CN215220680U

CN215220680U - Conveying arm structure for improving temperature difference between conveying arm and carrying disc

Info

Publication number: CN215220680U
Application number: CN202121687476.9U
Authority: CN
Inventors: 王艳良; 杨平
Original assignee: Shanghai Jet Plasma Co ltd
Current assignee: Shanghai Jet Plasma Co ltd
Priority date: 2021-07-23
Filing date: 2021-07-23
Publication date: 2021-12-17
Anticipated expiration: 2031-07-23

Abstract

The utility model discloses an improve conveying arm structure of conveying arm and year difference in temperature between dish, including ceramic arm main part, ceramic arm main part is equipped with year dish bearing district and radiating area, be equipped with the heat conduction strip in the ceramic arm main part, the heat conduction strip extends to the radiating area surface from year dish bearing district surface in the ceramic arm main part. Compared with the prior art, the utility model the advantage be: the problem that heat accumulation originally exists between the aluminum wafer carrying disc and the ceramic transmission arm is effectively solved, so that the heat can be quickly dissipated, and the curling phenomenon of the ultrathin sheet caused by difficulty in heat dissipation is inhibited.

Description

Conveying arm structure for improving temperature difference between conveying arm and carrying disc

Technical Field

The utility model relates to a conveying arm structure especially relates to an improve conveying arm and carry conveying arm structure of difference in temperature between dish.

Background

During wafer fabrication, a transfer arm is often required to transfer the wafer to the reaction chamber. As shown in fig. 1, one transfer process is divided into four steps. 1) Transferring the wafer to a cavity, and closing the cavity to perform process treatment; 2) after the process treatment is finished, the wafer is jacked up by using a mechanical thimble, and the cavity door is opened; 3) the transfer arm extends into the cavity to take the wafer, and the vacuum adsorption hole at the front end of the arm can adsorb the wafer to prevent the wafer from falling off in the transfer process; 4) the wafer is removed and the chamber door is closed. In this process, the transfer arm is required to contact and adsorb the bottom of the wafer before it can be taken out smoothly. For a silicon wafer, typically 750um thick, the mechanical strength is sufficient to allow the arm and wafer to be in direct contact; for ultra-thin wafers of 50-200um thickness, the vacuum force causes the ultra-thin wafer to break due to direct contact with the transfer arm, thereby requiring a carrier plate for wafer carrying. An aluminum carrying disc is usually used for carrying the wafer, and the aluminum is a material usually used in the reaction chamber and has a strong plasma corrosion resistance; and the manufacturing cost is low, so the method becomes the first choice for the wafer manufacturing customer.

The conveying arm is usually made of ceramic materials and has the characteristics of long service life, low abrasion, low particle pollution in a vacuum environment and the like; however, the heat conduction and dissipation of the ceramic material are poor. If an aluminum wafer carrier plate is used, after some high-temperature treatment processes, if heat stored on the carrier plate directly contacts the ceramic transfer arm, the ultrathin sheet on the aluminum carrier plate can be curled or broken due to heat accumulation because of no heat dissipation channel. Figure 2 shows the direct contact between the aluminum wafer carrier and the ceramic transfer arm.

Therefore, developing a transfer arm structure that improves the temperature difference between the transfer arm and the carrier tray is a problem that needs to be solved by those skilled in the art.

SUMMERY OF THE UTILITY MODEL

The utility model provides an it is not enough to solve the aforesaid, provides an improve conveying arm structure of difference in temperature between conveying arm and the year dish. The ceramic conveying arm is redesigned aiming at the problem of poor heat conduction between an aluminum wafer carrying disc and the ceramic conveying arm, an aluminum strip is integrated in the arm under the condition of keeping a ceramic arm main body, and the carrying disc and the aluminum strip are made of the same material with good heat conduction, so that the heat stored on the carrying disc can be rapidly and uniformly dissipated.

The above object of the present invention is achieved by the following technical solutions: the utility model provides an improve conveying arm structure that conveys the difference in temperature between arm and year dish, includes ceramic arm main part, and ceramic arm main part is equipped with year dish bearing district and heat dissipation district, be equipped with heat conduction strip in the ceramic arm main part, heat conduction strip extends to heat dissipation district surface from year dish bearing district surface in the ceramic arm main part.

Furthermore, an embedded groove is formed in the ceramic arm main body, and the heat conducting strip is embedded in the embedded groove in the ceramic arm main body.

Further, the surface of the heat conducting strip is flat with the surface of the transfer arm.

Furthermore, the heat conducting strips and the wafer carrying disc are made of the same materials and are made of aluminum materials.

Further, the shape of the heat conducting strip may take various shapes including, but not limited to, a parallel line shape, a meandering shape, and a zigzag shape.

Compared with the prior art, the utility model the advantage be: for the ultrathin sheet process, the heat generated when the aluminum wafer carrying disc and the ceramic transmission arm are contacted can not be effectively conducted away due to different heat conducting properties of the materials of the aluminum wafer carrying disc and the ceramic transmission arm. The utility model discloses based on reduce the difference in temperature as the starting point, inlayed aluminium matter heat conduction strip on the pottery conveying arm, because aluminium matter heat conduction strip and aluminium matter wafer carry the dish to be the same kind of material, therefore come from the heat that carries on the dish and can lead away through the aluminium matter strip on the arm, reduced and carried the temperature difference between dish and arm. The problem that heat accumulation originally exists between the aluminum wafer carrying disc and the ceramic transmission arm is effectively solved, so that the heat can be quickly dissipated, and the curling phenomenon of the ultrathin sheet caused by difficulty in heat dissipation is inhibited.

Drawings

FIG. 1 is a schematic diagram of a process for transferring a wafer to a reaction chamber by a transfer arm.

Figure 2 is a schematic view of the wafer curling due to the direct contact between the aluminum wafer carrier and the ceramic transfer arm.

Fig. 3 is a schematic view of the heat conduction between the transfer arm and the wafer chuck according to the present invention.

Fig. 4 is a schematic structural view of the transfer arm of the present invention.

Fig. 5-7 illustrate several embodiments of a transfer arm of the present invention.

Detailed Description

The present invention will be described in detail with reference to the accompanying drawings.

As shown in fig. 3 and 4, a conveying arm structure for improving the temperature difference between a conveying arm and a carrying disc comprises a ceramic arm main body, wherein the ceramic arm main body is provided with a carrying disc bearing area 101 and a heat dissipation area 102, the ceramic arm main body is provided with a heat conduction strip 103, and the heat conduction strip 103 extends from the surface of the carrying disc bearing area 101 on the ceramic arm main body to the surface of the heat dissipation area 102.

Furthermore, the ceramic arm main body is provided with an embedded groove 104, and the heat conduction strip 103 is embedded in the embedded groove 104 on the ceramic arm main body.

Further, the surface of the heat conducting strip 103 is even with the surface of the transfer arm 100.

Further, the heat conducting strips 103 and the wafer carrier 200 are made of the same material and are made of aluminum.

As shown in fig. 5, 6 and 7, the shape of the heat conducting strip 103 may take various shapes, including but not limited to a parallel line shape, a zigzag shape, and a zigzag shape.

As shown in fig. 3 and 4, a method for improving the temperature difference between the transfer arm and the wafer carrier is to dispose a heat conducting strip 103 on the surface of the transfer arm 100, the material of which is the same as that of the wafer carrier 200, and fix the heat conducting strip 103 on the surface of the transfer arm 100 contacting the wafer carrier 200.

For the ultrathin sheet process, the heat generated when the aluminum wafer carrying disc and the ceramic transmission arm are contacted can not be effectively conducted away due to different heat conducting properties of the materials of the aluminum wafer carrying disc and the ceramic transmission arm. The utility model discloses based on reduce the difference in temperature as the starting point, inlayed aluminium matter heat conduction strip 103 on the pottery conveying arm, because aluminium matter heat conduction strip 103 and aluminium matter wafer carry the dish for the same kind of material, therefore come from the heat that carries on the dish and can lead away through the aluminium matter strip on the arm, reduced the difference in temperature between year dish and arm. The problem that heat accumulation originally exists between the aluminum wafer carrying disc and the ceramic transmission arm is effectively solved, so that the heat can be quickly dissipated, and the curling phenomenon of the ultrathin sheet caused by difficulty in heat dissipation is inhibited.

The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.

Claims

1. The utility model provides an improve conveying arm structure that difference in temperature between conveying arm and the year dish which characterized in that: including ceramic arm main part, ceramic arm main part is equipped with year dish bearing district and radiating area, be equipped with heat conduction strip in the ceramic arm main part, heat conduction strip extends to the radiating area surface from year dish bearing district surface in the ceramic arm main part.

2. The structure of claim 1, wherein the transfer arm comprises a first arm and a second arm, and the first arm comprises a first arm and a second arm, and the second arm comprises a first arm and a second arm, and the first arm comprises a first arm and a second arm, the second arm comprises a first arm and a second arm, the first arm and the second arm are connected to the first arm, the second arm comprises a first arm and a second arm, the first arm and the second arm are connected to the first arm, the second arm are connected to the second arm, the first arm and the second arm are connected to the second arm, and the second arm are connected to the second arm respectively: the ceramic arm body is provided with an embedded groove, and the heat conducting strip is embedded in the embedded groove in the ceramic arm body.

3. The structure of claim 1, wherein the transfer arm comprises a first arm and a second arm, and the first arm comprises a first arm and a second arm, and the second arm comprises a first arm and a second arm, and the first arm comprises a first arm and a second arm, the second arm comprises a first arm and a second arm, the first arm and the second arm are connected to the first arm, the second arm comprises a first arm and a second arm, the first arm and the second arm are connected to the first arm, the second arm are connected to the second arm, the first arm and the second arm are connected to the second arm, and the second arm are connected to the second arm respectively: the surface of the heat conducting strip is level with the surface of the conveying arm.

4. The structure of claim 1, wherein the transfer arm comprises a first arm and a second arm, and the first arm comprises a first arm and a second arm, and the second arm comprises a first arm and a second arm, and the first arm comprises a first arm and a second arm, the second arm comprises a first arm and a second arm, the first arm and the second arm are connected to the first arm, the second arm comprises a first arm and a second arm, the first arm and the second arm are connected to the first arm, the second arm are connected to the second arm, the first arm and the second arm are connected to the second arm, and the second arm are connected to the second arm respectively: the heat conducting strip and the wafer carrying disc are made of the same materials and are made of aluminum materials.

5. The structure of claim 1, wherein the transfer arm comprises a first arm and a second arm, and the first arm comprises a first arm and a second arm, and the second arm comprises a first arm and a second arm, and the first arm comprises a first arm and a second arm, the second arm comprises a first arm and a second arm, the first arm and the second arm are connected to the first arm, the second arm comprises a first arm and a second arm, the first arm and the second arm are connected to the first arm, the second arm are connected to the second arm, the first arm and the second arm are connected to the second arm, and the second arm are connected to the second arm respectively: the shape of the heat conducting strip is a parallel line shape, a zigzag shape or a zigzag shape.