CN215216761U - Semiconductor water cooling plant - Google Patents
Semiconductor water cooling plant Download PDFInfo
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- CN215216761U CN215216761U CN202120722427.8U CN202120722427U CN215216761U CN 215216761 U CN215216761 U CN 215216761U CN 202120722427 U CN202120722427 U CN 202120722427U CN 215216761 U CN215216761 U CN 215216761U
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- heat dissipation
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- water cooling
- cooling device
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Abstract
The utility model provides a semiconductor water cooling device, which comprises a base, a semiconductor refrigeration piece arranged on the base and a heat dissipation part arranged at the hot end of the semiconductor refrigeration piece; the heat dissipation part comprises a heat dissipation seat and a cover body, wherein the heat dissipation seat is connected with the cold end of the semiconductor; the heat dissipation seat is provided with a heat dissipation cavity, and the bottom of the heat dissipation cavity is provided with a plurality of heat dissipation grooves; the cold end of the semiconductor refrigeration piece is connected with the base. The utility model can refrigerate through the semiconductor refrigerating sheet and can be connected with external equipment through the base, thereby providing refrigeration for the external equipment; the heat dissipation part is arranged, so that the heat end of the semiconductor refrigeration sheet can be cooled through the heat dissipation part; set up heat dissipation chamber and a plurality of radiating groove, can effectively increase the area of contact of radiating part and coolant liquid, effectively improve the radiating efficiency of coolant liquid to semiconductor refrigeration piece, more convenient to use.
Description
Technical Field
The utility model relates to a semiconductor refrigerating plant technical field especially relates to a semiconductor water cooling plant.
Background
The existing semiconductor refrigeration device adopts a heat radiating fin and a heat radiating fan to radiate heat through a hot end; the efficiency is low in the aspect of heat dissipation, and the use is not facilitated.
SUMMERY OF THE UTILITY MODEL
The utility model provides a semiconductor water cooling device for solving the technical problem of poor heat dissipation performance of the existing semiconductor refrigerating device.
The utility model provides a semiconductor water cooling device, which comprises a base, a semiconductor refrigeration piece arranged on the base and a heat dissipation part arranged at the hot end of the semiconductor refrigeration piece; the heat dissipation part comprises a heat dissipation seat and a cover body, wherein the heat dissipation seat is connected with the cold end of the semiconductor; the heat dissipation seat is provided with a heat dissipation cavity for containing cooling liquid, and the bottom of the heat dissipation cavity is provided with a plurality of heat dissipation grooves; the cold end of the semiconductor refrigeration piece is connected with the base.
Furthermore, the bottom of the heat dissipation cavity is also provided with a plurality of heat dissipation columns, and the heat dissipation columns are arranged between adjacent heat dissipation grooves.
Furthermore, the cavity bottom of the heat dissipation cavity is gradually recessed towards the center along the periphery.
Further, the heat dissipation seat is also provided with a sealing groove, and a sealing ring is arranged in the sealing groove.
Further, the lid be equipped with the water inlet and the delivery port of heat dissipation chamber intercommunication.
Furthermore, the heat dissipation seat is also provided with a temperature sensor.
The utility model has the advantages that: the utility model can refrigerate through the semiconductor refrigerating sheet and can be connected with external equipment through the base, thereby providing refrigeration for the external equipment; the heat dissipation part is arranged, so that the heat end of the semiconductor refrigeration sheet can be cooled through the heat dissipation part; set up heat dissipation chamber and a plurality of radiating groove, can effectively increase the area of contact of radiating part and coolant liquid, effectively improve the radiating efficiency of coolant liquid to semiconductor refrigeration piece, more convenient to use.
Drawings
Fig. 1 is a perspective view of an embodiment of the semiconductor water cooling device of the present invention.
Fig. 2 is a perspective view of another embodiment of the semiconductor water cooling device of the present invention.
Fig. 3 is a perspective view of another embodiment of the semiconductor water cooling device of the present invention.
Fig. 4 is a perspective view of an embodiment of a heat sink of the semiconductor water cooling device of the present invention.
Fig. 5 is a perspective view of another embodiment of the heat sink of the semiconductor water cooling device of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The present invention will be described in further detail with reference to the accompanying drawings.
As shown in fig. 1 to 5, the utility model provides a semiconductor water cooling device, which comprises a base 1, a semiconductor refrigeration sheet 11 arranged on the base 1 and a heat dissipation part arranged at the cold end of the semiconductor refrigeration sheet 11; the heat dissipation part comprises a heat dissipation seat 2 and a cover body 3 which are connected with the cold end of the semiconductor; the heat dissipation seat 2 is provided with a heat dissipation cavity for containing cooling liquid, and the bottom of the heat dissipation cavity is provided with a plurality of heat dissipation grooves 21; the cold end of the semiconductor refrigeration sheet 11 is connected with the base 1.
The utility model refrigerates through the semiconductor refrigeration piece 11, and can be connected with external equipment through the base 1, thereby providing refrigeration for the external equipment; the heat dissipation part is arranged, so that the heat end of the semiconductor refrigeration sheet 11 can be cooled through heat dissipation; set up heat dissipation chamber and a plurality of radiating groove 21, can effectively increase the area of contact of radiating part and coolant liquid, effectively improve the radiating efficiency of coolant liquid to semiconductor refrigeration piece 11, more convenient to use.
In an alternative embodiment, the bottom of the heat dissipation cavity is further provided with a plurality of heat dissipation studs 22, and the heat dissipation studs 22 are arranged between adjacent heat dissipation grooves 21. In this embodiment, the heat dissipation studs 22 are installed on the wall of the slot between the adjacent heat dissipation slots 21, and the heat dissipation studs 22 are arranged to further increase the contact area with the coolant, thereby further improving the heat dissipation efficiency of the coolant.
In an optional embodiment, the cavity bottom of the heat dissipation cavity is gradually recessed towards the center along the periphery. The bottom that refrigerates strongly is concave towards the center for the chamber end is the slope form, can further increase the area at the bottom of the chamber, thereby the effectual area of contact who improves the chamber end and coolant liquid further promotes the radiating efficiency.
In an alternative embodiment, the heat sink 2 is further provided with a sealing groove 24, and the sealing ring 23 is arranged in the sealing groove 24. The sealing ring 23 is arranged, so that the sealing performance between the cover body 3 and the heat radiating seat 2 can be effectively improved, and the leakage of cooling liquid is prevented.
In an alternative embodiment, the cover 3 is provided with a water inlet 31 and a water outlet 32 communicating with the heat dissipation chamber. The water inlet 31 and the water outlet 32 are arranged, so that the cooling liquid circulation device is convenient to connect with the cooling liquid circulation device, the cooling liquid flows circularly, and the heat dissipation effect is achieved.
In an alternative embodiment, the heat sink 2 is further provided with a temperature sensor 4. Set up temperature-sensing ware 4, can carry out real time monitoring to the temperature of radiating part to carry out real-time control to the temperature of coolant liquid, the user of also being convenient for adjusts the circulation efficiency of coolant liquid, thereby provides the heat dissipation of different efficiency.
In the description herein, references to the description of the terms "one embodiment," "some embodiments," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is a more detailed description of the present invention that is presented in conjunction with specific embodiments, and it is not to be understood that the specific embodiments of the present invention are limited to these descriptions. To the utility model belongs to the technical field of ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement.
Claims (6)
1. The semiconductor water cooling device is characterized by comprising a base, a semiconductor refrigerating sheet arranged on the base and a heat radiating part arranged at the hot end of the semiconductor refrigerating sheet; the heat dissipation part comprises a heat dissipation seat and a cover body, wherein the heat dissipation seat is connected with the cold end of the semiconductor; the heat dissipation seat is provided with a heat dissipation cavity for containing cooling liquid, and the bottom of the heat dissipation cavity is provided with a plurality of heat dissipation grooves; the cold end of the semiconductor refrigeration piece is connected with the base.
2. The semiconductor water cooling device according to claim 1, wherein the bottom of the heat dissipation chamber is further provided with a plurality of heat dissipation pillars, and the heat dissipation pillars are arranged between adjacent heat dissipation grooves.
3. The semiconductor water cooling device according to claim 1, wherein the cavity bottom of the heat dissipation cavity is gradually recessed toward the center along the periphery.
4. The semiconductor water cooling device according to claim 1, wherein the heat sink is further provided with a sealing groove, and a sealing ring is arranged in the sealing groove.
5. The semiconductor water cooling device according to claim 1, wherein the cover body is provided with a water inlet and a water outlet which are communicated with the heat dissipation chamber.
6. The semiconductor water cooling device according to claim 1, wherein the heat sink is further provided with a temperature sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120722427.8U CN215216761U (en) | 2021-04-09 | 2021-04-09 | Semiconductor water cooling plant |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120722427.8U CN215216761U (en) | 2021-04-09 | 2021-04-09 | Semiconductor water cooling plant |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215216761U true CN215216761U (en) | 2021-12-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120722427.8U Active CN215216761U (en) | 2021-04-09 | 2021-04-09 | Semiconductor water cooling plant |
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| CN (1) | CN215216761U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114828594A (en) * | 2022-06-07 | 2022-07-29 | 珠海格莱克科技有限公司 | Heat dissipation device, heat dissipation system and electrical equipment |
-
2021
- 2021-04-09 CN CN202120722427.8U patent/CN215216761U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114828594A (en) * | 2022-06-07 | 2022-07-29 | 珠海格莱克科技有限公司 | Heat dissipation device, heat dissipation system and electrical equipment |
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