CN215220724U - Array substrate and display panel - Google Patents

Abstract

The application discloses array substrate and display panel, array substrate includes: a substrate and a metal layer; the metal layer is arranged on the substrate; the array substrate further comprises a composite material layer, the composite material layer is arranged above the metal layer and comprises a passivation layer and a hydrophobic membrane layer, and the hydrophobic membrane layer is used for preventing water vapor from invading. This application, through above mode, prevent that external steam from seeing through the invasion metal of the thinner department of passivation layer and walk the line to increase the risk of metal wiring corruption.

Description

Array substrate and display panel

Technical Field

The application relates to the technical field of display, in particular to an array substrate and a display panel.

Background

A thin-film transistor (TFT) array substrate is a major component of a current liquid crystal display device, and is used to provide a driving circuit for a display. The array substrate is generally provided with a plurality of gate scan lines and a plurality of data lines, which collectively define a plurality of pixel units. A thin film transistor and a pixel electrode are arranged in each pixel unit, the grid electrode of the thin film transistor is connected with a corresponding grid electrode scanning line, when the voltage on the grid electrode scanning line reaches a starting voltage, the source electrode and the drain electrode of the thin film transistor are conducted, so that the data voltage on the data line is input to the pixel electrode, and then the display of the corresponding pixel area is controlled, wherein the state of metal wiring of a non-display area or a display area has important influence on the display effect of the display device.

On the array substrate, the top of substrate, generally including first metal level, the insulating layer, second metal level and passivation layer, wherein, the passivation layer is the key rete of guarantee metal wiring normal work, but the passivation layer also can go wrong and lead to metal wiring unusual and influence the display effect, it is special, when first metal level and second metal level cut together the design, the marginal position department that the passivation layer corresponds the second metal level, the passivation layer is easy to be split, aqueous vapor in the air sees through the passivation layer of thinner department and gets into retes such as metal wiring, influence metal wiring stability, thereby influence the display effect.

SUMMERY OF THE UTILITY MODEL

The utility model provides an array substrate and display panel aims at solving the invasion metal that external aqueous vapor sees through the thinner department of passivation layer and walks the line to increase the risk of metal wiring corruption, influence the problem of stability.

The application discloses array substrate, array substrate includes: a substrate and a metal layer; the metal layer is arranged on the substrate; the array substrate further comprises a composite material layer, the composite material layer is arranged above the metal layer and comprises a passivation layer and a hydrophobic membrane layer, and the hydrophobic membrane layer is used for preventing water vapor from invading.

Optionally, the metal layer includes a first metal layer and a second metal layer, an insulating layer is disposed between the first metal layer and the second metal layer, the hydrophobic film layer includes a first hydrophobic film layer, and the first hydrophobic film layer is disposed between the second metal layer and the passivation layer.

Optionally, the metal layer includes a first metal layer and a second metal layer, an insulating layer is disposed between the first metal layer and the second metal layer, a transition structure is disposed at an edge of the second metal layer, and the transition structure is a chamfer disposed at the edge of the second metal layer.

Optionally, the chamfer is a step-shaped chamfer, and a notch is arranged at an edge corner of the second metal layer to form the step-shaped chamfer.

Optionally, the chamfer is an arc chamfer or a fillet, and the arc chamfer or the fillet is tangent to the upper surface and the side surface of the second metal layer respectively.

Optionally, the chamfer includes a straight chamfer, and the straight chamfer is formed by inclining the upper surface of the second metal layer to the side surface of the second metal layer; the included angle range of the straight chamfer angle and the horizontal plane is 30-60 degrees.

Optionally, the hydrophobic membrane layer further includes a second hydrophobic membrane layer, and the second hydrophobic membrane layer is disposed above the passivation layer.

Optionally, the hydrophobic membrane layer comprises at least one membrane layer, and the material of the hydrophobic membrane layer comprises fluorocarbon polymer.

Optionally, the metal layer only includes a first metal layer, the first metal layer is formed on the substrate, and the composite material layer is formed over the first metal layer; or the metal layer includes only a second metal layer formed on the substrate, the composite layer being formed over the second metal layer.

The application also discloses a display panel, which comprises the array substrate and a color film substrate, wherein the color film substrate and the array substrate are arranged in a box-to-box mode.

This application is through at array substrate set up the metal level on the substrate, set up combined material layer on the metal level again, it is right to utilize the passivation layer in the combined material layer the metal level is protected, and hydrophobic rete has not only strengthened the thickness of the rete of metal level top, has reduced the rete and too thin and cracked possibility, and hydrophobic rete has hydrophobic effect moreover, and even a little steam invades, also can be blockked by hydrophobic rete. The hydrophobic film layer can effectively prevent external water vapor from penetrating through the metal wiring at the thinner part of the passivation layer, the risk of corrosion of the water vapor to films such as the metal wiring is reduced, the display quality of the liquid crystal display panel and the liquid crystal display is further guaranteed, the service life is prolonged, and the reliability of products is enhanced.

Drawings

The accompanying drawings, which are included to provide a further understanding of the embodiments of the application, are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:

fig. 1 is a schematic view of a display panel according to a first embodiment of the present application;

fig. 2 is a schematic view of an array substrate according to a first embodiment of the present application;

fig. 3 is a schematic view of an array substrate according to a second embodiment of the present application;

fig. 4 is a schematic view of an array substrate according to a third embodiment of the present application;

fig. 5 is a schematic view of an array substrate according to a fourth embodiment of the present application;

fig. 6 is a schematic view of an array substrate according to a fifth embodiment of the present application;

fig. 7 is a schematic view of an array substrate according to a sixth embodiment of the present application;

fig. 8 is a schematic view of an array substrate according to a seventh embodiment of the present application;

fig. 9 is a schematic view of an array substrate according to an eighth embodiment of the present application;

fig. 10 is a schematic view of an array substrate according to a ninth embodiment of the present application.

10, a display panel; 100. a substrate; 110. a metal layer; 120. an array substrate; 130. a color film substrate; 200. a first metal layer; 300. a second metal layer; 400. a composite material layer; 410. a passivation layer; 420. a hydrophobic membrane layer; 421. a first hydrophobic membrane layer; 422. a second hydrophobic membrane layer; 430. a transition structure; 440. chamfering; 441. step-shaped chamfering; 442. arc chamfering; 443. round corners; 444. straight chamfering; 500. an insulating layer.

Detailed Description

It is to be understood that the terminology, the specific structural and functional details disclosed herein are for the purpose of describing particular embodiments only, and are representative, but that the present application may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.

In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or as implicitly indicating the number of technical features indicated. Thus, unless otherwise specified, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "plurality" means two or more. The terms "comprises" and "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that one or more other features, integers, steps, operations, elements, components, and/or combinations thereof may be present or added.

Further, terms of orientation or positional relationship indicated by "center", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, are described based on the orientation or relative positional relationship shown in the drawings, are simply for convenience of description of the present application, and do not indicate that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application.

Furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and may include, for example, fixed connections, removable connections, and integral connections; can be mechanically or electrically connected; either directly or indirectly through intervening media, or through both elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

The present application is described in detail below with reference to the figures and alternative embodiments.

Fig. 1 is a schematic view of a display panel according to a first embodiment of the present application, in the present application, a display panel 10 includes an array substrate 120 and a color filter substrate 130, the array substrate 120 and the color filter substrate 130 are arranged in a box-to-box manner, and the array substrate 120 includes a substrate 100 and a metal layer 110; a metal layer 110 is disposed on the substrate 100; the array substrate 120 further includes a composite layer 400, the composite layer 400 is disposed over the metal layer 110, the composite layer 400 includes a passivation layer 410 and a hydrophobic film layer 420, and the hydrophobic film layer 420 is used to prevent moisture from entering. During the use or manufacturing process of the display panel 10, the metal layer 110 is often corroded by moisture due to the moisture from the outside entering the metal layer 110, which affects the display effect. Increase combined material layer 400 on display panel 10's array substrate 120, reach dual water-proof effects through passivation layer 410 and hydrophobic membrane layer 420 in combined material layer 400, make steam be difficult to invade metal level 110, and further, promoted display panel 10's display effect, prolonged display panel 10's life.

The display panels are of various types, and the design of the film layers of the display panels of the same type may also be different, which makes the structure of the film layers vary between different display panels, but the invention of the present application corresponds to the position between the uppermost metal layer 110 of the array substrate and the passivation layer 410 in the display panel regardless of which display panel is used.

Fig. 2 is a schematic view of an array substrate according to a first embodiment of the present disclosure, and referring to fig. 2, it can be seen that, in some positions on the array substrate 120 of the display panel 10, the metal layer 110 only has a first metal layer 200, the first metal layer 200 is directly formed on the substrate 100, and the composite material layer 400 is directly formed on the first metal layer 200; or in some positions, the metal layer 100 only includes the second metal layer 300, the second metal layer 300 is directly formed on the substrate 100, and the composite material layer 400 is directly formed above the second metal layer 300, but of course, it may be not one metal layer 110, but two, three or even more metal layers 110, as long as the technical solution of the present application is applied, and all of them belong to the protection scope of the present application.

Since most of the array substrates of the display panels and most of the positions on the array substrates of the display panels are generally provided with two metal layers, for clarity of explaining the invention of the present application, the following description mainly takes the metal layer 110 including the first metal layer 200 and the second metal layer 300 as an example:

fig. 3 is a schematic view of an array substrate according to a second embodiment of the present disclosure, and as shown in fig. 3, the present disclosure discloses an array substrate 120, where the array substrate 120 includes: the method comprises the following steps: a substrate 100, a first metal layer 200, and a second metal layer 300; a first metal layer 200 is disposed on the substrate 100; the insulating layer 500 is disposed on the first metal layer 200 and covers the first metal layer 200; the second metal layer 300 is disposed on the insulating layer 500; the hydrophobic film layer 420 further includes a second hydrophobic film layer 422, the second hydrophobic film layer 422 being disposed over the passivation layer 410. The second hydrophobic film layer 422 serves to prevent the intrusion of moisture.

In the present application, the first metal layer 200 is disposed on the substrate 100 of the array substrate 120, the insulating layer 500 is disposed on the first metal layer 200, the second metal layer 300 is disposed on the insulating layer 500, and the passivation layer 410 and the second hydrophobic film layer 422 are disposed on the second metal layer 300, especially, for the position where the first metal layer 200 and the second metal layer 300 are cut and aligned (the two metal layers are manufactured by the same photomask, so that the edge position of the second metal layer 300 is steeper), the passivation layer 410 in the composite material layer 400 is used to protect the metal traces, other film structures, etc. thereunder, the position on the climbing position is thinner and is easy to break, and the second hydrophobic film layer 422 can further effectively prevent external moisture from penetrating through the metal traces at the thinner part of the passivation layer 410, so as to reduce the risk of corrosion of moisture to the metal, thereby ensuring the display quality of the liquid crystal display panel 10 and the liquid crystal traces, the service life is prolonged, the reliability of the product is enhanced, and the metal wiring and other film layer structures are prevented from being polluted by moisture and impurities, so that the physical properties and the electrical properties of the metal wiring and the film layer structures are damaged; and the second hydrophobic membrane layer 422 is matched with the passivation layer 410 to be arranged, so that the insulation effect of the passivation layer can be enhanced, the stability of metal wiring can be improved in a non-display area, and the stability of metal wiring, a thin film transistor and the like can be improved in a display area.

Of course, even if there are two metal layers at different positions, the corresponding film structures may be different, for example, there should be a semiconductor layer between the insulating layer and the second metal layer and a pixel electrode layer above the passivation layer at the position corresponding to the thin film transistor; the film layer structure corresponding to the peripheral wiring portion of the non-display area is slightly different, and will not be described one by one here.

Fig. 4 is a schematic diagram of an array substrate according to a third embodiment of the present disclosure, and as shown in fig. 4, the embodiment of fig. 4 is a modification of the embodiment shown in fig. 3, specifically, the metal layer 110 includes a first metal layer 200 and a second metal layer 300, an insulating layer 500 is disposed between the first metal layer 200 and the second metal layer 300, the hydrophobic film layer 420 includes a first hydrophobic film layer 421, and the first hydrophobic film layer 421 is disposed between the second metal layer 300 and the passivation layer 410.

The first hydrophobic film layer 421 and the passivation layer 410 may be formed by using a common mask, and the first hydrophobic film layer 421 may be formed on the second metal layer 300 by photolithography, and the passivation layer 410 may be formed on the first hydrophobic film layer 421, or may be formed separately.

Because the passivation layer 410 has a certain waterproof property, it can block part of the water vapor from the outside, such as the water vapor remained in the air or in the washing process, but because the passivation layer 410 is thinner at the climbing position of the boundary between the first metal layer 200 and the second metal layer 300, the water vapor still invades into the metal layers, thereby corroding the metal layers and affecting the performance of the metal routing, so that the first hydrophobic film layer 421 can be arranged above the second metal layer 300, and then the passivation layer 410 is arranged, even if the water vapor penetrates through the thinner position of the passivation layer 410, the water vapor can be blocked by the first hydrophobic film layer 421 between the passivation layer 410 and the second metal layer 300, thereby effectively preventing the water vapor from the outside from further invading into the metal layers, and ensuring that the first metal layer 200 and the second metal layer 300 are not corroded due to the invasion of the water vapor; through utilizing the passivation layer 410 to cooperate with the first hydrophobic film 421, a better effect of preventing the invasion of water vapor or other impurities is achieved, the performance of the display panel 10 is ensured, and the service life of the display panel 10 is prolonged.

Moreover, the hydrophobic membrane layer 420 and the passivation layer 410 are designed in a matching way, so that the generated water vapor is well isolated in the subsequent process and the technological process after the passivation layer 410, and the yield of finished products can be improved; and in the use process, the invasion of external water vapor or impurities can be prevented, and the service life of the display device is prolonged.

In addition, the hydrophobic film layer 420 and the passivation layer 410 may not share a photomask, the hydrophobic film layer 420 may be a whole-surface structure and not etched, the hydrophobic film layer 420 is deposited after the second metal layer 300 is coated, the hydrophobic film layer 420 is coated without using a photomask to form a whole-surface film layer, and the first metal layer 200 and the second metal layer 300 may also be protected.

Fig. 5 is a schematic diagram of an array substrate according to a fourth embodiment of the present disclosure, and as shown in fig. 5, the embodiment of fig. 5 is a modification of the embodiment shown in fig. 4, a hydrophobic film layer 420 includes a first hydrophobic film layer 421 and a second hydrophobic film layer 422, the second hydrophobic film layer 422 is disposed above the passivation layer 410, and the first hydrophobic film layer 421 is disposed between the passivation layer 410 and the second metal layer 300.

In the scheme, the hydrophobic film layers 420 are arranged above the passivation layer 410 and between the passivation layer 410 and the second metal layer 300, so that the passivation layer 410 is covered by the upper and lower hydrophobic film layers 420, under the protection of the double hydrophobic film layers 420, even if external water vapor passes through the second hydrophobic film layer 422 carelessly and passes through the passivation layer 410, the external water vapor is blocked by the first hydrophobic film layer 421, and the external water vapor passes through the second hydrophobic film layer 422 to block partial water vapor invasion first, when reaching the passivation layer 410, the passivation layer 410 has certain waterproofness and blocks the water vapor again, and finally, the water vapor is blocked by the first hydrophobic film layer 421 arranged between the passivation layer 410 and the second metal layer 300, so that the triple effect of preventing the water vapor invasion is achieved, further waterproofness of the display panel 10 is enhanced, and external water vapor is effectively prevented from invading into the first metal layer 200 and the second metal layer 300, the situation that the use effect and the service life of the display panel 10 are affected by the corrosion of the water vapor on the routing of the first metal layer 200 and the second metal layer 300 is avoided.

Fig. 6 is a schematic view of an array substrate according to a fifth embodiment of the present disclosure, and as shown in fig. 6, the embodiment of fig. 6 is a modification of the embodiment shown in fig. 3, a hydrophobic film layer 420 includes at least one film layer, and a material of the hydrophobic film layer 420 includes fluorocarbon polymer. In this scheme, hydrophobic membrane layer 420 can be the structure of two retes, covers in passivation layer 410 top through hydrophobic membrane layer 420 of designing two retes of membranous structure, has improved hydrophobic membrane layer 420 self and has prevented the effect that steam invaded. In order to further enhance the effect of the hydrophobic film layer 420 itself for preventing the intrusion of water vapor, on the basis that the hydrophobic film layer 420 has two film layers, preferably, the hydrophobic film layer 420 may be made of a fluorocarbon polymer material, which is a fluorine-containing carbon polymer material, and since fluorine is contained therein, the surface energy is low, and thus the hydrophobic film layer is suitable for constructing a super-hydrophobic surface.

It should be noted that the material of the passivation layer 410 in the embodiment of the present application may be silicon nitride. The material of the hydrophobic membrane layer 420 may also be other hydrophobic materials, for example, silane coupling agent type materials such as gamma-methacryloxypropyltrimethoxysilane (MPTMS), N-Methylperfluorooctylsulfonylaminoethylacrylate (MPSAEA). Preferably, the thickness of the hydrophobic film layer 420 may be 15 to 110 nm.

In addition, the surface of the passivation layer 410 close to the hydrophobic film layer 420 can be set to be a rough surface, the rough surface of the passivation layer 410 and the hydrophobic film layer 420 of the fluorocarbon polymer material act together, the effect of blocking water vapor is better, the first metal layer 200 and the second metal layer 300 can be effectively protected from being corroded by the invasion of external water vapor, the internal electrical elements of the display panel 10 are protected, and the service life of the display panel 10 is prolonged.

Fig. 7 is a schematic diagram of an array substrate according to a sixth embodiment of the present application, and as shown in fig. 7, the embodiment of fig. 7 is a modification of the embodiment shown in fig. 3, and on the basis of the above solution, a transition structure 430 is disposed at an edge of the second metal layer 300, and the transition structure 430 is a chamfer 440 disposed at the edge of the second metal layer 300. Since two borders of the first metal layer 200 and the second metal layer 300 are mostly cut-and-aligned in the normal case, the passivation layer 410 is covered on the first metal layer 200 and the second metal layer 300 along the two borders of the first metal layer 200 and the second metal layer 300. Due to the climbing of the passivation layer 410 at the boundary between the first metal layer 200 and the second metal layer 300, the passivation layer 410 is thin at the climbing position and is easily broken, so that the problem that external moisture intrudes into the first metal layer 200 and the second metal layer 300 at the climbing position of the passivation layer 410 is most likely to occur.

In order to solve the problem, the chamfer 440 is located at the boundary of the second metal layer 300 and corresponds to the position where the passivation layer 410 climbs, the slope of the edge of the second metal layer 300 is reduced by setting the chamfer, the edge is not sharp or steep any more, the contact area is increased, and the problem that the passivation layer 410 is torn is solved; moreover, as the slope becomes gentle, the passivation layer 410 can be more accumulated at the edge, so that the thickness of the passivation layer 410 at the edge becomes thicker, thereby effectively blocking water vapor from invading into the second metal layer 300 and the first metal layer 200 through the passivation layer 410, and preventing the second metal layer 300 and the first metal layer 200 from being corroded due to the influence of the water vapor; further, when the thickness of the passivation layer 410 covered at the edge corresponding to the second metal layer 300 is increased, the hydrophobic film layer 420 is arranged above the passivation layer 410 or between the passivation layer 410 and the second metal layer 300, the passivation layer 410 is utilized to have certain waterproof matching with the hydrophobic film layer 420 for further waterproofing, and then the thickness of the passivation layer 410 is increased, matching of three aspects, the waterproof performance of the display panel 10 is greatly improved, the first metal layer 200 and the second metal layer 300 are protected from being affected by the invasion of external water vapor, the first metal layer 200 and the second metal layer 300 are prevented from being corroded, further assurance is achieved, the overall performance of the display panel 10 is improved, internal electrical elements of the display panel 10 are not easy to damage, and the service life of the display panel 10 is prolonged.

Optionally, the chamfer 440 includes a straight chamfer 444, the straight chamfer 444 is formed by inclining the upper surface of the second metal layer 300 to the side surface of the second metal layer 300, and an angle α between the straight chamfer 444 and the horizontal plane is in a range of 30 to 60 degrees. Forming a straight chamfer 444 by inclining the side surface of the second metal layer 300, so that the second metal layer 300 is notched at a position where the side surface corresponds to the climbing of the passivation layer 410, thereby increasing the distance between the side surface of the second metal layer 300 and the passivation layer 410; when the passivation layer 410 or the hydrophobic film layer 420 covers the formed notch, the thickness of the passivation layer 410 or the hydrophobic film layer 420 covered at the edge of the second metal layer 300 is increased, so that the passivation layer 410 or the hydrophobic film layer 420 is effectively prevented from being broken at the position of the climbing position, meanwhile, as the thickness of the passivation layer 410 or the hydrophobic film layer 420 covered at the edge of the corresponding second metal layer 300 is increased, the waterproofness of the passivation layer 410 or the hydrophobic film layer 420 at the position of the edge of the corresponding second metal layer 300 is improved, water vapor can be effectively prevented from invading into the second metal layer 300 and the first metal layer 200 through the passivation layer 410, and the second metal layer 300 and the first metal layer 200 are prevented from being affected by water vapor and being corroded.

When the angle α between the straight chamfer 444 and the horizontal plane is smaller than 30 degrees, the edge of the second metal layer 300 cannot achieve the purpose of effectively increasing the thickness of the passivation layer 410 or the hydrophobic film layer 420 because the gap formed by the straight chamfer 444 is smaller, and when the angle α between the straight chamfer 444 and the horizontal plane is greater than 60 degrees, the second metal layer 300 may be further thinned, thereby affecting the performance of the second metal layer 300. Therefore, the angle range of the included angle between the straight chamfer 444 and the horizontal plane is set between 30 and 60 degrees, so that an effective gap can be formed at the edge of the second metal layer 300, the thickness of the passivation layer 410 or the hydrophobic film layer 420 covering the second metal layer 300 at the edge is increased, the passivation layer 410 or the hydrophobic film layer 420 is prevented from being broken at the edge, the waterproof performance and the structural stability of the passivation layer 410 or the hydrophobic film layer 420 are ensured, and the performance of the second metal layer 300 is not affected.

Of course, the transition result of the present application is not limited to the straight chamfer, and may be other designs, specifically as follows:

fig. 8 is a schematic diagram of an array substrate according to a seventh embodiment of the present invention, and as shown in fig. 8, the embodiment of fig. 8 is a modification of the embodiment shown in fig. 7, in which the chamfer 440 is a step-shaped chamfer 441, and the edge corner of the second metal layer 300 is provided with a notch to form the step-shaped chamfer 441. Compared with the design of the previous embodiment in which the chamfer 440 is a straight chamfer 444, in this embodiment, a step-shaped chamfer 441 structure is provided at the edge corner of the second metal layer 300, in this case, the passivation layer has a point of force, which can be attached to the step-like chamfer, so that, when the passivation layer is prepared, more passivation layer material can be deposited at the edge corner position, the formed passivation layer has thicker thickness corresponding to the edge corner, and a gentle slope, which can further enlarge the distance between the edge of the second metal layer 300 and the passivation layer 410 or the hydrophobic film layer 420, and increase the thickness of the passivation layer 410 or the hydrophobic film layer 420 covering the edge of the second metal layer 300, so that after the passivation layer 410 or the hydrophobic film layer 420 is covered on the second metal layer 300, the fracture is not easy to occur, and the water resistance and the structural stability of the passivation layer 410 or the hydrophobic film layer 420 are further improved. On the basis of the step-shaped chamfer 441, the hydrophobic film layer 420 is covered to achieve a better effect of preventing water vapor from invading, and the step-shaped chamfer 441 can be a step-shaped chamfer or a multi-step chamfer, and the effect can be achieved.

In addition, fig. 9 is a schematic view of an array substrate according to an eighth embodiment of the present invention, fig. 10 is a schematic view of an array substrate according to a ninth embodiment of the present invention, and referring to fig. 9 and 10, it can be seen that the chamfer 440 may also be an arc-shaped chamfer 442 or a fillet 443, and the arc-shaped chamfer 442 or the fillet 443 is tangent to the upper surface and the side surface of the second metal layer 300, respectively. Arc chamfer 442 or fillet 443 also can achieve the above-mentioned effect, and arc chamfer or fillet grinds away the edges and corners, like this, the passivation layer at the edge will not receive the influence of sharp-pointed structure again and lead to the problem of easy damage, no longer gives unnecessary details here.

Further, in the present application, the array substrate 120 includes a display area and a non-display area, and the non-display area is disposed around the display area; the composite layer 400 is disposed in the non-display region. The waterproof design of first metal level 200 and second metal level 300 through setting up combined material layer 400 in this application, not only be limited to on the display area, waterproof and protection on the thin film transistor also are applicable to in the non-display area, the waterproof and protection of peripheral line of walking. In the manufacturing process and daily use process of the display panel 10, the non-display area is more easily invaded by external water vapor, the water vapor from the outside easily invades into the display panel 10, the performance of electrical components inside the display panel 10 is affected, and the metal wiring is seriously corroded; moreover, because the metal traces in the non-display region are partially connected to the driving circuit of the display panel 10, if the metal traces at the ports are corroded due to the influence of external moisture, the display effect of the display panel 10 is affected.

Therefore, the composite material layer 400 is disposed in the non-display area of the array substrate 120, and particularly, above the source fan-out trace at the position of the array substrate 120 corresponding to the source flip-chip. The composite material layer 400 may cover the source driving binding portion. Set up combined material layer 400 on the metal route line, just can effectually block that external steam from invading the metal of the non-display region of array substrate 120 and walk the line, avoid the metal to walk the line and receive the corruption and damage, further assurance, display panel 10's wholeness ability and display effect for display panel 10's inside electrical components is difficult to damage, has prolonged display panel 10's life.

When the metal layer has only one layer, the edge of the metal layer may also be correspondingly provided with a transition structure, and the transition structure may specifically refer to any other embodiment disclosed in the present application.

The defect of metal wiring caused in the water vapor invasion surface is effectively prevented, the display quality of the liquid crystal display panel is guaranteed, and the product reliability is enhanced. The display panel in the present application may be a liquid crystal display panel or an organic electroluminescence display panel, wherein a specific structure of a liquid crystal layer in the liquid crystal display panel and a specific structure of an organic electroluminescence device of the organic electroluminescence display panel belong to the prior art and are not described herein again.

It should be noted that the inventive concept of the present application can form many embodiments, but the present application has a limited space and cannot be listed one by one, so that, on the premise of no conflict, any combination between the above-described embodiments or technical features can form a new embodiment, and after the embodiments or technical features are combined, the original technical effect will be enhanced.

The foregoing is a more detailed description of the present application in connection with specific alternative embodiments, and the specific implementations of the present application are not to be considered limited to these descriptions. For those skilled in the art to which the present application pertains, several simple deductions or substitutions may be made without departing from the concept of the present application, and all should be considered as belonging to the protection scope of the present application.

Claims (10)

1. An array substrate, comprising: a substrate and a metal layer; the metal layer is arranged on the substrate; the array substrate is characterized by further comprising a composite material layer, wherein the composite material layer is arranged above the metal layer and comprises a passivation layer and a hydrophobic membrane layer, and the hydrophobic membrane layer is used for preventing water vapor from invading.

2. The array substrate of claim 1, wherein the metal layer comprises a first metal layer and a second metal layer with an insulating layer disposed therebetween, and the hydrophobic membrane layer comprises a first hydrophobic membrane layer disposed between the second metal layer and the passivation layer.

3. The array substrate of claim 1, wherein the metal layer comprises a first metal layer and a second metal layer, an insulating layer is disposed between the first metal layer and the second metal layer, and a transition structure is disposed at an edge of the second metal layer, and the transition structure is a chamfer disposed at an edge of the second metal layer.

4. The array substrate of claim 3, wherein the chamfer is a step-shaped chamfer, and notches are formed at edges and corners of the second metal layer to form the step-shaped chamfer.

5. The array substrate of claim 3, wherein the chamfer is an arc-shaped chamfer or a fillet, and the arc-shaped chamfer or the fillet is tangent to the upper surface and the side surface of the second metal layer respectively.

6. The array substrate of claim 3, wherein the chamfer comprises a straight chamfer formed by inclining an upper surface of the second metal layer toward a side surface of the second metal layer; the included angle range of the straight chamfer angle and the horizontal plane is 30-60 degrees.

7. The array substrate of claim 2, wherein the hydrophobic membrane layer further comprises a second hydrophobic membrane layer disposed over the passivation layer.

8. The array substrate of claim 1, wherein the hydrophobic membrane layer comprises at least one membrane layer, and the material of the hydrophobic membrane layer comprises fluorocarbon polymer.

9. The array substrate of claim 1, wherein the metal layer comprises only a first metal layer formed on the substrate, the composite layer formed over the first metal layer; or the metal layer includes only a second metal layer formed on the substrate, the composite layer being formed over the second metal layer.

10. A display panel, comprising the array substrate according to any one of claims 1 to 9, and a color filter substrate, wherein the color filter substrate and the array substrate are arranged in a box-to-box manner.

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