CN215187716U - Heat conduction waterproof circuit board - Google Patents

Abstract

The utility model discloses a heat-conducting waterproof circuit board, which comprises a lower shell, wherein four corners of the top of the lower shell are provided with connecting holes, connecting grooves are arranged between the connecting holes, the top of the lower shell is fixedly connected with an upper shell, the bottom of the upper shell is provided with connecting lugs, four corners of the upper shell are provided with through holes, two sides of the lower shell are provided with radiating grids, four corners of the inner part of the lower shell are provided with fixing columns, four fixing columns are clamped and connected with a circuit board, the bottom end of the circuit board is fixedly connected with a heat-conducting insulating sheet, the bottom end of the heat-conducting insulating sheet is fixedly connected with a plurality of radiating fins, the inner part of the lower shell is provided with a drying sheet, the bottom end of the heat-conducting insulating sheet is fixedly connected with a drying sheet, the top of the circuit board is provided with an adhesive layer, the heat-conducting waterproof circuit board has simple and reasonable structure and novel design, the heat-conducting waterproof circuit board has higher waterproof performance and heat-conducting performance.

Description

Heat conduction waterproof circuit board

Technical Field

The utility model relates to a waterproof circuit board technical field specifically is a heat conduction waterproof circuit board.

Background

The circuit board plays a very critical role in each electronic part, and if accumulated water is on the surface of the circuit board, the circuit board is easy to corrode and even short circuit occurs, so that the normal operation of the circuit board is influenced. Most of the existing circuit boards do not have a waterproof function, and when the existing circuit boards are affected with damp or are stained with water, the existing circuit boards are prone to failure, even can generate short circuit, damage other hardware, or have poor heat conductivity. Therefore, we improve this and propose a heat-conducting waterproof circuit board.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a following technical scheme:

the utility model relates to a heat conduction waterproof circuit board, which comprises a lower housin, casing top four corners is provided with the connecting hole down, be provided with connecting groove between the connecting hole, casing top fixedly connected with goes up the casing down, it sets up the connection lug to go up the casing bottom, it is provided with the through-hole to go up the casing four corners, the casing both sides are provided with radiator grille down, the internal four corners of inferior valve is provided with the fixed column, four the fixed column block is connected with the circuit board, circuit board bottom fixedly connected with heat conduction insulating piece, a plurality of radiating fin of heat conduction insulating piece bottom fixedly connected with, the internal portion of inferior valve is provided with the dry piece, heat conduction insulating piece bottom fixedly connected with dry piece of fixedly connected with, the circuit board top is provided with the binder layer.

As a preferred technical scheme of the utility model, the inside internal thread that is provided with of connecting hole, through bolted connection between lower casing and the last casing, coupling groove corresponds each other with the connection lug, and the inside sealing washer that is provided with of coupling groove.

As an optimal technical scheme of the utility model, it is the circular arc structure to go up the casing top, it is provided with a plurality of drying tanks to go up the casing bottom, the inside drier piece that is provided with of drying tank, drier piece and drying piece are the silica gel drier.

As the utility model discloses an optimized technical scheme, the heat dissipation grid is inside to be constituted by a plurality of louvre, just the louvre is the bell mouth, the heat dissipation grid inboard all is provided with dustproof filter screen and the cotton that absorbs water.

As an optimal technical scheme of the utility model, the binder layer is laid on the circuit board top, just the binder layer constitutes for the epoxy resin casting glue.

As an optimal technical scheme of the utility model, the circuit board plate body has three layer construction to constitute, the circuit board plate body bottom is the basic unit, the basic unit top is provided with the insulating layer, the insulating layer top is provided with circuit board line layer.

As an optimized technical scheme of the utility model, the insulating layer adopts the sintering of electronic insulation medium thick liquids to form, and has scribbled transparent protection film on the circuit board line layer top of circuit board.

The utility model has the advantages that: the heat-conducting waterproof circuit board is different from the prior art, has reasonable structure, convenient use and simple operation, and can enable a user to simply and clearly understand the working principle; the lower shell water absorption cotton and the upper shell water absorption cotton are arranged, and the circuit board water absorption cotton is protected by matching the lower shell water absorption cotton and the upper shell water absorption cotton, so that the circuit board is effectively protected, the sealing ring is arranged in the circuit board, the sealing performance is better, and water vapor is prevented from entering from a gap; the insulating layer is arranged, the water absorption cotton and the base layer are arranged, the water absorption cotton is matched with the heat dissipation fin, the circuit board water absorption cotton has better heat conduction and heat dissipation effects, the temperature resistance and the vitrification temperature resistance are higher, and the heat dissipation problem of the circuit board is effectively solved.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic view of a main structure of a heat-conducting waterproof circuit board of the present invention;

fig. 2 is a schematic plane structure diagram of the heat-conducting waterproof circuit board of the present invention.

In the figure: 1. a lower housing; 2. connecting holes; 3. an upper housing; 4. a heat dissipation grid; 5. fixing a column; 6. a circuit board; 7. a thermally conductive insulating sheet; 8. a heat dissipating fin; 9. drying the slices; 10. an adhesive layer; 11. a drying tank; 12. a dustproof filter screen; 13. a base layer; 14. an insulating layer.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

As shown in fig. 1-2, the utility model relates to a heat conduction waterproof circuit board, including casing 1 down, 1 top four corners of casing are provided with connecting hole 2 down, be provided with connecting groove between the connecting hole 2, casing 3 on 1 top fixedly connected with of casing down, 3 bottoms on the casing set up the connection lug, 3 four corners on the casing are provided with the through-hole, 1 both sides of casing are provided with radiator grille 4 down, 1 inside four corners of casing are provided with fixed column 5 down, four fixed column 5 blocks are connected with circuit board 6, 6 bottom fixedly connected with heat conduction insulating piece 7 of circuit board, 7 bottom fixedly connected with a plurality of radiating fin 8 of heat conduction insulating piece, 1 inside dry piece 9 that is provided with of casing down, 7 bottom fixedly connected with dry piece 9 of heat conduction insulating piece, 6 tops of circuit board are provided with adhesive layer 10.

Wherein, connecting hole 2 is inside to be provided with the internal thread, through bolted connection between lower casing 1 and the last casing 3, connecting groove corresponds with the connecting lug each other, and connecting groove is inside to be provided with the sealing washer, through being provided with casing 1 and last casing 3 down, opens guard action can dustproof and waterproof to circuit board 6 through the cooperation of the two, the effectual circuit board that has protected, and inside the sealing washer messenger, the seal is better, prevents to get into steam from the gap.

Wherein, 3 tops of last casing are the circular arc structure, go up 3 bottoms of casing and are provided with a plurality of drying tanks 11, and 11 inside drying tanks are provided with the drier piece, and drier piece and drying piece 9 are the silica gel drier, through being provided with drying tank 11 and drier piece, can absorb inside steam, prevent to get into inside steam and influence circuit board 6, damage electronic component.

Wherein, the inside louvre that comprises a plurality of heat dissipation grid 4, and the louvre is the bell mouth, and 4 inboard of heat dissipation grid all are provided with dustproof filter screen 12 and cotton that absorbs water, through being provided with heat dissipation grid 4 and dustproof filter screen 12, circuit board 6 during operation can produce a large amount of heats, if not in time effluvium, can damage circuit board 6, influence the use.

The adhesive layer 10 is laid on the top end of the circuit board 6, the adhesive layer 10 is made of epoxy resin pouring adhesive, and the waterproof performance is improved and the heat-conducting performance of the pouring adhesive is good through the arrangement of the adhesive layer 10.

Wherein, the 6 plate bodies of circuit board have three layer construction to constitute, and 6 plate bodies of circuit board are basic unit 13 for the bottom, and basic unit 13 top is provided with insulating layer 14, and insulating layer 14 top is provided with circuit board line layer, through being provided with insulating layer 14 and basic unit 13, and through radiating fin 8's cooperation, makes circuit board 6 have better heat conduction and radiating effect, higher temperature resistant and anti vitrification temperature performance, has effectively solved the heat dissipation problem of circuit board.

The insulating layer 14 is formed by sintering electronic insulating medium slurry, and a transparent protective film is coated on the top of the circuit board circuit layer of the circuit board 6.

When the waterproof sealing structure works, the lower shell 1 and the upper shell 3 are arranged, the circuit board 6 can be protected in a dustproof and waterproof mode through the protection effect of the lower shell and the upper shell in a matched mode, the circuit board is effectively protected, the sealing ring enables the interior to be better in tightness and prevents water vapor from entering a gap, the drying groove 11 and the drying agent sheet are arranged to absorb the water vapor inside and prevent the water vapor entering the interior from influencing the circuit board 6 and damaging electronic elements, the circuit board 6 can generate a large amount of heat during working through the arrangement of the radiating grids 4 and the dustproof filter screen 12, the circuit board 6 can be damaged if the water vapor is not dispersed in time and the use is influenced, the waterproof performance is improved through the arrangement of the adhesive layer 10, the heat conducting performance of the pouring adhesive is good, the circuit board 6 has better heat conducting and radiating effects and higher temperature resistance and vitrification temperature resistance through the arrangement of the insulating layer 14 and the base layer 13 and the matching of the radiating fins 8, the heat dissipation problem of the circuit board is effectively solved.

Finally, it should be noted that: in the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (7)

1. A heat-conducting waterproof circuit board comprises a lower shell (1) and is characterized in that connecting holes (2) are formed in four corners of the top of the lower shell (1), connecting grooves are formed between the connecting holes (2), an upper shell (3) is fixedly connected to the top of the lower shell (1), connecting lugs are arranged at the bottom of the upper shell (3), through holes are formed in four corners of the upper shell (3), heat-radiating grids (4) are arranged on two sides of the lower shell (1), fixing columns (5) are arranged in four corners inside the lower shell (1), a circuit board (6) is connected to the four fixing columns (5) in a clamping mode, a heat-conducting insulating sheet (7) is fixedly connected to the bottom end of the circuit board (6), a plurality of heat-radiating fins (8) are fixedly connected to the bottom end of the heat-conducting insulating sheet (7), and a drying sheet (9) is arranged inside the lower shell (1), the heat conduction insulating sheet (7) bottom fixedly connected with drying piece (9), circuit board (6) top is provided with binder layer (10).

2. The heat-conducting waterproof circuit board according to claim 1, wherein an internal thread is provided inside the connecting hole (2), the lower casing (1) and the upper casing (3) are connected by a bolt, the connecting groove and the connecting protrusion correspond to each other, and a sealing ring is provided inside the connecting groove.

3. The heat-conducting waterproof circuit board according to claim 1, wherein the top of the upper housing (3) is of a circular arc structure, the bottom of the upper housing (3) is provided with a plurality of drying grooves (11), a desiccant sheet is arranged inside the drying grooves (11), and the desiccant sheet and the drying sheet (9) are both silica gel desiccants.

4. The heat-conducting waterproof circuit board according to claim 1, wherein the heat dissipation grid (4) is internally formed by a plurality of heat dissipation holes, the heat dissipation holes are tapered holes, and the inner side of the heat dissipation grid (4) is provided with a dust-proof filter screen (12) and absorbent cotton.

5. The heat-conducting waterproof circuit board according to claim 1, wherein the adhesive layer (10) is laid on top of the circuit board (6), and the adhesive layer (10) is made of epoxy resin pouring sealant.

6. The heat-conducting waterproof circuit board as claimed in claim 1, wherein the board body of the circuit board (6) is composed of three layers, the lowest layer of the board body of the circuit board (6) is a base layer (13), an insulating layer (14) is arranged on the top of the base layer (13), and a circuit board circuit layer is arranged on the top of the insulating layer (14).

7. The heat-conducting waterproof circuit board of claim 6, characterized in that the insulating layer (14) is formed by sintering an electronic insulating medium slurry, and a transparent protective film is coated on the top of the circuit board circuit layer of the circuit board (6).

Images