CN215220269U - Modularized disk array - Google Patents

Abstract

The utility model discloses a modularization disk array, concretely relates to storage device technical field, including the interior casing that is used for placing and fixed single disk, with two interior framework fixed component holistic modularization casing, inside sunken screw hole has been seted up to modularization casing both sides edge, the modularization casing can freely set for quantity and realize the modularization equipment through the screw hole according to the user demand be provided with the heat conduction spare that is used for conducting heat between two inside interior frameworks of modularization casing. The utility model discloses utilize and compress tightly two interior casings of a extrusion, make its and two heat-conducting piece laminating between the interior casing inseparable, let the heat-conducting piece can be effectual in two interior casings hard disk conduct to the outside of modularization casing at the heat that the during operation produced, when effectually reducing whole modularization shell structure size, guaranteed the radiating effect for the modularization casing after reducing is convenient for carry out the modularization equipment, and area is little.

Description

Modularized disk array

Technical Field

The utility model relates to a storage device technical field, more specifically say, the utility model relates to a modularization disk array.

Background

A disk array is a system that integrates several hard disk drives as a whole as required and is managed by an array controller. Redundant Array of Independent Disks (RAID) is a large-scale disk assembly composed of a plurality of Inexpensive Disks with small capacity, high stability and low speed, and the performance of the entire disk system is enhanced by the additive effect of data provided by individual Disks.

The existing disk array adopts an external large metal shell to uniformly place and manage a plurality of disks. The clearance is big in order to keep ventilating heat dissipation between disk and the disk for whole disk array area is big, is difficult for carrying, can't realize the modularization equipment, and the practicality is low.

SUMMERY OF THE UTILITY MODEL

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a modularization disk array, includes the workstation, including the interior casing that is used for placing and fixed single disk, with two interior framework fixed component holistic modularization casings, inside sunken screw hole has been seted up to modularization casing both sides edge, the modularization casing can be according to user demand freely set for quantity and realize the modularization equipment through the screw hole be provided with the heat-conduction piece that is used for the heat conduction between the inside two interior frameworks of modularization casing, the heat-conduction piece runs through the outside that extends to the modularization casing, with the heat conduction of the inside disk of interior casing extremely the outside of modularization casing, be provided with on the modularization shells inner wall and compress tightly the piece for exert pressure to the inside interior casing of modularization casing and make it inseparable with the laminating of heat-conduction piece, realize thermal high-efficient conduction.

In a preferred embodiment, the inner housing is provided with a removable housing cover, and the housing cover and two side walls of the inner housing are attached to the inner wall of the modular housing.

In a preferred embodiment, heat-conducting piece includes soaking board, briquetting, heat dissipation copper pipe and semiconductor refrigeration piece, the soaking board inlays to be established on the outer wall that shell lid one side was kept away from to the casing including, the heat dissipation copper pipe inlays to be established on the modularization casing and one end is located the inside of modularization casing, the other end extends to the outside of modularization casing, the briquetting passes through reflow soldering and welds the outside that is located the inside one end of modularization casing at the heat dissipation copper pipe, two the soaking board on the interior casing supports the briquetting and presses and spacing between two soaking boards, the both sides wall of briquetting is laminated respectively on the outer wall of both sides soaking board.

In a preferred embodiment, the semiconductor refrigeration piece is installed on the outer wall of modularization casing, the one end welding that the heat dissipation copper pipe is located the outside of modularization casing is on the semiconductor refrigeration piece, the soaking plate is located and has laminated the heat conduction silica gel subsides on the inside lateral wall of interior casing, and the laminating of heat conduction silica gel is in the outside of disk.

In a preferred embodiment, a detachable housing cover is provided on the modular housing, and the pressing member is located on an end face of the modular housing, on which the housing cover is detached.

In a preferred embodiment, the pressing member includes a sliding groove formed on an inner wall of the modular housing, a connecting block connected to two side walls of the inner housing, a threaded pipe fixed to the connecting block, a threaded rod inserted into the threaded pipe and rotatable, and a bearing fixed to an end of the threaded rod, the sliding groove is communicated with a space inside the modular housing, and the bearing is mounted on an end surface of the sliding groove at one end inside the modular housing.

In a preferred embodiment, the end of the threaded rod remote from the bearing is provided with a thread groove for rotating the threaded rod.

The utility model discloses a technological effect and advantage:

this practicality utilizes to compress tightly two interior casings of piece extrusion, makes its and two heat-conducting piece laminating between the interior casing inseparable, lets the heat-conducting piece can be effectual with two interior casings in the heat conduction to the outside of modularization casing that the during operation produced of hard disk, when effectually reducing whole modularization shell structure size, guaranteed the radiating effect for the modularization casing after reducing is convenient for carry out the modularization equipment, and area is little, portable has promoted the practicality.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention.

Fig. 2 is a schematic structural view of the two modular housings of the present invention when they are assembled in a modular manner.

The reference signs are: 1 inner shell, 2 modularization shells, 3 screw holes, 4 heat conduction pieces, 5 pressing pieces, 6 shell covers, 7 soaking plates, 8 pressing pieces, 9 heat dissipation copper pipes, 10 semiconductor refrigeration pieces, 11 shell covers, 12 sliding grooves, 13 connecting blocks, 14 threaded pipes, 15 threaded rods, 16 bearings, 17 screw grooves and 18 heat conduction silica gel pastes.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1-2, a modular disk array includes an inner housing 1 for placing and fixing a single disk, and a modular housing 2 for fixing two inner housings into a whole, wherein two edges of two sides of the modular housing 2 are provided with inwardly recessed screw holes 3, the modular housing 2 can be freely set in quantity according to the use requirement and can be modularly assembled through the screw holes 3, a heat conduction member 4 for conducting heat is disposed between two inner housings inside the modular housing 2, the heat conduction member 4 extends through the outside of the modular housing 2 to conduct the heat of the disk inside the inner housing 1 to the outside of the modular housing 2, a pressing member 5 is disposed on the inner wall of the modular housing 2 for pressing the inner housing 1 inside the modular housing 2 to make it tightly fit with the heat conduction member 4, the high-efficiency heat conduction is realized;

when using, place the disk in casing 1 including, place the inside in modularization casing 2 with two inner frame bodies again, utilize to compress tightly 5 extrusion two interior casings 1, make it inseparable with the laminating of heat-conducting piece 4 between two interior casings 1, let heat-conducting piece 4 can effectually conduct the outside to modularization casing 2 with the heat that hard disk produced at the during operation in two interior casings 1, in effectual whole modularization casing 2 structure size that reduces, the radiating effect has been guaranteed, make modularization casing 2 after reducing be convenient for carry out the modularization equipment, floor area uses.

When carrying out the modularization equipment, modularization casing 2 adopts external connecting plate, leans on two modularization casings 2 together, and the screw hole 3 of both sides lies in same straight line with one side, with the connecting plate laminating in the junction of two modularization casings 2, then adopts bolt through-connection board to extend to screw hole 3 in and fixed, links together two modularization casings 2, accomplishes the modularization equipment.

The inner shell body 1 is provided with a detachable shell cover 6, the shell cover 6 and two side walls of the inner shell body 1 are attached to the inner wall of the modularized shell body 2, and a magnetic disk is installed inside the inner shell body 1 by detaching the shell cover 6.

The heat conduction piece 4 comprises vapor chambers 7, pressing blocks 8, heat dissipation copper pipes 9 and semiconductor refrigeration pieces 10, the vapor chambers 7 are embedded in the outer wall of the inner shell 1 far away from one side of the shell cover 6, the heat dissipation copper pipes 9 are embedded in the modular shell 2, one end of each heat dissipation copper pipe is located inside the modular shell 2, the other end of each heat dissipation copper pipe extends to the outside of the modular shell 2, the pressing blocks 8 are welded outside one end of each heat dissipation copper pipe 9 located inside the modular shell 2 through reflow soldering, the two vapor chambers 7 on the inner shell 1 press the pressing blocks 8 to be limited between the two vapor chambers 7, and two side walls of the pressing blocks 8 are respectively attached to the outer walls of the vapor chambers 7 on two sides;

in the use, when the user makes its to the interior casing 1 of opposite side when moving through pressing the 5 interior casings 1 that extrude the outside of piece, can make two soaking plates 7 on the interior casing 1 extrude briquetting 8 each other and the laminating is inseparable, and at this in-process, the user still can paint heat conduction silicone grease on the outer wall of briquetting 8 and soaking plate 7, it is even to paint in the gap between briquetting 8 and soaking plate 7 through extrusion soaking plate 7 and briquetting 8 messenger heat conduction silicone grease, fill the gap between the two, further promote the radiating efficiency of briquetting 8 and heat dissipation copper pipe 9.

The semiconductor refrigeration piece 10 is arranged on the outer wall of the modular shell 2, one end, located outside the modular shell 2, of the heat dissipation copper pipe 9 is welded to the semiconductor refrigeration piece 10, the side wall, located inside the inner shell 1, of the vapor chamber 7 is attached with a heat conduction silica gel paste 18, and the heat conduction silica gel paste 18 is attached to the outside of a magnetic disk;

the heat conduction silica gel that sets up pastes 18 can reduce the gap between magnetic disc and the vapor chamber 7, makes its laminating inseparabler, is favorable to thermal conduction, and heat dissipation copper pipe 9 welds inside briquetting 8, conducts the outside to modularization casing 2 with the heat that briquetting 8 conducted, accomplishes quick heat dissipation through the semiconductor refrigerant for modularization casing 2 is carrying out the in-process of modularization equipment, can not have the heat dissipation bottleneck.

The modularized housing 2 is provided with a detachable housing cover 11, the pressing member 5 is located on the end face of the modularized housing 2 after the housing cover 11 is detached, and the inner housing 1 is installed inside the modularized housing 2 by detaching the housing cover 11.

The pressing piece 5 comprises a sliding groove 12 formed in the inner wall of the modular shell 2, connecting blocks 13 connected to two side walls of the inner shell 1, a threaded pipe 14 fixed on the connecting block 13, a rotatable threaded rod 15 inserted in the threaded pipe 14 and a bearing 16 fixed at the end part of the threaded rod 15, the sliding groove 12 is communicated with the space inside the modular shell 2, the bearing 16 is installed on the end face of the sliding groove 12 at one end inside the modular shell 2, and a threaded groove 17 used for rotating the threaded rod 15 is formed in one end, far away from the bearing 16, of the threaded rod 15;

the user adopts the screwdriver effect to drive threaded rod 15 at screwed pipe 14 and bearing 16 internal rotation on spiral groove 17, because screwed pipe 14 is fixed on the outer wall of interior casing 1 through connecting block 13, consequently when the user rotated threaded rod 15, threaded rod 15 can drive threaded rod 15 and remove in threaded rod 15 outside, the direction of rotation of control threaded rod 15 can drive interior casing 1 and remove to the heat-conducting piece 4 at middle part, realize two effects that interior casing 1 compresses tightly heat-conducting piece 4.

The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;

secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are referred to, and other structures can refer to the common design, and under the condition of no conflict, the same embodiment and different embodiments of the present invention can be combined with each other;

and finally: the above description is only for the preferred embodiment of the present invention and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (7)

1. A modular disk array, comprising: including the interior casing that is used for placing and fixed single disk, with two interior framework fixed component holistic modularization casings, inside sunken screw hole has been seted up to modularization casing both sides edge, the modularization casing can freely set for quantity and realize the modularization equipment through the screw hole according to the user demand be provided with the heat-conducting piece that is used for conducting heat between two interior frameworks inside the modularization casing, the heat-conducting piece runs through the outside that extends to the modularization casing, with the heat conduction of the inside disk of interior casing extremely the outside of modularization casing, be provided with on the modularization shells inner wall and compress tightly the piece for exert pressure and make its inseparable with the laminating of heat-conducting piece to the inside interior casing of modularization casing, realize thermal high-efficient conduction.

2. The modular disk array of claim 1, wherein: the inner shell is provided with a detachable shell cover, and the shell cover and two side walls of the inner shell are attached to the inner wall of the modularized shell.

3. A modular disk array as in claim 2, wherein: the heat-conducting piece includes soaking board, briquetting, heat dissipation copper pipe and semiconductor refrigeration piece, the soaking board inlays to be established on the outer wall that the casing kept away from casing one side including on, the heat dissipation copper pipe inlays to be established on the modularization casing and one end is located modularization casing inside, the other end extends to the modularization casing outside, the briquetting passes through reflow soldering and welds the outside that is located the inside one end of modularization casing at the heat dissipation copper pipe, two the soaking board on the interior casing supports the briquetting and presses and spacing between two soaking boards, the both sides wall of briquetting is laminated respectively on the outer wall of both sides soaking board.

4. A modular disk array as in claim 3 wherein: semiconductor refrigeration piece is installed on the outer wall of modularization casing, the one end welding that the heat dissipation copper pipe is located the outside of modularization casing is on semiconductor refrigeration piece, the soaking plate is located and has laminated heat conduction silica gel subsides on the inside lateral wall of interior casing, and the laminating of heat conduction silica gel subsides is in the outside of disk.

5. The modular disk array of claim 1, wherein: the modularized shell is provided with a detachable shell cover, and the pressing piece is located on the end face of the modularized shell after the shell cover is detached.

6. The modular disk array of claim 5, wherein: the pressing piece comprises a sliding groove formed in the inner wall of the modularized shell, a connecting block connected to the two side walls of the inner shell, a threaded pipe fixed on the connecting block, a rotatable threaded rod inserted in the threaded pipe and a bearing fixed at the end of the threaded rod, the sliding groove is communicated with the space inside the modularized shell, and the bearing is installed on the end face, located at one end of the modularized shell, of the sliding groove.

7. The modular disk array of claim 6, wherein: and one end of the threaded rod, which is far away from the bearing, is provided with a screw groove for rotating the threaded rod.

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