CN215188072U - Electronic component heat dissipation mechanism for electromechanical device based on building engineering - Google Patents
Electronic component heat dissipation mechanism for electromechanical device based on building engineering Download PDFInfo
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- CN215188072U CN215188072U CN202121461159.5U CN202121461159U CN215188072U CN 215188072 U CN215188072 U CN 215188072U CN 202121461159 U CN202121461159 U CN 202121461159U CN 215188072 U CN215188072 U CN 215188072U
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Abstract
The utility model discloses an electronic component heat dissipation mechanism for electromechanical device based on building engineering, including shell, air inlet window, air outlet window, base, electronic component main part, guide, radiating element, pushing down mechanism, cooling body and fan, the utility model discloses an upper right end installs the mechanism that moves down in the shell, pushes down the mechanism bottom and meets with radiating element, moves down the mechanism and is driven by the motor, can make the radiating element after the continuous operation move down under the drive, enters into the cooling body that the lower right end of shell set up, cools off fast, avoids using for a long time, and radiating element inside heat is great, leads to the radiating effect lower, and efficiency becomes poor; and cooling mechanism inside is equipped with the slot that supplies radiating element to get into, is equipped with the sponge that can adsorb the coolant liquid in cooling piece inside, and the sponge is in full back, and the infiltration hole on the accessible oozing layer is attached to radiating element, makes it carry out stable quick cooling.
Description
Technical Field
The utility model particularly relates to an electronic component heat dissipation mechanism for electromechanical device based on building engineering relates to the relevant field of building engineering electromechanics.
Background
The building engineering refers to an engineering entity formed by the construction of various building constructions and their auxiliary facilities and the installation of lines, pipelines and equipment matched with them. Wherein "housing construction" indicates that there is top cap, beam column, wall, basis and can form the inner space, satisfies the engineering that people produced, live in, study, public activity needs, in the building engineering, needs use many electromechanical device, and electromechanical device is last to install electronic component, and electronic component can produce the heat in the use, need use dedicated heat dissipation mechanism, carries out stable heat dissipation to it.
In the actual use process of the electronic element heat dissipation mechanism for electromechanical equipment based on constructional engineering, as the heat dissipation element works for a long time and the surface and the internal heat are large, the heat dissipation effect is deteriorated and the efficiency is reduced when the heat dissipation element continues to work.
SUMMERY OF THE UTILITY MODEL
Therefore, in order to solve the above-mentioned insufficiency, the utility model provides an electronic component heat dissipation mechanism for electromechanical device based on building engineering here.
The utility model is realized in such a way, an electronic element heat dissipation mechanism for electromechanical equipment based on building engineering is constructed, the device comprises a shell, the left side and the right side of the shell are respectively provided with an air inlet window and an air outlet window, the lower end in the shell is provided with a base, the top of the base is provided with an electronic element main body, the right side of the electronic element main body and the inner side of the shell are provided with a guide piece, the heat dissipation element is embedded in the guide piece, the right side of the air outlet window is connected with a fan, the right end of the top of the shell is provided with a pressing mechanism, the bottom of the pressing mechanism penetrates through the bottom of the shell and is connected with the heat dissipation element, a cooling mechanism is arranged at the right lower end in the shell, the pressing mechanism comprises a transmission case, a driving motor and a connecting plate, the bottom of the transmission case is fixed with the shell, the back of the transmission case is provided with the driving motor, the bottom of the transmission case penetrates through the top of the shell through the connecting plate, and the bottom of the connecting plate is connected with the heat dissipation element.
Preferably, the transmission case comprises a case body, a rotating disc, a poking column, a linkage part and a push rod, wherein the rotating disc is arranged at the upper end in the case body, the middle part of the rotating disc is connected with an output shaft of the driving motor, the poking column is fixed at the front end of the rotating disc, the front end of the poking column is connected with the linkage part, the push rod is fixed at the bottom of the linkage part, and the bottom of the push rod penetrates through the bottom of the case body and is connected with the connecting plate.
Preferably, the cooling mechanism comprises a cooling part, a water injection port and a slot, the bottom of the cooling part is arranged at the bottom in the shell, the water injection port is formed in the upper end of the front end face of the cooling part, and the slot is formed in the upper end of the cooling part.
Preferably, the cooling part comprises a protective shell, a sponge and a seepage layer, the interior of the protective shell is communicated with the water injection port, the sponge is arranged on the inner side of the protective shell, and the inner side of the sponge is attached to the seepage layer.
Preferably, a guide block a is arranged in the middle of the box body, and the middle of the guide block a is penetrated by the push rod.
Preferably, a strip-shaped groove a is formed in the middle of the interior of the linkage piece, and the toggle column is movably embedded into the strip-shaped groove.
Preferably, the inner diameter of the slot is larger than the outer diameter of the heat dissipation element.
Preferably, the inner wall of the exudation layer is smooth, and more than 300 groups of exudation holes are arranged in the exudation layer.
Preferably, the linkage piece is made of alloy steel.
Preferably, the exudation layer is made of aluminum.
The utility model has the advantages of as follows: the utility model discloses an improve and provide an electronic component heat dissipation mechanism for electromechanical device based on building engineering here, compare with the equipment of the same type, have following improvement:
the method has the advantages that: an electronic component heat dissipation mechanism for electromechanical device based on building engineering installs through upper right end in the shell and moves down the mechanism, pushes down the mechanism bottom and meets with heat radiating element, moves down the mechanism and by motor drive, can make the heat radiating element after the continuous operation move down under the drive, enters into the cooling body that shell right side lower extreme set up inside, cools off fast, avoids using for a long time down, and the inside heat of heat radiating element is great, leads to the radiating effect lower, and efficiency worsens.
The method has the advantages that: a electronic component heat dissipation mechanism for electromechanical device based on building engineering, wherein the inside slot that supplies radiating element to get into that is equipped with of cooling body, at the inside sponge that is equipped with adsorbable coolant liquid of cooling part, the sponge is in full back, and the accessible oozes the seepage hole on the layer and adheres to on radiating element, makes it stabilize quick cooling.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of the pressing mechanism of the present invention;
FIG. 3 is a schematic view of the structure of the transmission case of the present invention;
FIG. 4 is a schematic structural view of the cooling mechanism of the present invention;
fig. 5 is a partial sectional structural schematic view of the cooling member of the present invention.
Wherein: the air-conditioning system comprises a shell-1, an air inlet window-2, an air outlet window-3, a base-4, an electronic component main body-5, a guide piece-6, a heat dissipation component-7, a pressing mechanism-8, a cooling mechanism-9, a fan-10, a transmission case-81, a driving motor-82, a connecting plate-83, a box body-811, a rotating disc-812, a toggle column-813, a linkage piece-814, a push rod-815, a cooling piece-91, a water injection port-92, a slot-93, a protective shell-911, a sponge-912, a seepage layer-913, a guide block-811 a and a strip groove-814 a.
Detailed Description
The present invention will be described in detail with reference to the accompanying fig. 1-5, and the technical solutions in the embodiments of the present invention will be clearly and completely described, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Please refer to fig. 1, the utility model provides an electronic component heat dissipation mechanism for electromechanical device based on building engineering through the improvement here, including shell 1, air inlet window 2 and air outlet window 3 have been seted up respectively to the shell 1 left and right sides, the lower extreme is equipped with base 4 in the shell 1, 4 tops of base are equipped with electronic component main part 5, 5 right sides of electronic component main part are equipped with guide 6 with 1 inboard of shell, the inside embedding of guide 6 has heat radiating element 7, air outlet window 3 right side meets with fan 10, shell 1 top right-hand member is equipped with pushing down mechanism 8, 8 bottoms of pushing down mechanism run through shell 1 bottom and meet with heat radiating element 7, cooling body 9 locates the right lower extreme in the shell 1.
Referring to fig. 2, the present invention provides an electronic component heat dissipation mechanism for electromechanical devices based on building engineering through an improvement, the pressing mechanism 8 includes a transmission case 81, a driving motor 82 and a connecting plate 83, the bottom of the transmission case 81 is fixed to the housing 1, the driving motor 82 is disposed on the back of the transmission case 81, the bottom of the transmission case 81 penetrates the top of the housing 1 through the connecting plate 83, and the bottom of the connecting plate 83 is connected to the heat dissipation component 7.
Referring to fig. 3, the present invention provides an electronic component heat dissipation mechanism for electromechanical devices based on building engineering, wherein a transmission case 81 includes a case 811, a rotating disc 812, a toggle column 813, a linkage 814 and a push rod 815, the upper end of the case 811 is provided with the rotating disc 812, the middle of the rotating disc 812 is connected to an output shaft of a driving motor 82, the front end of the rotating disc 812 is fixed with the toggle column 813, the front end of the toggle column 813 is connected to the linkage 814, the bottom of the linkage 814 is fixed with the push rod 815, the bottom of the push rod 815 penetrates the bottom of the case 811 and is connected to the connecting plate 83, the middle of the linkage 814 is provided with a bar-shaped groove 814a, the toggle column 813 is movably embedded into the bar-shaped groove 814a for toggling the linkage 814, the linkage 814 is made of alloy steel, the linkage 814 is high in strength and strong in stability, the middle of the case 811 is provided with a guide block 811, and the middle of the guide block 811a is penetrated by the push rod 815, the direction is stable, and the slip is smooth.
Referring to fig. 4, the present invention provides an electronic component heat dissipation mechanism for electromechanical devices based on building engineering, wherein the cooling mechanism 9 includes a cooling member 91, a water injection port 92 and a slot 93, the bottom of the cooling member 91 is disposed at the bottom of the housing 1, the water injection port 92 is disposed at the upper end of the front end face of the cooling member 91, the slot 93 is disposed at the inner upper end of the cooling member 91, the inner diameter of the slot 93 is greater than the outer diameter of the heat dissipation member 7, thereby facilitating the entry of the heat dissipation member 7.
Please refer to fig. 5, the utility model provides an electronic component heat dissipation mechanism for electromechanical device based on building engineering through the improvement here, cooling piece 91 includes protective case 911, sponge 912 and oozes layer 913, protective case 911 inside communicates with each other with water filling port 92, protective case 911 inboard is equipped with sponge 912, sponge 912 inboard is pasted mutually with oozing layer 913, ooze layer 913 inner wall smooth, and ooze layer 913 inside set up more than 300 group's infiltration holes, ooze evenly, it is efficient, ooze layer 913 and adopt the aluminium material, the heat conduction effect is good, high efficiency.
The utility model provides an electronic element heat dissipation mechanism for electromechanical equipment based on constructional engineering through improvement, and the working principle is as follows;
firstly, when the heat dissipation mechanism needs to be used, firstly, electronic elements are placed on the base 4, then the fan 10 is started to work, and then heat dissipation can be started by matching the heat dissipation element 7 with the extraction of the fan 10;
secondly, after the heat dissipation element 7 continuously works, the heat dissipation element 7 needs to be cooled, a user starts the driving motor 82 to work, the driving motor 82 drives the rotating disc 812 at the front end to rotate, then the toggle column 813 at the front end of the rotating disc 812 can drive the linkage 814, so that the push rod 815 at the bottom moves downwards under the guidance of the guide block 811a, and the connecting plate 83 at the bottom presses the heat dissipation element 7 to enter the slot 93 in the cooling piece 91;
thirdly, a user adds cooling liquid into the interior of the cooling liquid through the water injection port 92 and adsorbs the cooling liquid by the sponge 912, and after the sponge 912 is full, the cooling liquid can slowly pass through the seepage holes on the seepage layer 913 to be attached to the radiating element 7, so that rapid cooling is realized;
fourthly, finally, the driving motor 82 is restarted to continuously work, and the rotating disc 812 is driven to pull up the heat dissipation element 7 for resetting.
The utility model provides an electronic component heat dissipation mechanism for electromechanical device based on building engineering through improving, through install in shell 1 upper right end move down mechanism 8, push down 8 bottoms of mechanism and meet with radiating element 7, move down mechanism 8 and be driven by the motor, can make radiating element 7 after the continuous work move down under the drive, enter into the cooling body 9 that shell 1 right lower extreme set up inside, cool off fast, avoid using for a long time, radiating element 7 inside heat is great, lead to the radiating effect lower, efficiency worsens; and the cooling mechanism 9 is provided with a slot 93 for the heat dissipation element 7 to enter, the cooling piece 91 is provided with a sponge 912 capable of adsorbing cooling liquid, and after the sponge 912 is full, the sponge can be attached to the heat dissipation element 7 through the seepage holes on the seepage layer 913, so that the heat dissipation element 7 can be cooled stably and rapidly.
Claims (8)
1. An electronic element heat dissipation mechanism for electromechanical equipment based on constructional engineering comprises a shell (1), wherein an air inlet window (2) and an air outlet window (3) are respectively formed in the left side and the right side of the shell (1), a base (4) is arranged at the inner lower end of the shell (1), an electronic element main body (5) is arranged at the top of the base (4), a guide piece (6) is arranged on the right side of the electronic element main body (5) and the inner side of the shell (1), a heat dissipation element (7) is embedded into the guide piece (6), and the right side of the air outlet window (3) is connected with a fan (10);
the method is characterized in that: still including pushing down mechanism (8) and cooling body (9), shell (1) top right-hand member is equipped with pushing down mechanism (8), pushing down mechanism (8) bottom runs through shell (1) bottom and meets with radiating element (7), right lower extreme in shell (1) is located in cooling body (9), pushing down mechanism (8) including transmission case (81), driving motor (82) and even board (83), transmission case (81) bottom is fixed with shell (1), transmission case (81) back is equipped with driving motor (82), transmission case (81) bottom runs through shell (1) top through even board (83) to even board (83) bottom meets with radiating element (7).
2. The electronic component heat dissipation mechanism for electromechanical devices based on constructional engineering as claimed in claim 1, wherein: the transmission case (81) comprises a case body (811), a rotating disc (812), a shifting column (813), a linkage piece (814) and a push rod (815), wherein the rotating disc (812) is arranged at the inner upper end of the case body (811), the middle of the rotating disc (812) is connected with an output shaft of a driving motor (82), the shifting column (813) is fixed at the front end of the rotating disc (812), the front end of the shifting column (813) is connected with the linkage piece (814), the push rod (815) is fixed at the bottom of the linkage piece (814), and the bottom of the push rod (815) penetrates through the bottom of the case body (811) and is connected with a connecting plate (83).
3. The electronic component heat dissipation mechanism for electromechanical devices based on constructional engineering as claimed in claim 1, wherein: cooling body (9) are including cooling piece (91), water filling port (92) and slot (93), the bottom in shell (1) is arranged in to cooling piece (91) bottom, water filling port (92) have been seted up to cooling piece (91) preceding terminal surface upper end, slot (93) have been seted up to cooling piece (91) interior upper end.
4. The electronic component heat dissipation mechanism for electromechanical devices based on constructional engineering as claimed in claim 3, wherein: the cooling part (91) comprises a protective shell (911), a sponge (912) and an exudation layer (913), wherein the protective shell (911) is communicated with a water injection port (92), the sponge (912) is arranged on the inner side of the protective shell (911), and the inner side of the sponge (912) is attached to the exudation layer (913).
5. The electronic component heat dissipation mechanism for electromechanical devices based on constructional engineering as claimed in claim 2, wherein: a guide block (811a) is arranged in the middle of the box body (811), and the middle of the guide block (811a) is penetrated by a push rod (815).
6. The electronic component heat dissipation mechanism for electromechanical devices based on constructional engineering as claimed in claim 2, wherein: a strip-shaped groove (814a) is formed in the middle of the interior of the linkage piece (814), and the poking column (813) is movably embedded into the strip-shaped groove (814 a).
7. The electronic component heat dissipation mechanism for electromechanical devices based on constructional engineering as claimed in claim 3, wherein: the inner diameter of the slot (93) is larger than the outer diameter of the heat dissipation element (7).
8. The electronic component heat dissipation mechanism for electromechanical devices based on constructional engineering as claimed in claim 4, wherein: the inner wall of the exudation layer (913) is smooth, and more than 300 groups of exudation holes are arranged in the exudation layer (913).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121461159.5U CN215188072U (en) | 2021-06-29 | 2021-06-29 | Electronic component heat dissipation mechanism for electromechanical device based on building engineering |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202121461159.5U CN215188072U (en) | 2021-06-29 | 2021-06-29 | Electronic component heat dissipation mechanism for electromechanical device based on building engineering |
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| CN215188072U true CN215188072U (en) | 2021-12-14 |
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| CN202121461159.5U Active CN215188072U (en) | 2021-06-29 | 2021-06-29 | Electronic component heat dissipation mechanism for electromechanical device based on building engineering |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114872305A (en) * | 2022-06-23 | 2022-08-09 | 浙江昊杨新能源科技有限公司 | Cooling device for plastic shell processing of storage battery |
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2021
- 2021-06-29 CN CN202121461159.5U patent/CN215188072U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114872305A (en) * | 2022-06-23 | 2022-08-09 | 浙江昊杨新能源科技有限公司 | Cooling device for plastic shell processing of storage battery |
| CN114872305B (en) * | 2022-06-23 | 2024-03-15 | 浙江昊杨新能源科技有限公司 | Storage battery plastic shell processing and cooling device |
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