CN215203222U

CN215203222U - Mobile phone part mold blank capable of being cooled quickly

Info

Publication number: CN215203222U
Application number: CN202121348236.6U
Authority: CN
Inventors: 段常娥
Original assignee: Songjia Precision Technology Dongguan Co ltd
Current assignee: Songjia Precision Technology Dongguan Co ltd
Priority date: 2021-06-17
Filing date: 2021-06-17
Publication date: 2021-12-17
Anticipated expiration: 2031-06-17

Abstract

The utility model discloses a mobile phone part mould blank capable of being cooled rapidly, which belongs to the field of mobile phones and aims to solve the problems that when the existing mould blank for producing mobile phone parts is used, the heat dissipation effect is poor, the cooling rate is slow, the cooling method is single, the demoulding is difficult, and the mobile phone parts are easy to be bonded with a mould cavity; the water cooling device, the thimble mechanism and the semiconductor refrigerating device are matched, so that the cold water can be used for carrying out circulating water cooling and rapid heat dissipation on the hand parts, the cooling efficiency is improved, the production efficiency is accelerated, meanwhile, the semiconductor refrigerator is used for manufacturing cold air, the cold air is conveyed to the hand parts by the conveying pipe, and the heat dissipation and cooling are carried out in two modes simultaneously, so that the rapid cooling of the hand parts is realized; the ejector pin mechanism can eject the die core, so that the stability during production is improved, the hand parts can be ejected when the die core falls, auxiliary demolding is realized, the hand parts are prevented from being bonded on the die core, the production quality of the hand parts is improved, and meanwhile, the hand parts can be conveniently demolded by rapidly cooling the hand parts.

Description

Mobile phone part mold blank capable of being cooled quickly

Technical Field

The utility model relates to a cell-phone field specifically is a cell-phone spare mould embryo that can fast cool.

Background

The mould blank is the outer forming part of the mould steel, namely the frame on the outermost side of the mould, and is used for positioning the mould, the inner part of the mould blank also comprises a mould core (namely a mould core) connecting rod, a heating rod, a flow channel, a cooling device, an ejector pin and the like, the mould core is arranged on the mould blank and used, a base of the mould is convenient for installing the mould, plays a role in supporting, protecting and connecting a key part (mould core) of the mould, the mould blank is a processing method used when producing some parts with complicated shapes in batch, the injection moulding process of the mould blank is to inject a material melted by heating into a mould cavity by high pressure, and a formed product is obtained after cooling and solidification. The hand parts are accessories required by the production of the mobile phone, the hand parts need to be cast by using the mold and the mold blank during the production, the existing mold blank for the production of the hand parts has the problem of poor heat dissipation effect during the use, the cooling rate is slow, the production efficiency of the hand parts is low, the cooling method is single, the demolding is difficult, the hand parts are easy to be bonded with the mold cavity, and the production quality of the hand parts is greatly reduced.

SUMMERY OF THE UTILITY MODEL

In view of the problems in the prior art, the utility model discloses a mobile phone part mold blank capable of being cooled rapidly, which adopts the technical proposal that the mold blank comprises an upper mold blank, a lower mold blank and a bottom plate, wherein the lower mold blank is arranged at the bottom of the lower mold blank, the bottom of the lower mold blank is provided with the bottom plate, the upper surface of the upper mold blank is provided with a squirt nozzle which can be directly contacted with a beer nozzle through the arrangement of the squirt nozzle, so that raw materials can conveniently and smoothly enter a cavity, the top of the squirt nozzle is provided with a positioning ring which can be used for positioning the beer nozzle through the arrangement of the positioning ring, the outer side of the squirt nozzle is arranged inside the upper mold blank and is provided with a water cooling device, through the arrangement of the water cooling device, cold water parts can be utilized for circulating water cooling heat dissipation of hands, the cooling efficiency of the hands is improved, the production efficiency is accelerated, the positioning cavities are arranged inside of the lower mold blank and the bottom plate, the upper surface of the bottom plate is provided with a thimble mechanism, the die core can be ejected out through the arrangement of the ejector pin mechanism, the stability during production is improved, meanwhile, the auxiliary demolding can be carried out, the mobile phone piece is prevented from being bonded on the die core, the production quality of the mobile phone piece is improved, the die core is arranged at the top of the ejector pin mechanism, the semiconductor refrigerating device is arranged inside the die core, through the arrangement of the semiconductor refrigerating device, the semiconductor refrigerating device can be used for manufacturing cold air, the cold air is conveyed to the mobile phone piece and is matched with the water cooling device for use, the two modes are simultaneously carried out for heat dissipation and cooling, the rapid cooling of the mobile phone piece is realized, and the demolding is convenient; the water cooling device, the thimble mechanism, the semiconductor refrigerating device and the microprocessor are electrically connected.

As a preferred technical scheme of the utility model, water cooling plant includes storage water tank, miniature pump and raceway, the inside of going up the mould embryo is provided with the storage water tank, the inside of storage water tank is provided with miniature pump, the raceway intercommunication is passed through to the both sides of storage water tank, miniature pump and microprocessor electric connection, through the setting of storage water tank, miniature pump and raceway, utilize cold water to carry out the cooling by water that circulates to the parts of the adversary's parts, improve its cooling efficiency for production efficiency.

As a preferred technical scheme of the utility model, one side of storage water tank is provided with the water filling port, the opposite side of storage water tank is provided with fin and louvre, one side of raceway is provided with the outlet, and through the setting of water filling port, fin, louvre and outlet, water in the storage water tank is conveniently changed to water filling port and outlet, and fin and louvre can dispel the heat to the water in the storage water tank, reduce the temperature, improve the cooling effect.

As a preferred technical scheme of the utility model, thimble mechanism includes thimble bottom plate, thimble panel, hydraulic stem and dead lever, the last fixed surface of bottom plate is connected with thimble bottom plate, thimble bottom plate's top is provided with thimble panel, bottom plate, thimble bottom plate and thimble panel's inside is run through there is the hydraulic stem, the top of hydraulic stem is connected with the lower fixed surface of mould benevolence, thimble panel's last fixed surface is connected with the dead lever, the dead lever runs through mould benevolence, hydraulic stem and microprocessor electric connection through the setting of thimble bottom plate, thimble panel, hydraulic stem and dead lever, can ejecting mould benevolence, stability when improving production, when simultaneously mould benevolence falls, the dead lever can eject the hand machine part, assists the drawing of patterns, avoids the hand machine part to bond on mould benevolence, improves the production quality of hand machine part.

As an optimal technical scheme of the utility model, semiconductor refrigerating plant includes semiconductor refrigerator, conveyer pipe and shelves net, the inside of mould benevolence is provided with semiconductor refrigerator, semiconductor refrigerator's top intercommunication has the conveyer pipe, the output of conveyer pipe is provided with the shelves net, semiconductor refrigerator and microprocessor electric connection through the setting of semiconductor refrigerator, conveyer pipe and shelves net, can utilize semiconductor refrigerator to make air conditioning, and the conveyer pipe is carried air conditioning for the hand parts, and the shelves net avoids the raw materials to get into the conveyer pipe, uses with the water cooling plant cooperation, and two kinds of modes dispel the heat simultaneously and cool off, have realized the quick cooling of hand parts, conveniently carry out the drawing of patterns.

As an optimized technical scheme of the utility model, it is provided with the die cavity to go up between mould embryo and the mould benevolence, purt mouth and die cavity intercommunication through the setting of die cavity, can make things convenient for the rapid prototyping of parts of the hand.

The utility model has the advantages that: the utility model discloses a water cooling plant, thimble mechanism and semiconductor refrigerating plant's cooperation setting, water cooling plant utilizes the cold water in the storage water tank to carry out the quick heat dissipation of circulating water cooling to the parts, improves its cooling efficiency, accelerates production efficiency, semiconductor refrigerating plant can utilize the semiconductor refrigerator to make air conditioning, the conveyer pipe is carried the air conditioning to the parts of the hand, the shelves net avoids the raw materials to get into the conveyer pipe, uses with the water cooling plant cooperation, two kinds of modes carry out the cooling of dispelling the heat simultaneously, realized the quick cooling of parts of the hand; the ejector pin mechanism can eject the die core, so that the stability during production is improved, and meanwhile, when the die core falls down, the hand parts can be ejected, so that auxiliary demolding is realized, the hand parts are prevented from being bonded on the die core, the production quality of the hand parts is improved, and meanwhile, the hand parts can be conveniently demolded by rapidly cooling the hand parts.

Drawings

FIG. 1 is a schematic view of the cross-sectional structure of the present invention;

FIG. 2 is a schematic view of the structure of the present invention;

fig. 3 is an enlarged schematic view of the a position of the present invention.

In the figure: 1-upper mould blank, 2-lower mould blank, 3-bottom plate, 4-squirt nozzle, 5-positioning ring, 6-water cooling device, 601-water storage tank, 602-micro water pump, 603-water delivery pipe, 7-positioning cavity, 8-thimble mechanism, 801-thimble bottom plate, 802-thimble panel, 803-hydraulic rod, 804-fixed rod, 9-mould core, 10-semiconductor refrigerating device, 1001-semiconductor refrigerator, 1002-delivery pipe, 1003-blocking net, 11-water injection port, 12-radiating fin, 13-radiating hole, 14-water discharge port and 15-mould cavity.

Detailed Description

Example 1

As shown in fig. 1 to 3, the utility model discloses a mobile phone part mold blank capable of being cooled rapidly, which adopts the technical scheme that the mold blank comprises an upper mold blank 1, a lower mold blank 2 and a bottom plate 3, wherein the lower mold blank 2 is arranged at the bottom of the lower part of the upper mold blank 1, the bottom plate 3 is arranged at the bottom of the lower mold blank 2, a squirt nozzle 4 is arranged on the upper surface of the upper mold blank 1, a positioning ring 5 is arranged at the top of the squirt nozzle 4, the squirt nozzle 4 and the positioning ring 5 can align and position the nozzle of the beer machine and directly contact with the nozzle of the beer machine, so that raw materials can smoothly enter a cavity 15 from the squirt nozzle 4, a water cooling device 6 is arranged at the outer side of the squirt nozzle 4, after the raw materials are injected, the water cooling device 6 is opened, cold water is utilized for circulating water cooling heat dissipation of the hand parts, the cooling efficiency is improved, the production efficiency is accelerated, a positioning cavity 7 is arranged inside the lower mold blank 2 and the bottom plate 3, the positioning cavity 7 can limit and position the mold core 9, the top surface of the bottom plate 3 is provided with the thimble mechanism 8, the thimble mechanism 8 can eject the mold core 9, the stability during production is improved, meanwhile, the hand parts can be ejected for auxiliary demolding, the adhesion of the hand parts on the mold core 9 is avoided, the top of the thimble mechanism 8 is provided with the mold core 9, the interior of the mold core 9 is provided with the semiconductor refrigerating device 10, the semiconductor refrigerating device 10 can be used for manufacturing cold air, the cold air is conveyed to the hand parts and is matched with the water cooling device 6 for use, the two modes are used for radiating and cooling at the same time, the rapid cooling of the hand parts is realized, and the demolding is convenient; the water cooling device is characterized by further comprising a control device, wherein a microprocessor is arranged in the control device, and the water cooling device 6, the thimble mechanism 8, the semiconductor refrigerating device 10 and the microprocessor are electrically connected.

As a preferred technical scheme of the utility model, water cooling plant 6 includes storage water tank 601, micro water pump 602 and raceway 603, the inside of going up mould embryo 1 is provided with storage water tank 601, storage water tank 601's inside is provided with micro water pump 602, raceway 603 intercommunication is passed through to storage water tank 601's both sides, micro water pump 602 and microprocessor electric connection, after the completion of moulding plastics, open micro water pump 602, in micro water pump 602 will the cold water suction raceway 603 in the storage water tank 601, carry out the water-cooling heat dissipation that circulates to the parts of the hand, improve its cooling efficiency for production efficiency.

As a preferred technical scheme of the utility model, one side of storage water tank 601 is provided with water filling port 11, storage water tank 601's opposite side is provided with fin 12 and louvre 13, one side of raceway 603 is provided with outlet 14, and water in storage water tank 601 is conveniently in time changed with outlet 14 to water filling port 11, and fin 12 and louvre 13 can last the heat dissipation to the water in storage water tank 601, reduce the temperature, improve its cooling effect.

As a preferred technical solution of the present invention, the thimble mechanism 8 includes a thimble bottom plate 801, a thimble panel 802, a hydraulic rod 803 and a fixing rod 804, the upper surface of the bottom plate 3 is fixedly connected with the thimble bottom plate 801, the thimble panel 802 is disposed above the thimble bottom plate 801, the hydraulic rod 803 penetrates through the insides of the bottom plate 3, the thimble bottom plate 801 and the thimble panel 802, the top of the hydraulic rod 803 is fixedly connected with the lower surface of the mold insert 9, the fixing rod 804 is fixedly connected with the upper surface of the thimble panel 802, the fixing rod 804 penetrates through the mold insert 9, the hydraulic rod 803 is electrically connected with the microprocessor, when injecting, the hydraulic rod 803 ejects the mold insert 9, the stability of the mold insert 9 is improved, after cooling is completed, the hydraulic rod 803 lowers the mold insert 9, the fixing rod 804 can eject a hand piece to assist in demolding, so as to avoid the hand piece from being adhered to the mold insert 9, the production quality of the mobile parts is improved.

As an optimal technical scheme of the utility model, semiconductor refrigerating plant 10 includes semiconductor refrigerator 1001, conveyer pipe 1002 and shelves net 1003, the inside of mould benevolence 9 is provided with semiconductor refrigerator 1001, semiconductor refrigerator 1001's top intercommunication has conveyer pipe 1002, conveyer pipe 1002's output is provided with shelves net 1003, semiconductor refrigerator 1001 and microprocessor electric connection, the completion back of moulding plastics, open semiconductor refrigerator 1001 and make air conditioning, conveyer pipe 1002 carries air conditioning for the hand parts, and shelves net 1003 avoids the raw materials to get into conveyer pipe 1002, uses with the cooperation of water cooling plant 6, and the cooling that dispels the heat simultaneously of dual mode has realized the quick cooling of hand parts, conveniently carries out the drawing of patterns.

As an optimal technical scheme of the utility model, go up and be provided with die cavity 15 between mould embryo 1 and the mould benevolence 9, purt mouth 4 and die cavity 15 intercommunication, die cavity 15 can be when moulding plastics convenient hand parts rapid prototyping.

The utility model discloses a theory of operation: firstly, a beer nozzle is put into a squirt nozzle 4 to inject raw materials, the squirt nozzle 4 and a positioning ring 5 can align and position the beer nozzle and directly contact the beer nozzle to facilitate the raw materials to smoothly enter a cavity 15 from the squirt nozzle 4, after the raw materials are injected, a water cooling device 6 and a semiconductor refrigerating device 10 are opened, a micro water pump 602 of the water cooling device 6 pumps cold water in a water storage tank 601 into a water conveying pipe 603 to circularly cool and radiate the mobile parts, so that the cooling efficiency is improved, the production efficiency is accelerated, a water filling port 11 and a water discharging port 14 facilitate the timely replacement of water in the water storage tank 601, a radiating fin 12 and a radiating hole 13 can continuously radiate the water in the water storage tank 601, the water temperature is reduced, the cooling effect is improved, a semiconductor refrigerator 1001 of the semiconductor refrigerating device 10 produces cold air, the conveying pipe 1002 conveys the cold air to the mobile parts, and a baffle net 1003 prevents the raw materials from entering the conveying pipe 1002, the cooling device is matched with the water cooling device 6 for use, the two modes are used for cooling and radiating simultaneously, the fast cooling of the mobile phone parts is realized, the demoulding is convenient, after the cooling is finished, the hydraulic rod 803 lowers the die core 9, the fixing rod 804 can eject the mobile phone parts for auxiliary demoulding, the mobile phone parts are prevented from being bonded on the die core 9, and the production quality of the mobile phone parts is improved.

The microprocessor adopts an Itemel 89C51 type singlechip for controlling the miniature water pump, the hydraulic rod and the semiconductor refrigerator, and the pins and the connection mode of 89C51 can be referred by technicians in the field to obtain technical inspiration by referring to teaching materials or technical manuals published by manufacturers; the circuit connection of the present invention is a conventional method adopted by those skilled in the art, and can be suggested by limited tests, which belongs to the common knowledge.

Components not described in detail herein are prior art.

Although the present invention has been described in detail with reference to the specific embodiments, the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge range of those skilled in the art, and modifications or variations without creative efforts are still within the scope of the present invention.

Claims

1. The utility model provides a cell-phone spare mould embryo that can fast cool, includes mould embryo (1), lower mould embryo (2) and bottom plate (3), it has lower mould embryo (2) to go up mould embryo (1) below bottom, the bottom of lower mould embryo (2) is provided with bottom plate (3), its characterized in that: the upper surface of the upper die blank (1) is provided with a sprue bushing (4), the top of the sprue bushing (4) is provided with a positioning ring (5), the outer side of the sprue bushing (4) is positioned in the upper die blank (1) and is provided with a water cooling device (6), the lower die blank (2) and the bottom plate (3) are internally provided with positioning cavities (7), the upper surface of the bottom plate (3) is provided with an ejector pin mechanism (8), the top of the ejector pin mechanism (8) is provided with a die core (9), and the die core (9) is internally provided with a semiconductor refrigerating device (10); the water cooling device is characterized by further comprising a control device, wherein a microprocessor is arranged in the control device, and the water cooling device (6), the thimble mechanism (8), the semiconductor refrigerating device (10) and the microprocessor are electrically connected.

2. The mobile phone mold blank capable of being cooled rapidly according to claim 1, wherein: the water cooling device (6) comprises a water storage tank (601), a micro water pump (602) and a water conveying pipe (603), the water storage tank (601) is arranged inside the upper die blank (1), the micro water pump (602) is arranged inside the water storage tank (601), two sides of the water storage tank (601) are communicated through the water conveying pipe (603), and the micro water pump (602) is electrically connected with the microprocessor.

3. The mobile phone mold blank capable of being cooled rapidly according to claim 2, wherein: one side of the water storage tank (601) is provided with a water filling port (11), the other side of the water storage tank (601) is provided with radiating fins (12) and radiating holes (13), and one side of the water conveying pipe (603) is provided with a water outlet (14).

4. The mobile phone mold blank capable of being cooled rapidly according to claim 1, wherein: thimble mechanism (8) are including thimble bottom plate (801), thimble panel (802), hydraulic stem (803) and dead lever (804), the last fixed surface of bottom plate (3) is connected with thimble bottom plate (801), the top of thimble bottom plate (801) is provided with thimble panel (802), the inside of bottom plate (3), thimble bottom plate (801) and thimble panel (802) is run through there is hydraulic stem (803), the top of hydraulic stem (803) and the lower fixed surface of mould benevolence (9) are connected, the last fixed surface of thimble panel (802) is connected with dead lever (804), dead lever (804) run through mould benevolence (9), hydraulic stem (803) and microprocessor electric connection.

5. The mobile phone mold blank capable of being cooled rapidly according to claim 1, wherein: the semiconductor refrigerating device (10) comprises a semiconductor refrigerator (1001), a conveying pipe (1002) and a blocking net (1003), the semiconductor refrigerator (1001) is arranged inside the mold core (9), the top of the semiconductor refrigerator (1001) is communicated with the conveying pipe (1002), the blocking net (1003) is arranged at the output end of the conveying pipe (1002), and the semiconductor refrigerator (1001) is electrically connected with the microprocessor.

6. The mobile phone mold blank capable of being cooled rapidly according to claim 1, wherein: a cavity (15) is arranged between the upper mold blank (1) and the mold core (9), and the sprue bushing (4) is communicated with the cavity (15).