crossbeam 3 of locating on pillar 2 pillar, and the storage tank has been seted up to the middle part below of organism seat 1, and the piece through-hole 4 that a plurality of upper end, lower extreme link up is seted up to the middle part top of organism seat 1, and the middle part up end of organism seat 1 is "V" shape, has seted up pipeline through-hole 5 on the pillar 2 of both sides respectively.
The polishing mechanism is composed of a driving cylinder I6 fixedly arranged on the lower wall of the cross beam and a polishing disk 7 connected with a cylinder shaft of the driving cylinder I6 (the cylinder shaft of the driving cylinder I is connected with the polishing disk through a connecting block).
The polishing solution box 8 is fixedly arranged on the lower wall of the cross beam 3 and located on the side of the first driving cylinder 6, the polishing solution box 8 is connected with the polishing solution spray head 9 through a solution pipeline, an electromagnetic valve can be arranged on the solution pipeline, and the solution pipeline can be remotely controlled to be communicated and closed.
Each motor ceramic processing mechanism is composed of a driving cylinder II 10 fixedly arranged on the polishing machine body (a cylinder seat is arranged below the driving cylinder II 10), a flared air inlet cavity 11 connected with a cylinder shaft of the driving cylinder II 10, a motor 24 connected with the flared air inlet cavity 11 (the flared air inlet cavity 11 is connected with the motor 24 through a connecting block), a clamping cylinder 13 connected with a motor shaft of the motor 24, springs 14 arranged on two sides of the inner wall of the clamping cylinder 13 and opposite to each other, and clamping claws 15 fixedly connected with the springs 14.
The flaring direction of the flaring-shaped air inlet cavity 11 faces outwards, the flaring-shaped air inlet cavity 11 is internally of a hollow structure, an air inlet and a plurality of air outlets are respectively arranged on the upper end surface and the inner side end surface of the flaring-shaped air inlet cavity 11, the air inlet is connected with the air inlet soft rubber pipe 12, the air inlet soft rubber pipe 12 penetrates through a pipeline through hole to be connected with an external air supply source, the air outlets on the upper part of the plurality of air outlets are respectively connected with branch air pipes which are obliquely arranged towards the upper part, the air outlets on the lower part of the plurality of air outlets are respectively connected with branch air pipes which are obliquely arranged towards the lower part, each branch air pipe is connected with an air nozzle 13, when the spring 14 is in a natural state, the distance between the two clamping jaws 15 is larger than 1/2 of the inner diameter of the clamping cylinder 13, the two clamping cylinders 13 are respectively positioned on two sides of the scrap through hole 4, when the spring 14 is in a stretching state, the tubular electronic ceramic 16 is arranged at the central position of the clamping cylinder 13, the upper part and the lower part of the side end port of the tubular electronic ceramic 16 are respectively clamped and inserted into the clamping jaw 15 and are fixed by elastic force, and the polishing disk 7 and the polishing solution nozzle 9 are arranged above the tubular electronic ceramic 16.
The debris collection mechanism comprises a debris collection box 17, the upper wall of the debris collection box 17 is provided with a plurality of debris collection holes 18, the plurality of debris collection holes 18 are communicated with the inside of the debris collection box 17, the debris collection box 17 is arranged in the containing groove in a sliding mode, the plurality of debris collection holes 18 are communicated with the plurality of debris through holes 4 respectively, the front end of the debris collection box 17 is provided with a gas port 19, and the gas port 19 is communicated with the inside of the debris collection box 17.
The piece divides the mechanism to dial includes spring 14, divide and dial mobile jib 20, divide and dial branch pole 21, elastic sponge ball 22, spring 14 is fixed on the bottom inner wall of locating piece through-hole 4 through dividing and dial seat 23 (divide and dial seat 23 slope and set up downwards), spring 14 upper end is connected with branch and dial mobile jib 20, divide and dial mobile jib 20 from top to bottom to be equipped with the branch pole 21 of dividing of the downward setting of a plurality of slope, each divides the end of dividing pole 21 to be connected with elastic sponge ball 22, elastic sponge ball 22 just in time contacts with 4 inner walls of piece through-hole.
The utility model discloses a theory of operation does:
the device is suitable for polishing the tubular electronic ceramic 16;
firstly, mounting tubular electronic ceramics 16, firstly, placing the tubular electronic ceramics 16 at the central position of a clamping cylinder 13, respectively clamping and inserting a clamping claw 15 above and below a side end port of the tubular electronic ceramics 16, wherein a spring 14 is in a stretching state at the moment, and the tubular electronic ceramics 16 are fixed by elastic force, compared with the conventional method for clamping the outer side of the tubular electronic ceramics 16, the clamping method realizes that all outer side walls of the tubular electronic ceramics 16 can be ground and polished by a polishing disc 7 (the outer side clamping part of the conventional tubular electronic ceramics 16 cannot be polished);
secondly, starting the polishing work, namely starting the driving cylinder I6 (the driving cylinder I6, the driving cylinder II 10 and the motor 24 are conventional cylinders and motors on the market, and the polishing disc 7 can normally work after being started), and driving the polishing disc to move downwards by a cylinder shaft of the driving cylinder I6 to be in contact with the outer wall of the tubular electronic ceramic 16; the motor 24 is started to work simultaneously, the motor shaft of the motor 24 drives the tubular electronic ceramics 16 to rotate, and the polishing liquid spray head 9 sprays polishing liquid simultaneously, so that the polishing of the tubular electronic ceramics 16 by the polishing disk 7 is realized; the driving cylinder II 10 is started to work at the same time, and a cylinder shaft of the driving cylinder II 10 drives the motor 24 and the tubular electronic ceramic 16 to move leftwards or rightwards, so that the tubular electronic ceramic 16 is uniformly and completely polished by the polishing disc 7;
in the polishing process, gas is ejected from the gas nozzle 13, the gas containing the fragments is intensively ejected into the central position and is intensively ejected above the fragment through hole 4, the gas port is connected with the gas extraction pipe and the gas extraction device, the gas containing the fragments is sucked into the fragment collection box 17, the gas containing the fragments is cleaned and concentrated as much as possible by the mode of centralizing the fragment gas in the middle, the gas containing the fragments is also included in the range as large as possible in the sliding process of the gas nozzle 13 in the flaring distribution, and the collection of the fragments is facilitated; the piece divides the mechanism to dial can prevent that the piece from blockking up in piece through-hole 4, and main gas port air exhaust in-process divides the dial main pole 20 and divides the dial to divide pole 21 to produce vibrations, even the piece blocks up and also can vibrate through elasticity sponge ball 22 and get off, elasticity sponge ball 22 and the contact of 4 inner walls of piece through-hole, the vibrations in-process also can scrape the absorbent piece of inner wall and get off.
Above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the design of the present invention, equivalent replacement or change should be covered within the protection scope of the present invention.

Claims (5)

1. A polishing device for electronic ceramic processing is characterized by comprising:
the polishing machine body comprises a body base, a pillar arranged on the body base and a cross beam arranged on the pillar, wherein a containing groove is formed below the middle part of the body base, a plurality of chip through holes with communicated upper ends and lower ends are formed above the middle part of the body base, the upper end surface of the middle part of the body base is V-shaped, and pipeline through holes are formed in the pillars on two sides of the body base respectively;
the polishing mechanism is composed of a first driving cylinder fixedly arranged on the lower wall of the cross beam and a polishing disc connected with a cylinder shaft of the first driving cylinder;
the polishing solution box is fixedly arranged on the lower wall of the cross beam and positioned on one side of the driving air cylinder, and the polishing solution box is connected with the polishing solution spray head through a solution pipeline;
the electronic ceramic processing mechanisms are provided with 2, each electronic ceramic processing mechanism consists of a driving cylinder II fixedly arranged on a polishing machine body, a flared air inlet cavity connected with the cylinder shaft of the driving cylinder II, a motor connected with the flared air inlet cavity, a clamping cylinder connected with the motor shaft of the motor, springs arranged on two sides of the inner wall of the clamping cylinder and opposite to each other, and clamping jaws fixedly connected with the springs, wherein the flared direction of the flared air inlet cavity faces to the outside, the flared air inlet cavity is of a hollow structure, an air inlet and a plurality of air outlets are respectively arranged on the upper end surface and the inner side end surface of the flared air inlet cavity, the air inlet is connected with an air inlet flexible rubber pipe, the air inlet flexible rubber pipe penetrates through a pipeline through hole and is connected with an external air supply source, and branch air pipes obliquely arranged towards the upper part are respectively connected with air outlets in the plurality of the air outlets, the lower part of the gas outlets are respectively connected with a branch gas pipe which is obliquely arranged downwards, each branch gas pipe is connected with a gas nozzle, when the spring is in a natural state, the distance between the two clamping jaws is greater than 1/2 of the inner diameter of the clamping cylinder, the two clamping cylinders are respectively positioned at two sides of the fragment through hole, when the spring is in a stretching state, the tubular electronic ceramic is arranged at the central position of the clamping cylinder, the upper part and the lower part of the side end port of the tubular electronic ceramic are respectively clamped and inserted into the clamping jaws and are fixed by elastic force, and a polishing disc and a polishing liquid spray head are arranged above the tubular electronic ceramic;
the chip collecting mechanism comprises a chip collecting box, the upper wall of the chip collecting box is provided with a plurality of chip collecting holes, the plurality of chip collecting holes are communicated with the inside of the chip collecting box, the chip collecting box is arranged in the accommodating groove in a sliding mode, the plurality of chip collecting holes are communicated with the plurality of chip through holes respectively, and the front end of the chip collecting box is provided with a gas port which is communicated with the inside of the chip collecting box.
2. The polishing device for electronic ceramic machining according to claim 1, further comprising a debris distributing mechanism, wherein the debris distributing mechanism comprises a spring, a distributing main rod, a distributing rod and an elastic ball, the spring is fixedly arranged on the inner wall of the bottom end of the debris through hole through a distributing seat, the upper end of the spring is connected with the distributing main rod, the distributing main rod is provided with a plurality of distributing rods which are obliquely arranged from top to bottom, the tail end of each distributing rod is connected with the elastic ball, and the elastic ball is just in contact with the inner wall of the debris through hole.
3. The polishing apparatus for electronic ceramic processing as set forth in claim 2, wherein said elastic ball is a sponge ball.
4. The polishing apparatus for electronic ceramic machining as claimed in claim 1, wherein a cylinder shaft of the first driving cylinder is connected to the polishing plate through a connecting block.
5. The electronic ceramic processing polishing device as recited in claim 1, wherein said flared inlet chamber is connected to a motor through a connecting block.
CN202121153426.2U 2021-05-27 2021-05-27 Burnishing device is used in electronic ceramic processing Active CN215240084U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121153426.2U CN215240084U (en) 2021-05-27 2021-05-27 Burnishing device is used in electronic ceramic processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121153426.2U CN215240084U (en) 2021-05-27 2021-05-27 Burnishing device is used in electronic ceramic processing

Publications (1)

Publication Number Publication Date
CN215240084U true CN215240084U (en) 2021-12-21

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Application Number Title Priority Date Filing Date
CN202121153426.2U Active CN215240084U (en) 2021-05-27 2021-05-27 Burnishing device is used in electronic ceramic processing

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117047642A (en) * 2023-10-12 2023-11-14 烟台龙港泵业股份有限公司 Polishing device for centrifugal pump machining
CN117260541A (en) * 2023-11-17 2023-12-22 江苏湖润泵业科技有限公司 Clamping and fixing device for camshaft machining production

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117047642A (en) * 2023-10-12 2023-11-14 烟台龙港泵业股份有限公司 Polishing device for centrifugal pump machining
CN117047642B (en) * 2023-10-12 2023-12-08 烟台龙港泵业股份有限公司 Polishing device for centrifugal pump machining
CN117260541A (en) * 2023-11-17 2023-12-22 江苏湖润泵业科技有限公司 Clamping and fixing device for camshaft machining production
CN117260541B (en) * 2023-11-17 2024-01-26 江苏湖润泵业科技有限公司 Clamping and fixing device for camshaft machining production

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