CN215198472U

CN215198472U - Semiconductor wafer cleaning machine

Info

Publication number: CN215198472U
Application number: CN202121389011.5U
Authority: CN
Inventors: 李仁杰
Original assignee: Suzhou Dingxin Photoelectric Technology Co ltd; Jiangsu Etern Co Ltd
Current assignee: Suzhou Dingxin Photoelectric Technology Co ltd; Jiangsu Etern Co Ltd
Priority date: 2021-06-22
Filing date: 2021-06-22
Publication date: 2021-12-17
Anticipated expiration: 2031-06-22

Abstract

The utility model discloses a semiconductor wafer cleaning machine, including wasing the case, wash roof portion fixed connection motor, the first pivot of motor coaxial coupling, the first gear of first pivot fixedly connected with, the terminal fixedly connected with brush of first pivot, first gear engagement has the second gear, second gear fixedly connected with second pivot, the second pivot is rotated with the washing roof portion and is connected, the bottom of second gear is rotated and is connected with the horizontal pole, the horizontal pole is rotated and is connected with the air push stopper, wash case fixed connection water storage box, the first water pipe of water storage box fixed connection, install first check valve on the first water pipe. The utility model discloses can control wastewater discharge, simple to use's mechanical tool cooperation motor is constituteed water spray system, has realized that the motor both can be used for rotating the brush, two uses that can go out water again, and the size of control washing water yield, unusual energy-concerving and environment-protective.

Description

Semiconductor wafer cleaning machine

Technical Field

The utility model relates to a semiconductor wafer technical field especially relates to a semiconductor wafer cleaning machine.

Background

To meet the requirements of mass production, the electrical properties of semiconductors must be predictable and stable, and thus, the purity of the dopants and the quality of the semiconductor lattice structure are critical. Common quality problems include dislocations (dislocations), twinning planes (twins) or stacking faults (stacking faults) affecting the properties of the semiconductor material. For a semiconductor device, defects in the material lattice (crystal defects) are often the main cause of the element performance.

The existing semiconductor wafer cleaning machine realizes the work of the semiconductor wafer cleaning machine through a plurality of power mechanisms, and a water pump and a motor are used simultaneously, so that the manufacturing cost of the semiconductor wafer cleaning machine is increased; if the semiconductor wafer can be scrubbed and washed by one motor, the production cost of the semiconductor wafer cleaning machine can be reduced.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defects in the prior art and provides a semiconductor wafer cleaning machine.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a semiconductor wafer cleaning machine comprises a cleaning box, wherein the cleaning box is fixedly connected with four lifters, the four lifters are fixedly connected with adsorption plates, the top of the cleaning box is fixedly connected with a motor, the motor is coaxially connected with a first rotating shaft, the first rotating shaft is fixedly connected with a first gear, the tail end of the first rotating shaft is fixedly connected with a brush, the first gear is meshed with a second gear, the second gear is fixedly connected with a second rotating shaft, the second rotating shaft is rotatably connected with the top of the cleaning box, the bottom of the second gear is rotatably connected with a cross rod, the cross rod is rotatably connected with an air pushing plug, the cleaning box is fixedly connected with a water storage box, the water storage box is fixedly connected with a first water pipe, a first check valve is installed on the first water pipe, a piston cylinder is fixedly connected above the water storage box, and the air pushing plug is connected with the piston cylinder, and a second water pipe is fixedly connected below the piston cylinder, one end of the second water pipe is fixedly connected with the spray head, and a second one-way valve is installed on the second water pipe.

Preferably, the lower end of the side wall of the cleaning box is provided with a drain pipe, and the drain pipe is provided with a valve.

Preferably, the inner bottom of the cleaning tank is fixedly connected with a baffle plate, and the baffle plate is positioned between the adsorption plate and the water storage tank.

Preferably, the horizontal pole comprises first horizontal pole, second horizontal pole, screw groove jointly, the screw groove sets up the upper end at first horizontal pole, first horizontal pole and second horizontal pole pass through the screw and the cooperation of screw groove is connected.

Preferably, two switch doors are installed at the front end of the cleaning box, and handles are installed on the switch doors.

Preferably, the air pushing plug consists of a connecting rod and a piston, the connecting rod is rotatably connected with the cross rod, and the piston is slidably connected with the inner wall of the piston cylinder.

Compared with the prior art, the utility model, its beneficial effect does:

1. the work of the piston and the brush can be realized through the rotation of the motor, the semiconductor wafer can be scrubbed through the rotating brush, water can be supplied to the semiconductor wafer at the same time, a water pump and the motor do not need to be used at the same time, and the economic cost is reduced.

2. Through the cooperation such as piston cylinder, first check valve, second check valve, piston, can constitute simple and easy water pump, realize supplying water to semiconductor wafer on, compare the water pump, it is more convenient simple to manufacture, and the cost is lower.

3. Can unscrew first horizontal pole, then remove the change of both total lengths of first horizontal pole and second horizontal pole control, when first horizontal pole and second horizontal pole total length shorten, the range that the piston moved diminishes, the water of inhaling in the piston section of thick bamboo reduces to make shower nozzle spun water diminish, when first horizontal pole and second horizontal pole total length grow, the range grow that the piston moved, the water increase of inhaling in the piston section of thick bamboo, thereby make shower nozzle spun water grow, thereby control displacement.

To sum up, the utility model discloses a motor can realize the rotation of brush to can wash semiconductor wafer, can drive piston reciprocating motion simultaneously, thereby can supply water to semiconductor wafer on, simultaneously, also can adjust the water supply capacity, in order to satisfy the in-service use demand, can carry out effectual washing to semiconductor wafer, and can replace the water pump through piston, a piston section of thick bamboo etc. manufacturing cost is lower.

Drawings

Fig. 1 is a schematic structural diagram of a semiconductor wafer cleaning machine according to the present invention.

Fig. 2 is a front view of a semiconductor wafer cleaning machine according to the present invention.

Fig. 3 is an enlarged view of a structure at a in fig. 1.

In the figure: 1 washing case, 2 lifters, 3 adsorption plates, 4 baffles, 5 valves, 6 motors, 7 first rotating shafts, 8 first gears, 9 second gears, 10 second rotating shafts, 11 cross bars, 12 air-pushing plugs, 13 piston cylinders, 14 first water pipes, 15 water storage tanks, 16 second water pipes, 17 spray heads, 18 second check valves, 19 first check valves, 20 switch doors, 21 brushes, 11a first cross bars, 11b second cross bars, 11c screws and 11d screw grooves.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-3, a semiconductor wafer cleaning machine, including wasing case 1, washs case 1 lateral wall lower extreme and installs the drain pipe, installs valve 5 on the drain pipe, opens valve 5 and can discharge washing waste water, washs the interior bottom fixedly connected with baffle 4 of case 1, and baffle 4 is located between adsorption plate 3 and water storage box 15, and baffle 4 can be in the washing scope the washing waste water separation, opens valve 5 again and can discharge washing waste water.

Wash four lifters 2 of 1 fixed connection of case, lifter 2 comprises electronic telescopic rod and base fixed connection, fixed connection adsorption plate 3 on four lifters 2, there are many apertures on 3 surfaces of adsorption plate, place the semiconductor wafer on adsorption plate 3, reuse air extractor manage to find time the air in 3 adsorption plates, can reach the semiconductor wafer and adsorb on adsorption plate 3, be difficult to remove when wasing the operation, adsorb fixedly as prior art through the negative pressure.

The top of the cleaning box 1 is fixedly connected with a motor 6, the motor 6 is coaxially connected with a first rotating shaft 7, the first rotating shaft 7 is fixedly connected with a first gear 8, the tail end of the first rotating shaft 7 is fixedly connected with a brush 21, the first gear 8 is meshed with a second gear 9, the second gear 9 is fixedly connected with a second rotating shaft 10, the second rotating shaft 10 is rotatably connected with the top of the cleaning box 1, the bottom of the second gear 9 is rotatably connected with a cross rod 11, the cross rod 11 consists of a first cross rod 11a, a second cross rod 11b, a screw 11c and a screw groove 11d, a screw groove 11d is arranged at the upper end of the first cross rod 11a, the first cross rod 11a and the second cross rod 11b are connected with the screw groove 11d in a matched mode through the screw 11c, the cross rod 11 is rotatably connected with an air pushing plug 12, when water supply quantities of different sizes are needed, the distance between the first cross rod 11a and the second cross rod 11b can be adjusted to control the sliding displacement of the air pushing plug 12, thereby controlling the amount of water discharged.

Wash case 1 fixed connection water storage box 15, water storage box 15 fixed connection first water pipe 14, install first check valve 19 on the first water pipe 14, water storage box 15 top fixed connection has piston cylinder 13, push away air lock 12 and be connected with piston cylinder 13, push away air lock 12 and comprise connecting rod and piston, connecting rod and horizontal pole 11 rotate to be connected, the inner wall sliding connection of piston and piston cylinder 13, piston cylinder 13 below fixed connection

second water pipe

16, 16 one end fixed connection shower nozzles 17 of second water pipe, install second check valve 18 on the second water pipe 16.

Two switch doors 20 are installed at the front end of the cleaning box 1, and handles are installed on the two switch doors 20.

The working principle is as follows: when the semiconductor crystal needs to be cleaned, firstly, the semiconductor crystal needing to be cleaned is placed on the adsorption plate 3, the air in the adsorption plate 3 is evacuated by starting the air extractor, then the height of the lifter 2 is adjusted, the semiconductor crystal is attached to the brush 21, the motor 6 is started, the brush 21 is driven by the motor 6 to scrub the semiconductor crystal, meanwhile, the motor 6 drives the first gear 8 to rotate, the first gear 8 drives the second gear 9 to rotate, the second gear 9 drives the cross rod 11 to rotate, the cross rod 11 drives the piston at the front end of the air pushing plug 12 to move left and right in the piston cylinder 13, when the piston moves left, the first one-way valve 19 is opened, the second one-way valve 18 is closed, the water in the water storage tank 15 flows into the piston cylinder 13 through the first water pipe 14, when the piston moves right, the first one-way valve 19 is closed, the second one-way valve 18 is opened, the water in the piston cylinder 13 flows to the spray head 17 through the second water pipe 16, the shower head 17 sprays water onto the brush 21, and the cleaning work of the semiconductor wafer is completed in cooperation with the rotation of the brush 21.

When the water yield of the nozzle 17 needs to be adjusted, only the distance between the first cross rod 11a and the second cross rod 11b needs to be adjusted, a worker can unscrew the screw 11c and then move the first cross rod 11a and the second cross rod 11b to control the total length change of the first cross rod 11a and the second cross rod 11b, when the total length of the first cross rod 11a and the second cross rod 11b is shortened, the moving amplitude of the piston is reduced, the water sucked into the piston cylinder 13 is reduced, the water sprayed out of the nozzle 17 is reduced, when the total length of the first cross rod 11a and the second cross rod 11b is prolonged, the moving amplitude of the piston is increased, the water sucked into the piston cylinder 13 is increased, the water sprayed out of the nozzle 17 is increased, and the water discharge amount is controlled.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. A semiconductor wafer cleaning machine, comprising a cleaning tank (1), characterized in that: the cleaning device is characterized in that the cleaning box (1) is fixedly connected with four lifters (2), the four lifters (2) are fixedly connected with an adsorption plate (3), the top of the cleaning box (1) is fixedly connected with a motor (6), the motor (6) is coaxially connected with a first rotating shaft (7), the first rotating shaft (7) is fixedly connected with a first gear (8), the tail end of the first rotating shaft (7) is fixedly connected with a brush (21), the first gear (8) is meshed with a second gear (9), the second gear (9) is fixedly connected with a second rotating shaft (10), the second rotating shaft (10) is rotatably connected with the top of the cleaning box (1), the bottom of the second gear (9) is rotatably connected with a transverse rod (11), the transverse rod (11) is rotatably connected with a gas pushing plug (12), the cleaning box (1) is fixedly connected with a water storage box (15), and the water storage box (15) is fixedly connected with a first water pipe (14), install first check valve (19) on first water pipe (14), water storage box (15) top fixedly connected with piston cylinder (13), push away air lock (12) and be connected with piston cylinder (13), piston cylinder (13) below fixed connection second water pipe (16), second water pipe (16) one end fixed connection shower nozzle (17), install second check valve (18) on second water pipe (16).

2. A semiconductor wafer cleaning machine according to claim 1, characterized in that a drain pipe is installed on the lower end of the side wall of the cleaning tank (1), and a valve (5) is installed on the drain pipe.

3. A semiconductor wafer cleaning machine according to claim 1, characterized in that a baffle (4) is fixedly connected to the inner bottom of the cleaning tank (1), and the baffle (4) is located between the adsorption plate (3) and the water storage tank (15).

4. The semiconductor wafer cleaning machine according to claim 1, wherein the cross bar (11) is composed of a first cross bar (11a), a second cross bar (11b), a screw (11c) and a screw groove (11d), the screw groove (11d) is disposed at the upper end of the first cross bar (11a), and the first cross bar (11a) and the second cross bar (11b) are connected by the screw (11c) and the screw groove (11d) in a matching manner.

5. A semiconductor wafer cleaning machine according to claim 1, characterized in that two switch doors (20) are installed at the front end of the cleaning tank (1), and a handle is installed on each of the two switch doors (20).

6. The semiconductor wafer cleaning machine according to claim 1, wherein the push plug (12) is composed of a connecting rod and a piston, the connecting rod is rotatably connected with the cross rod (11), and the piston is slidably connected with the inner wall of the piston cylinder (13).